Miniaturized K-band satellite communication up-conversion module

Abstract

A miniaturized K-band satellite communication up-conversion module is provided with an LTCC substrate serving as a packaging substrate, the bottom surface of the LTCC substrate is provided with a BGA solder ball array serving as an external electric connector, the top surface of the LTCC substrate is fixedly provided with a frequency conversion chip, the LTCC substrate is provided with a frequency conversion circuit, and the frequency conversion circuit is connected with the BGA solder ball array. The frequency conversion circuit comprises an intermediate frequency VGA, a temperature compensation attenuator, a frequency generator, a low-pass filter and an alternative switch filtering group, the intermediate frequency VGA and the temperature compensation attenuator are sequentially connected to the input end of the frequency conversion chip, and the frequency generator and the low-pass filter are sequentially connected to the input end of the frequency conversion chip; the output end of the frequency conversion chip is connected with an alternative switch filtering group, and the input end of the intermediate frequency VGA, the input end of the frequency generator and the output end of the alternative switch filtering group are connected with the BGA solder ball array. The up-conversion module can meet the requirement of being mounted on other printed boards, the size is small, and the cost and the power consumption of the module are reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to microwave electron technology field, specifically speak to a kind of miniaturization K wave band satellite communication up-conversion module. BACKGROUND

[0002] The current satellite network microwave up-conversion module is not enough due to the customer demand of satellite communication, so the market has not carried out single-chip integration scheme. Most of the schemes still adopt separate functional devices to build, as shown in Figure 1 、 Figure 2 To achieve 27.5G-31G, the device needs to build dozens of functional devices, and also needs complex matching circuit, local oscillator driving amplifier, etc., leading to complex link, more functional chips, lower integration. Therefore, it leads to higher power consumption and cost, larger volume, and cannot meet the use of patch. UTILITY MODEL CONTENT

[0003] To solve the above technical problems, the utility model provides a kind of miniaturization K wave band satellite communication up-conversion module, so that the up-conversion module can meet the requirement of being mounted on other printed boards, small volume, reduce the cost and power consumption of module.

[0004] To achieve the above technical purpose, the technical scheme adopted is: a kind of miniaturization K wave band satellite communication up-conversion module is provided with LTCC substrate as packaging substrate, BGA solder ball array as external electrical connection port is arranged on the bottom surface of LTCC substrate, frequency conversion chip is fixed on the top surface of LTCC substrate, frequency conversion circuit is arranged on LTCC substrate, the frequency conversion circuit includes intermediate frequency VGA, temperature compensation attenuator, frequency generator, low-pass filter and two alternative switch filter groups, intermediate frequency VGA, temperature compensation attenuator are sequentially connected on the input end of frequency conversion chip, frequency generator and low-pass filter are sequentially connected on the input end of frequency conversion chip, the output end of frequency conversion chip is connected with two alternative switch filter groups, the input end of intermediate frequency VGA, the input end of frequency generator and the output end of two alternative switch filter groups are connected with BGA solder ball array.

[0005] The top of the LTCC substrate is also provided with a metal cover for sealing.

[0006] The metal cover and the top surface of the LTCC substrate are provided with a metal frame for isolating different signals generated by the frequency conversion circuit.

[0007] The metal cover and the surface of the frequency conversion chip are compressed by heat-conducting material.

[0008] The filter of two alternative switch filter group and low-pass filter are arranged in the interior of LTCC substrate.

[0009] The frequency conversion chip is MSTR207 chip.

[0010] The present application has the advantages that:

[0011] 1、The simple circuit architecture adopted in the present application can make the power consumption of the KA satellite communication up-conversion module low, the volume small and the cost low. The use of the mature 5G frequency conversion chip in the KA band satellite communication frequency can improve the module integration, reduce the number of frequency conversion circuit chips, reduce the cost and ensure the excellent electrical performance of the module, while the volume is obviously reduced. The KA satellite communication frequency conversion module can be attached to the antenna array or other PCB board, improving the integration of the whole system. The cost, volume and power consumption of the product are reduced.

[0012] 2、The metal cover is added on the top of the LTCC substrate to increase the sealing and shielding effect.

[0013] 3、The metal frame is used to isolate different signals, so that the signals do not interfere with each other through space. At the same time, the metal cover can be combined to shield the whole module and improve the shielding effect.

[0014] 4、The heat of the frequency conversion chip is conducted upward through the heat-conducting material to cool the frequency conversion chip and improve the service life of the whole module.

[0015] 5、The filters of the two alternative switch filter groups and the low-pass filter are arranged inside the LTCC substrate, which can further reduce the volume of the whole module. DETAILED DESCRIPTION

[0016] Figure 1 is a structural schematic diagram of the prior art;

[0017] Figure 2 is a frequency relationship diagram of Figure 1 ;

[0018] Figure 3 is a structural schematic diagram of the present application;

[0019] Figure 4 is a structural schematic diagram of the present application;

[0020] In the figure: 1, heat-conducting material, 2, metal cover, 3, frequency conversion chip, 4, frequency conversion circuit, 5, metal frame, 6, LTCC substrate, 7, BGA solder ball array, 401, intermediate frequency VGA, 402, temperature compensation attenuator, 403, frequency generator, 404, low-pass filter, 405, two alternative switch filter groups, 4011, digital attenuator, 4012, amplifier. DETAILED DESCRIPTION

[0021] The preferred embodiments of the present invention are given below with reference to the accompanying drawings to illustrate the technical solution of the present invention in detail. The corresponding accompanying drawings will be provided for detailed description of the present invention. It should be particularly noted that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit or restrict the present invention.

