Intelligent power module

Abstract

The utility model provides an intelligent power module. In the intelligent power module, the front surface of a printed circuit board is provided with a first chip bearing pad and a second chip bearing pad, the second chip bearing pad is arranged close to the first chip bearing pad, a power chip is mounted on the first chip bearing pad, and a driving chip is mounted on the second chip bearing pad. The power chip, the driving chip and the printed circuit board are electrically connected through corresponding bonding wires, and the encapsulation layer is located on the front face of the printed circuit board and wraps the power chip, the driving chip and the bonding wires. The intelligent power module is low in manufacturing cost, small in packaging size and high in electrical performance, heat dissipation performance and reliability.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of packaging technology, especially to an intelligent power module. BACKGROUND

[0002] With the continuous development of power electronics technology, intelligent power modules (IPM) are increasingly widely used in industrial control, motor drive, new energy power generation and many other fields. The traditional IPM packaging method has some limitations, for example, lead frames and packaging shells are used. Due to the complex packaging process and the consumption of a large amount of packaging materials, the production efficiency is low, the production cost is high, and the economic benefit is poor. Due to the limitations of the lead frame, the connection line between the internal chips and the external circuit of the module is long, resulting in large parasitic inductance and resistance, which not only increases power loss, but also may cause electromagnetic interference problems, affecting the electrical performance of the IPM. In addition, the heat dissipation efficiency of the traditional IPM also needs to be improved. In high-power application scenarios, the heat generated by the chip cannot be dissipated in time, which will cause the chip temperature to rise, thereby reducing its working efficiency and service life. SUMMARY

[0003] The utility model provides a kind of intelligent power module, which can reduce manufacturing cost and packaging volume, improve the electrical performance, heat dissipation performance and reliability of intelligent power module.

[0004] To achieve the above purpose, the intelligent power module provided by the utility model comprises: a printed circuit board having a first chip carrier pad and a second chip carrier pad on its front surface, with the second chip carrier pad being arranged close to the first chip carrier pad; a power chip mounted on the first chip carrier pad; a drive chip mounted on the second chip carrier pad; a plurality of bonding wires electrically connecting the power chip, the drive chip and the printed circuit board via corresponding bonding wires; and a potting layer located on the front surface of the printed circuit board, wrapping the power chip, the drive chip and the plurality of bonding wires.

[0005] Optionally, the intelligent power module further comprises an adhesive material layer arranged between the power chip and the first chip carrier pad, and between the drive chip and the second chip carrier pad.

[0006] Optionally, the adhesive material layer is silver glue or solder.

[0007] Optionally, the printed circuit board comprises a substrate and a metal circuit layer on the surface of the substrate.

[0008] Optionally, the substrate is a ceramic substrate or an aluminum nitride substrate.

[0009] Optionally, the power chip comprises a MOS tube, or the power chip comprises an insulated gate bipolar transistor and a freewheeling diode.

[0010] Optionally, the smart power module comprises two or more power chips.

[0011] Optionally, the potting layer covers part of the front surface of the printed circuit board.

[0012] Optionally, the smart power module is a half-bridge smart power module or a full-bridge smart power module.

[0013] Optionally, the smart power module is a COB type packaging module.

[0014] In the smart power module, the front surface of the printed circuit board has a first chip bearing pad and a second chip bearing pad, the second chip bearing pad is arranged close to the first chip bearing pad, a power chip is attached to the first chip bearing pad, a drive chip is attached to the second chip bearing pad, the power chip, the drive chip and the printed circuit board are electrically connected through corresponding bonding wires, and a potting layer is located on the front surface of the printed circuit board and wraps the power chip, the drive chip and the bonding wires. In this way, the smart power module does not need to use a lead frame and a packaging shell, the use of packaging materials is reduced, the packaging process is simplified, the manufacturing cost is reduced, the production efficiency is improved, the overall structure of the smart power module is more compact, and the packaging volume is smaller. In the smart power module, the drive chip and the power chip are directly attached to the printed circuit board, the first chip bearing pad and the second chip bearing pad on the printed circuit board have high design flexibility, the first chip bearing pad and the second chip bearing pad can be arranged close to each other to the maximum extent, the length of the bonding wires between the chips can be greatly shortened, the parasitic inductance and resistance can be effectively reduced, the voltage spike and current oscillation in the switching process are reduced, the switching speed and efficiency are improved, the power loss and electromagnetic interference are reduced, and the high-frequency performance of the smart power module is significantly improved, that is, the electrical performance of the smart power module can be significantly improved. In addition, since the chips are directly attached to the printed circuit board, the thermal resistance layer between the chips and the packaging shell in the traditional packaging is reduced, the heat conduction path is shorter, the thermal resistance is smaller, the heat in the chips is more easily dissipated, the heat dissipation effect is better, and the reliability of the smart power module is improved. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 FIG. 1 is a schematic diagram of the internal structure of a smart power module according to an embodiment of the present application.

