Storage device and test data line

Abstract

The utility model discloses a storage device and a test data line. The memory device includes: a circuit board; the control chip is arranged on the circuit board; the storage array is arranged on the circuit board and is coupled with the control chip; one edge position of the circuit board forms a test port through a golden finger. Through the mode, the material cost of the test port can be reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of storage testing, in particular to a storage device and a test data line. BACKGROUND

[0002] Currently, the storage device testing and failure analysis mostly use a Micro HDMI connector as a test port, as shown in the prior art. Figure 1 As shown in the prior art, the circuit board of the storage device is provided with corresponding electronic components and a test port 10, and the test port 10 is formed by using a Micro HDMI connector. Due to the double-row Pin design and small Pin spacing, the SMT patch and X-ray inspection are challenging. During the SMT patch process, the flatness requirement is high, and the size offset tolerance is small, so SMT is prone to cause pin empty welding. In addition, due to the high sensitivity of the current storage device and other products to the dose, X-ray cannot detect with higher clarity, causing a certain degree of welding failure to escape to the product end, affecting product testing and failure analysis. At the same time, the cost of the Micro HDMI connector is high. CONTENT OF THE UTILITY MODEL

[0003] The storage device and the test data line provided by the present application can improve the test stability of the test port and reduce the material cost of the test port.

[0004] In a first aspect, the present application provides a storage device, which comprises: a circuit board; a control chip arranged on the circuit board; a storage array arranged on the circuit board and coupled to the control chip; and a test port formed by a gold finger at an edge position of the circuit board.

[0005] The gold finger comprises a plurality of gold finger pieces.

[0006] The plurality of gold finger pieces are distributed on the same surface of the circuit board.

[0007] The gold finger comprises 10 gold finger pieces.

[0008] The 10 gold finger pieces are sequentially coupled to a LOADER_Mode pin, a GND pin, a TCK pin, a TDI pin, a TDO pin, a TMS pin, a RST pin, a RX pin, a TX pin and a NC pin, respectively.

[0009] The edge position is provided with at least one opening.

[0010] The edge position comprises a first side, a second side and a third side connected in sequence, the first side is provided with a first opening, the second side is provided with a second opening and a third opening, the third side is provided with a fourth opening, and the first side and the third side are arranged opposite to each other.

[0011] In a second aspect, the present application provides a test data line, comprising: a test connector, configured to adapt to the test port in the storage device provided in the first aspect.

[0012] The test connector is provided with an elastic limiting piece, which is adapted to the first opening and the fourth opening at the edge position of the storage device.

[0013] The test connector is provided with a fixed limiting piece, which is adapted to the second opening and the third opening at the edge position of the storage device.

[0014] The beneficial effects of the present application are: different from the prior art, the storage device and the test data line provided by the present application form a test port through a golden finger at an edge position of a circuit board, without setting an HDMI connector to form a test port as in the prior art, which can reduce the material cost of the test port and improve the test stability of the test port. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor. Among them:

[0016] Figure 1 is a structural schematic diagram of an embodiment of the storage device provided by the related art;

[0017] Figure 2 is a structural schematic diagram of another embodiment of the storage device provided by the present application;

[0018] Figure 3 is a structural schematic diagram of an embodiment of the test port provided by the present application;

[0019] Figure 4 is a structural schematic diagram of an embodiment of the test connector provided by the present application;

[0020] Figure 5 is a front view of Figure 4 ;

[0021] Figure 6 is a top view of Figure 5 ;

[0022] Figure 7 is a sectional view of Figure 4 along E-E;

[0023] Figure 8 is a sectional view of Figure 7 ;

[0024] Figure 9 is a structural schematic diagram of one embodiment of the storage device and test connector provided by the present application. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. It can be understood that the specific embodiments described herein are only used to explain the present application, rather than limit the present application. In addition, it should be noted that, for the convenience of description, only the parts related to the present application are shown in the drawings, rather than all the structures. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0026] In this document, reference to“an embodiment” means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase“in an embodiment” in various places in the specification are not necessarily all referring to the same embodiment, nor are they necessarily mutually exclusive of one another. Those skilled in the art will understand that the embodiments described herein can be combined with other embodiments.

