Movable cleaning device for semiconductor products

Abstract

The utility model discloses a mobile cleaning device for semiconductor products, which belongs to the field of semiconductor cleaning and comprises a box body, drying mechanisms are fixedly connected to two sides of the box body, a sliding groove is formed in the upper surface of the box body, and a spraying mechanism is slidably connected into the sliding groove. Through cooperative use of all the devices and through the arranged drying mechanism, after the semiconductor product is cleaned, water stains on the surface of the semiconductor product are dried through the drying mechanism, it is guaranteed that no water stains or chemical residues exist on the surface of the semiconductor product, and therefore the quality and reliability of the product are improved; in the cleaning and drying process, the drying mechanism is added, the time for waiting for natural air drying after traditional cleaning can be shortened, the whole production process is accelerated, the production efficiency is improved, then after cleaning is completed, moisture is rapidly removed through the drying mechanism, the risk of secondary pollution caused by dust or chemical substances in air can be reduced, and the product quality is improved. And the cleaned product is kept in a clean state.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor cleaning, and specifically relates to a mobile semiconductor product cleaning device. BACKGROUND

[0002] Semiconductor products refer to various electronic components and devices manufactured based on semiconductor materials (such as silicon, germanium, gallium arsenide, etc.) and utilizing their unique electrical properties. These products play a crucial role in modern technology and are widely used in various electronic devices and systems. The mobile semiconductor product cleaning device is a device designed specifically for cleaning equipment during the semiconductor manufacturing and packaging process. This type of device typically features flexibility, mobility, and high cleaning efficiency to meet the needs of different production sites and environments.

[0003] The existing semiconductor product cleaning device requires multiple steps for cleaning, including soaking, spraying, and drying, to complete the cleaning process. However, during the multiple cleaning steps, the semiconductor products may come into direct contact with dust in the air, which can cause the products to adhere to dust again, resulting in a longer overall cleaning process and affecting production efficiency and the quality of the semiconductor products. This leads to poor cleaning effectiveness and makes it inconvenient to complete the cleaning steps in one go, thereby shortening the cleaning process time.

[0004] Therefore, the utility model provides a mobile semiconductor product cleaning device to solve the above problems. UTILITY MODEL CONTENTS

[0005] (I) Technical problems solved

[0006] The utility model provides a mobile semiconductor product cleaning device, aiming to solve the problems raised in the background art.

[0007] (II) Technical solutions

[0008] To achieve the above-mentioned purposes, the utility model provides the following technical solutions: a mobile semiconductor product cleaning device, comprising a box body, dryers are fixedly connected to both sides of the box body, a chute is formed on the upper surface of the box body, a spraying mechanism is slidably connected inside the chute, and a moving mechanism is fixedly connected to the bottom of the box body.

[0009] The dryer comprises an air blower, the outer surface of the air blower is fixedly connected to one side of the box body, one end of the air blower is fixedly connected to a wind storage pipe, the bottom end of the wind storage pipe is fixedly connected to a connecting pipe, and an air outlet is formed on the outer surface of the wind storage pipe.

[0010] As a preferred technical scheme of the present application, the spraying mechanism comprises a sliding block, an outer surface of the sliding block being slidingly connected to the inside of the sliding groove, an upper surface of the sliding block being fixedly connected with a top plate, an upper surface of the top plate being fixedly connected with a spraying pipe, an outer surface of the spraying pipe being fixedly connected with a spraying head, one end of the spraying head being fixedly connected with a water inlet pipe.

[0011] As a preferred technical scheme of the present application, the moving mechanism comprises a driving motor, an outer surface of the driving motor being fixedly connected to the bottom of the box body, an output end of the driving motor being spline-connected with a threaded rod, an outer surface of the threaded rod being threadedly connected with a placing plate, a surface of the placing plate being provided with an A air outlet hole.

[0012] As a preferred technical scheme of the present application, an inner side wall of the box body is fixedly connected with a partition plate, a surface of the partition plate is provided with an A groove, and an inside of the A groove is fixedly connected with a shielding piece.

[0013] As a preferred technical scheme of the present application, an inner bottom wall of the box body is fixedly connected with a placing box, both sides of the placing box are fixedly connected with a transmission pipe, one end of the transmission pipe is fixedly connected to the inside of the air storage pipe, an upper surface of the placing box is provided with a B groove, an inside of the B groove is fixedly connected with a baffle, and a surface of the baffle is provided with a B air outlet hole.