[0016] Figure 2 FIG. 2 is a circuit diagram of the smart power module according to the embodiment of the present application.

[0017] Figure 3 The utility model provides a front view schematic drawing of printed circuit board of intelligent power module of an embodiment.

[0018] Mark explanation: 100 - printed circuit board, 101 - first chip bearing pad, 102 - second chip bearing pad, 103 - potting material setting area, 201 - power chip, 202 - drive chip, 300 - bonding wire. DETAILED DESCRIPTION

[0019] The utility model provides intelligent power module further detailedly below combining with the drawings and specific embodiment. According to the following explanation, the advantages and characteristics of the utility model will be more clear. It is stated that, the drawings all adopt very simplified form and all use non-precise proportion, just to facilitate, clear and assist the purpose of the utility model embodiment.

[0020] It is stated that, the term " first " " second " used in the application is only for the purpose of description, and can not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with " first " " second " can explicitly or implicitly include one or more features. In the description of the application, the meaning of " multiple " is two or two or more, and at least one refers to one, two or two or more, unless otherwise specifically limited.

[0021] Figure 1 The utility model provides an internal structure schematic drawing of intelligent power module of an embodiment. Figure 2 The utility model provides an internal circuit diagram of intelligent power module of an embodiment. Figure 3 The utility model provides a front view schematic drawing of printed circuit board of intelligent power module of an embodiment.

[0022] Reference Figures 1 to 3 As shown, the intelligent power module provided by the embodiment includes printed circuit board 100, power chip 201, drive chip 202, a plurality of bonding wires 300 and potting layer, the front of printed circuit board 100 has first chip bearing pad 101 and second chip bearing pad 102, and the second chip bearing pad 102 is close to the first chip bearing pad 101 and is arranged, the power chip 201 is attached on the first chip bearing pad 101, the drive chip 202 is attached on the second chip bearing pad 102, the power chip 201, the drive chip 202 and the printed circuit board 100 are electrically connected through corresponding bonding wire 300, the potting layer is located on the front of printed circuit board 100, and the power chip 201, the drive chip 202 and a plurality of bonding wire 300 are wrapped.

[0023] Exemplarily, the printed circuit board 100 can include a substrate and a metal circuit layer located on a surface of the substrate.

[0024] The substrate can be made of an insulating material with high thermal conductivity, for example, a ceramic substrate or an aluminum nitride substrate, which helps the printed circuit board 100 to effectively dissipate the heat of the chip mounted thereon.

[0025] The front surface and the back surface of the substrate can be provided with a single-layer or multi-layer metal circuit layer, which is used for electrical connection and heat dissipation. The material of the metal circuit layer includes, but is not limited to, metal materials such as aluminum (Al), copper (Cu), gold (Au), silver (Ag), chromium (Cr), titanium (Ti), or tungsten (W), and can also include alloy materials of the above metal materials.

[0026] It should be noted that the first chip carrier pad 101 and the second chip carrier pad 102 can be part of the top metal circuit layer of the front surface of the substrate; the top metal circuit layer is also provided with other pads, which can be used to carry the bonding wire 300. Since the design flexibility of the metal circuit layer on the surface of the printed circuit board 100 is high, i.e., the design flexibility of the first chip carrier pad 101 and the second chip carrier pad 102 is high, the first chip carrier pad 101 and the second chip carrier pad 102 can be maximally close to each other under the condition of meeting the electrical isolation requirement, thereby greatly shortening the length of the bonding wire between the chips arranged on the chip carrier pads, which helps to improve the electrical performance of the intelligent power module.

[0027] Reference Figure 1 and Figure 3 As shown in FIGS. 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73, 74, 75, 76, 77, 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93, 94, 95, 96, 97, 98, 99, and 100, the number of the first chip carrier pad 101 and the second chip carrier pad 102 on the printed circuit board 100 can be one or more, for example, the front surface of the printed circuit board 100 has two first chip carrier pads 101 and one second chip carrier pad 102.

[0028] Exemplarily, the thickness and area of the printed circuit board 100 can be optimally designed according to the power level and application scenario of the intelligent power module, to ensure that the intelligent power module has good heat dissipation effect and electrical performance.

[0029] In this embodiment, the power chip 201 is mounted on the first chip carrier pad 101. Exemplarily, the power chip 201 includes a MOS tube, or the power chip 201 includes an insulated gate bipolar transistor (IGBT) and a freewheeling diode, but is not limited thereto.

