Wafer film pasting platform deck

Abstract

The utility model provides a wafer film pasting platform deck which comprises a base plate, a film pasting platform, a film pasting platform and a film pasting platform, and a sliding rail is arranged in the X-axis direction of the base plate; the bearing table is arranged above the sliding rail in a sliding manner; the bearing plate is fixed through supporting columns arranged on the bearing table; the air blower is arranged below the base plate, and the center point of the air blower and the center point of the bearing plate are located on the same axis; the vacuum assembly is arranged on the bearing table; one end of the air blower abuts against the bearing plate, and the gas flow generated by the air blower is larger than that generated by the vacuum assembly. The air blower is matched with the vacuum assembly, so that the wafers with different warping degrees can be better attached to the carrying table.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor manufacturing, in particular to a wafer film pasting platform. BACKGROUND

[0002] In the field of semiconductor manufacturing, wafer is the core basic material for making integrated circuits. Its raw material is silicon, which needs to go through a series of complex processes such as segmenting, roll grinding, slicing, chamfering, polishing, and laser marking, and finally forms a silicon wafer blank that can be used for integrated circuit processing. When the silicon wafer blank is subjected to subsequent finishing, in order to prevent scratching the surface of the semiconductor wafer during processing, pasting film on the wafer becomes a key process, which makes the role of the semiconductor wafer film pasting platform crucial.

[0003] Some existing semiconductor wafer film pasting platforms, such as the semiconductor wafer film pasting platform disclosed in CN218827052U, move the bottom plate through a transmission mechanism, and then push the wafer body in the carrier plate with the top plate, which facilitates the removal of the wafer from the carrier plate and improves production efficiency to a certain extent. However, in actual use, the cutting mechanism of this type of platform moves from top to bottom to cut the film. Since the film itself has a certain softness, it is easy to move the film downward during the pressing process, resulting in the edge of the film being attached to the side of the wafer, which makes the cutting not precise enough, ultimately leading to a decrease in film pasting efficiency. In addition, the existing wafer film pasting equipment also has problems such as the risk of dust pollution during operation in a dust-free space, resulting in product defects; insufficient tightness of pasting, inconvenience of product removal; poor versatility, and inability to adapt to products with large differences in specifications, etc.

[0004] In summary, there are still some problems to be solved in the actual application of the wafer film pasting platform, such as improving the cutting precision of the film pasting, enhancing the versatility of the equipment, improving the protection of the dust-free environment, and optimizing the convenience of product pasting and removal, etc., which also prompts relevant technical personnel to continuously explore and develop new wafer film pasting platform technology solutions. Practical new type content

[0005] To achieve the above purpose, the present application proposes a wafer film pasting platform, which comprises:

[0006] A base plate is provided with a sliding rail in the X-axis direction;

[0007] A carrier platform is slidably arranged above the sliding rail;

[0008] A carrier plate is fixed by a support column arranged on the carrier platform;

[0009] A blower is arranged below the base plate, and the center point of the blower and the center point of the carrier plate are located on the same axis;

[0010] A vacuum assembly is arranged on the bearing table.

[0011] The air flow generated by the air blower is greater than the air flow generated by the vacuum assembly.

[0012] According to the above technical scheme, the wafer is adsorbed and flattened by the air blower with large air flow when the warpage of the wafer is greater than 5mm, and then the wafer is adsorbed on the wafer bearing plate by the vacuum.

[0013] Specifically, the bearing plate comprises a patch ring, a patch bearing plate and a wafer bearing plate; the patch ring, the patch bearing plate and the wafer bearing plate are arranged in sequence from top to bottom; and a plurality of air holes are formed in the wafer bearing plate.

[0014] This layered structure makes the function of each component more clear. The patch ring can preliminarily position and fix the patch, the patch bearing plate provides intermediate support, and the wafer bearing plate directly bears the wafer, thereby improving the precision and stability of the patching process.

[0015] Specifically, it further comprises an X-axis motor and a Z-axis motor; the X-axis motor is arranged at one end of the slide rail to drive the bearing table to move along the slide rail; and the Z-axis motor is arranged on the bearing table and connected to the wafer bearing plate to drive the wafer bearing plate to move along the Z-axis.