[0014] As a preferred technical scheme of the present application, middle portions of both sides of the box body are fixedly connected with a pull rod, and a surface of the pull rod is provided with an anti-skid groove.

[0015] As a preferred technical scheme of the present application, the four around of the bottom of the box body are fixedly connected with a supporting rod, a bottom of the supporting rod is fixedly connected with a universal wheel, and an inside of the universal wheel is rotatably connected with a brake pad.

[0016] (Three) beneficial effects

[0017] 1. By setting the drying mechanism, after the semiconductor product is washed, the water stains on the surface of the semiconductor product are dried by the drying mechanism, so as to ensure that the surface of the semiconductor product is free of water stains and chemical residues, thereby improving the quality and reliability of the product. In the cleaning and drying process, the drying mechanism can reduce the time required for natural drying after traditional cleaning, thereby accelerating the entire production process and improving production efficiency. Subsequently, the water is quickly removed by the drying mechanism after cleaning, which helps to reduce the risk of secondary pollution caused by dust or chemicals in the air, and ensures that the cleaned product remains clean.

[0018] 2. Through the spraying mechanism, semiconductor products are placed in the box for immersion cleaning, and then their surfaces are sprayed again using the spraying mechanism. The spraying mechanism can achieve uniform coverage, ensuring that the cleaning solution fully contacts the surface of the semiconductor products, effectively removing contaminants and residues. The combination of spraying and immersion cleaning technologies enhances the cleaning effect and ensures thorough cleaning. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of a cleaning device for mobile semiconductor products;

[0020] Figure 2 This is a schematic diagram of the structure of the housing in a cleaning device for mobile semiconductor products.

[0021] Figure 3 This is a schematic diagram of the spray pipe structure in a mobile semiconductor product cleaning device;

[0022] Figure 4 This is a schematic diagram of the structure of a baffle in a cleaning device for mobile semiconductor products.

[0023] Figure 5 This is a schematic diagram of the drive motor in a cleaning device for mobile semiconductor products.

[0024] Figure 6 This is a schematic diagram of the air storage duct in a cleaning device for mobile semiconductor products.

[0025] Figure 7 This is a schematic diagram of the partition structure in a cleaning device for mobile semiconductor products.

[0026] In the picture:

[0027] 1. Housing; 2. Blower; 3. Air storage pipe; 4. Connecting pipe; 5. Slider; 6. Top plate; 7. Spray pipe; 8. Spray head; 9. Water inlet pipe; 10. Drive motor; 11. Threaded rod; 12. Placement plate; 13. Partition; 14. Baffle plate; 15. Placement box; 16. Transmission pipe; 17. Baffle; 18. Pull rod; 19. Support rod; 20. Casters. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] This utility model provides a cleaning device for mobile semiconductor products, such as... Figures 1-7 As shown, the cleaning device for mobile semiconductor products includes a housing 1, with drying mechanisms fixedly connected to both sides of the housing 1. A sliding groove is provided on the upper surface of the housing 1, and a spraying mechanism is slidably connected inside the sliding groove. A moving mechanism is fixedly connected to the bottom of the housing 1.

[0030] The drying mechanism includes a blower 2, the outer surface of which is fixedly connected to one side of the housing 1. One end of the blower 2 is fixedly connected to an air storage pipe 3, and the bottom end of the air storage pipe 3 is fixedly connected to a connecting pipe 4. An air outlet is provided on the outer surface of the air storage pipe 3. After the semiconductor product is cleaned, the drying mechanism is used to dry the water stains on its surface, ensuring that there are no water stains or chemical residues on the surface of the semiconductor product, thereby improving the quality and reliability of the product. The addition of a drying mechanism in the cleaning and drying process can reduce the time required for natural air drying after traditional cleaning, thereby accelerating the entire production process and improving production efficiency. Subsequently, after cleaning, the moisture is quickly removed by the drying mechanism, which helps to reduce the risk of secondary pollution caused by dust or chemicals in the air and ensures that the cleaned product remains clean.

