Temperature and pressure reducing device

Abstract

The utility model belongs to the technical field of temperature reduction and pressure reduction, and particularly relates to a temperature reduction and pressure reduction device which comprises a pipeline body, a pressure relief assembly and a temperature reduction and pressure reduction assembly, the outer wall of the pipeline body is sleeved with a cooling sleeve, a cavity is formed in the cooling sleeve, a cooling assembly is arranged in the cavity, and the outer wall of the pipeline body is wrapped by the cooling assembly. And the pressure relief assembly is used for conducting automatic pressure relief on the pipeline body, the pressure relief assembly is arranged on the pipeline body and located on one side of the cooling sleeve, and the effects that the structure is more simplified, and uniform cooling can be achieved are achieved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of temperature and pressure reduction, especially relates to a temperature and pressure reduction device. BACKGROUND

[0002] Steam, also known as "water vapor". According to the classification of various steam under pressure and temperature: saturated steam, superheated steam. The main use of steam is heating / humidification; It can also generate power; As machine drive, etc.

[0003] Chinese utility model patent CN221610855U discloses a kind of steam temperature and pressure reduction device, comprising: pipeline body, the outer side of the pipeline body is provided with cooling pipe, pipeline body and cooling pipe are connected by two net-shaped plates, flange is mounted on the both sides of cooling pipe, two exhaust mechanisms are provided in the top of cooling pipe, fan assembly is provided in the bottom of cooling pipe, the bottom side of fan assembly is provided with air cooler, two exhaust mechanisms, fan assembly and air cooler are connected by rotary connecting device, drying treatment device is installed in the bottom of rotary connecting device.

[0004] In the above technical scheme, the exhaust mechanism, fan assembly and air cooler are driven to rotate by the cooperation of motor and upper gear structure, so that the pipeline body conveying steam can be uniformly cooled, and the structure is relatively complex to realize the function of uniform cooling. UTILITY MODEL CONTENTS

[0005] The utility model aims at the above-mentioned technical problem, provides a kind of temperature and pressure reduction device, reaches the structure more simplification, can realize the effect of uniform cooling.

[0006] Therefore, the utility model provides a kind of temperature and pressure reduction device, including: pipeline body, characterized by, cooling jacket is sleeved on the outer wall of the pipeline body, the cooling jacket is equipped with cavity, cooling assembly is equipped in the cavity, the outer wall of the pipeline body is wrapped by cooling assembly, still include: pressure relief component, the pressure relief component is used to automatically pressure relief to pipeline body, the pressure relief component is located on the pipeline body, and located cooling jacket side;

[0007] The cooling assembly includes: heat dissipation copper pipe, the heat dissipation copper pipe is wound on the outer wall of the pipeline body;Semiconductor refrigeration sheet, the refrigeration face of the semiconductor refrigeration sheet faces one end of heat dissipation copper pipe, the other side of the semiconductor refrigeration sheet is equipped with heat dissipation fan.

[0008] In the technical solution, when the steam temperature in the pipeline body is high, the semiconductor refrigeration sheet starts to work, and the refrigeration surface thereof faces one end of the heat dissipation copper pipe to transfer heat from the pipeline body to the semiconductor refrigeration sheet through the heat dissipation copper pipe. Meanwhile, the heat dissipation fan starts to work to timely dissipate the heat generated on the other surface of the semiconductor refrigeration sheet. With the continuous transfer and dissipation of heat, the temperature of the pipeline body gradually decreases, and the cooling effect is realized. When the pressure in the pipeline body exceeds the set value, the pressure relief assembly is automatically opened to release the excess pressure, and the safe operation of the pipeline body is ensured.

[0009] In the above technical solution, further, the heat dissipation copper pipe is arranged in a serpentine shape and wound on the outer wall of the pipeline body, so that the uniform cooling effect of the pipeline body is improved.

[0010] In the above technical solution, further, the pipeline body is provided with a placing groove, the semiconductor refrigeration sheet is arranged in the placing groove, a fixing cylinder is arranged outside the placing groove, the heat dissipation fan is arranged in the fixing cylinder, and a dust screen is arranged at the outer end of the fixing cylinder.

[0011] In the technical solution, the heat dissipation fan is installed in the fixing cylinder, can efficiently take away the heat generated by the semiconductor refrigeration sheet through air flow, and the outer end of the fixing cylinder is also provided with a dust screen, which effectively prevents dust and sundries from entering the inside of the fixing cylinder and causing potential damage to the heat dissipation fan and the semiconductor refrigeration sheet.

