Auxiliary driving controller and vehicle

Abstract

The utility model discloses an auxiliary driving controller and a vehicle, the auxiliary driving controller comprises a housing, a mainboard and a heat dissipation assembly, and the housing is provided with an accommodating cavity; the mainboard and the heat dissipation assembly are accommodated in the accommodating cavity; the heat dissipation assembly comprises at least one heat pipe and at least one temperature control part, the heat pipe and the temperature control part abut against the main board, each heat pipe extends in the thickness direction of the main board, and when the temperature of the main board is higher than a first working temperature threshold value of the main board, the face, facing the main board, of the temperature control part conducts refrigeration, and the heat pipes absorb heat transmitted by the main board; and when the external temperature is lower than a second working temperature threshold value of the mainboard, the mainboard is heated by the side, facing the mainboard, of the temperature control part. Thus, when the temperature of the mainboard is higher than the first working temperature threshold value of the mainboard, the heat pipe absorbs heat emitted by the mainboard to achieve the cooling effect, and when the external environment temperature is low, the temperature control part works to transfer heat to the mainboard so as to accelerate the mainboard to recover to the normal working temperature.

Description

TECHNICAL FIELD

[0001] The embodiment of the utility model relates to the field of controller, especially to an auxiliary driving controller and a vehicle. BACKGROUND

[0002] With the increasing popularity of intelligent driving technology, more and more vehicles are equipped with cameras, laser radars, millimeter wave radars, positioning sensors and vehicle-mounted computing devices to realize the function of intelligent auxiliary driving. Generally speaking, in order to realize the function of auxiliary driving, the vehicle usually needs to deploy an auxiliary driving controller, which is used to control the above-mentioned auxiliary devices for realizing intelligent auxiliary driving.

[0003] The auxiliary driving controller usually includes a shell and a mainboard, and the mainboard is provided with chips, MCUs and other functional devices for computing. These functional devices will generate a large amount of heat when working, which will affect the normal work of the components in the mainboard and cause the risk of abnormal work of the auxiliary driving controller, thereby causing inconvenience. UTILITY MODEL CONTENT

[0004] In order to solve the above technical problems, the embodiment of the utility model provides an auxiliary driving controller and a vehicle which can timely dissipate heat.

[0005] The embodiment of the utility model solves its technical problems by adopting the following technical scheme:

[0006] An auxiliary driving controller includes a shell, a mainboard and a heat dissipation assembly, the shell is provided with a containing cavity; the mainboard is accommodated in the containing cavity; the heat dissipation assembly is accommodated in the containing cavity, the heat dissipation assembly includes at least one heat pipe and at least one temperature control piece, the heat pipe and the temperature control piece are in abutment with the mainboard, and each heat pipe is vertically arranged on the mainboard along the thickness direction of the mainboard, wherein when the temperature of the mainboard is higher than the first working temperature threshold of the mainboard, the temperature control piece cools one side of the mainboard, and the heat pipe absorbs the heat transferred by the mainboard; and when the external temperature is lower than the second working temperature threshold of the mainboard, the temperature control piece heats the mainboard.

[0007] In some embodiments, the heat dissipation assembly further includes a heat-conducting filler, the heat-conducting filler is arranged in the containing cavity and in abutment with the mainboard, wherein the heat-conducting filler is provided with at least one first mounting hole and at least one second mounting hole, one heat pipe is arranged in one first mounting hole, and one second mounting hole is arranged with one temperature control piece.

[0008] In some embodiments, the heat-conducting filler includes heat-conducting silica gel, heat-conducting mud or heat-conducting gel.

[0009] In some embodiments, the auxiliary driving controller further comprises a sealing partition accommodated in the accommodating cavity and located at a side of the heat-conductive filler away from the main board, wherein the sealing partition is provided with at least one avoiding opening through which the heat pipe is exposed at the side of the sealing partition away from the main board.