[0030] In the embodiment shown, the back of the power chip 201 is attached to the first chip carrier pad 101, and the front of the power chip 201 has a plurality of chip pads that can be used to set the bonding wires 300 to achieve electrical connection of the power chip 201 to other chips and / or the printed circuit board 100.

[0031] Referring to Figures 1 to 3 In the embodiment shown, the smart power module includes two power chips 201. In other embodiments, the number of power chips 201 in the smart power module can be set according to performance needs.

[0032] Referring to Figure 1 and Figure 3 In the embodiment shown, the drive chip 202 is attached to the second chip carrier pad 102, and the drive chip 202 can provide drive signals for the power chip 201. The drive chip 202 can be customized according to specific application needs to meet different operating modes and control strategies. The drive chip 202 can integrate functions such as overcurrent protection, overvoltage protection, temperature monitoring and control, i.e., the drive chip 202 can integrate circuits such as overcurrent protection, overvoltage protection, temperature monitoring and control.

[0033] In the embodiment shown, the back of the drive chip 202 is attached to the second chip carrier pad 102, and the front of the drive chip 202 has a plurality of chip pads that can be used to set the bonding wires 300 to achieve electrical connection of the drive chip 202 to other chips and / or the printed circuit board 100.

[0034] Referring to Figures 1 to 3 In the embodiment shown, the smart power module includes one drive chip 202, but is not limited thereto.

[0035] It should be noted that, due to the high design flexibility of the first chip carrier pad 101 and the second chip carrier pad 102 on the surface of the printed circuit board 100, the first chip carrier pad 101 and the second chip carrier pad 102 can be as close to each other as possible, and multiple first chip carrier pads 101 can also be as close to each other as possible, thereby greatly shortening the length of the bonding wires between the chips and helping to improve the electrical performance of the smart power module.

[0036] In the embodiment shown, the smart power module can also include an adhesive material layer, which is disposed between the power chip 201 and the first chip carrier pad 101, and between the drive chip 202 and the second chip carrier pad 102, i.e., the power chip 201 and the drive chip 202 are attached to the printed circuit board 100 through the adhesive material layer.

[0037] The material of the adhesive layer can be accurately selected according to the electrical characteristics of different chips and the power demand of the product. The material of the adhesive layer includes various types such as insulating type or conductive type, and the adhesive layer needs to ensure that the power chip 201 and the drive chip 202 are firmly bonded to the chip carrying pads on the surface of the printed circuit board 100, and at the same time, excellent heat conduction performance is provided between the chips and the chip carrying pads, which creates favorable conditions for the reliable operation of the chips.

[0038] For example, the adhesive layer is silver glue or solder, which can ensure good thermal conductivity and mechanical stability between the chips and the printed circuit board 100.

[0039] Reference Figure 1 As shown, the power chip 201, the drive chip 202 and the printed circuit board 100 are electrically connected through corresponding bonding wires 300.

[0040] In this embodiment, the bonding wire 300 is a metal wire with high conductivity and high strength characteristics, such as gold wire or aluminum wire, which is used to realize the electrical connection between the chips (including the power chip 201 and the drive chip 202) and between the chips and the printed circuit board 100. The length and diameter of the bonding wire 300 can be accurately calculated and optimized to effectively reduce the line resistance and inductance, ensure the stability and reliability of the signal in the transmission process, and provide strong protection for the efficient operation of the intelligent power module.

[0041] In this embodiment, the potting layer is arranged on the front surface of the printed circuit board 100, which wraps the power chip 201, the drive chip 202 and a plurality of bonding wires 300, to provide all-round protection for the chips and the bonding wires 300, effectively resist the interference of external factors such as moisture, dust and mechanical vibration, and ensure that the intelligent power module can operate stably for a long time in a complex working environment.

[0042] The potting layer has excellent insulation performance, high thermal conductivity and chemical stability, for example, the material of the potting layer includes but is not limited to silicone gel or epoxy resin, etc.

[0043] In this embodiment, the potting layer can cover part of the front surface of the printed circuit board 100, and part of the area of the printed circuit board 100 is not covered by the potting layer. Reference Figure 1 and Figure 3 As shown, the front surface of the printed circuit board 100 has a potting material setting area 103, which can be circular or square, etc. The first chip carrying pad 101, the second chip carrying pad 102 are arranged in the potting material setting area 103, and the bonding wire 300 is also arranged in the potting material setting area 103, so that the potting layer can simultaneously encapsulate the power chip 201, the drive chip 202 and the bonding wire 300.

