Semiconductor refrigeration module

Abstract

The utility model relates to a semiconductor refrigeration module which comprises at least one semiconductor unit and a temperature control bin tightly attached to the first end face of the semiconductor unit, and the temperature control bin is provided with a medium input end and a medium output end and used for inputting and outputting temperature control media. Compared with the prior art, the utility model has the beneficial effects that according to the Peltier effect principle of a semiconductor, the semiconductor unit is adopted for refrigerating and heating, so that the temperature control medium has two functions of cold conduction and heat conduction, and the refrigerating and heating requirements of equipment can be met; the temperature control bin and the cooling bin are arranged on the two end faces of the semiconductor respectively, temperature control media and cooling liquid are input and output respectively, and efficient refrigeration and temperature control can be achieved. The semiconductor unit is tightly attached to the temperature control bin and the cooling bin, the attaching tightness is guaranteed through the limiting ribs, the heat transfer efficiency is improved, and therefore the refrigeration efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of refrigeration equipment, especially relates to a semiconductor refrigeration module. BACKGROUND

[0002] Frozen beverage making machines, which can also be referred to as semi-frozen beverage making machines or slush beverage making machines, typically include a transparent jar or mixing vessel that receives and processes a beverage product therein, including cooling, often transforming the beverage product from a pure liquid (or a combination of liquid and ice in part) into a frozen or semi-frozen product.

[0003] In this ice making equipment, the conventional compressor is usually used for refrigeration, the cold medium is introduced into the equipment for beverage production, the refrigeration speed is slow, the uniformity of refrigeration is not enough, and temperature control is difficult. SUMMARY

[0004] In order to solve the above problems existing in the prior art, the utility model provides a semiconductor refrigeration module.

[0005] The above problems of the utility model are solved through the following technical scheme:

[0006] A semiconductor refrigeration module comprises at least one semiconductor unit and a temperature control bin closely attached to a first end surface of the semiconductor unit, the temperature control bin is provided with a medium input end and a medium output end for inputting and outputting the temperature control medium.

[0007] The above technical scheme is further provided as follows: further comprising a cooling bin closely attached to a second end surface of the semiconductor unit.

[0008] The cooling bin is provided with a cooling liquid input end and a cooling liquid output end for inputting and outputting the cooling liquid.

[0009] The first end surface and the second end surface are respectively two opposite end surfaces of the semiconductor unit.

[0010] The above technical scheme is further provided as follows: the semiconductor unit is provided with two semiconductor units closely attached to two opposite end surfaces of the temperature control bin respectively; the cooling bin is correspondingly provided with two cooling bins.

[0011] The above technical scheme is further provided as follows: the temperature control bin and the cooling bin extend limited limit rods to one side of the semiconductor unit.

[0012] The above technical scheme is further provided as follows: further comprising a module support, the module support comprises two compression plates on the two sides and a connecting rod for connecting the two compression plates.

[0013] Further settings of the above technical solution are that the two pressing plates are provided with convex surfaces on the end faces facing the inner side of the module support.

[0014] Further settings of the above technical solution are that the upper and lower ends of the pressing plate are provided with mounting holes for mounting the connecting rod, and the mounting holes are located on the upper and lower sides of the cooling bin.

[0015] Further settings of the above technical solution are that the temperature control bin and / or the cooling bin are provided with positioning grooves on the bin covers, and the connecting rod can be clamped into the positioning grooves.

[0016] Compared with the prior art, the utility model has the beneficial effects that:

[0017] 1. According to the Peltier effect principle of the semiconductor, the semiconductor unit is used for refrigeration and heating, so that the temperature control medium has the functions of cold conduction and heat conduction, thereby meeting the refrigeration and heating requirements of the equipment;

[0018] 2. The temperature control bin and the cooling bin are respectively arranged on the two end faces of the semiconductor, and the temperature control medium and the cooling liquid are respectively input and output, so that efficient refrigeration and temperature control can be realized;

[0019] 3. The semiconductor unit is closely attached to the temperature control bin and the cooling bin, and the close attachment is ensured by the limiting ribs, so that the heat transfer efficiency is improved, and the refrigeration efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is an explosion structure schematic diagram of the embodiment.