[0010] In some embodiments, the heat pipe is at least two, the avoiding opening is at least two, at least one of the heat pipe is a circular heat pipe, at least one of the heat pipe is a square heat pipe, at least one of the avoiding opening is a square avoiding opening, at least one of the avoiding opening is a circular avoiding opening, one of the circular heat pipe is arranged in one of the circular avoiding opening, and one of the square heat pipe is arranged in one of the square avoiding opening.

[0011] In some embodiments, the shell is provided with an air inlet communicating with the accommodating cavity, the auxiliary driving controller further comprises a blowing member installed on the shell and located at the air inlet, an air inlet end of the blowing member is directed to the air inlet, an air outlet end of the blowing member is directed to the sealing partition, and the blowing member is used for dissipating heat of the exposed part of the heat pipe; and / or, the sealing partition is further provided with at least one second avoiding opening, and one of the second avoiding opening is used for exposing one of the temperature control member.

[0012] In some embodiments, the main board comprises a board body, a connector and a chip, the board body is located in the accommodating cavity, the connector is connected to the board body and partially extends out of the accommodating cavity, the chip is arranged on the board body, and the chip abuts against the heat pipe.

[0013] In some embodiments, the shell comprises an upper shell and a lower shell, the upper shell and the lower shell are distributed along the thickness direction of the main board and connected, and the upper shell and the lower shell enclose the accommodating cavity.

[0014] In some embodiments, the upper shell is provided with a plurality of heat dissipation holes communicating with the accommodating cavity, and the plurality of heat dissipation holes are distributed at the four sides of the upper shell.

[0015] The technical problem of the embodiments of the utility model is solved by adopting the following technical solutions:

[0016] A vehicle comprises the auxiliary driving controller.

[0017] The embodiment of the utility model discloses an auxiliary driving controller, including casing, mainboard and heat dissipation subassembly, and the casing is provided with containing cavity, and the mainboard is contained in containing cavity, and the heat dissipation subassembly is contained in containing cavity, and the heat dissipation subassembly includes at least one heat pipe and at least one temperature control piece, and the heat pipe and temperature control piece all abut with mainboard, and every heat pipe is perpendicular to mainboard along the thickness direction of mainboard, wherein when the temperature of mainboard is higher than the first working temperature threshold value of mainboard, the side of temperature control piece towards mainboard carries out refrigeration, and heat pipe absorbs the heat of mainboard transmission, and when the outside temperature is lower than the second working temperature threshold value of mainboard, the side of temperature control piece towards mainboard heats mainboard, so when the temperature of mainboard is higher than the first working temperature threshold value of mainboard, heat pipe and temperature control piece can cool down mainboard, and when the outside environment temperature is lower, can pass through the work of temperature control piece and transfer the heat of mainboard to speed up mainboard to restore to the temperature of normal working, and it is convenient to use. BRIEF DESCRIPTION OF DRAWINGS

[0018] One or more embodiments are illustrated by way of example in the figures that are part of this disclosure and which are illustrative, but not restrictive, of the present embodiments, wherein elements having the same reference number designates like elements throughout the various figures, and wherein the figures are not necessarily drawn to scale.

[0019] Figure 1 It is the structure schematic diagram of auxiliary driving controller of one embodiment of the application;

[0020] Figure 2 It is Figure 1 The schematic diagram of cutting along the straight line MM in it;

[0021] Figure 3 It is Figure 1 The schematic diagram of cutting along the straight line NN in it;

[0022] Figure 4 It is Figure 1 The explosion view of auxiliary driving controller in it;

[0023] Figure 5 It is Figure 4 The schematic diagram of further explosion of it;

[0024] In the drawing: 1, auxiliary driving controller;2, casing;3, mainboard;4, heat dissipation subassembly;5, sealed partition;

[0025] 201, containing cavity;202, heat dissipation hole;203, opening;204, air inlet;

[0026] 21, upper casing;22, lower casing;

[0027] 31, board body;32, chip;33, connector;

[0028] 331 low-speed connector; 332 Ethernet connector; 333 video data connector;

[0029] 41 heat pipe; 42 temperature control member; 43 heat-conductive filling member;

[0030] 431 first mounting port; 432 second mounting port;

[0031] 501 first avoiding port; 502 second avoiding port. DETAILED DESCRIPTION

[0032] For the purpose of facilitating the understanding of the present application, the present application will be described in more detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that when an element is described as being "fixed to" another element, it can be directly on the other element or one or more intervening elements can be present therebetween. When an element is described as being "connected to" another element, it can be directly connected to the other element or one or more intervening elements can be present therebetween. The terms "upper", "lower", "inner", "outer", "vertical", "horizontal" and the like as used in the present specification indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are merely used for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second" and the like are merely used for the purpose of description and cannot be understood as indicating or implying relative importance.