[0016] The X-axis motor is arranged at one end of the slide rail and can drive the bearing table to move along the slide rail, realizing the automatic and accurate movement of the bearing table in the X-axis direction, improving the efficiency and accuracy of the patching operation, and reducing the error of manual operation; the Z-axis motor is arranged on the bearing table and connected to the wafer bearing plate, and can drive the wafer bearing plate to move along the Z-axis, so as to adjust the height position of the wafer according to the specific requirements of the patching, further improving the adhesion and quality of the patching.

[0017] Specifically, it further comprises a heating sheet; the heating sheet is arranged below the wafer bearing plate.

[0018] Heating the wafer during the patching process can make the patching material better adhere to the surface of the wafer, enhance the adhesion and firmness of the patching, and help eliminate defects such as air bubbles generated during the patching process.

[0019] Specifically, it further comprises a buffer mechanism; the buffer mechanism is arranged below the heating sheet, and the buffer mechanism comprises an elastic component and a support plate; the elastic component is arranged on the support plate.

[0020] When the wafer bearing plate moves up and down or is impacted by external force, the elastic component can absorb and disperse energy, reducing the damage to the heating sheet and the wafer bearing plate, and prolonging the service life of the equipment.

[0021] Specifically, the elastic component comprises an elastic gasket or a spring.

[0022] Specifically, the device further comprises clamping cylinder modules, and the clamping cylinder modules are symmetrically arranged on both sides of the bearing plate.

[0023] Specifically, the support column is provided with a leveling screw.

[0024] Specifically, the vacuum assembly comprises a first vacuum generator and a second vacuum generator.

[0025] Specifically, the patch ring bearing plate is further provided with an electromagnet and a clamping positioning column.

[0026] Compared with the prior art, the device has the advantages of:

[0027] Through the synergistic effect (gas flow control) of the air blower and the vacuum assembly, the problems of bubbles and wrinkles in the process of pasting the film are solved, the X / Z-axis motor drive and the layered bearing structure are combined to realize the automatic and accurate adjustment of the position of the wafer, the pasting efficiency is improved, and the film flatness and process stability are optimized through the electromagnet positioning, heating piece and buffer mechanism. BRIEF DESCRIPTION OF DRAWINGS

[0028] The accompanying drawings are included to provide a further understanding of embodiments and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments and serve the purpose of explaining principles of the present application. Other embodiments and many of the intended advantages of the present application will be readily appreciated as the same becomes better understood by reference to the following detailed description when considered in connection with the accompanying drawings. The elements of the drawings are not necessarily to scale relative to each other. Like reference numerals designate corresponding similar parts.

[0029] Figure 1 is a structural diagram of a wafer film pasting table according to an embodiment of the present application Figure 1 ;

[0030] Figure 2 is a structural diagram of a wafer film pasting table according to an embodiment of the present application Figure 2 ;

[0031] Figure 3 is a structural diagram of a wafer film pasting table according to an embodiment of the present application

[0032] Figure 4 is a structural diagram of a wafer film pasting table according to an embodiment of the present application

[0033] The meanings of the numbers in the figure are as follows: 1, bearing plate; 1a, patch bearing plate; 1b, wafer bearing plate; 2, patch ring; 3, X-axis motor; 4, vacuum assembly; 5, support column; 5a, leveling screw; 6, first clamping cylinder module; 7, patch ring adsorption vacuum port; 8, wafer adsorption vacuum port; 9, buffer mechanism; 10, second clamping cylinder module; 11, air blower; 12, base plate; 12a, sliding rail; 13, heating sheet. DETAILED DESCRIPTION

[0034] In the following detailed description, reference is made to the accompanying drawings, which form a part hereof, and in which are shown by way of illustration illustrative embodiments in which the application can be practiced. For purposes of explanation and illustration, directional terms are used with respect to the descriptions, such as "top," "bottom," "left," "right," "up," "down," etc. Because the embodiments can be positioned in a number of different orientations, the directional terms are used for purposes of illustration and are in no way limiting. It is to be understood that other embodiments can be utilized and logical changes can be made without departing from the scope of the present application. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present application is defined by the appended claims.

