Semiconductor insulating heat-conducting silica gel gasket

Abstract

The utility model discloses a semiconductor insulation heat conduction silica gel gasket comprising a fixing assembly, the fixing assembly comprises a main body silica gel pad, the top of the main body silica gel pad is provided with a heat conduction assembly, the heat conduction assembly comprises a first silica gel pad and a heat conduction block, and the bottom of the main body silica gel pad is provided with a buffer assembly. According to the semiconductor insulation heat conduction silica gel gasket, the heat conduction assembly is arranged at the top of the gasket, heat conduction and heat dissipation of the gasket are facilitated, the buffer assembly is arranged at the bottom of the gasket, and the pressure on a semiconductor circuit board at the bottom during installation of a radiator is relieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of silica gel gasket, specifically to a semiconductor insulating heat-conducting silica gel gasket. BACKGROUND

[0002] Silica gel heat-conducting gasket is a kind of high-performance gap filling heat-conducting material, mainly used in the transfer interface between electronic equipment and heat sink or product shell. When installing semiconductor electronic circuit board, to avoid electromagnetic interference between electronic circuit boards and circuit board chip operation is burnt through, semiconductor insulating heat-conducting silica gel gasket is often used to protect semiconductor electronic circuit board.

[0003] Although there are many benefits in the prior art, there are still the following problems: single silica gel matrix is prone to heat accumulation due to limited heat conduction channels, and at the same time, the traditional gasket lacks pressure buffering design, which may cause local stress concentration on the circuit board during the assembly of the heat sink, affecting the long-term use stability. SUMMARY

[0004] This section aims to outline some aspects of the embodiments of the utility model and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the abstract of the specification and the utility model name to avoid obscuring the purpose of this section, the abstract of the specification and the utility model name, and such simplifications or omissions cannot be used to limit the scope of the utility model.

[0005] 1. Technical problem to be solved:

[0006] In order to solve the problems of poor heat conduction effect and high bubble residual rate of the gasket in the prior art, the utility model is proposed.

[0007] Therefore, the purpose of the utility model is to provide a semiconductor insulating heat-conducting silica gel gasket, which is provided with a heat-conducting assembly on the top of the gasket, facilitating heat conduction and heat dissipation of the gasket, and at the same time, a buffering assembly is arranged on the bottom of the gasket, reducing the pressure on the circuit board during the installation of the heat sink.

[0008] 2. Technical scheme:

[0009] In order to solve the above technical problems, according to one aspect of the utility model, the utility model provides the following technical scheme:

[0010] A semiconductor insulating heat-conducting silica gel gasket, comprising a fixing assembly, the fixing assembly comprises a main body silica gel gasket, the main body silica gel gasket is provided with a heat-conducting assembly on the top, the heat-conducting assembly comprises a first silica gel gasket, the first silica gel gasket is internally connected with a heat-conducting block, the main body silica gel gasket is provided with a buffering assembly on the bottom, the buffering assembly comprises a second silica gel gasket and a heat-conducting plate.

[0011] As a preferred scheme of the semiconductor insulating heat-conducting silica gel gasket, the first silica gel pad top is provided with a plurality of mounting grooves, the first silica gel pad side wall is provided with a plurality of insertion holes, the heat-conducting block side wall is provided with an insertion block, and the mounting groove is internally inserted with the heat-conducting block.

[0012] As a preferred scheme of the semiconductor insulating heat-conducting silica gel gasket, the first silica gel pad top is provided with a plurality of mounting grooves, the first silica gel pad side wall is provided with a plurality of insertion holes, the heat-conducting block side wall is provided with an insertion block, and the mounting groove is internally inserted with the heat-conducting block.

[0013] As a preferred scheme of the semiconductor insulating heat-conducting silica gel gasket, the second silica gel pad top is attached with a micro spring, and the micro spring top is attached with a heat-conducting plate.

[0014] As a preferred scheme of the semiconductor insulating heat-conducting silica gel gasket, the first silica gel pad top is provided with a plurality of mounting grooves, the first silica gel pad side wall is provided with a plurality of insertion holes, the heat-conducting block side wall is provided with an insertion block, and the mounting groove is internally inserted with the heat-conducting block.