[0021] Figure 2 It is a whole structure schematic diagram of the embodiment.

[0022] Figure 3 It is a side view of the embodiment.

[0023] Figure 4 It is a structure schematic diagram of the temperature control bin or the cooling bin.

[0024] Figure 5 It is a circuit connection schematic diagram of the two power supply circuits and the semiconductor unit.

[0025] The figures are marked as follows: 100, semiconductor unit; 101, first end face; 102, second end face;

[0026] 200, temperature control bin; 201, medium input end; 202, medium output end;

[0027] 300, cooling bin; 301, cooling liquid input end; 302, cooling liquid output end;

[0028] 400, first power supply circuit;

[0029] 500, second power supply circuit;

[0030] 600, module support; 610, pressing plate; 611, convex surface; 620, connecting rod;

[0031] a, limiting rib; b, positioning groove; c, holding plate. DETAILED DESCRIPTION

[0032] To further illustrate the technical means and effects adopted by the utility model to achieve the predetermined utility model purposes, the specific embodiments, structures, features and effects according to the utility model are described in detail as follows in combination with the drawings and preferred embodiments.

[0033] As shown in Figures 1-5 the embodiment, a semiconductor refrigeration module is disclosed.

[0034] A semiconductor refrigeration module comprises at least one semiconductor unit 100 and a temperature control bin 200 in close contact with a first end surface 101 of the semiconductor unit 100, wherein the temperature control bin 200 is provided with a medium input end 201 and a medium output end 202 for inputting and outputting temperature control medium.

[0035] The above is the basic scheme of the embodiment.

[0036] The semiconductor refrigeration module is connected to a circuit, the circuit is turned on, the first end surface 101 of the semiconductor unit 100 is refrigerated, and the temperature control bin 200 in close contact therewith is heat-absorbed to rapidly cool the temperature control medium in the temperature control bin 200 to make refrigerant, which supplies cold to ice-making or refrigeration equipment.

[0037] The temperature control medium is input into the temperature control bin 200 through the medium input end 201 and is output after being cooled from the medium output end 202 and is input into ice-making or refrigeration equipment along a pipeline for use.

[0038] It should be noted that the semiconductor unit 100 has one refrigeration surface and one heating surface when being powered on, and the two surfaces are opposite surfaces; when the semiconductor unit 100 is powered in reverse, the refrigeration surface and the heating surface are also exchanged. In the embodiment, the semiconductor refrigeration module can be connected to a special control circuit, which can power the semiconductor unit 100 in two directions, that is, the control circuit has two power supply circuits connected to the semiconductor unit 100, the first power supply circuit 400 powers the semiconductor unit 100 in a first current direction, and the second power supply circuit 500 powers the semiconductor unit 100 in a second current direction, the first current direction and the second current direction are opposite, and specific reference is made to Figure 5 .

[0039] When the first power supply circuit 400 is turned on, the current passing through the semiconductor unit 100 is in a first current direction, at this time, the first end surface 101 is a refrigeration surface, and the control chamber absorbs heat;

[0040] When the second power supply circuit 500 is turned on, the current passing through the semiconductor unit 100 is in a second current direction, at this time, the first end surface 101 is a heating surface, and the control chamber is heated.

[0041] Based on the above setting, the semiconductor refrigeration module in the embodiment has both refrigeration and heating functions, and can supply cold or heat to the equipment.

[0042] When the first end surface 101 is refrigerated, the second end surface 102 opposite to the first end surface 101 is heated. In order to cool the semiconductor unit 100, the embodiment further comprises a cooling chamber 300 which is tightly attached to the second end surface 102 of the semiconductor unit 100.

