Multi-dimensional constant temperature control system of high-power digital optical image processor

Abstract

The utility model discloses a multi-dimensional constant-temperature control system of a high-power digital optical image processor. The multi-dimensional constant-temperature control system comprises a circulating water system, a heat dissipation assembly and a processor module, the circulating water system is used for providing cooling water for the heat dissipation assembly; the heat dissipation assembly comprises a first refrigeration sheet, a second refrigeration sheet, a first liquid cooling plate and a second liquid cooling plate. The first refrigeration sheet is arranged on the front side or the back side of the processor module, the second refrigeration sheet is arranged on the outer side of the processor module in a sleeving mode, the first liquid cooling plate is arranged on the outer side of the first refrigeration sheet, and the second liquid cooling plate is arranged on the outer side of the second refrigeration sheet in a sleeving mode; at least five surfaces of the processor module are cooled through the first refrigeration sheet and the second refrigeration sheet, heat transfer is carried out through the first liquid cooling plate and the second liquid cooling plate, the effect of rapidly cooling the processor module is achieved, the heat transfer efficiency can be improved by adding the heat conduction layer between the liquid cooling plates and the refrigeration sheets, and the service life of the processor module is prolonged. The cooling effect is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to constant temperature control technical field especially relates to a high -power digital light image processor multidimension constant temperature control system. BACKGROUND

[0002] Digital light modulator flat display device, not only application in attenuator and filter, digital camera, 3D scanning, optical neural network, lithography, etc. Field, also be applied to high definition television and digital projection display etc. Field, especially in the projection field to the brightness and quality requirement of image output is higher and higher, the traditional heat pipe heat transfer and aluminum material air cooling scheme, cannot realize incident light source power>100W / mm2, digital light modulator cannot radiate heat, cannot work problem, especially high -power laser light source or LED light source irradiation to digital light processor can produce big heat, result in digital processor can not work normally. SUMMARY

[0003] According to the utility model embodiment, provide a kind of high -power digital light image processor multidimension constant temperature control system, comprising: circulating water system, heat dissipation component and processor module;

[0004] The circulating water system is used to provide cooling water or coolant to the heat dissipation component;

[0005] The heat dissipation component includes: first refrigeration sheet, second refrigeration sheet, first liquid cooling plate and second liquid cooling plate;

[0006] The first refrigeration sheet is arranged on the front or back of the processor module, the second refrigeration sheet is sleeved on the outside of the processor module, the first liquid cooling plate is arranged on the outside of the first refrigeration sheet, and the second liquid cooling plate is sleeved on the outside of the second refrigeration sheet.

[0007] The first refrigeration sheet and the second refrigeration sheet are provided with a first thermal conductive layer on the adjacent surface of the processor module, the first refrigeration sheet is provided with a second thermal conductive layer on the adjacent surface of the first liquid cooling plate, and the second refrigeration sheet is provided with a third thermal conductive layer between the second liquid cooling plate.

[0008] Further, the shape of the first refrigeration sheet includes but is not limited to oval, rectangle, polygon and circle, and the first refrigeration sheet is provided with an adapter material between the processor module, and the adapter material is used for conducting heat.

[0009] Further, the adapter material includes but is not limited to pure aluminum, red copper, thermal conductive gasket and graphene sheet.

[0010] Further, the second refrigeration sheet is in a ring structure, the wall thickness of the second refrigeration sheet is related to the wall thickness of the processor module, there is a mounting gap between the second refrigeration sheet and the processor module, and the mounting gap is filled with a thermal conductive gasket.

[0011] Further, the first liquid cooling plate is provided with a first liquid inlet and a first liquid outlet, the first liquid inlet and the first liquid outlet are arranged on the same side of the first liquid cooling plate, and the first liquid inlet and the first liquid outlet are arranged in parallel.

[0012] Further, the middle part of the first liquid cooling plate is used for the illumination light source to enter the light inlet of the processor module, and the opening size of the middle part of the first liquid cooling plate is greater than 1.5 times of the incident light spot.

[0013] Further, the second liquid cooling plate is provided with a second liquid inlet and a second liquid outlet, the second liquid inlet and the second liquid outlet are oppositely arranged at two ends of the second liquid cooling plate, the second liquid inlet is communicated with the water outlet end of the circulating water system, the second liquid outlet is communicated with the first liquid inlet, and the first liquid outlet is communicated with the water return end of the circulating water system.