[0015] As a preferred scheme of the semiconductor insulating heat-conducting silica gel gasket, the heat-conducting blocks are longitudinally distributed on the heat-conducting assembly, and the mounting gaps between the heat-conducting blocks are the same.

[0016] As a preferred scheme of the semiconductor insulating heat-conducting silica gel gasket, the second silica gel pad bottom is provided with a plurality of exhaust grooves, and the exhaust groove channel is designed as a longitudinal gradient section.

[0017] 3. Beneficial effects:

[0018] Compared with the prior art, the semiconductor insulating heat-conducting silica gel gasket has the beneficial effects that:

[0019] The semiconductor insulating heat-conducting silica gel gasket is provided with a heat-conducting assembly on the top, the heat-conducting assembly comprises a plurality of heat-conducting blocks which are uniformly distributed, and the heat-conducting assembly is convenient for heat conduction and heat dissipation of the semiconductor insulating heat-conducting silica gel gasket.

[0020] The semiconductor insulating heat-conducting silica gel gasket is provided with a heat-conducting assembly on the top, the heat-conducting assembly comprises a plurality of heat-conducting blocks which are uniformly distributed, and the heat-conducting assembly is convenient for heat conduction and heat dissipation of the semiconductor insulating heat-conducting silica gel gasket. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to make the technical scheme of the embodiments of the present application more clear, the present application will be described in detail below with reference to the drawings and detailed embodiments. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor. Among them:

[0022] Figure 1 It is a whole structure schematic diagram of the semiconductor insulating heat-conducting silica gel gasket of the present application.

[0023] Figure 2 It is a split schematic diagram of the semiconductor insulating heat-conducting silica gel gasket of the present application.

[0024] Figure 3 It is a fixed component structure schematic diagram of the semiconductor insulating heat-conducting silica gel gasket of the present application.

[0025] Figure 4 It is a heat-conducting component structure schematic diagram of the semiconductor insulating heat-conducting silica gel gasket of the present application.

[0026] Figure 5 It is a buffer component structure schematic diagram of the semiconductor insulating heat-conducting silica gel gasket of the present application.

[0027] The figure label explanation: 100, fixed component; 110, main silica gel pad; 111, fixed hole; 120, fixed stud; 200, heat-conducting component; 210, first silica gel pad; 211, installation slot; 212, jack; 220, heat-conducting block; 221, plug block; 300, buffer component; 310, second silica gel pad; 311, exhaust slot; 320, micro spring; 330, heat-conducting plate. DETAILED DESCRIPTION

[0028] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application will be described in detail below with reference to the drawings.

[0029] The present application is described in detail in combination with the schematic diagram, and in the detailed description of the embodiments of the present application, the cross-sectional view of the device structure will be partially enlarged without the general proportion for the convenience of description, and the schematic diagram is only an example, which should not limit the scope of protection of the present application. In addition, three-dimensional spatial dimensions including length, width and depth should be included in actual production.

[0030] The orientation or position relationship indicated in the term is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present application.

[0031] The connecting mode in the terms should be understood in a broad sense, for example, "connection" can be fixed connection, detachable connection or integral connection, can be mechanical connection or electrical connection, can be direct connection or indirect connection through an intermediate medium, or can be internal connection of two elements.

[0032] The embodiments of the present application will be described in further detail below with reference to the drawings.

[0033] The present application provides a kind of semiconductor insulating heat-conducting silicone gasket one embodiment overall structure schematic diagram, including:

[0034] Please refer to Figures 1-5 The semiconductor insulating heat-conducting silicone gasket of the embodiment includes a fixing assembly 100, the fixing assembly 100 includes a main silicone gasket 110, the top of the main silicone gasket 110 is provided with a heat-conducting assembly 200, the heat-conducting assembly 200 includes a first silicone gasket 210, the first silicone gasket 210 is internally connected with a heat-conducting block 220, the heat-conducting block 220 is made of boron nitride filling bump, while facilitating the heat conduction and heat dissipation of the heat-conducting block 220, the electromagnetic interference that the heat-conducting block 220 of metal material can cause is reduced, the bottom of the main silicone gasket 110 is provided with a buffer assembly 300, and the buffer assembly 300 includes a second silicone gasket 310 and a heat-conducting plate 330.