[0044] In the embodiment, the intelligent power module can be a half-bridge intelligent power module or a full-bridge intelligent power module, so that the expansibility and flexibility design of the module topology expand the application field and market potential of the intelligent power module.

[0045] In the embodiment, the intelligent power module is a Chips on Board (COB) type packaging module.

[0046] In the intelligent power module, the printed circuit board 100 has a first chip bearing pad 101 and a second chip bearing pad 102 on the front surface, and the second chip bearing pad 102 is arranged close to the first chip bearing pad 101. The power chip 201 is attached to the first chip bearing pad 101, and the driving chip 202 is attached to the second chip bearing pad 102. The power chip 201, the driving chip 202, and the printed circuit board 100 are electrically connected through corresponding bonding wires 300. The potting layer is located on the front surface of the printed circuit board 100 and wraps the power chip 201, the driving chip 202, and the plurality of bonding wires 300. In this way, the intelligent power module does not need to use lead frames and packaging shells, reducing the use of packaging materials and simplifying the packaging process, reducing manufacturing costs, improving production efficiency, and making the overall structure of the intelligent power module more compact and the packaging volume smaller. This has great advantages for space-limited application scenarios such as small motor drivers and portable electronic devices, and can meet the needs of device miniaturization. The driving chip 202 and the power chip 201 in the intelligent power module are directly attached to the printed circuit board 100. Due to the high design flexibility of the first chip bearing pad 101 and the second chip bearing pad 102 on the printed circuit board 100, the first chip bearing pad 101 and the second chip bearing pad 102 can be made as close to each other as possible, thereby greatly shortening the length of the bonding wires between the chips, effectively reducing parasitic inductance and resistance, reducing voltage spikes and current oscillations during switching, improving switching speed and efficiency, reducing power loss and electromagnetic interference, and significantly improving the high-frequency performance of the intelligent power module. It can also speed up the transmission speed of the driving signal, improve the accuracy and stability of signal transmission, make the power device respond to the control signal more quickly and accurately, and significantly improve the electrical performance of the intelligent power module. In addition, since the chips are directly attached to the printed circuit board 100, the thermal resistance layer between the chips and the packaging shell in traditional packaging is reduced, the heat conduction path is shorter, and the thermal resistance is smaller, making it easier for heat to dissipate from the chips and improving the heat dissipation effect. This is particularly important for high-power-density intelligent power module applications, which can effectively prevent chips from overheating, performance degradation, shortened lifespan, and even damage, thereby improving the reliability of the intelligent power module.

[0047] The above description is only a description of the preferred embodiments of the present application, and is not any limitation on the scope of the present application. Any person skilled in the art can make possible changes and modifications to the technical scheme of the present application by using the disclosed methods and technical contents without departing from the spirit and scope of the present application. Therefore, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present application, which does not depart from the technical scheme of the present application, belongs to the protection scope of the technical scheme of the present application.

Claims

1. A smart power module, characterized in that, include: A printed circuit board has a first chip carrier pad and a second chip carrier pad on its front side, with the second chip carrier pad being disposed close to the first chip carrier pad. A power chip is mounted on the first chip carrier pad; The driver chip is mounted on the second chip carrier pad; Multiple bonding wires are used to electrically connect the power chip, the driver chip, and the printed circuit board. as well as A potting layer, located on the front side of the printed circuit board, encapsulates the power chip, the driver chip, and the multiple bonding wires.

2. The intelligent power module as described in claim 1, characterized in that, It also includes an adhesive material layer disposed between the power chip and the first chip carrier pad, and between the driver chip and the second chip carrier pad.

3. The intelligent power module as described in claim 2, characterized in that, The adhesive layer is silver paste or solder.

4. The intelligent power module as described in claim 1, characterized in that, The printed circuit board includes a substrate and a metal circuit layer located on the surface of the substrate.

5. The intelligent power module as described in claim 4, characterized in that, The substrate is a ceramic substrate or an aluminum nitride substrate.

6. The intelligent power module as described in claim 1, characterized in that, The power chip includes a MOSFET, or the power chip includes an insulated gate bipolar transistor and a freewheeling diode.

7. The intelligent power module as described in claim 1, characterized in that, The intelligent power module includes two or more power chips.

8. The intelligent power module as described in claim 1, characterized in that, The potting layer covers a portion of the front side of the printed circuit board.

9. The intelligent power module as described in claim 1, characterized in that, The intelligent power module is either a half-bridge intelligent power module or a full-bridge intelligent power module.

10. The intelligent power module as described in claim 1, characterized in that, The intelligent power module is a COB-type packaged module.

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