[0043] The cooling chamber 300 is provided with a cooling liquid input end 301 and a cooling liquid output end 302 for inputting and outputting cooling liquid.

[0044] The first end surface 101 and the second end surface 102 are respectively two opposite end surfaces of the semiconductor unit 100.

[0045] With reference to Figure 1 and Figure 2 In the embodiment, the semiconductor unit 100 is provided in a sheet structure, and the structure of the cooling chamber 300 is similar or identical to that of the temperature control chamber 200, that is, a shell with an internal cavity. The temperature control chamber 200 and the cooling chamber 300 are respectively tightly attached to the two opposite first end surface 101 and second end surface 102 of the semiconductor unit 100. When the first end surface 101 is a refrigeration surface, the second end surface 102 is a heating surface. At this time, when the first end surface 101 absorbs heat and cools the temperature control chamber 200, the cooling chamber 300 absorbs heat from the second end surface 102 to cool the semiconductor unit 100 as a whole.

[0046] When the first end surface 101 is a heating surface, the second end surface 102 is a refrigeration surface. At this time, the first end surface 101 heats and warms the temperature control chamber 200, and the temperature of the cooling liquid in the cooling chamber 300 is higher than that of the second end surface 102, that is, the second end surface 102 is heated and kept warm.

[0047] Preferably, in order to improve the temperature control speed, the semiconductor unit 100 is provided with two units, and is respectively tightly attached to the two opposite end surfaces of the temperature control chamber 200; the cooling chamber 300 is correspondingly provided with two units.

[0048] Specifically, with reference to Figure 2And Figure 3 As shown in FIG. 1 and FIG. 2, in the embodiment, the temperature control bin 200 is arranged in the center of the semiconductor refrigeration module, and the first end surface 101 of each of the two semiconductor units 100 is tightly attached to the opposite end surface of the temperature control bin 200, and the second end surface 102 of each of the two semiconductor units 100 is tightly attached to the corresponding cooling bin 300.

[0049] Each of the two cooling bins 300 is provided with a cooling liquid input end 301 and a cooling liquid output end 302.

[0050] In order to ensure the installation position of the semiconductor unit 100 between the temperature control bin 200 and the cooling bin 300, in the embodiment, the temperature control bin 200 and the cooling bin 300 extend a limiting rib a towards the side of the semiconductor unit 100.

[0051] Referring to FIG. 1 and FIG. 2 in detail, Figure 3 And Figure 4 As shown in FIG. 1 and FIG. 2, in the embodiment, the temperature control bin 200 is arranged in the center of the semiconductor refrigeration module, and the first end surface 101 of each of the two semiconductor units 100 is tightly attached to the opposite end surface of the temperature control bin 200, and the second end surface 102 of each of the two semiconductor units 100 is tightly attached to the corresponding cooling bin 300.

[0052] In order to ensure the consistency of the semiconductor refrigeration module, in the embodiment, a module support 600 is further included, and the module support 600 includes two pressing plates 610 and a connecting rod 620 for connecting the two pressing plates 610.

[0053] Referring to FIG. 1 and FIG. 2 in detail, Figures 1-3 As shown in FIG. 1 and FIG. 2, in the embodiment, the module support 600 is arranged outside the semiconductor unit 100, the temperature control bin 200 and the cooling bin 300, i.e., outside the two cooling bins 300 located at the outermost side.

[0054] The connecting rod 620 and the two pressing plates 610 form a containing space, and the semiconductor unit 100, the temperature control bin 200 and the cooling bin 300 are combined and limitedly installed in the containing space, so as to form a complete and independent module.

[0055] In addition, the two pressing plates 610 press the outermost end surface of the two cooling bins 300, and the two pressing plates 610 are fixed through the connecting rod 620, so as to fix the positions of the pressing plates 610 and the cooling bins 300.

[0056] In the embodiment, the end surface of each of the two pressing plates 610 towards the inside of the module support 600 is provided with a convex surface 611.