[0014] Further, the processor module comprises an array micro-mirror, a fixing structure and a window sheet.

[0015] The fixing structure is used for fixing the array micro-mirror, the window sheet is arranged outside the array micro-mirror, and each micro-mirror in the array micro-mirror can realize independent spatial light modulation.

[0016] Further, the circulating water system comprises a water tank, a water pump and a heat exchanger.

[0017] The water tank stores cooling water, the inlet end of the water pump is communicated with the water tank, the outlet end is communicated with the first liquid cooling plate, the inlet end of the heat exchanger is communicated with the second liquid cooling plate, and the outlet end is communicated with the water tank.

[0018] Further, the circulating water system further comprises a first quick release connector and a second quick release connector.

[0019] The first quick release connector is located between the outlet end of the water pump and the first liquid cooling plate, the second quick release connector is located between the inlet end of the heat exchanger and the second liquid cooling plate, and the first quick release connector is connected with the second quick release connector.

[0020] According to the multi-dimensional constant temperature control system of the high-power digital light image processor, the circulating water system is used for providing cooling water for the heat dissipation assembly, the first refrigerating fin and the second refrigerating fin are used for cooling at least five surfaces of the processor module, the first liquid cooling plate and the second liquid cooling plate are used for heat transfer, the cooling liquid is used for quickly transferring heat generated by the processor module, the heat dissipation effect of the processor module is improved, and the heat transfer efficiency is improved by the heat conduction layer.

[0021] It is to be understood that both the foregoing general description and the following detailed description are exemplary and intended to provide further explanation of the subject technology. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 It is a structure diagram of a multi-dimensional constant temperature control system of a high-power digital light image processor according to an embodiment of the present application.

[0023] Figure 2 It is a front view of a heat dissipation assembly of a multi-dimensional constant temperature control system of a high-power digital light image processor according to an embodiment of the present application.

[0024] Figure 3 It is a side view of a heat dissipation assembly of a multi-dimensional constant temperature control system of a high-power digital light image processor according to an embodiment of the present application.

[0025] Figure 4 It is a structure diagram of a processor module of a multi-dimensional constant temperature control system of a high-power digital light image processor according to an embodiment of the present application.

[0026] Figure 5 It is a structure diagram of a first refrigerating fin of a multi-dimensional constant temperature control system of a high-power digital light image processor according to an embodiment of the present application.

[0027] Figure 6 It is a structure diagram of a second refrigerating fin of a multi-dimensional constant temperature control system of a high-power digital light image processor according to an embodiment of the present application.

[0028] Figure 7 It is a structure diagram of a first liquid cooling plate of a multi-dimensional constant temperature control system of a high-power digital light image processor according to an embodiment of the present application.

[0029] Figure 8 It is a structure diagram of a second liquid cooling plate of a multi-dimensional constant temperature control system of a high-power digital light image processor according to an embodiment of the present application.

[0030] Figure 9 It is a structure diagram of a liquid cooling plate of a multi-dimensional constant temperature control system of a high-power digital light image processor according to an embodiment of the present application.

[0031] In the drawing, the reference numeral 1 is a water tank, 2 is a water pump, 3 is a heat dissipation assembly, 31 is a first refrigerating fin, 32 is a second refrigerating fin, 33 is a first liquid cooling plate, 331 is a first liquid inlet, 332 is a first liquid outlet, 34 is a second liquid cooling plate, 341 is a second liquid inlet, 342 is a second liquid outlet, 4 is a processor module, 41 is an array micro-mirror, 42 is a fixing structure, 43 is a window sheet, 5 is a heat exchanger, 6 is a first quick release connector, and 7 is a second quick release connector. DETAILED DESCRIPTION

[0032] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, further illustrating the present invention.

[0033] First, combine Figures 1-9 This invention describes a multi-dimensional constant temperature control system for a high-power digital optical image processor, according to an embodiment of the present invention, for cooling the high-power processor.