[0033] Unless otherwise defined, all technical and scientific terms used in the present specification have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs. The terms used in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. The term "and / or" used in the present specification includes any and all combinations of one or more related listed items.

[0034] In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as there is no conflict.

[0035] As Figures 1-3As shown, the auxiliary driving controller 1 provided by one of the embodiments of the present application comprises a shell 2, a mainboard 3 and a heat dissipation assembly 4. The shell 2 is provided with a receiving cavity 201, and the mainboard 3 and the heat dissipation assembly 4 are both received in the receiving cavity 201. The heat dissipation assembly 4 comprises at least one heat pipe 41 and at least one temperature control piece 42. The heat pipe 41 and the temperature control piece 42 are both in abutment with the mainboard 3, and each heat pipe 41 is vertically arranged on the mainboard 3 along the thickness direction Y of the mainboard 3. The heat pipe 41 is used to absorb the heat transferred by the mainboard 3 when the temperature of the mainboard 3 is higher than a first working temperature threshold of the mainboard 3. The temperature control piece 42 is used to cool the side of the mainboard 3 when the ambient temperature is higher than the first working temperature threshold of the mainboard 3, and is used to heat the side of the mainboard 3 when the temperature of the mainboard 3 is lower than a second working temperature threshold of the mainboard 3.

[0036] In this way, when the temperature of the mainboard 3 is higher than the first working temperature threshold of the mainboard 3, the heat pipe 41 absorbs the heat generated by the mainboard 3 during working, so as to play a role in cooling the mainboard 3, thereby reducing the risk of abnormal working of the mainboard 3. Moreover, when the ambient temperature is lower than the second working temperature threshold of the mainboard 3, the heat pipe 41 can be used to transfer heat to the mainboard 3 by working to generate heat, so as to accelerate the recovery of the mainboard 3 to the temperature during normal working, thereby being convenient to use.

[0037] It should be noted that when the mainboard 3 works and generates a large amount of heat, the temperature of the mainboard 3 will rise. If the mainboard 3 is in a high-temperature environment higher than the temperature required for normal working for a long time, the working efficiency of some functional devices on the mainboard 3 will decrease, and even there is a risk of being burned out. Moreover, when the ambient temperature of the mainboard 3 is lower than the temperature required for normal working of the mainboard 3, the functional devices on the mainboard 3 cannot work normally, thereby affecting the starting speed of the auxiliary driving controller 1. Therefore, it is necessary to ensure that the mainboard 3 works in a predetermined temperature range.

[0038] The first working temperature threshold and the second working temperature threshold of the mainboard 3 respectively represent two critical values of the temperature range required for normal working of the mainboard 3, which depend on the working temperature range of each group of functional devices on the mainboard 3. The first working temperature threshold of the mainboard 3 represents the maximum temperature during normal working of the mainboard 3. When the temperature of the mainboard 3 is higher than the first working temperature threshold, the working efficiency of the functional devices (such as chips) on the mainboard 3 will decrease. The second working temperature threshold of the mainboard 3 represents the minimum temperature during normal working of the mainboard 3. When the ambient temperature is lower than the second working temperature threshold, the working efficiency of the functional devices (such as chips) on the mainboard 3 will also decrease, which will affect the starting speed of the auxiliary driving controller 1.

[0039] The heat pipe 41 in the embodiment adopts an existing structure. For the convenience of understanding, the structure of the heat pipe 41 is briefly described below.