[0035] As shown in the figure, a wafer film pasting platform comprises: Figures 1 to 4

[0036] A base plate 12 is provided with a sliding rail 12a in the X-axis direction of the base plate 12;

[0037] A bearing table is slidably arranged above the sliding rail 12a;

[0038] A bearing plate 1 is fixed by a support column 5 arranged on the bearing table;

[0039] An air blower 11 is arranged below the base plate 12, and the center point of the air blower 11 and the center point of the bearing plate 1 are located on the same axis;

[0040] A vacuum assembly 4 is arranged on the bearing table;

[0041] The air blower 11 is arranged close to one end of the bearing plate 1, and the gas flow generated by the air blower 11 is greater than the gas flow generated by the vacuum assembly 4.

[0042] According to the above technical solution, for the wafer with a warpage of more than 5 mm, a large-flow air blower 11 is used to adsorb and flatten the wafer, and then the wafer is adsorbed on the wafer bearing plate 1b by vacuum.

[0043] The bearing plate 1 comprises a patch ring 2, a patch bearing plate 1a and a wafer bearing plate 1b; the patch ring 2, the patch bearing plate 1a and the wafer bearing plate 1b are arranged in sequence from top to bottom; and a plurality of air holes are formed in the wafer bearing plate 1b. ​

[0044] This hierarchical structure makes the function of each component more explicit. The patch ring 2 can preliminarily position and fix the film, the patch carrier plate 1a provides intermediate support, and the wafer carrier plate 1b directly carries the wafer, thereby improving the precision and stability of the film pasting process.

[0045] It also includes an X-axis motor 3 and a Z-axis motor; the X-axis motor 3 is arranged at one end of the slide rail 12a to drive the carrier to move along the slide rail 12a; the Z-axis motor is arranged on the carrier and connected to the wafer carrier plate 1b to drive the wafer carrier plate 1b to move along the Z-axis.

[0046] The X-axis motor 3 is arranged at one end of the slide rail 12a and can drive the carrier to move along the slide rail 12a, realizing the automatic and accurate movement of the carrier in the X-axis direction, improving the efficiency and accuracy of the film pasting operation, and reducing the error of manual operation; the Z-axis motor is arranged on the carrier and connected to the wafer carrier plate 1b, which can drive the wafer carrier plate 1b to move along the Z-axis, so as to adjust the height position of the wafer according to the specific requirements of the film pasting, further improving the fitting degree and quality of the film pasting.

[0047] It also includes a heating sheet; the heating sheet is arranged below the wafer carrier plate 1b.

[0048] The wafer is heated during the film pasting process, which can make the film material better fit the wafer surface, enhance the adhesion and firmness of the film, and at the same time help to eliminate defects such as air bubbles generated during the film pasting process.

[0049] It also includes a buffer mechanism 9; the buffer mechanism 9 is arranged below the heating sheet, and the buffer mechanism 9 includes an elastic component and a support plate; the elastic component is arranged on the support plate.

[0050] When the wafer carrier plate 1b moves up and down or is subjected to external force impact, the elastic component can absorb and disperse energy, reducing damage to the heating sheet and the wafer carrier plate 1b, and prolonging the service life of the equipment.

[0051] The elastic component includes an elastic gasket or a spring.

[0052] It also includes a clamping cylinder module; the clamping cylinder module is symmetrically arranged on both sides of the carrier plate 1. The clamping cylinder module is symmetrically arranged on both sides of the carrier plate 1, which can clamp and position the wafer and the film on the carrier plate 1, prevent the wafer and the film from shifting during the film pasting process, and ensure the precision and quality of the film pasting.

[0053] The support column is provided with a leveling screw 5a.

[0054] The vacuum component 4 includes a first vacuum generator and a second vacuum generator; in one specific embodiment, the first vacuum generator is configured to provide vacuum suction force for the patch ring, and the second vacuum generator is configured to provide vacuum suction force for the wafer.

