Wafer silicon carbide heating disc
By combining air cooling and water cooling with a symmetrically designed silicon carbide heating plate, the problems of uneven heating and slow heat dissipation are solved, achieving efficient wafer heating and cooling, and improving processing quality and efficiency.
Patent Information
- Application Number
- CN202423036684.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-10
- Publication Date
- 2026-02-13
- Estimated Expiration
- 2034-12-10
AI Technical Summary
Traditional silicon carbide heating plates for wafers suffer from uneven heating and slow heat dissipation, which affect heating quality and processing efficiency.
The silicon carbide heating plate, with its symmetrical design, combines air cooling and water cooling methods. It utilizes spirally arranged heating wires and water-cooling pipes, along with a temperature sensor and hydraulic system, to achieve efficient heat conduction and cooling under vacuum.
This improves the heating quality and production efficiency of wafers, ensures heating uniformity and cooling rate, and reduces manufacturing costs.
Smart Images
Figure CN223912827U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to wafer processing equipment technical field especially relates to a wafer silicon carbide heating disc. BACKGROUND
[0002] The silicon carbide heating disc is a heating device designed by using the performance of silicon carbide material, and the silicon carbide heating disc can rapidly transfer heat to the heated object due to the high thermal conductivity of silicon carbide, thereby improving the heating efficiency.
[0003] The traditional wafer silicon carbide heating disc has a simple structure, and uneven heating occurs during use, which affects the heating quality. Moreover, the heat dissipation rate is slow during the wafer heating process, thereby affecting the processing efficiency. Therefore, the wafer silicon carbide heating disc is proposed to solve the above problems. UTILITY MODEL CONTENT
[0004] The utility model solves the problem of providing a wafer silicon carbide heating disc that can have air cooling and water cooling cooling methods during use, effectively improving the cooling rate of the silicon carbide heating disc and improving the production efficiency. At the same time, it can ensure the heat conduction efficiency under vacuum and greatly improve the heating quality of the wafer.
[0005] To achieve the above purpose, the utility model adopts the following technical scheme:
[0006] A wafer silicon carbide heating disc comprises an upper silicon carbide heating disc body and a lower silicon carbide heating disc body.
[0007] The upper silicon carbide heating disc body is filled with upper disc heating wires arranged in a spiral manner. An upper silicon carbide water cooling disc body is installed on the top end face of the upper silicon carbide heating disc body. An upper disc water cooling pipe is installed inside the upper silicon carbide water cooling disc body and arranged in a spiral manner. An upper disc fixing plate is provided on the top outside of the upper silicon carbide water cooling disc body. The two side ends of the upper disc heating wires pass through the upper silicon carbide heating disc body, the upper silicon carbide water cooling disc body, and the upper disc fixing plate to connect with the outside. The two side ends of the upper disc water cooling pipe pass through the upper silicon carbide water cooling disc body and the upper disc fixing plate to connect with the outside.
[0008] The inside of the lower silicon carbide heating disc body is filled with lower disc heating wires, and the lower disc heating wires are arranged in a spiral manner; the bottom end face of the lower silicon carbide heating disc body is attached and mounted with a lower silicon carbide water cooling disc body, the inside of the lower silicon carbide water cooling disc body is filled with lower disc water cooling pipes, and the lower disc water cooling pipes are arranged in a spiral manner, the bottom outside of the lower silicon carbide water cooling disc body is provided with a lower disc fixing plate, and the two side ends of the lower disc heating wires respectively penetrate the lower silicon carbide heating disc body, the lower silicon carbide water cooling disc body, the lower disc fixing plate and the outside.
[0009] Further, the central part of the top end face of the upper disc fixing plate is connected and mounted with a main bellows, so as to facilitate movement connection and facilitate vacuum sealing; the periphery of the top end face of the upper disc fixing plate is connected and mounted with a secondary bellows, so as to facilitate vacuum sealing; and the two side ends of the upper disc water cooling pipe respectively penetrate the two secondary bellows and are connected with the outside.