[0022] like Figure 3 As shown, a miniaturized K-band satellite communication upconversion module includes an LTCC substrate 6 serving as a packaging substrate. The bottom surface of the LTCC substrate 6 has a BGA solder ball array 7 serving as an external electrical connection port. An upconversion chip 3 is fixed on the top surface of the LTCC substrate 6. An upconversion circuit 4 is also located on the LTCC substrate 6. The surface layer of the LTCC substrate 6 uses thin-film technology to fabricate the chip pins and filters in the circuit. Control, power supply, and some signal lines are routed in the inner layer, connected to surface-mount device pins or circuit patterns via vias, or connected to the BGA solder ball array 7 on the bottom surface. The upconversion chip is fixed to the surface of the top substrate or in slots using conductive adhesive or alloy, bonding the upconversion chip to the surface circuit pattern. The use of a BGA solder ball array 7 in the form of solder balls is advantageous because the solder ball pins are smaller and denser than those of a QFN package, resulting in a smaller upconversion module size. Furthermore, proper routing eliminates the need for circuit matching, leading to a more rational structural arrangement, reduced circuitry, and further reduced module size.

[0023] This upconversion module can be mounted on the transmitting antenna array as a standardized component to achieve signal conversion from intermediate frequency to radio frequency. Alternatively, the upconversion module and downconversion module can be integrated into a single external module mounted outside the array. This miniaturized design significantly reduces the overall size of the frequency conversion module compared to currently available products.

[0024] like Figure 4 As shown, the frequency converter circuit 4 includes an intermediate frequency VGA 401, a temperature-compensated attenuator 402, a frequency generator 403, a low-pass filter 404, and a two-to-one switch filter group 405. The frequency converter circuit 4 requires only five components to complete the input of reference and control signals, intermediate frequency input, and RF output, significantly reducing the overall size and increasing integration. The intermediate frequency VGA 401 and the temperature-compensated attenuator 402 are sequentially connected to the input terminals of the frequency converter chip 3. The frequency generator 403 and the low-pass filter 404 are also sequentially connected to the input terminals of the frequency converter chip 3. The output terminal of the frequency converter chip 3 is connected to the two-to-one switch filter group 405. The input terminals of the intermediate frequency VGA 401, the frequency generator 403, and the output terminal of the two-to-one switch filter group 405 are connected to the BGA solder ball array 7. The intermediate frequency VGA consists of a data attenuator and an amplifier connected in series. The input terminal of the data attenuator is used for intermediate frequency input, and the output terminal of the amplifier is connected to the temperature-compensated attenuator 402. Figure 1The conventional connecting power supply components such as connecting wires, via holes, power sources and the like are omitted. When the components of the frequency conversion circuit are fixed on the top surface of the LTCC substrate 6, the naked chip or the packaged chip can be adopted to realize the frequency conversion circuit, the naked chip is fixed on the surface or the slot of the substrate by the conductive glue or the alloy, and the packaged chip is fixed on the surface of the LTCC by the reflow soldering.

[0025] The top of the LTCC substrate 6 is also provided with a metal cover 2 for sealing, and the metal cover 2 covers the top of the LTCC substrate 6 to realize the shielding of the whole module.

[0026] The metal cover 2 and the top surface of the LTCC substrate 6 are provided with a metal frame 5 for isolating different signals generated by the frequency conversion circuit 4. The frame separates the intermediate frequency, local oscillator, radio frequency and other functional circuits through the surface connection with the LTCC substrate 6, so that the signals do not interfere with each other through the space. The frame and the top cover are welded to ensure the isolation and sealing of the internal circuit of the module from the outside. Since the frame and the top cover are both made of metal, the whole module can be shielded.

[0027] The metal cover 2 and the surface of the frequency conversion chip 3 are pressed by the heat-conducting material, the heat-conducting material conducts heat, and then the metal cover 2 conducts heat to dissipate the heat of the frequency conversion chip.

[0028] The filters of the alternative switch filter group 405 and the low-pass filter 404 can be arranged on the surface or in the interior of the LTCC substrate 6. When arranged in the interior, the size of the whole module is smaller and the integration is higher.

[0029] The frequency conversion chip is the MSTR207 chip, which has a working frequency of 22-31GHz, high output power, low cost and high integration.

[0030] The above is only a preferred example of the utility model, and is not used for limiting or defining the utility model. For the researchers or technicians in the field, the utility model can have various changes and variations. Any modification, equivalent replacement, improvement and the like made within the spirit and principles of the utility model should be included in the protection scope declared by the utility model.

Claims

1. A miniaturized K-band FTH up-conversion module, characterized in that: The application discloses a frequency conversion chip and a frequency conversion circuit thereof, and belongs to the technical field of frequency conversion.

2. The miniaturized K-band FTH up-conversion module of claim 1, wherein: The top of the LTCC substrate (6) is further provided with a metal cover (2) for sealing.

3. The miniaturized K-band satellite communication upconversion module as described in claim 2, characterized in that: The metal cover (2) and the top surface of the LTCC substrate (6) are provided with a metal frame (5) for isolating different signals generated by the frequency conversion circuit (4).

4. A miniaturized K-band satellite communication upconversion module as described in claim 2, characterized in that: The metal cover (2) and the surface of the frequency conversion chip (3) are pressed by a heat-conducting material.

5. A miniaturized K-band satellite communication upconversion module as described in claim 1, characterized in that: The filters of the two-alternative switch filter group (405) and the low-pass filter (404) are arranged in the interior of the LTCC substrate (6).

6. The miniaturized K-band satellite communication upconversion module as described in claim 1, characterized in that: The frequency conversion chip is an MSTR207 chip.

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