[0034] like Figures 1-9 As shown in the figure, a multi-dimensional constant temperature control system for a high-power digital optical image processor according to an embodiment of the present invention includes: a circulating water system, a heat dissipation component 3 and a processor module 4;

[0035] The circulating water system is used to provide cooling water or coolant to the heat dissipation component 3;

[0036] The heat dissipation component 3 includes: a first cooling chip 31, a second cooling chip 32, a first liquid cooling plate 33, and a second liquid cooling plate 34;

[0037] The first cooling chip 31 is disposed on the front or back of the processor module 4, the second cooling chip 32 is sleeved on the outside of the processor module 4, the first liquid cooling plate 33 is disposed on the outside of the first cooling chip 31, and the second liquid cooling plate 34 is sleeved on the outside of the second cooling chip 32.

[0038] The first cooling chip 31 and the second cooling chip 32 are provided with a first heat-conducting layer on the adjacent surface with the processor module 4, the first cooling chip 31 is provided with a second heat-conducting layer on the adjacent surface with the first liquid cooling plate 33, and the second cooling chip 32 is provided with a third heat-conducting layer between the second cooling chip 32 and the second liquid cooling plate 34.

[0039] This application provides cooling water to the heat dissipation component 3 through a circulating water system, cools at least five sides of the processor module 4 through the first cooling chip 31 and the second cooling chip 32, and then transfers heat through the first liquid cooling plate 33 and the second liquid cooling plate 34. The heat generated by the processor module 4 is quickly transferred away by the coolant, achieving the effect of rapid cooling of the processor module 4. By setting a heat-conducting layer, the efficiency of heat transfer can be increased and the cooling effect can be improved.

[0040] In this embodiment, the first, second, and third thermal conductive layers use thermal grease to increase the efficiency of heat transfer.

[0041] like Figures 2-5 As shown, the shape of the first cooling chip 31 includes, but is not limited to, elliptical, rectangular, polygonal, and circular shapes. A transition material is provided between the first cooling chip 31 and the processor module 4, and the transition material is used to conduct heat. The transition material includes, but is not limited to, pure aluminum, copper, thermal pads, and graphene sheets.

[0042] The first refrigeration sheet 31 is arranged on the front or back of the processor module 4 to perform semiconductor refrigeration on the front or back of the processor module 4, and an adapter material is arranged between the first refrigeration sheet 31 and the processor module 4 to improve the heat conduction efficiency. In other embodiments, the first refrigeration sheet 31 can be directly attached to the back of the processor module 4.

[0043] As shown in Figures 2-6 , the second refrigeration sheet 32 has a ring structure, the wall thickness of the second refrigeration sheet 32 is related to the wall thickness of the processor module 4, and the second refrigeration sheet 32 and the processor module 4 have a mounting gap therebetween, and the mounting gap is filled with a heat-conducting gasket.

[0044] The processor module 4 and the second refrigeration sheet 32 are mounted in a gap fit, and the gap between the processor module 4 and the second refrigeration sheet 32 is reserved to be 0.5 mm, and a heat-conducting gasket with a thickness of 0.6 mm is filled in the gap after assembly, and the heat-conducting gasket is compressed and deformed by itself.

[0045] As shown in Figures 2-7 , the first liquid cooling plate 33 is provided with a first liquid inlet 331 and a first liquid outlet 332, the first liquid inlet 331 and the first liquid outlet 332 are arranged on the same side of the first liquid cooling plate 33, and the first liquid inlet 331 and the first liquid outlet 332 are arranged in parallel. The middle part of the first liquid cooling plate 33 is used for the illumination light source to enter the light inlet of the processor module 4, and the opening size of the middle part of the first liquid cooling plate 33 is greater than 1.5 times the size of the incident light spot.

[0046] The middle part of the first liquid cooling plate 33 is not designed as a water channel, and is used for the illumination light source to enter the light inlet of the processor module 4. In order that the middle part of the first liquid cooling plate 33 does not block the incident light, considering the actual processing and installation and debugging errors, the opening size of the middle part of the first liquid cooling plate 33 is greater than 1.5 times the size of the incident light spot.

[0047] As shown in Figures 7-8 , the second liquid cooling plate 34 is provided with a second liquid inlet 341 and a second liquid outlet 342, the second liquid inlet 341 and the second liquid outlet 342 are arranged at opposite ends of the second liquid cooling plate 34, the second liquid inlet 341 is in communication with the water outlet end of the circulating water system, the second liquid outlet 342 is in communication with the first liquid inlet 331, and the first liquid outlet 332 is in communication with the water return end of the circulating water system.