[0010] Further, the inside end face of the upper disc fixing plate and the inside end face of the lower disc fixing plate are fixedly installed with a water cooling shielding layer, which can effectively isolate temperature and effectively protect the vacuum cavity and other components; the inside end face of the water cooling shielding layer is attached and mounted with an isolation ceramic layer, which can have good heat insulation effect and can conveniently bear stress to improve structural stability.
[0011] The bottom end face of the isolation ceramic layer on the bottom side of the upper disc fixing plate is attached and connected with the top end face of the upper silicon carbide water cooling disc body, and the top end face of the isolation ceramic layer on the top side of the lower disc fixing plate is attached and connected with the bottom end face of the lower silicon carbide water cooling disc body.
[0012] Further, the two side ends of the upper disc heating wire, the upper disc water cooling pipe, the lower disc heating wire and the lower disc water cooling pipe respectively penetrate the end faces of the water cooling shielding layer and the isolation ceramic layer at the corresponding positions, so as to facilitate part installation and improve installation convenience.
[0013] Further, the outside of the upper silicon carbide heating disc body is connected and mounted with an upper disc temperature sensor, so as to facilitate feedback of the temperature of the upper silicon carbide heating disc body through the upper disc temperature sensor; the outside of the lower silicon carbide heating disc body is connected and mounted with a lower disc temperature sensor, so as to facilitate feedback of the temperature of the lower silicon carbide heating disc body through the lower disc temperature sensor, thereby facilitating control of the heating temperature of the wafer.
[0014] Further, the two sides of the top end face of the upper disc fixing plate and the two sides of the bottom end face of the lower disc fixing plate are provided with two hydraulic systems, and the hydraulic rods of the hydraulic systems are connected with the end faces of the upper disc fixing plate and the lower disc fixing plate; the position of the upper disc fixing plate and the lower disc fixing plate can be moved, so that the upper silicon carbide heating disc body and the lower silicon carbide heating disc body heat the top and bottom of the wafer.
[0015] Further, the upper silicon carbide heating disc body, the upper silicon carbide water-cooled disc body, the lower silicon carbide heating disc body and the lower silicon carbide water-cooled disc body are formed by high-pressure pressing of dry silicon carbide powder and high-temperature firing, and the heating wires and the water-cooled pipes are fired into the silicon carbide, so that the heat conduction efficiency under vacuum is ensured.
[0016] The silicon carbide heating disc for wafers has the advantages that: the overall structure is designed symmetrically, so that the preparation cost is effectively reduced; the water-cooled shielding layer, the isolation ceramic layer and the water-cooled pipes are arranged, so that the cooling mode of air cooling and water cooling is achieved, the cooling rate of the silicon carbide heating disc is effectively improved, and the production efficiency is improved; meanwhile, the silicon carbide heating disc and the silicon carbide water-cooled disc are formed by high-pressure pressing of dry silicon carbide powder and high-temperature firing, and the heating wires and the water-cooled pipes are fired into the silicon carbide, so that the heat conduction efficiency under vacuum is ensured, and the heating quality of the wafer is greatly improved. BRIEF DESCRIPTION OF DRAWINGS
[0017] Figure 1 It is a schematic view of the overall structure of the utility model;
[0018] Figure 2 It is a top view of the overall structure of the utility model;
[0019] Figure 3 It is Figure 2 the sectional view of A-A;
[0020] Figure 4 It is a schematic view of the local structure of the utility model;
[0021] Figure 5 It is a local front view of the utility model.