[0040] The heat pipe 41 is a heat transfer element with extremely high thermal conductivity, which is composed of a pipe shell, a wick and an end cover. After the pipe is pumped to a negative pressure, an appropriate amount of phase change medium liquid is filled in the pipe, so that the wick capillary porous material close to the inner wall of the pipe is filled with phase change medium. The pipe shell is usually made of high thermal conductivity metal material, such as copper or copper alloy. It is generally divided into evaporation section and condensation section, and the evaporation section is closer to the device requiring heat dissipation than the condensation section. The heat dissipation effect achieved by using the heat pipe 41 is better than that of air cooling or liquid cooling. When working, the evaporation section of the heat pipe 41 is heated and reaches the temperature of the phase change medium in the heat pipe 41. The phase change medium liquid in the capillary tube of the heat pipe 41 rapidly vaporizes and absorbs heat. After vaporization, the temperature inside the heat pipe 41 rises, and the gas pressure increases. The vaporized medium rises to the condensation section under the pressure difference, and liquefies and releases heat at the condensation section. The released heat can be naturally dissipated to the air or accelerated by other structures (such as a fan). The liquefied medium returns to the evaporation section at the bottom of the heat pipe 41 under the action of gravity and capillary pores, forming a heat dissipation cycle of “vaporization heat absorption-liquidization heat release”. Heat is continuously conducted away to achieve the effect of rapidly cooling the mainboard 3.

[0041] The heat pipe 41 of the embodiment of the application is vertically arranged on the mainboard 3 along the thickness direction Y of the mainboard 3. Compared with the horizontal placement of the heat pipe 41, the path of the phase change medium liquid in the capillary tube of the heat pipe 41 is shorter when it vaporizes. This is conducive to the rapid vaporization and upward movement of the phase change medium liquid to absorb the heat emitted by the functional devices below the heat pipe 41, thereby improving the heat dissipation efficiency.

[0042] It can be understood that the shell 2 can have other structures in addition to being distributed in two parts along the thickness direction Y of the mainboard 3. For example, the shell 2 includes a left shell and a right shell distributed along the thickness direction Y perpendicular to the mainboard 3. The left shell and the right shell each have a recessed receiving space, and the left shell and the right shell form an accommodation cavity. In the embodiment, as shown in Figure 2 The shell 2 includes an upper shell 21 and a lower shell 22, the upper shell 21 and the lower shell 22 are distributed along the thickness direction Y of the mainboard 3 and connected, and the upper shell 21 and the lower shell 22 each have a recessed receiving space, and the upper shell 21 and the lower shell 22 form an accommodation cavity 201.

[0043] In some embodiments, as Figures 1-3As shown, the upper shell 21 is provided with a plurality of heat dissipation holes 202 in communication with the accommodating cavity 201, and the plurality of heat dissipation holes 202 are distributed at the four sides of the upper shell 21. In this way, the heat generated by the main board 3 located in the accommodating cavity 201 can be dissipated through the plurality of heat dissipation holes 202, thereby reducing the risk of the auxiliary driving controller 1 being too high in temperature. The lower shell 22 is provided with a plurality of openings 203 for the partial devices of the main board 3 to extend out.

[0044] In some embodiments, as shown, the main board 3 comprises a board body 31, a connector 33 and a chip 32, the board body 31 is located in the accommodating cavity 201, the connector 33 is connected to the board body 31 and partially extends out of the accommodating cavity 201, and the chip 32 is arranged on the board body 31 and abuts against the heat pipe 41. In this way, the heat generated by the chip 32 during operation can be transferred to the heat pipe 41, thereby avoiding the chip 32 being too high in working temperature. Figures 4-5

[0045] It can be understood that the chip 32 has different classifications according to its functions, such as a computing power chip 32, an MCU or others. In addition to the above-mentioned structures, the main board 3 can also comprise other electrical elements, such as resistors, capacitors and the like. As shown, Figure 5

[0046] It should be noted that the number of heat pipes 41 can be set as needed, and the heat pipes 41 can abut against the chip 32 with a larger heat generation or other electrical elements on the board body 31, and the specific setting can be made as needed. In this embodiment, in order to improve the heat dissipation effect, the heat pipe 41 abuts against the chip 32 with a larger heat generation, and a heat-conducting medium (such as heat-conducting gel, heat-conducting silicone and the like) with high heat-conducting performance can be coated between the heat pipe 41 and the chip 32 to reduce the thermal resistance and improve the heat conduction efficiency. The temperature control member 42 can be in direct contact with the main board 3 or in indirect contact, as long as it can cool down to dissipate heat when the main board 3 exceeds the first working temperature threshold and heat up to heat the main board 3 in a low-temperature environment.

