Diamond-based metal target suitable for high-power-density electron beam

Abstract

The utility model provides a diamond-based metal target suitable for high-power density electron beams, which comprises a diamond base and at least one metal layer, the metal layer is arranged on one surface of the diamond base, and the metal layer is made of metal with high melting point, low vapor pressure and high atomic number. The base material is replaced by the diamond material to be combined with the metal target material for use, the heat conductivity of the diamond material is larger than or equal to 2200 W / mK, heat dissipation of electron beams of the target surface under high density is better facilitated, the X-ray generation efficiency is higher, and the service life of the target surface is prolonged. Compared with the service life of the metal film on the beryllium sheet, the service life of the metal film on the diamond is prolonged by several times; and compared with the originally usable electron beam, the power density is improved, so that the imaging is clearer. The product is simple in structure, good in heat conduction and heat dissipation effect, high in ray excitation efficiency, good in stability, long in service life and beneficial to application and popularization.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of ray target, especially suitable for diamond base metal target of high power density electron beam. BACKGROUND

[0002] X ray, commonly used in medical perspective inspection, is used to detect in industry;X ray can be detected by ion meter, scintillation counter and photosensitive emulsion sheet etc.;X ray diffraction method has become an important means for researching crystal structure, appearance and various defects, and is widely applied. The existing X ray metal target uses beryllium as base material, but the thermal conductivity of beryllium is 180 W / mK, but under the bombardment of high power density electron beam, a large amount of heat will be generated on the target surface, which cannot be dissipated in time, so that the target surface will be ablated, even melted, finally leading to the serious decline of the output quality of X ray. INVENTION CONTENTS

[0003] The utility model provides a diamond base metal target suitable for high power density electron beam can effectively solve above -mentioned problem.

[0004] The utility model is realized as follows:

[0005] A diamond base metal target suitable for high power density electron beam, including diamond base and metal layer, the metal layer is located in the surface of diamond base, the metal layer is equipped with at least one layer, the metal layer is the metal of high melting point, low vapour pressure and high atomic number.

[0006] As further improvement, the metal layer is tungsten layer, copper layer, aluminum layer or gold layer.

[0007] As further improvement, the diameter of the diamond base is not less than 10mm, and the thickness is not less than 250um.

[0008] As further improvement, the diamond base is single crystal diamond.

[0009] As further improvement, the diamond base is polished on at least the metal layer side, and Ra is less than 1nm.

[0010] As further improvement, the diamond base is provided with a copper support, and the diamond base is welded on the copper support.

[0011] As further improvement, the copper support is provided with a cooling groove, a water inlet and a water outlet, the aperture of the cooling groove is smaller than the aperture of the diamond base, the diamond base is welded on the groove opening of the cooling groove, and the water inlet and the water outlet are communicated with the cooling groove;The diamond base is provided with a polishing layer at least in the groove opening connecting area of the cooling groove.

[0012] As a further improvement, a TiPtAu layer is plated on the polishing layer; a gold-tin solder layer or a brazing layer is arranged between the TiPtAu layer and the copper support.

[0013] As a further improvement, the water inlet is arranged at the center of the bottom of the cooling tank and is perpendicular to the diamond base, and the water outlet is arranged at the periphery of the cooling tank and is located at the side or bottom of the cooling tank.

[0014] As a further improvement, an S-shaped water channel or a spiral water channel is arranged in the cooling tank, and the water inlet and the water outlet are arranged at the side of the cooling tank, or the water inlet is arranged at the center of the bottom of the cooling tank and the water outlet is arranged at the side or bottom of the cooling tank.

[0015] As a further improvement, a rough surface is arranged at the corresponding area of the diamond base and the cooling tank.

[0016] The beneficial effects of the present application are as follows: the base material is replaced by diamond material combined with metal target material, the thermal conductivity of the diamond material is greater than or equal to 2200 W / mK, which is more conducive to heat dissipation of the target surface under high-density electron beam operation, the X-ray generation efficiency is higher, and the service life of the target surface is improved. Compared with the service life of the metal film on the beryllium sheet, the service life of the metal film on the diamond is extended by several times; compared with the original electron beam power density, the imaging is more clear. Through further improvement of the corresponding cooling water channel, the cooling effect is improved to meet the excitation requirements of high-power electron beam power density. The product has the advantages of simple structure, good heat dissipation effect, high X-ray excitation efficiency, good stability, long service life, and is conducive to popularization and application. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor.