[0035] It is worth mentioning that, in order to improve the overall stability of the gasket, specifically, the main silicone gasket 110 is provided, the top of the main silicone gasket 110 is provided with two fixing holes 111, the fixing holes 111 are internally provided with threads, and the fixing holes 111 are internally inserted with fixing studs 120, and the circumferential outer wall of the fixing stud 120 is provided with threads matched with the fixing holes 111.

[0036] Then, in order to facilitate the stability of the heat-conducting assembly 200, specifically, a plurality of mounting grooves 211 are formed in the top of the first silicone gasket 210, a plurality of insertion holes 212 are formed in the side wall of the first silicone gasket 210, the side wall of the heat-conducting block 220 is provided with an insertion block 221, and the heat-conducting block 220 is inserted into the mounting groove 211 ， The connection stability between the heat-conducting block 220 and the first silicone gasket 210 is improved.

[0037] At the same time, in order to facilitate the buffering and heat-conducting function of the buffer assembly 300, specifically, a micro spring 320 is bonded to the top of the second silicone gasket 310, the heat-conducting plate 330 is bonded to the top of the micro spring 320, and the buffer assembly 300 transmits heat to the main silicone gasket 110 through the internal heat-conducting plate 330.

[0038] Further, in order to fix the connection between the heat conduction assembly 200, the fixing assembly 100 and the buffer assembly 300, specifically, two fixing holes 111 are arranged on the top of the buffer assembly 300 and the bottom of the heat conduction assembly 200, the heat conduction assembly 200, the fixing assembly 100 and the buffer assembly 300 are stacked together, the heat conduction assembly 200, the fixing assembly 100 and the buffer assembly 300 are penetrated by the fixing stud 120 after being stacked together, the fixing stud 120 is inserted into the inside of the fixing assembly 100, the heat conduction assembly 200 and the buffer assembly 300, the heat conduction assembly 200 and the buffer assembly 300 on the top of the fixing assembly 100 are limited and fixed, the disconnection of each assembly is prevented, and the use of the semiconductor insulating heat conduction silica gel gasket is affected.

[0039] Notably, in order to facilitate the heat conduction and heat dissipation of the heat conduction block 200, specifically, the heat conduction blocks 220 are longitudinally arranged on the heat conduction assembly 200, the installation gaps between the heat conduction blocks 220 are the same, after the semiconductor insulating heat conduction silica gel gasket is installed on the top of the semiconductor circuit board, a heat sink is usually installed to dissipate heat, and the installation position of the heat conduction block 220 reduces the contact area between the heat conduction block 220 and the heat sink to be installed on the top of the semiconductor insulating heat conduction silica gel gasket, and the heat dissipation of the heat conduction block 220 is more convenient.

[0040] Finally, in order to reduce the air bubbles generated at the bottom of the semiconductor insulating heat conduction silica gel gasket during installation, specifically, a plurality of exhaust grooves 311 are arranged on the bottom of the second silica gel pad 310, the exhaust grooves 311 are designed as a longitudinal gradient section, the air bubble residual rate of the semiconductor insulating heat conduction silica gel gasket during the fitting installation process is reduced, the rework rate of the semiconductor insulating heat conduction silica gel gasket is reduced, and the long-term reliability is increased.

[0041] In combination Figures 1-5 The semiconductor insulating heat conduction silica gel gasket of the embodiment is used as follows:

[0042] 1: The top and the bottom of the bearing assembly 100 on the semiconductor insulating heat conduction silica gel gasket are respectively pasted with the heat conduction assembly 200 and the exhaust assembly 300, the fixing stud 120 in the bearing assembly 100 is inserted and fixed with the heat conduction assembly 200 and the exhaust assembly 300, before the semiconductor insulating heat conduction silica gel gasket is used, the connection between the bearing assembly 100 and the heat conduction assembly 200 and the exhaust assembly 300 on the gasket is ensured to be stable, and then the semiconductor insulating heat conduction silica gel gasket is placed on the position where it needs to be pasted and installed;