[0047] In some embodiments, the temperature control member 42 is a Peltier element, which is a component made of two different materials according to the Peltier principle. When the positive direction is powered on, one side generates heat and the other side cools down, and when the reverse direction is powered on, the cold side and the hot side are exchanged.

[0048] ​​Peltier principle refers to the DC through two different conductive materials (usually semiconductors or metals) heterojunction, junction zone will be accompanied by non-joule heat absorption or release: the direction of the current changes, the direction of heat absorption / heat release will also be reversed. Its physical nature is the energy transition of carriers (electrons or holes) at the heterojunction interface, which needs to be combined with the potential energy difference of the material. Different materials have different Fermi levels: the Fermi level is the highest energy level occupied by electrons in the material, which directly determines the energy state of the carriers. When two materials form a junction, the carriers will migrate from the material with a high Fermi level to the material with a low Fermi level to achieve energy balance. There are two cases of energy exchange: (1) for the heat absorption end: if the carrier jumps from the "low potential energy material" to the "high potential energy material", it needs to absorb energy from the outside (to overcome the potential difference), resulting in a decrease in the temperature of the junction zone; (2) for the heat release end: if the carrier jumps from the "high potential energy material" to the "low potential energy material", the excess energy is released in the form of heat, resulting in an increase in the temperature of the junction zone.

[0049] It can be understood that the material selection and the working temperature setting of the Peltier element can be adjusted according to the different heat dissipation intensities required by the different power consumptions of the auxiliary driving controller 1. For example, when the auxiliary driving controller 1 with a current power consumption of 100W is working, the temperature can be as high as 100℃, and the reverse power dissipation temperature of the Peltier element can be set to 70℃. When the power consumption of the auxiliary driving controller 1 is higher, the working temperature can be as high as 150℃, and the reverse power dissipation temperature of the Peltier element can be set to 80℃ or even 100℃.

[0050] It should be understood that the temperature control member 42 can be other structures in addition to the Peltier element, as long as it can transfer heat and cool the mainboard 3 according to the scene needs.

[0051] In some embodiments, as shown in Figure 5 The heat dissipation assembly 4 further includes a heat-conducting filler 43, which is arranged in the accommodating cavity 201 and abuts against the mainboard 3. The heat-conducting filler 43 is used to conduct the heat emitted by the mainboard 3, so as to play a role in dissipating heat for the mainboard 3. In this embodiment, the heat-conducting filler 43 is provided with at least one first mounting opening 431 and at least one second mounting opening 432. One heat pipe 41 is arranged in one first mounting opening 431, and one temperature control member 42 is arranged in one second mounting opening 432. In this way, the first mounting opening 431 and the second mounting opening 432 can fix the heat pipe 41 and the temperature control member 42, and the heat absorbed by the heat pipe 41 can be directly diffused outward through the first mounting opening 431, which is conducive to improving the heat dissipation efficiency.

[0052] It can be understood that the shape of the first mounting hole 431 is similar to the shape of the heat pipe 41, when the heat pipe 41 is a circular heat pipe 41, then the shape of the first mounting hole 431 is a circular hole. When the heat pipe 41 is a square heat pipe 41, then the shape of the first mounting hole 431 is a square shape. Similarly, the shape of the second mounting hole 432 is similar to the shape of the temperature control piece 42, for example, when the shape of the temperature control piece 42 is a square, then the shape of the second mounting hole 432 is a square shape.