[0027] Currently, the storage device test and failure analysis use Micro HDMI connector as the test port, as shown in Figure 1 The circuit board of the storage device is provided with corresponding electronic components and a test port 10, which is composed of a Micro HDMI connector. This connector is challenging for SMT patch and X-ray inspection due to its double-row Pin design and small Pin pitch. During the SMT patch process, the SMT is prone to cause pin empty welding due to the high flatness requirement and small size offset tolerance. In addition, X-ray cannot detect with high clarity due to the high sensitivity of current storage devices and other products to dose, causing a certain degree of poor welding to escape to the product end, affecting product testing and failure analysis. At the same time, the cost of the Micro HDMI connector is high.

[0028] Based on this, the present application proposes to form a test port by a gold finger at the edge position of the circuit board, without setting an HDMI connector to form a test port as in the prior art, which can reduce the material cost of the test port and improve the test stability of the test port. For details, please refer to any of the following embodiments.

[0029] Referring to Figure 2 , Figure 2is a structural schematic diagram of another embodiment of the storage device provided in the present application. The storage device 100 comprises a circuit board, a control chip, a storage array, and a test port 20. In some embodiments, the storage device 100 can be a solid state disk, a mechanical hard disk, a U disk, or the like. In some embodiments, the solid state disk can be an enterprise-level solid state disk.

[0030] In some embodiments, the test port 20 is a separate port, which is different from the power supply end and the data transmission end of the storage device 100. The test port 20 is mainly used for testing after the corresponding components on the circuit board of the storage device 100 are constructed. After the finished product of the storage device 100 is shipped, the test port 20 is arranged in the housing of the storage device 100, and the storage device 100 is exposed to the outside, mainly the power supply end and the data transmission end. In some embodiments, after the finished product of the storage device 100 is shipped, the storage device 100 is exposed to the power supply end, the data transmission end, and the test port 20. Since the test port 20 does not need to be connected to the external device during normal use of the storage device 100, a corresponding shielding member can be arranged on the housing to shield the test port 20 in the housing. When the shielding member is moved, the test port 20 can be exposed for testing.

[0031] The control chip is arranged on the circuit board. The control chip can be composed of a corresponding processing unit.

[0032] The storage array is arranged on the circuit board and coupled to the control chip. The storage array is used to store corresponding data and realize the data storage function.

[0033] An edge position of the circuit board is configured as the test port 20 by a gold finger. As shown in Figure 2 , a separate area is divided at the edge of the circuit board, and the gold finger is arranged in the area to configure the test port 20. In some embodiments, the electronic components of the remaining functions can be arranged on the circuit board. By comparing the test port 10 of Figure 1 and the test port 20 of Figure 2 , Figure 2 the test port 20 of relies on the circuit board, and only needs to arrange the corresponding gold finger on the circuit board, without the complex arrangement of the corresponding HDMI structure on the circuit board as shown in Figure 1 .

[0034] In some embodiments, the gold finger comprises a plurality of gold finger pins (PINs). As shown in Figure 3 , the plurality of gold finger pins are distributed on the same surface of the circuit board. For example, the plurality of gold finger pins are distributed on the upper surface of the circuit board. In other embodiments, the plurality of gold finger pins are distributed on the lower surface of the circuit board. The gold finger pins can be coupled to the corresponding pins on the control chip and coupled to the test equipment through the test port 20 for testing by using the data line.

[0035] Further, as shown in Figure 3 , the golden finger includes 10 golden finger pieces, such as PIN1, PIN2, PIN3, PIN4, PIN5, PIN6, PIN7, PIN8, PIN9, and PIN10. Among them, the 10 golden finger pieces are sequentially coupled with the LOADER_Mode pin, the GND pin, the TCK pin, the TDI pin, the TDO pin, the TMS pin, the RST pin, the RX pin, the TX pin, and the NC pin. That is, PIN1 is coupled with the LOADER_Mode pin, PIN2 is coupled with the GND pin, PIN3 is coupled with the TCK pin, PIN4 is coupled with the TDI pin, PIN5 is coupled with the TDO pin, PIN6 is coupled with the TMS pin, PIN7 is coupled with the RST pin, PIN8 is coupled with the RX pin, PIN9 is coupled with the TX pin, and PIN10 is coupled with the NC pin.