[0022] Legend:
[0023] 1, the upper silicon carbide heating disc body; 2, the upper silicon carbide water-cooled disc body; 3, the upper disc water-cooled pipe; 4, the upper disc heating wire; 5, the water-cooled shielding layer; 6, the upper disc fixed plate; 7, the upper disc temperature sensor; 8, the isolation ceramic layer; 9, the auxiliary corrugated pipe; 10, the lower disc fixed plate; 11, the main corrugated pipe; 12, the lower silicon carbide heating disc body; 13, the lower disc heating wire; 14, the lower silicon carbide water-cooled disc body; 15, the lower disc water-cooled pipe; 16, the lower disc temperature sensor; 17, the hydraulic system. DETAILED DESCRIPTION
[0024] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of the present application.
[0025] The specific embodiments are given below.
[0026] Referring to Figures 1-5 A silicon carbide wafer heating disc comprises: an upper silicon carbide disc body 1 and a lower silicon carbide disc body 12; the upper silicon carbide disc body 1 and the lower silicon carbide disc body 12 can facilitate heating of a wafer;
[0027] The upper silicon carbide disc body 1 is internally filled with upper disc heating wires 4 arranged in a spiral manner; the top end face of the upper silicon carbide disc body 1 is attached with an upper silicon carbide water cooling disc body 2, the internal part of the upper silicon carbide water cooling disc body 2 is filled with upper disc water cooling pipes 3 arranged in a spiral manner; the top of the upper silicon carbide water cooling disc body 2 is externally provided with an upper disc fixing plate 6; the two side ends of the upper disc heating wires 4 pass through the upper silicon carbide disc body 1, the upper silicon carbide water cooling disc body 2 and the upper disc fixing plate 6 and are connected with the outside; the two side ends of the upper disc water cooling pipes 3 pass through the upper silicon carbide water cooling disc body 2 and the upper disc fixing plate 6 and are connected with the outside.
[0028] The lower silicon carbide disc body 12 is internally filled with lower disc heating wires 13 arranged in a spiral manner; the bottom end face of the lower silicon carbide disc body 12 is attached with a lower silicon carbide water cooling disc body 14, the internal part of the lower silicon carbide water cooling disc body 14 is filled with lower disc water cooling pipes 15 arranged in a spiral manner; the bottom of the lower silicon carbide water cooling disc body 14 is externally provided with a lower disc fixing plate 10; the two side ends of the lower disc heating wires 13 pass through the lower silicon carbide disc body 12, the lower silicon carbide water cooling disc body 14 and the lower disc fixing plate 10 and are connected with the outside; the two side ends of the lower disc water cooling pipes 15 pass through the lower silicon carbide water cooling disc body 14 and the lower disc fixing plate 10 and are connected with the outside.
[0029] The top end face of the upper disc fixing plate 6 is centrally connected with a main bellows pipe 11 for facilitating movement connection and vacuum sealing; the top end face of the upper disc fixing plate 6 is peripherally connected with a plurality of auxiliary bellows pipes 9 for facilitating vacuum sealing; the two side ends of the upper disc water cooling pipes 3 pass through the two auxiliary bellows pipes 9 and are connected with the outside.
[0030] The inner side end faces of the upper disc fixing plate 6 and the lower disc fixing plate 10 are fixedly installed with water-cooled shielding layers 5, which can effectively isolate temperature and effectively protect the vacuum cavity and other components; the inner side end faces of the water-cooled shielding layers 5 are fixedly installed with isolation ceramic layers 8, which can have good heat insulation effect and can conveniently bear stress to improve structural stability.
[0031] The bottom end face of the isolation ceramic layer 8 on the bottom side of the upper disc fixing plate 6 is connected with the top end face of the upper silicon carbide water-cooled disc body 2, and the top end face of the isolation ceramic layer 8 on the top side of the lower disc fixing plate 10 is connected with the bottom end face of the lower silicon carbide water-cooled disc body 14.
[0032] The two side end heads of the upper disc heating wire 4, the upper disc water-cooled pipe 3, the lower disc heating wire 13 and the lower disc water-cooled pipe 15 all penetrate the end faces of the water-cooled shielding layers 5 and the isolation ceramic layers 8 at corresponding positions, so as to facilitate part installation and improve installation convenience.