[0053] The heat-conducting filling piece 43 can be heat-conducting silica gel, heat-conducting mud or heat-conducting gel, and of course can be other shapes, which can be selected according to needs, as long as heat conduction can be achieved. Of course, in order to avoid short circuit when the heat-conducting filling piece 43 contacts the components on the mainboard 3, the heat-conducting filling piece 43 needs to have insulation performance.

[0054] In some embodiments, as shown in Figure 5 The auxiliary driving controller 1 also includes a sealing partition plate 5, which is accommodated in the accommodating cavity 201 and located on the side of the heat-conducting filling piece 43 away from the mainboard 3. The sealing partition plate 5 is provided with at least one first avoiding hole 501, and the heat pipe 41 passes through the first avoiding hole 501 and is exposed on the side of the sealing partition plate 5 away from the mainboard 3. That is, the end of the heat pipe 41 away from the mainboard 3 is exposed to the sealing partition plate 5 through the first avoiding hole 501, so that the phase change medium in the end of the heat pipe 41 away from the mainboard 3 can be liquefied in time to release heat, thereby achieving the purpose of heat dissipation. Moreover, the sealing partition plate 5 abuts against the heat-conducting filling piece 43, and the sealing partition plate 5 can absorb the heat transferred by the heat-conducting filling piece 43, thereby playing a role in heat dissipation.

[0055] It can be understood that the shape of the first avoiding hole 501 is similar to the shape of the heat pipe 41, that is, the shape of the first avoiding hole 501 changes with the shape of the heat pipe 41, for example, when the heat pipe 41 is a circular heat pipe 41, then the shape of the first avoiding hole 501 is a circular hole. When the heat pipe 41 is a square heat pipe 41, then the shape of the first avoiding hole 501 is a square shape. In this embodiment, there are at least two heat pipes 41, at least two first avoiding holes 501, at least one heat pipe 41 is a circular heat pipe 41, at least one heat pipe 41 is a square heat pipe 41, at least one first avoiding hole 501 is a square avoiding hole, and at least one first avoiding hole 501 is a circular avoiding hole. One circular heat pipe 41 is arranged in one circular avoiding hole, and one square heat pipe 41 is arranged in one square avoiding hole.

[0056] It should be noted that the first avoiding port 501 and the heat pipe 41 need to be sealed, that is, the gap between the first avoiding port 501 and the outer wall surface of the heat pipe 41 needs to be filled to avoid liquid or dust entering the heat-conducting filler 43 through the first avoiding port 501 and falling on the mainboard 3, thereby affecting the normal work of the mainboard 3. In the embodiment, the gap between the first avoiding port 501 and the heat pipe 41 is filled with sealant.

[0057] In some embodiments, as shown in Figure 5 The sealing partition plate 5 is also provided with at least one second avoiding port 502, and one second avoiding port 502 is used to expose one temperature control member 42, so that when one side of the temperature control member 42 faces the mainboard 3 to perform refrigeration, the other side of the temperature control member 42 away from the mainboard 3 can dissipate heat to the side of the sealing partition plate 5 away from the heat-conducting filler 43 through the second avoiding port 502, so as to reduce the adverse effects on the mainboard 3.

[0058] Similarly, the second avoiding port 502 and the temperature control member 42 need to be sealed, that is, the gap between the second avoiding port 502 and the outer wall surface of the temperature control member 42 needs to be filled to avoid liquid or dust entering the heat-conducting filler 43 through the second avoiding port 502 and falling on the mainboard 3, thereby affecting the normal work of the mainboard 3. In the embodiment, the gap between the second avoiding port 502 and the temperature control member 42 is filled with sealant.

[0059] It can be understood that, in order to facilitate installation, a plurality of first avoiding ports 501 need to be distributed and arranged at positions where the heat-conducting filler 43 is located corresponding to a plurality of first mounting ports 431, and a plurality of second avoiding ports 502 need to be distributed and arranged at positions where the heat-conducting filler 43 is located corresponding to a plurality of second mounting ports 432, that is, along the thickness direction Y of the mainboard 3, the first avoiding port 501 is located directly above the first mounting port 431, and the second avoiding port 502 is located directly above the second mounting port 432.