[0048] The first cooling plate 33 transfers heat to the first cooling chip 31, allowing the cooling water to carry away the heat from the first cooling chip 31; the second cooling plate 34 transfers heat to the second cooling chip 32, allowing the cooling water to carry away the heat from the second cooling chip 32; the cooling water is then introduced into the heat exchanger 5, where it undergoes heat exchange and is recycled.

[0049] like Figure 9 As shown, in this embodiment, both the first liquid cooling plate 33 and the second liquid cooling plate 34 are composed of a cooling plate cover plate 352 and a cooling plate base 351. A sealing ring 353 is provided at the connection between the cooling plate cover plate 352 and the cooling plate base 351. The cooling plate base 351 is provided with heat transfer fins 354, and a flow groove is formed between every two heat transfer fins 354. Cooling water flows through the flow groove for heat exchange, effectively improving the cooling effect of the liquid cooling plate.

[0050] like Figures 2-4 As shown, the processor module 4 includes: an array of micromirrors 41, a fixing structure 42, and a window 43;

[0051] The fixing structure 42 is used to fix the array micromirrors 41. The window 43 is located on the outside of the array micromirrors 41. Each micromirror in the array micromirrors 41 can independently modulate spatial light.

[0052] The fixing structure 42 is used to fix the array of micromirrors 41, and each micromirror of the array of micromirrors 41 can independently modulate spatial light. In this embodiment, the fixing structure 42 is a conventional technical means in the prior art.

[0053] like Figure 1 As shown, the circulating water system includes: a water tank 1, a water pump 2, and a heat exchanger 5;

[0054] The water tank 1 stores cooling water. The inlet end of the water pump 2 is connected to the water tank 1, and the outlet end is connected to the first liquid cooling plate 33. The inlet end of the heat exchanger 5 is connected to the second liquid cooling plate 34, and the outlet end is connected to the water tank 1.

[0055] The circulating water system also includes: a first quick-release connector 6 and a second quick-release connector 7;

[0056] The first quick-release connector 6 is located between the outlet end of the water pump 2 and the first liquid cooling plate 33, and the second quick-release connector 7 is located between the inlet end of the heat exchanger 5 and the second liquid cooling plate 34. The first quick-release connector 6 and the second quick-release connector 7 are connected.

[0057] The water tank 1 stores cooling water, the cooling water is transported into the first liquid cooling plate 33 through the water pump 2, the first liquid cooling plate 33 and the second liquid cooling plate 34 are cooled, the cooled cooling water is introduced into the heat exchanger 5, the cooling water is heat exchanged through the heat exchanger 5, the heat exchanged cooling water is introduced into the water tank 1 to be recycled, the heat dissipation assembly 3 and the processor module 4 can be disassembled through the first quick release connector 6 and the second quick release connector 7, so that the heat dissipation assembly 3 and the processor module 4 are maintained.

[0058] The above, with reference to as Figures 1-9 The present application provides cooling water to the heat dissipation assembly 3 through the circulating water system, cools at least five surfaces of the processor module 4 through the first refrigeration fin 31 and the second refrigeration fin 32, and then performs heat transfer through the first liquid cooling plate 33 and the second liquid cooling plate 34, so that the heat generated by the processor module 4 is quickly transferred away, achieving the effect of quickly cooling the processor module 4.

[0059] The utility model effectively solves the industry pain point that high-power light irradiation on small area digital light processor cannot realize constant temperature control and high working temperature, and unstable performance, realizes that digital light processor works stably in-30℃~50℃ environment.

[0060] It should be noted that in the present specification, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, so that processes, methods, articles or devices including a series of elements not only include those elements, but also include other elements not explicitly listed, or include elements inherent to such processes, methods, articles or devices. Without more limitations, the elements defined by the statement "include" do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0061] Although the content of the present application has been described in detail through the above preferred embodiments, it should be recognized that the above description should not be considered as a limitation of the present application. After reading the above content, various modifications and alternatives of the present application will be obvious to those skilled in the art. Therefore, the protection scope of the present application should be defined by the appended claims.