[0043] 2: When the semiconductor insulating heat-conducting silica gel pad is attached, the second silica gel pad 310 bottom exhaust groove 311 will discharge the bottom gas from the exhaust channel due to the pressure on the top. When the semiconductor insulating heat-conducting silica gel pad is connected to the top heat sink, the micro spring 320 inside the buffer assembly 300 will buffer the top pressure in cooperation with the second silica gel pad 310 connected to the bottom, reducing the pressure on the bottom semiconductor circuit board of the semiconductor insulating heat-conducting silica gel pad. The heat-conducting plate 330 inside the buffer assembly 300 increases the heat transfer efficiency of the buffer assembly 300, making it easier for the buffer assembly 300 to transfer heat from the bottom semiconductor circuit to the heat-conducting assembly 200 at the bottom of the semiconductor insulating heat-conducting silica gel pad.

[0044] 3: When the semiconductor insulating heat-conducting silica gel pad is installed and used, the heat-conducting block 230 on the top heat-conducting assembly 200 of the semiconductor insulating heat-conducting silica gel pad will conduct heat into the pad top heat sink. The installation gap between the heat-conducting blocks 230 is large, making it easier for the heat-conducting blocks 230 to dissipate heat. The micro spring 220 at the bottom of the heat-conducting block 230 will also slow down the pressure of the heat sink on the pad, and ensure that the heat-conducting block 230 is in full contact with the heat sink.

[0045] Although the present application has been described above with reference to the embodiments, various modifications can be made to it and equivalent components can be substituted therefor without departing from the scope of the present application. In particular, each feature disclosed in the embodiments of the present application can be combined with any other feature disclosed in the embodiments of the present application, as long as there is no structural conflict. The combinations of these features are not exhaustively described in the present specification, which is only for the purpose of omitting the length and saving resources. Therefore, the present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A semiconductor insulating heat conductive silicone gasket, characterized by, Including fixed assembly (100), the fixed assembly (100) includes main body silica gel pad (110), the top of main body silica gel pad (110) is provided with heat conduction assembly (200), the heat conduction assembly (200) includes first silica gel pad (210), the first silica gel pad (210) is connected with heat conduction block (220) inside, the bottom of main body silica gel pad (110) is provided with buffer assembly (300), the buffer assembly (300) includes second silica gel pad (310) and heat conduction plate (330).

2. The semi-conductive, insulating, heat-conductive silicone gasket of claim 1, wherein, The main body silica gel pad (110) is provided with a plurality of fixing holes (111) on the top, and the fixing holes (111) are inserted with fixing studs (120) inside.

3. The semi-conductive, insulating, and heat-conductive silicone gasket of claim 1, wherein, The first silica gel pad (210) is provided with a plurality of installation grooves (211) on the top, and a plurality of insertion holes (212) are formed in the side wall of the first silica gel pad (210), and the heat conduction block (220) is provided with an insertion block (221) on the side wall, and the heat conduction block (220) is inserted into the installation groove (211).

4. The semi-conductive, insulating, and heat-conductive silicone gasket of claim 1, wherein, The second silica gel pad (310) is attached with a micro spring (320) on the top, and the micro spring (320) is attached with a heat conduction plate (330) on the top.

5. The semi-conductive, insulating, heat-conductive silicone gasket of claim 2, wherein, The top of the buffer assembly (300) and the bottom of the heat conduction assembly (200) are provided with a plurality of fixing holes (111), and the heat conduction assembly (200), the fixed assembly (100) and the buffer assembly (300) are stacked together and penetrated by the fixing studs (120), and the fixing studs (120) are inserted into the heat conduction assembly (200), the fixed assembly (100) and the buffer assembly (300).

6. The semi-conductive, insulating, heat-conductive silicone gasket of claim 3, wherein, The heat conduction block (220) is longitudinally distributed on the heat conduction assembly (200), and the installation gaps between a plurality of heat conduction blocks (220) are the same.

7. The semi-conductive, insulating, heat-conductive silicone gasket of claim 3, wherein, The bottom of the second silica gel pad (310) is provided with a plurality of exhaust grooves (311), and the exhaust grooves (311) are longitudinally gradient cross-section design.

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