[0012] In the above technical solution, further, the pressure relief assembly comprises a pressure relief pipe arranged in the air outlet groove and in communication with the inside of the pipeline body, a guide rod arranged at the top end of the pressure relief pipe, a sealing plate slidably connected to the outer wall of the guide rod, and a sealing plug arranged at one end of the sealing plate close to the pressure relief pipe.

[0013] In the above technical solution, further, a stopper is arranged at the top end of the guide rod, the stopper is used to abut against the sealing plate, and the diameter of the stopper is greater than the diameter of the guide rod.

[0014] In the technical solution, when the internal pressure rises to a critical value and needs to be relieved, the internal pressure will push the sealing plate to move upward along the first guide rod, so as to open the pressure relief pipe. The sealing plate moves upward to contact the stopper. Since the diameter of the stopper is greater than the diameter of the first guide rod, the sealing plate is limited and cannot continue to move upward, so that the sealing plate is prevented from being separated from the guide rod. After the pressure relief is completed or the pressure decreases to a safe range, the sealing plate re-seals the pressure relief pipe.

[0015] Furthermore, the above technical solution also includes limiting components, which are located on both sides of the cooling jacket to limit its position. This ensures the stable installation of the cooling jacket on the pipe body and prevents displacement or loosening during operation, thereby improving the structural stability of the entire desuperheating and pressure reducing device.

[0016] In the above technical solution, the limiting component further includes: two symmetrically arranged limiting clamps, one end of the two limiting clamps is rotatably connected to a rotating shaft, the other end of the two limiting clamps is fixedly connected to a threaded rod, and the two threaded rods are fixedly connected to a nut by a common thread on their exterior.

[0017] In this technical solution, when it is necessary to fix the cooling jacket, simply wrap the two limiting clamps tightly around the cooling jacket and rotate the nut. As the nut rotates, the two limiting clamps will gradually be tightened, thereby generating a strong clamping force on the cooling jacket and ensuring that it is securely installed on the pipe body.

[0018] The beneficial effects of this invention are as follows: When the steam temperature inside the pipe body is high, the thermoelectric cooler starts working, with its cooling side facing the heat dissipation copper pipe, transferring heat from the pipe body to the thermoelectric cooler through the copper pipe. Simultaneously, the cooling fan starts working, dissipating the heat generated on the other side of the thermoelectric cooler in a timely manner. With the continuous transfer and dissipation of heat, the temperature of the pipe body gradually decreases, achieving a cooling effect. When the pressure inside the pipe body exceeds a set value, the pressure relief component automatically opens, releasing the excess pressure and ensuring the safe operation of the pipe body. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of a de-heating and de-pressure reducing device according to this utility model;

[0020] Figure 2 This is a cross-sectional view of a de-cooling and de-pressure reducing device according to this utility model;

[0021] Figure 3 This is a schematic diagram of the structure of a pressure relief component of a de-icing and de-stressing device according to this utility model;

[0022] Figure 4 This is a schematic diagram of the structure of a limiting component of a de-heating and de-pressure reducing device according to this utility model;

[0023] The markings in the diagram are as follows:

[0024] 1, pipe body; 2, cooling jacket; 3, cooling assembly; 301, heat dissipation copper pipe; 302, semiconductor refrigeration sheet; 303, fixing cylinder; 304, heat dissipation fan; 305, dust screen; 4, limiting assembly; 401, limiting hoop; 402, rotating shaft; 403, threaded rod; 404, nut; 5, pressure relief assembly; 501, pressure relief pipe; 502, sealing plate; 503, guide rod; 504, sealing plug; 505, stop block. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be clearly described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art belong to the scope of protection of the present application.

[0026] In the description of the present application, it should be noted that the terms used herein are only intended to describe the specific embodiments, and are not intended to limit the exemplary embodiments according to the present application. For the convenience of description, the sizes of the various parts shown in the drawings are not drawn in accordance with the actual proportional relationship. The techniques, methods and devices known to those of ordinary skill in the relevant art can not be discussed in detail, but should be considered as part of the authorized description. In all examples shown and discussed herein, any specific value should be interpreted as merely exemplary, and not as a limitation. Therefore, other examples of exemplary embodiments can have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so further discussion is not needed in the subsequent drawings once an item is defined in one drawing.

[0027] It should be noted that the terms "first", "second" and the like in the specification and claims of the present application are used to distinguish similar objects, and are not intended to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than that illustrated or described herein, and the objects distinguished by "first", "second" and the like are generally of a kind, and do not limit the number of objects, for example, the first object can be one or more. In addition, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / ", generally indicates that the associated objects before and after are in a "or" relationship.