[0031] The spraying mechanism includes a slider 5, the outer surface of which is slidably connected to the inside of the trough. A top plate 6 is fixedly connected to the upper surface of the slider 5, and a spray pipe 7 is fixedly connected to the upper surface of the top plate 6. A spray head 8 is fixedly connected to the outer surface of the spray pipe 7, and a water inlet pipe 9 is fixedly connected to one end of the spray head 8. After the semiconductor product is placed in the box 1 for immersion and cleaning, its surface is sprayed again using the spraying mechanism. The spraying mechanism can achieve uniform coverage, ensuring that the cleaning solution fully contacts the surface of the semiconductor product, effectively removing contaminants and residues. The combination of spraying and immersion cleaning technologies enhances the cleaning effect and ensures thorough cleaning.

[0032] The moving mechanism includes a drive motor 10, the outer surface of which is fixedly connected to the bottom of the housing 1. The output end of the drive motor 10 is splinedly connected to a threaded rod 11, and the outer surface of the threaded rod 11 is threadedly connected to a placement plate 12. An air outlet A is provided on the surface of the placement plate 12. When the drive motor 10 is started, it rotates and drives the threaded rod 11 to rotate. The placement plate 12 moves up and down through the threaded rod 11, moving the placement plate 12 to the highest position. The semiconductor product to be cleaned is placed on the placement plate 12. The drive motor 10 is started again to move the placement plate 12 downward and place it on the baffle 17.

[0033] The inner side wall of the box body 1 is fixedly connected with a partition plate 13, the surface of the partition plate 13 is provided with an A groove, the inside of the A groove is fixedly connected with a shielding piece 14, the connecting pipe 4 transmits the wind into the wind storage pipe 3, and then blows out from the air outlet, the wind is blown out from the shielding piece 14 while being shielded by the partition plate 13, the wind can be blown evenly in the cleaning liquid, when the wind blows in the cleaning liquid, the cleaning liquid can be driven to circulate, the effect of convection is achieved, and the semiconductor product can be cleaned more cleanly.

[0034] The inner bottom wall of the box body 1 is fixedly connected with a placing box 15, both sides of the placing box 15 are fixedly connected with a transmission pipe 16, one end of the transmission pipe 16 is fixedly connected to the inside of the wind storage pipe 3, the upper surface of the placing box 15 is provided with a B groove, the inside of the B groove is fixedly connected with a baffle 17, the surface of the baffle 17 is provided with a B air outlet, when the wind storage pipe 3 blows wind, the wind is transmitted into the placing box 15 by the transmission pipe 16 and blown out from the B air outlet on the baffle 17, the bottom of the semiconductor product is blown, the water flow at the bottom can be blown to clean.

[0035] The middle part of both sides of the box body 1 is fixedly connected with a pull rod 18, the surface of the pull rod 18 is provided with an anti-skid groove, the pull rod 18 is provided with the anti-skid groove, so that the friction force can be increased, and slipping of hands when pushing can be avoided.

[0036] The four around the bottom of the box body 1 are fixedly connected with support rods 19, the bottom of the support rod 19 is fixedly connected with universal wheels 20, the inside of the universal wheel 20 is rotatably connected with brake pads, when the box body 1 needs to be moved, the pull rod 18 is pushed, the box body 1 is moved to a suitable position by cooperating with the universal wheel 20, the brake pads can fix the box body 1 after moving, so that the box body 1 is prevented from slipping during cleaning, and the semiconductor product cleaning is affected.