[0036] The LOADER_Mode pin can correspond to a startup mode, mainly used for firmware update and maintenance. In this mode, the device can be programmed through the bootloader or uboot.

[0037] The TCK pin corresponds to the test clock input.

[0038] The TDI pin corresponds to the test data input, and the data is input to the JTAG port through TDI.

[0039] The TDO pin corresponds to the test data output, and the data is output from the JTAG port through TDO.

[0040] The TMS pin corresponds to the test mode selection, and TMS is used to set the JTAG port to a certain specific test mode.

[0041] The RST pin corresponds to the test reset, which is an input pin and is effective at low level. That is, through the above connection mode, the test function of the storage device can be realized.

[0042] Further, at least one opening is provided at the edge position of the test port 20. As shown in Figure 3 , the edge position includes a first side 21, a second side 22, and a third side 23 connected in turn, the first side 21 is provided with a first opening a, the second side 22 is provided with a second opening b and a third opening c, and the third side 23 is provided with a fourth opening d, and the first side 21 and the third side 23 are arranged opposite to each other. That is, as shown in Figure 3 , the first side 21 is located at the left side, the third side 23 is located at the right side, and the second side 22 is located at the upper side. The first opening a, the second opening b, the third opening c, and the fourth opening d can be in corresponding adaptive contact with the structure in the test connection head of the test data line, realizing the close contact between the test port 20 and the test connection head, and then testing.

[0043] Further, the application provides a test data line, which comprises a test connector, the test connector is used for adapting the test port 20 in the storage device 100 in Figure 2 、 Figure 3 and Figure 4 .

[0044] Exemplarily, the application is described in combination with Figure 4 、 Figure 5 、 Figure 6 、 Figure 7 、 Figure 8 .

[0045] The test connector 30 is provided with elastic limit members A and B. The elastic limit members A and B are respectively adapted to the first opening a and the fourth opening d at the edge position of the storage device 100. That is, the elastic limit member A is adapted to the first opening a at the edge position of the storage device 100. The elastic limit member B is adapted to the fourth opening d at the edge position of the storage device 100. When the test port 20 is inserted into the test connector 30, the bending part of the elastic limit member A is arranged in the first opening a, and the bending part of the elastic limit member B is arranged in the fourth opening d, so as to fasten the connection between the test connector 30 and the test port 20, improve the test stability, and reduce the phenomenon of falling off of the test connector and the test port 20 during the test. That is, the elastic limit members A and B are similar to the buckle function, when the test port 20 is inserted into the test connector 30, the elastic limit members A and B fix the test port 20 through the first opening a and the fourth opening d. Wherein, the first opening a and the fourth opening d can be provided in the form of chamfer, which is convenient for adapting the bending part of the elastic limit members A and B when inserted, and increases the smoothness when inserted. The bending part of the elastic limit members A and B can be arc-shaped, which is adapted to the chamfer of the first opening a and the fourth opening d. The elastic limit members A and B can be more closely attached to the first opening a and the fourth opening d by using the elastic force, so as to improve the test stability.

[0046] The test connector 30 is equipped with a fixing limiter C and a fixing limiter D. The fixing limiter C is adapted to the second opening b at the edge of the storage device 100. The fixing limiter D is adapted to the third opening c at the edge of the storage device 100. When the test port 20 is inserted into the test connector 30, the fixing limiter C is positioned within the second opening b, and the fixing limiter D is positioned within the third opening c, thereby ensuring the connection between the test connector 30 and the test port 20 and improving test stability. That is, when the test port 20 is inserted into the test connector 30, the elastic limiter A, elastic limiter B, fixing limiter C, and fixing limiter D work together to ensure the connection between the test connector 30 and the test port 20 and improve test stability.