[0060] In some embodiments, as shown in Figure 5As shown, the shell 2 is provided with an air inlet 204 in communication with the accommodating cavity 201, and the auxiliary driving controller 1 further comprises an air supply member (not shown in the figure), which is installed on the shell 2 and located at the air inlet 204, the air inlet end of the air supply member faces the air inlet 204, and the air outlet end of the air supply member faces the sealing partition plate 5, and the air supply member is used for heat dissipation of the exposed part of the heat pipe 41. In this way, the air supply member can accelerate the heat dissipation of the heat pipe 41, compared with the natural heat dissipation mode of the heat pipe 41, which is conducive to improving the heat dissipation efficiency. Moreover, the air blown by the air supply member to the sealing partition plate 5 can also act on the temperature control member 42, which is conducive to the rapid dissipation of the heat emitted by the temperature control member 42, reduces the risk of heat accumulation on the side of the sealing partition plate 5 away from the main board 3, and is conducive to improving the stability of the auxiliary driving controller 1. In the embodiment, the air supply member is a fan and is located in the accommodating cavity 201, and the number of air inlets 204 is two, and the number of fans is correspondingly provided with two.

[0061] It can be understood that when the air supply member blows air to the sealing partition plate 5, dust in the air will be blown to the sealing plate, and in order to avoid the dust entering the main board 3 through the gap between the sealing partition plate 5 and the shell 2, causing the risk of short circuit of the main board 3, the four sides adjacent to the sealing partition plate 5 and the shell 2 need to be glued to isolate the space on the side of the sealing partition plate 5 away from the main board 3 from the space where the main board 3 is located, which is conducive to improving the stability of the main board 3.

[0062] It can be understood that the above-mentioned temperature control member 42 and air supply member can be connected to the main board 3 by a cable, so that the external power supply supplies power to the main board 3 at the same time. The temperature control member 42 and the air supply member are powered. Of course, the above-mentioned temperature control member 42 and air supply member can also be directly connected to the external power supply by a cable, which can be set as needed.

[0063] It should be noted that the number of heat dissipation assemblies 4 is not limited to the case shown in the group Figures 4-5 The specific number can be appropriately increased according to the power consumption of the auxiliary driving controller 1. For example, when the power consumption of the auxiliary driving controller 1 exceeds 300w, the chips 32 on the main board 3 can be arranged on the opposite end faces of the board body 31, and the heat dissipation assemblies 4, i.e. the heat-conducting filling members 43, the heat pipes 41 and the temperature control members 42, are arranged on the opposite end faces of the board body 31, so as to dissipate heat from the chips 32 on the opposite end faces of the board body 31. Moreover, in order to improve the heat dissipation efficiency, the other end face of the board body 31 can also be provided with a sealing partition plate 5 and an air supply member. It should be understood that the heat pipe 41 located at the lower end of the board body 31 relies on the capillary force to form the circulation of the phase change medium. In some embodiments, the auxiliary driving controller 1 can also be provided with a liquid cooling structure, which adopts the existing structure, which will not be described here. However, it should be noted that the specific setting of the liquid cooling structure cannot hinder the normal work of the heat pipe 41.

[0064] The auxiliary driving controller 1 provided by the embodiment of the application comprises a shell 2, a mainboard 3 and a heat dissipation assembly 4, the shell 2 is provided with a containing cavity 201, the mainboard 3 is contained in the containing cavity 201, and the heat dissipation assembly 4 is contained in the containing cavity 201, the heat dissipation assembly 4 comprises at least one heat pipe 41 and at least one temperature control piece 42, the heat pipe 41 and the temperature control piece 42 are both in abutment with the mainboard 3, and each heat pipe 41 is vertically arranged on the mainboard 3 along the thickness direction Y of the mainboard 3, wherein when the temperature of the mainboard 3 is higher than a first working temperature threshold of the mainboard 3, one side of the temperature control piece 42 facing the mainboard 3 is cooled, the heat pipe 41 absorbs the heat transferred by the mainboard 3, so that the mainboard 3 can be cooled, and when the external temperature is lower than a second working temperature threshold of the mainboard 3, one side of the temperature control piece 42 facing the mainboard 3 heats the mainboard 3, so that the mainboard 3 can be quickly restored to the temperature during normal working, and the auxiliary driving controller 1 is convenient to use.