[0033] The outer side of the upper silicon carbide heating disc body 1 is connected and installed with an upper disc temperature sensor 7, so as to conveniently feedback the temperature of the upper silicon carbide heating disc body 1 through the upper disc temperature sensor 7; the outer side of the lower silicon carbide heating disc body 12 is connected and installed with a lower disc temperature sensor 16, so as to conveniently feedback the temperature of the lower silicon carbide heating disc body 12 through the lower disc temperature sensor 16, thereby conveniently grasping the heating temperature of the wafer.
[0034] The top end face of the upper disc fixing plate 6 and the bottom end face of the lower disc fixing plate 10 are both provided with two hydraulic systems 17, the hydraulic rods of the hydraulic systems 17 are connected with the end faces of the upper disc fixing plate 6 and the lower disc fixing plate 10; the position of the upper disc fixing plate 6 and the lower disc fixing plate 10 can be moved, so that the upper silicon carbide heating disc body 1 and the lower silicon carbide heating disc body 12 heat the top and bottom of the wafer.
[0035] The upper silicon carbide heating disc body 1, the upper silicon carbide water-cooled disc body 2, the lower silicon carbide heating disc body 12 and the lower silicon carbide water-cooled disc body 14 all adopt a silicon carbide dry powder high-pressure pressing forming high-temperature firing process, the upper disc heating wire 4, the upper disc water-cooled pipe 3, the lower disc heating wire 13 and the lower disc water-cooled pipe 15 are fired into silicon carbide; the heat conduction efficiency under vacuum is ensured.
[0036] Working principle: when using, the upper disc heating wire 4 and the lower disc heating wire 13 are connected with the external heating device, and the upper disc water cooling pipe 3 and the lower disc water cooling pipe 15 are connected with the external water cooling device; in the vacuum chamber, after power on, the upper disc heating wire 4 and the lower disc heating wire 13 start to heat, the heat is conducted to the upper silicon carbide heating disc body 1 and the lower silicon carbide heating disc body 12 to make the temperature rise; the upper disc temperature sensor 7 and the lower disc temperature sensor 16 can facilitate independent temperature control; in the heating process, the water cooling shielding layer 5 can continuously pass water to protect the cavity temperature from being too high, and protect the cavity parts; after the heating is finished, in the cooling stage, air is passed to the upper disc water cooling pipe 3 and the lower disc water cooling pipe 15, so that the temperature of the upper silicon carbide water cooling disc body 2 and the lower silicon carbide water cooling disc body 14 is reduced, and then the temperature of the upper silicon carbide heating disc body 1 and the lower silicon carbide heating disc body 12 is reduced; since the upper disc fixed plate 6 and the lower disc fixed plate 10 are both provided with two hydraulic systems 17, the hydraulic rod of the hydraulic system 17 is connected with the end surface of the upper disc fixed plate 6 and the lower disc fixed plate 10, the hydraulic system 17 works, the upper disc fixed plate 6 and the lower disc fixed plate 10 can be driven to rise and fall through the hydraulic rod, so that the upper silicon carbide heating disc body 1 and the lower silicon carbide heating disc body 12 realize heating of the wafer, and the isolation ceramic layer 8 can effectively ensure the uniform pressure.
[0037] The above merely describes a preferred specific implementation of the present application, but the protection scope of the present application is not limited to this, any skilled person in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.