[0028] It should be noted that, in the description of the present application, the orientation words such as "front, back, upper, lower, left, right", "transverse, vertical, perpendicular, horizontal" and "top, bottom" and the like indicated orientation or position relationship is generally based on the orientation or position relationship shown in the drawings, only for the convenience of describing the present application and simplifying the description, without making the opposite statement, these orientation words do not indicate and imply that the device or element referred to must have a particular orientation or be constructed and operated in a particular orientation, therefore, it cannot be understood as a limitation on the scope of protection of the present application; the orientation words "inner, outer" refer to the inner and outer relative to the contour of each component itself.

[0029] It should be noted that in the present application, the terms "comprise", "include" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or device. Without more limitations, the element defined by the sentence "comprises a" does not exclude the existence of other identical elements in the process, method, article or device including the element. In addition, it should be pointed out that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, but can also include performing functions in a substantially simultaneous manner or in the opposite order according to the functions involved, for example, the described method can be performed in an order different from that described, and various steps can also be added, omitted or combined. In addition, the features described with reference to certain examples can be combined in other examples.

[0030] Example 1:

[0031] By Figures 1-4As shown, the embodiment provides a temperature and pressure reducing device, which comprises a pipeline body 1, a cooling jacket 2 sleeved on the outer wall of the pipeline body 1, a cavity in the cooling jacket 2, a cooling assembly 3 in the cavity, the outer wall of the pipeline body 1 being wrapped by the cooling assembly 3, and a pressure relief assembly 5 for automatically relieving the pressure of the pipeline body 1, the pressure relief assembly 5 being arranged on the pipeline body 1 and located at one side of the cooling jacket 2. The cooling assembly 3 comprises heat dissipation copper pipes 301 wound on the outer wall of the pipeline body 1, a semiconductor refrigeration sheet 302 with one surface facing one end of the heat dissipation copper pipes 301, and a heat dissipation fan 304 arranged on the other surface of the semiconductor refrigeration sheet 302. When the steam temperature in the pipeline body 1 is high, the semiconductor refrigeration sheet 302 starts to work, and the refrigeration surface thereof faces one end of the heat dissipation copper pipes 301, so that the heat is transferred from the pipeline body 1 to the semiconductor refrigeration sheet 302 through the heat dissipation copper pipes 301. At the same time, the heat dissipation fan 304 starts to work, and the heat generated on the other surface of the semiconductor refrigeration sheet 302 is promptly dissipated. With the continuous transfer and dissipation of the heat, the temperature of the pipeline body 1 gradually decreases, and the temperature reducing effect is achieved. When the pressure in the pipeline body 1 exceeds the set value, the pressure relief assembly 5 is automatically opened to release the excess pressure, and the safe operation of the pipeline body 1 is ensured.

[0032] Further, the heat dissipation copper pipes 301 are arranged in a serpentine shape and wound on the outer wall of the pipeline body 1, so that the uniform cooling effect of the pipeline body 1 is improved.

[0033] Further, the pipeline body 1 is provided with a placing groove, the semiconductor refrigeration sheet 302 is arranged in the placing groove, a fixing cylinder 303 is arranged outside the placing groove, the heat dissipation fan 304 is arranged in the fixing cylinder 303, and a dustproof net 305 is arranged at the outer end of the fixing cylinder 303. The heat dissipation fan 304 is installed in the fixing cylinder 303, and can efficiently take away the heat generated by the semiconductor refrigeration sheet 302 through air flow. The outer end of the fixing cylinder 303 is also provided with the dustproof net 305, which effectively prevents dust and sundries from entering the inside of the fixing cylinder 303 and causing potential damage to the heat dissipation fan 304 and the semiconductor refrigeration sheet 302.

[0034] Further, the pressure relief assembly 5 comprises a pressure relief pipe 501 arranged in the air outlet groove and in communication with the inside of the pipe body 1, a guide rod 503 arranged at the top end of the pressure relief pipe 501, a sealing plate 502 slidably connected to the outer wall of the guide rod 503, and a sealing plug 504 arranged at one end of the sealing plate 502 close to the pressure relief pipe 501. A stop block 505 is arranged at the top end of the guide rod 503 and used to abut against the sealing plate 502, and the diameter of the stop block 505 is greater than that of the guide rod 503. When the internal pressure rises to a critical value and needs to be relieved, the internal pressure will push the sealing plate 502 to move upward along the first guide rod 503, so as to open the pressure relief pipe 501. The sealing plate 502 moves upward to contact the stop block 505, and since the diameter of the stop block 505 is greater than that of the first guide rod 503, the sealing plate 502 is limited and cannot continue to move upward, so that the sealing plate 502 is prevented from being separated from the guide rod 503. After the pressure relief is completed or the pressure drops to a safe range, the sealing plate 502 re-seals the pressure relief pipe 501.