[0037] Specifically, the cleaning liquid is placed in the box 1, the cleaning liquid does not need to fill the box 1, can be poured into half, leaving half space, then, the driving motor 10 is started, the driving motor 10 rotates and drives the threaded rod 11 to rotate, the placing plate 12 moves up and down through the threaded rod 11, the placing plate 12 is moved to the highest position, the semiconductor products to be cleaned are placed on the placing plate 12, the driving motor 10 is started again to move the placing plate 12 downward, the placing plate 12 is placed on the baffle 17, the semiconductor products are soaked and cleaned in the cleaning liquid, when soaking and cleaning, the air blower 2 is started, the air blower 2 blows air in the air storage pipe 3, the air is transmitted in the air storage pipe 3 through the connecting pipe 4, and then is blown out from the air outlet, the air is blown out from the shielding piece 14 while being shielded by the partition plate 13, the air can be blown evenly in the cleaning liquid, when the air is blown in the cleaning liquid, the cleaning liquid can be circulated and flowed, the effect of convection is achieved, the semiconductor products can be cleaned more cleanly, then, when the air storage pipe 3 blows air, the air is transmitted to the placing box 15 through the transmission pipe 16, and is blown out from the B air outlet on the baffle 17, the bottom of the semiconductor products is blown, the water flow at the bottom can be blown and cleaned, after soaking and cleaning, the driving motor 10 is started to move the placing plate 12 upward, the semiconductor products are aligned with the upper half of the air storage pipe 3, then, the sliding block 5 is moved, the sliding block 5 moves in the sliding groove of the box 1, the spraying head 8 sprays and cleans the semiconductor products, then, the external water source is connected with the water inlet pipe 9, water is filled in the spraying pipe 7 and flows out from the spraying head 8, the semiconductor products are cleaned twice, the cleaning effect is enhanced, the semiconductor products are cleaned thoroughly, then, the semiconductor products cleaned are dried by the air blown out from the air storage pipe 3, the time for waiting for natural drying after traditional cleaning can be reduced, the whole production process is accelerated, and the production efficiency is improved, when the box 1 needs to be moved, the pull rod 18 is pushed, and the box 1 is moved to a suitable position by cooperating with the universal wheel 20.

[0038] The above merely describes a preferred embodiment of the present application, but the protection scope of the present application is not limited to this. Any skilled person in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.

Claims

1. A mobile cleaning device for semiconductor products, comprising a housing (1), characterized in that: Both sides of the box (1) are fixedly connected with drying mechanism, the upper surface of the box (1) is provided with a chute, the inside of the chute is slidably connected with a spraying mechanism, the bottom of the box (1) is fixedly connected with a moving mechanism; The drying mechanism comprises a blower (2), one end of the blower (2) is fixedly connected with a wind storage pipe (3), the bottom of the wind storage pipe (3) is fixedly connected with a connecting pipe (4), and the outer surface of the wind storage pipe (3) is provided with an air outlet.

2. The mobile cleaning apparatus for semiconductor products according to claim 1, wherein: The spraying mechanism comprises a sliding block (5), the outer surface of the sliding block (5) is slidably connected with the inside of the chute, the upper surface of the sliding block (5) is fixedly connected with a top plate (6), the upper surface of the top plate (6) is fixedly connected with a spraying pipe (7), the outer surface of the spraying pipe (7) is fixedly connected with a spraying head (8), one end of the spraying head (8) is fixedly connected with a water inlet pipe (9).

3. The mobile cleaning apparatus for semiconductor products according to claim 1, wherein: The moving mechanism comprises a driving motor (10), the outer surface of the driving motor (10) is fixedly connected with the bottom of the box (1), the output end of the driving motor (10) is spline-connected with a threaded rod (11), the outer surface of the threaded rod (11) is screw-connected with a placing plate (12), and the surface of the placing plate (12) is provided with an A air outlet.

4. The mobile cleaning apparatus for semiconductor products according to claim 1, wherein: The inner side wall of the box (1) is fixedly connected with a partition plate (13), the surface of the partition plate (13) is provided with an A groove, and the inside of the A groove is fixedly connected with a shielding piece (14).

5. The mobile cleaning apparatus for semiconductor products according to claim 1, wherein: The inner bottom wall of the box (1) is fixedly connected with a placing box (15), both sides of the placing box (15) are fixedly connected with a transmission pipe (16), one end of the transmission pipe (16) is fixedly connected with the inside of the wind storage pipe (3), the upper surface of the placing box (15) is provided with a B groove, the inside of the B groove is fixedly connected with a baffle (17), and the surface of the baffle (17) is provided with a B air outlet.

6. The mobile cleaning apparatus for semiconductor products of claim 1, wherein: The middle part of the box (1) is fixedly connected with a pull rod (18), and the surface of the pull rod (18) is provided with an anti-skid groove.

7. The mobile cleaning apparatus for semiconductor products of claim 1, wherein: The bottom of the box (1) is fixedly connected with a support rod (19), the bottom of the support rod (19) is fixedly connected with a universal wheel (20), and the inside of the universal wheel (20) is rotatably connected with a brake pad.

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