Claims

1. A multi-dimension constant temperature control system for a high-power digital light image processor, characterized in that, The application relates to a cooling system for a processor module. The cooling system comprises a circulating water system, a heat dissipation assembly and a processor module. The circulating water system is used for providing cooling water or cooling liquid to the heat dissipation assembly. The heat dissipation assembly comprises a first refrigeration fin, a second refrigeration fin, a first liquid cooling plate and a second liquid cooling plate. The first refrigeration fin is arranged on the front or back of the processor module, the second refrigeration fin is sleeved on the outer side of the processor module, the first liquid cooling plate is arranged on the outer side of the first refrigeration fin, and the second liquid cooling plate is sleeved on the outer side of the second refrigeration fin. The first refrigeration fin and the second refrigeration fin are provided with a first heat conduction layer on the adjacent surface of the processor module, the first refrigeration fin is provided with a second heat conduction layer on the adjacent surface of the first liquid cooling plate, and the second refrigeration fin is provided with a third heat conduction layer between the second liquid cooling plate.

2. The multi-dimensional constant temperature control system of the high-power digital optical image processor according to claim 1, wherein, The shape of the first refrigeration fin comprises but is not limited to an oval shape, a rectangular shape, a polygonal shape and a circular shape, and the first refrigeration fin is provided with a transition material between the first refrigeration fin and the processor module, which is used for conducting heat.

3. The multi-dimensional thermostatic control system for high power digital optical image processor according to claim 2, wherein, The transition material comprises but is not limited to pure aluminum, red copper, a heat conduction gasket and a graphene sheet.

4. The multi-dimensional thermostatic control system for high power digital optical image processor according to claim 1, wherein, The second refrigeration fin is in a ring structure, the wall thickness of the second refrigeration fin is related to the wall thickness of the processor module, the second refrigeration fin has a mounting gap between the second refrigeration fin and the processor module, and the mounting gap is filled with a heat conduction gasket.

5. The multi-dimensional thermostatic control system for high power digital optical image processor according to claim 1, wherein, The first liquid cooling plate is provided with a first liquid inlet and a first liquid outlet, the first liquid inlet and the first liquid outlet are arranged on the same side of the first liquid cooling plate, and the first liquid inlet and the first liquid outlet are arranged in parallel.

6. The multi-dimensional thermostatic control system for high power digital optical image processor according to claim 5, wherein, The middle part of the first liquid cooling plate is used for allowing an illumination light source to enter a light inlet of the processor module, and the opening size of the middle part of the first liquid cooling plate is greater than 1.5 times of the size of an incident light spot.

7. The multi-dimensional thermostatic control system for high power digital optical image processor according to claim 5, wherein, The second liquid cooling plate is provided with a second liquid inlet and a second liquid outlet, the second liquid inlet and the second liquid outlet are oppositely arranged at two ends of the second liquid cooling plate, the second liquid inlet is communicated with a water outlet end of the circulating water system, the second liquid outlet is communicated with the first liquid inlet, and the first liquid outlet is communicated with a water return end of the circulating water system.

8. The multi-dimensional thermostatic control system for high power digital optical image processor according to claim 1, wherein, The processor module comprises an array of micro-mirrors, a fixing structure and a window sheet. The fixing structure is used for fixing the array of micro-mirrors, and the window sheet is arranged on the outer side of the array of micro-mirrors.

9. The multi-dimensional thermostatic control system for high power digital optical image processor according to claim 1, wherein, The array of micro-mirrors can realize independent modulation of spatial light. The circulating water system comprises a water tank, a water pump and a heat exchanger.

10. The multi-dimensional thermostatic control system for high power digital optical image processor according to claim 9, wherein, The water tank stores cooling water, the inlet end of the water pump is communicated with the water tank, the outlet end of the water pump is communicated with the first liquid cooling plate, the inlet end of the heat exchanger is communicated with the second liquid cooling plate, and the outlet end of the heat exchanger is communicated with the water tank. The circulating water system further comprises a first quick release connector and a second quick release connector. The first quick release connector is arranged between the outlet end of the water pump and the first liquid cooling plate, the second quick release connector is arranged between the inlet end of the heat exchanger and the second liquid cooling plate, and the first quick release connector is connected with the second quick release connector.

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