[0018] Figure 1 is a structural schematic view of a diamond-based metal target suitable for high-power density electron beams provided by an embodiment of the present application;

[0019] Figure 2 is a sectional view of another embodiment of a diamond-based metal target suitable for high-power density electron beams provided by the present application;

[0020] Figure 3 is a sectional view of another embodiment of a diamond-based metal target suitable for high-power density electron beams provided by the present application;

[0021] Figure 4 is a sectional view of another embodiment of the diamond-based metal target suitable for high power density electron beams provided by the present application;

[0022] Figure 5 is a sectional view of another embodiment of the diamond-based metal target suitable for high power density electron beams provided by the present application;

[0023] Figure 6 is a sectional view of another embodiment of the diamond-based metal target suitable for high power density electron beams provided by the present application;

[0024] Figure 7 is Figure 6 is an enlarged structural schematic view of A in FIG.

[0025] Figure 8 is a schematic view of a copper support provided by the embodiment of the diamond-based metal target suitable for high power density electron beams of the present application;

[0026] Figure 9 is a schematic view of a copper support provided by another embodiment of the diamond-based metal target suitable for high power density electron beams of the present application.

[0027] Reference signs:

[0028] is a schematic view of a copper support provided by the embodiment of the diamond-based metal target suitable for high power density electron beams of the present application; DETAILED DESCRIPTION

[0029] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme of the embodiments of the present application will be described clearly and completely below in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present application. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only to represent selected embodiments of the present application.

[0030] In the description of the utility model, the terms "first", "second" are only used for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can be explicitly or implicitly included one or more of the features. In the description of the utility model, the meaning of "multiple" is two or more than two, unless otherwise specifically limited.

[0031] In the description of the utility model, the terms "upper", "middle", "side", "side", "upper side", "end" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, only for the convenience of describing the utility model and simplifying the description, and not indicating or implying that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, therefore, it cannot be understood as a limitation on the utility model.

[0032] Referring to Figures 1-9 As shown in FIG. 1, a diamond-based metal target suitable for high-power density electron beam, comprising a diamond base 1 and a metal layer 2, the metal layer 2 is arranged on a surface of the diamond base 1, the metal layer 2 is at least one layer, and the metal layer 2 is a metal with high melting point, low vapor pressure and high atomic number.

[0033] By sputtering the metal layer 2 on the diamond base 1 as a target for forming rays of bombardment, the heat is quickly conducted and dissipated, avoiding the problem of ablation or even melting of the target surface under the bombardment of high-power density electron beam. The metal layer 2 with high melting point, low vapor pressure and high atomic number is beneficial to form rays under bombardment.

[0034] The metal layer 2 is arranged on the surface of the diamond base 1 on the side of the bombardment surface of the diamond-based metal target.

[0035] Further, the metal layer 2 is a tungsten layer, a copper layer, an aluminum layer or a gold layer. These metals have long service life as target materials.

[0036] Further, the diameter of the diamond base 1 is not less than 10 mm, and the thickness is not less than 250 um.

[0037] Further, the diamond base 1 is a single crystal diamond. Single crystal diamond has better heat conduction and heat dissipation effect.

[0038] Further, the diamond base 1 is polished on at least the side of the metal layer 2 with Ra<1nm. To meet the requirements of plated metal.

[0039] Further, the diamond base 1 is provided with a copper support 3, and the diamond base 1 is welded on the copper support 3.

[0040] The copper support 3 serves as a mounting bracket on one hand, and as a heat conductor on the other hand, conducting and dissipating heat.

[0041] Further, the copper support 3 is provided with a cooling groove 31, a water inlet 32 and a water outlet 33, the diameter of the cooling groove 31 is smaller than that of the diamond base 1, the diamond base 1 is welded to the groove of the cooling groove 31, the water inlet 32 and the water outlet 33 are communicated with the cooling groove 31; the diamond base 1 is provided with a polishing layer 11 at least in the connection area of the groove of the cooling groove 31.