Claims
1. A wafer silicon carbide heating disc, characterized by, The utility model relates to a silicon carbide heating disc body (1) and lower silicon carbide heating disc body (12) are included: The inside of the upper silicon carbide heating disc body (1) is filled with upper disc heating wire (4), and the upper disc heating wire (4) is arranged in a spiral manner, the top end surface of the upper silicon carbide heating disc body (1) is attached with upper silicon carbide water cooling disc body (2), the inside of the upper silicon carbide water cooling disc body (2) is filled with upper disc water cooling pipe (3) and is arranged in a spiral manner, the top of the upper silicon carbide water cooling disc body (2) is provided with upper disc fixed plate (6) on the outside, the both ends of the upper disc heating wire (4) are connected with the outside through the upper silicon carbide heating disc body (1), the upper silicon carbide water cooling disc body (2), the upper disc fixed plate (6), and the both ends of the upper disc water cooling pipe (3) are connected with the outside through the upper silicon carbide water cooling disc body (2) and the upper disc fixed plate (6). The inside of the lower silicon carbide heating disc body (12) is filled with lower disc heating wire (13), and the lower disc heating wire (13) is arranged in a spiral manner, the bottom end surface of the lower silicon carbide heating disc body (12) is attached with lower silicon carbide water cooling disc body (14), the inside of the lower silicon carbide water cooling disc body (14) is filled with lower disc water cooling pipe (15) and is arranged in a spiral manner, the bottom of the lower silicon carbide water cooling disc body (14) is provided with lower disc fixed plate (10) on the outside, the both ends of the lower disc heating wire (13) are connected with the outside through the lower silicon carbide heating disc body (12), the lower silicon carbide water cooling disc body (14) and the lower disc fixed plate (10) respectively, and the both ends of the lower disc water cooling pipe (15) are connected with the outside through the lower silicon carbide water cooling disc body (14) and the lower disc fixed plate (10). The top end surface of the upper disc fixed plate (6) is connected with main bellow (11) in the middle, the top end surface of the upper disc fixed plate (6) is connected with auxiliary bellow (9) around, and the both ends of the upper disc water cooling pipe (3) are connected with the outside through the two auxiliary bellows (9) respectively.
2. The wafer silicon carbide heating disc according to claim 1, wherein, The inside end surface of the upper disc fixed plate (6) and the lower disc fixed plate (10) is fixedly installed with water cooling shielding layer (5), and the inside end surface of the water cooling shielding layer (5) is attached with isolation ceramic layer (8); 3. The wafer SiC heating disc according to claim 1, wherein, The bottom end surface of the isolation ceramic layer (8) on the bottom side of the upper disc fixed plate (6) is attached with the top end surface of the upper silicon carbide water cooling disc body (2), and the top end surface of the isolation ceramic layer (8) on the top side of the lower disc fixed plate (10) is attached with the bottom end surface of the lower silicon carbide water cooling disc body (14). The both ends of the upper disc heating wire (4), the upper disc water cooling pipe (3), the lower disc heating wire (13) and the lower disc water cooling pipe (15) are connected with the end surface of the water cooling shielding layer (5) and the isolation ceramic layer (8) in the corresponding position respectively.
4. The wafer silicon carbide heating disc of claim 3 wherein, The outside of the upper silicon carbide heating disc body (1) is connected with upper disc temperature sensor (7), and the outside of the lower silicon carbide heating disc body (12) is connected with lower disc temperature sensor (16).
5. The wafer silicon carbide heating disc of claim 1 wherein, 6. The wafer silicon carbide heating disc of claim 1 wherein, The top end surface of the upper disc fixing plate (6) and the bottom end surface of the lower disc fixing plate (10) are provided with two hydraulic systems (17), and the hydraulic rods of the hydraulic systems (17) are connected with the end surfaces of the upper disc fixing plate (6) and the lower disc fixing plate (10).
7. The wafer silicon carbide heating disc of claim 1 wherein, The upper silicon carbide heating disc body (1), the upper silicon carbide water cooling disc body (2), the lower silicon carbide heating disc body (12) and the lower silicon carbide water cooling disc body (14) are formed by high-pressure pressing of silicon carbide dry powder and high-temperature firing process, and the upper disc heating wire (4), the upper disc water cooling pipe (3), the lower disc heating wire (13) and the lower disc water cooling pipe (15) are fired into the silicon carbide.