[0055] More specifically, in this embodiment, as shown in Figure 2 the patch ring and the wafer suction vacuum port are arranged relatively parallel and not at the same height, through this staggered arrangement, the two suction vacuum ports are prevented from approaching each other and interfering with the generated vacuum degree.

[0056] The patch ring 2 is also provided with an electromagnet and a clamping positioning column on the wafer carrier plate 1.

[0057] In some specific embodiments, a three-stage coordinated suction system is developed for ultra-thin wafers with warping of more than 5mm: the first stage uses a large-flow air blower for pre-suction flattening, breaking through the traditional vacuum suction limitation on severely warped wafers; the middle stage realizes secondary fixation through a Z-axis dynamically adjustable precision vacuum suction platform, ensuring the required coplanar precision of the wafer upper surface and the patch ring, and more advantageously, the center of the wafer carrier plate and the center of the patch ring carrier plate are on the same axis; the last stage superimposes a magnetic suction array to form a composite clamping, cooperating with a flexible buffer mechanism to compensate for sub-millimeter level flatness errors. The system integrates a closed-loop height adjustment algorithm, combined with the double repositioning positioning technology of the patch ring, to realize full-process automation from wafer pretreatment to precision bonding, and finally complete high-reliability packaging in a constant temperature stage environment.

[0058] Obviously, those skilled in the art can make various modifications and changes to the embodiments of the present application without departing from the spirit and scope of the present application. In this way, if these modifications and changes are within the scope of the claims of the present application and their equivalents, the present application also aims to cover these modifications and changes. The word "comprising" does not exclude the presence of other elements or steps not listed in the claims. The simple fact that certain measures are described in mutually different dependent claims does not mean that the combination of these measures cannot be used to advantage. Any reference signs in the claims should not be considered as limiting the scope.

Claims

1. A wafer film sticking stage, characterized by, The utility model relates to a substrate, the substrate X axle direction is provided with slide rail; Bearing station, bearing station can slide be provided in slide rail top; Bearing plate, bearing plate is fixed through the support column of bearing station is arranged on; Blower, blower is arranged below the substrate, and the center point of blower and the center point of bearing plate are located same axis; Vacuum component, setting in bearing station; Wherein, one end of blower approaches bearing plate, and the gas flow generated by blower is greater than the gas flow generated by vacuum component. The bearing plate includes a patch ring, a patch bearing plate, and a wafer bearing plate. The patch ring, the patch bearing plate, and the wafer bearing plate are arranged in order from top to bottom. The wafer bearing plate is provided with a plurality of air holes.

2. The wafer film attachment stage of claim 1, wherein, It also includes an X-axis motor and a Z-axis motor. The X-axis motor is arranged at one end of the slide rail to drive the bearing station to move along the slide rail. The Z-axis motor is arranged on the bearing station and connected to the wafer bearing plate to drive the wafer bearing plate to move along the Z-axis.

3. The wafer film attachment stage of claim 2, wherein, It also includes a heating sheet. The heating sheet is arranged below the wafer bearing plate.

4. The wafer film attaching stage according to claim 2, wherein It also includes a buffer mechanism.

5. The wafer film sticking stage according to claim 4, wherein The buffer mechanism is arranged below the heating sheet, and the buffer mechanism includes an elastic component and a support plate. The elastic component is arranged on the support plate. The elastic component includes an elastic gasket or a spring. It also includes a clamping cylinder module.

6. The wafer film attachment stage of claim 5, wherein, The clamping cylinder module is symmetrically arranged on both sides of the bearing plate.

7. The wafer film attachment stage of claim 6, wherein, The support column is provided with a leveling screw. The vacuum component includes a first vacuum generator and a second vacuum generator. The patch ring bearing plate is also provided with an electromagnet and a clamping positioning column.

8. The wafer film attachment stage of claim 1, wherein, ​ 9. The wafer film attachment stage of claim 1, wherein, ​ 10. The wafer film attachment stage of claim 7, wherein, ​

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