[0057] In the embodiment, the protruding surface 611 is arranged to compress the middle part of the cooling bin 300, reduce the contact area between the compression plate 610 and the cooling bin 300, and reduce the temperature transfer from the cooling bin 300 to the compression plate 610.

[0058] Specifically, the upper and lower ends of the compression plate 610 are provided with mounting holes for mounting the connecting rod 620, and the mounting holes are located at the upper and lower sides of the cooling bin 300.

[0059] In order to avoid the position interference between the connecting rod 620 and the cooling bin 300 and the temperature control bin 200, in the embodiment, the upper and lower ends of the compression plate 610 protrude from the upper and lower ends of the cooling bin 300 and the temperature control bin 200, and the connecting rod 620 is mounted on the protruding part.

[0060] The connecting rod 620 and the compression plate 610 are fixed by screws.

[0061] In the embodiment, the temperature control bin 200 and / or the cooling bin 300 are provided with a positioning groove b on the bin cover, and the connecting rod 620 can be clamped into the positioning groove b.

[0062] Specifically, as shown in Figure 4 The bin cover of the temperature control bin 200 and / or the cooling bin 300 is provided with a holding plate c, and the holding plate c is integrally formed with the bin cover, and the positioning groove b is recessed at the upper end of the holding plate c.

[0063] In the embodiment, the positioning groove b is arranged as an arc-shaped groove consistent with the outer periphery of the connecting rod 620, and the connecting rod 620 can be embedded into the positioning groove b.

[0064] The above is only a preferred embodiment of the utility model, and does not limit the utility model in any form. Although the utility model has been disclosed as above, it is not intended to limit the utility model. Any person skilled in the art can make some changes or modifications to the above-mentioned equivalent embodiments without departing from the technical solution of the utility model. Any modification, equivalent change and modification of the above-mentioned embodiments without departing from the technical solution of the utility model are still within the scope of the utility model.

Claims

1. A semiconductor refrigeration module, characterized by: The application relates to a temperature control device, which comprises at least one semiconductor unit (100) and a temperature control bin (200) in close contact with a first end surface (101) of the semiconductor unit (100), wherein the temperature control bin (200) is provided with a medium input end (201) and a medium output end (202) for inputting and outputting temperature control medium.

2. The semiconductor refrigeration module of claim 1, wherein: The application further comprises a cooling bin (300) in close contact with a second end surface (102) of the semiconductor unit (100). The cooling bin (300) is provided with a cooling liquid input end (301) and a cooling liquid output end (302) for inputting and outputting cooling liquid. The first end surface (101) and the second end surface (102) are two opposite end surfaces of the semiconductor unit (100).

3. The semiconductor refrigeration module of claim 2, wherein: The semiconductor unit (100) is provided with two semiconductor units, which are in close contact with two opposite end surfaces of the temperature control bin (200); and the cooling bin (300) is correspondingly provided with two cooling bins.

4. The semiconductor refrigeration module of claim 2 or 3, wherein: The temperature control bin (200) and the cooling bin (300) are provided with limiting ribs (a) on the side facing the semiconductor unit (100).

5. The semiconductor refrigeration module of claim 2 or 3, wherein: The application further comprises a module support (600), which comprises two pressing plates (610) and connecting rods (620) for connecting the two pressing plates (610).

6. The semiconductor refrigeration module of claim 5, wherein: The two pressing plates (610) are provided with convex surfaces (611) on the end surface facing the inner side of the module support (600).

7. The semiconductor refrigeration module of claim 5, wherein: The upper and lower ends of the pressing plate (610) are provided with mounting holes for mounting the connecting rod (620), and the positions of the mounting holes are located on the upper and lower sides of the cooling bin (300).

8. The semiconductor refrigeration module of claim 5, wherein: The cover of the temperature control bin (200) and / or the cooling bin (300) is provided with a positioning groove (b), and the connecting rod (620) can be clamped into the positioning groove (b).

Images