[0047] In addition, the pins that connect to the gold fingers inside the test connector 30 are also made in the form of elastic sheets. When the test connector 30 is connected to the test port 20, the elastic sheets can fit more tightly to the gold fingers through elastic force, thereby improving test stability.

[0048] In a test scenario, such as Figure 9 As shown, the test port 20 in the storage device 100 can be coupled to the test connector 30 of the test data cable, and then the storage device 100 can be tested through the test equipment connected to the other end of the test data cable. For example, functional testing and failure analysis.

[0049] In summary, the storage device 100 and test data cable provided in this application form a test port at one edge of the circuit board via gold fingers, eliminating the need for an HDMI connector as in the prior art. This reduces the material cost of the test port and improves its test stability.

[0050] In this application, by removing the connector used for testing from the storage device 100 and introducing the data line provided in this application during the testing process, the production yield is improved, the maintenance risk is reduced, and the product quality is improved. At the same time, the data line can be reused, thus solving the yield and quality problems that have long plagued production.

[0051] Furthermore, since this application removes the HDMI connector used for testing in the storage device 100, uses the gold fingers as the test port 20, and the data cable corresponding to the gold fingers can be reused, the material cost and production cost are greatly reduced.

[0052] In several embodiments provided in the present application, it should be understood that the disclosed methods and devices can be implemented in other manners. For example, the embodiments of the device described above are merely schematic. For example, the division of the modules or units is merely logical function division. There can be another division manner in actual implementation. For example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the displayed or discussed mutual couplings between different units, or the displayed or discussed direct couplings between different units, can be indirect couplings or other couplings through some interfaces, devices or units.

[0053] The integrated units in the other embodiments described above, if realized in the form of software function units and sold or used as independent products, can be stored in a computer readable storage medium. Based on such understanding, the technical solutions of the present application, essentially or in part, or all or part of the technical solutions can be embodied in the form of a software product. The computer software product is stored in a storage medium, and includes several instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) or a processor to perform all or part of the steps of the methods described in the various embodiments of the present application. The foregoing storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), magnetic disk or optical disk, and various other media that can store program codes.

[0054] The above descriptions are merely some embodiments of the present application, and do not limit the patent scope of the present application. Any equivalent structure or equivalent flow transformation based on the content of the present application specification and drawings, or direct or indirect application in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A storage device, characterized by, The storage device comprises: a circuit board; a control chip disposed on the circuit board; a storage array disposed on the circuit board and coupled to the control chip; an edge position of the circuit board is configured as a test port by a gold finger.

2. The storage device of claim 1, wherein, The gold finger comprises a plurality of gold finger pieces.

3. The storage device of claim 2, wherein, The plurality of gold finger pieces are distributed on the same side of the circuit board.

4. The storage device of claim 1 or 2, wherein, The gold finger comprises 10 gold finger pieces.

5. The storage device of claim 4, wherein, The 10 gold finger pieces are coupled to a LOADER_Mode pin, a GND pin, a TCK pin, a TDI pin, a TDO pin, a TMS pin, a RST pin, a RX pin, a TX pin and a NC pin in sequence, respectively.

6. The storage device of claim 1, wherein, The edge position is provided with at least one opening.

7. The storage device of claim 6, wherein, The edge position comprises a first side, a second side and a third side connected in sequence, the first side is provided with a first opening, the second side is provided with a second opening and a third opening, the third side is provided with a fourth opening, and the first side and the third side are arranged opposite to each other.

8. A test data line, characterized by, The test data line comprises a test connector for adapting to the test port in the storage device as claimed in any one of claims 1-7.

9. The test data line of claim 8, wherein, The test connector is provided with an elastic limiting piece, and the elastic limiting piece is adapted to the first opening and the fourth opening of the edge position in the storage device.

10. The test data line of claim 8, wherein, The test connector is provided with a fixed limiting piece, and the fixed limiting piece is adapted to the second opening and the third opening of the edge position in the storage device.

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