[0065] The vehicle provided by another embodiment of the application comprises the auxiliary driving controller 1 in the above embodiment, and the vehicle further comprises a vehicle body, and the auxiliary driving controller 1 is mounted on the vehicle body.

[0066] The above description is only the embodiment of the application, and does not limit the patent range of the application, and any equivalent structure or equivalent process transformation or direct or indirect application in other related technical fields based on the content of the specification and drawings of the application are also included in the patent protection range of the application.

Claims

1. An assisted driving controller, characterized by, The auxiliary driving controller comprises: a shell provided with a receiving cavity; a main board accommodated in the receiving cavity; a heat dissipation assembly accommodated in the receiving cavity, the heat dissipation assembly comprising at least one heat pipe and at least one temperature control element, the heat pipe and the temperature control element both abutting against the main board, and each of the heat pipes being vertically arranged on the main board along the thickness direction of the main board, wherein when the temperature of the main board is higher than a first working temperature threshold of the main board, the temperature control element cools down one side of the main board, and the heat pipe absorbs the heat transferred by the main board; and when the external temperature is lower than a second working temperature threshold of the main board, the temperature control element heats up the main board from one side of the main board.

2. The assisted driving controller of claim 1, wherein, The heat dissipation assembly further comprises a heat-conductive filling piece arranged in the receiving cavity and abutting against the main board, wherein the heat-conductive filling piece is provided with at least one first mounting hole and at least one second mounting hole, one heat pipe is arranged in one first mounting hole, and one temperature control element is arranged in one second mounting hole.

3. The assisted driving controller of claim 2, wherein, The heat-conductive filling piece comprises heat-conductive silica gel, heat-conductive mud or heat-conductive gel.

4. The assisted driving controller of claim 2, wherein, Further comprising a sealing partition plate accommodated in the receiving cavity and located on the side of the heat-conductive filling piece away from the main board, wherein the sealing partition plate is provided with at least one first avoiding hole, and the heat pipe passes through the first avoiding hole and is exposed on the side of the sealing partition plate away from the main board.

5. The assisted driving controller of claim 4, wherein, The heat pipe is at least two, the first avoiding hole is at least two, at least one of the heat pipes is a circular heat pipe, at least one of the heat pipes is a square heat pipe, at least one of the first avoiding holes is a square avoiding hole, at least one of the first avoiding holes is a circular avoiding hole, one circular heat pipe is arranged in one circular avoiding hole, and one square heat pipe is arranged in one square avoiding hole.

6. The assisted driving controller of claim 4, wherein, The shell is provided with an air inlet communicating with the receiving cavity, and the auxiliary driving controller further comprises an air supply piece mounted on the shell and located at the air inlet, an air inlet end of the air supply piece facing the air inlet, and an air outlet end of the air supply piece facing the sealing partition plate, the air supply piece being used for dissipating heat of the exposed part of the heat pipe; and / or, the sealing partition plate is further provided with at least one second avoiding hole, and one second avoiding hole is used for exposing one temperature control element.

7. The assisted driving controller of claim 1, wherein, The main board comprises a board body, a connector and a chip, the board body being located in the receiving cavity, the connector being connected to the board body and partially extending out of the receiving cavity, the chip being arranged on the board body and abutting against the heat pipe; and / or, the temperature control element is a Peltier element.

8. The assisted driving controller according to any one of claims 1-7, wherein, The shell comprises an upper shell and a lower shell, the upper shell and the lower shell being distributed along the thickness direction of the main board and connected, and the upper shell and the lower shell enclosing the receiving cavity.

9. The assisted driving controller of claim 8, wherein, The upper shell is provided with a plurality of heat dissipation holes communicating with the receiving cavity, and the plurality of heat dissipation holes are distributed at intervals on the four sides of the upper shell.

10. A vehicle characterized by comprising: The auxiliary driving controller comprises any one of claims 1-9.

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