[0035] Further, the limiting assembly 4 is arranged at both sides of the cooling jacket 2 and used to limit the cooling jacket 2. The stable installation of the cooling jacket 2 on the pipe body 1 is ensured, and displacement or loosening of the cooling jacket 2 during operation is prevented, so as to improve the structural stability of the whole temperature and pressure reducing device.

[0036] Further, the limiting assembly 4 comprises two symmetrically arranged limiting clamps 401, a rotating shaft 402 rotatably connected to one end of the two limiting clamps 401, a threaded rod 403 fixedly connected to the other end of the two limiting clamps 401, and a nut 404 threadedly fixedly connected to the outside of the two threaded rods 403. When the cooling jacket 2 needs to be fixed, the two limiting clamps 401 are only needed to be tightly fitted around the cooling jacket 2, and the nut 404 is rotated. With the rotation of the nut 404, the two limiting clamps 401 will be gradually tightened, so as to generate a strong clamping force on the cooling jacket 2 and ensure that the cooling jacket 2 is stably installed on the pipe body 1.

[0037] The embodiments of the present application are described above in combination with the drawings, and the embodiments and features in the present application can be combined with each other without conflict, and the present application is not limited to the above specific embodiments. The above specific embodiments are only illustrative but not restrictive, and those skilled in the art can make many forms under the guidance of the present application without departing from the scope of the present application and the protection scope of the claims.

Claims

1. A pressure and temperature reducing device, comprising: Pipeline body (1), characterized in that the pipeline body (1) is sleeved with a cooling jacket (2), the cooling jacket (2) is provided with a cavity, the cavity is provided with a cooling assembly (3), the pipeline body (1) is wrapped by the cooling assembly (3), further comprising: a pressure relief assembly (5), the pressure relief assembly (5) is used for automatically relieving the pressure of the pipeline body (1), the pressure relief assembly (5) is arranged on the pipeline body (1) and located on one side of the cooling jacket (2). The cooling assembly (3) comprises: a heat dissipation copper pipe (301) wound on the outer wall of the pipeline body (1); a semiconductor refrigeration sheet (302) with a refrigeration surface facing one end of the heat dissipation copper pipe (301), the other surface of the semiconductor refrigeration sheet (302) being provided with a heat dissipation fan (304).

2. A pressure and temperature reducing device according to claim 1, characterized in that: The heat dissipation copper pipe (301) is arranged in a serpentine shape on the outer wall of the pipeline body (1).

3. A pressure and temperature reducing device according to claim 2, characterized in that: The pipeline body (1) is provided with a placing groove, the semiconductor refrigeration sheet (302) is arranged in the placing groove, the placing groove is provided with a fixing cylinder (303) outside, the heat dissipation fan (304) is arranged in the fixing cylinder (303), and the fixing cylinder (303) is provided with a dust screen (305) at the outer end.

4. A pressure and temperature reducing device according to claim 3, characterized in that: The pressure relief assembly (5) comprises: a pressure relief pipe (501) arranged in the air outlet groove and communicating with the inside of the pipeline body (1), a guide rod (503) arranged at the top end of the pressure relief pipe (501), and a sealing plate (502) slidably connected to the outer wall of the guide rod (503), the sealing plate (502) being provided with a sealing plug (504) near one end of the pressure relief pipe (501).

5. A pressure and temperature reducing device according to claim 4, characterized in that: The guide rod (503) is provided with a stop block (505) at the top end, the stop block (505) is arranged at the top end of the guide rod (503), the stop block (505) is used for abutting against the sealing plate (502), and the diameter of the stop block (505) is greater than the diameter of the guide rod (503).

6. The pressure and temperature reducing device according to claim 1, wherein: Further comprising a limiting assembly (4) arranged on both sides of the cooling jacket (2) and used for limiting the cooling jacket (2).

7. A pressure and temperature reducing device according to claim 6, characterized in that: The limiting assembly (4) comprises: two symmetrically arranged limiting clamps (401), two rotating shafts (402) rotatably connected to one end of the two limiting clamps (401), two screw rods (403) fixedly connected to the other ends of the two limiting clamps (401), and a nut (404) threadedly fixedly connected to the outer portions of the two screw rods (403).

Images