[0042] The water cooling device is added to conduct the heat on the diamond base 1 out. The polishing layer 11 is beneficial to the welding of the diamond base 1 and the copper support 3, and the welding connection can be directly performed by brazing to form a closed cooling space, and the cooling water directly contacts the diamond base 1 to achieve better cooling effect.

[0043] The water inlet and outlet 33 can be diagonally arranged to increase the residence time of the water flow in the cooling groove 31.

[0044] Further, the polishing layer 11 is plated with a Ti PtAu layer 12; a gold-tin solder layer or a brazing layer is arranged between the Ti PtAu layer 12 and the copper support 3.

[0045] The Ti PtAu layer 12 realizes the gold-tin soldering or brazing between the diamond base 1 and the copper support 3, the welding is more stable, and the heat conduction effect is good.

[0046] Further, the water inlet 32 is arranged at the bottom center of the cooling groove 31 and is perpendicular to the diamond base 1, and the water outlet 33 is arranged at the periphery of the cooling groove 31, and the water outlet 33 is located on the side or bottom surface of the cooling groove 31.

[0047] The water inlet 32 is arranged at the bottom of the cooling groove 31, and the water vertically impacts the surface of the diamond base 1 and then diverges to the side and is discharged through the water outlet 33, and the impact water flow can improve the contact effect of the cooling water and the surface of the diamond base 1. The heat is relatively concentrated in the center of the diamond base 1, and the heat is large, and the heat ablation is used to cool the coldest water, and the effect is better.

[0048] Further, the cooling groove 31 is provided with an S-shaped water channel 311 or a spiral water channel 312, the water inlet 32 and the water outlet 33 are arranged on the side of the cooling groove 31, or the water inlet 32 is arranged at the bottom center of the cooling groove 31 and the water outlet 33 is arranged on the side or bottom surface of the cooling groove 31.

[0049] The S-shaped water channel 311 or the spiral water channel 312 increases the contact time of the cooling water and the diamond base 1, and the center entry is also based on the above reasons.

[0050] Further, the diamond base 1 is provided with a rough surface 13 in the corresponding area of the cooling groove 31.

[0051] The formation of the rough surface 13 can not polish the diamond base 1 of the surface, or further through laser etching, so as to form an uneven surface, so as to increase the contact area of the diamond base 1 with the cooling water, and improve the heat conduction effect.

[0052] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. For those skilled in the art, the present application can be variously changed and modified. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A diamond-based metal target suitable for use with high power density electron beams, characterized in that, The diamond base and the metal layer, the metal layer is provided on one surface of the diamond base, the metal layer is provided with at least one layer; the metal layer is tungsten layer, copper layer, aluminum layer or gold layer; the diamond base is provided with copper support, the diamond base is welded on the copper support; the copper support surface is provided with cooling groove, water inlet and water outlet, the cooling groove caliber is less than the caliber of the diamond base, the diamond base is welded on the groove of the cooling groove, the water inlet and the water outlet are communicated with the cooling groove; the diamond base is provided with polishing layer at least with the groove mouth connecting area of the cooling groove.

2. The diamond-based metal target of claim 1, wherein, The diameter of the diamond base is not less than 10mm, and the thickness is not less than 250um.

3. The diamond-based metal target of claim 1, wherein, The diamond base is single crystal diamond.

4. The diamond-based metal target of claim 1, wherein, The polishing layer is plated with TiPtAu layer; the TiPtAu layer and the copper support are provided with gold tin welding layer or brazing layer.

5. The diamond-based metal target of claim 1, wherein, The water inlet is arranged at the bottom center of the cooling groove, and is perpendicular to the diamond base, the water outlet is arranged at the periphery of the cooling groove, and the water outlet is located on the side or bottom surface of the cooling groove.

6. The diamond-based metal target of claim 1, wherein, The cooling groove is provided with S-shaped water channel or spiral water channel, the water inlet and the water outlet are arranged on the side surface of the cooling groove, or the water inlet is located at the bottom center of the cooling groove, and the water outlet is arranged on the side surface or bottom surface of the cooling groove.

7. The diamond-based metal target according to claim 1 or 6, wherein The diamond base and the cooling groove corresponding area are provided with rough surface.

8. The diamond-based metal target of claim 7, wherein, ​

Images