Charging basket adsorption disc

Abstract

The utility model discloses a charging basket adsorption disc which comprises an adsorption disc body, a vacuum hole is formed in the middle of the adsorption disc body, a positioning pin is coaxially fixed to the adsorption disc body, the end, close to the vacuum hole, of the positioning pin is of a hollow structure, and a plurality of air holes are formed in the side wall of the end, close to the vacuum hole, of the positioning pin in a penetrating mode. The device has the beneficial effects that automatic positioning and dynamic protection are achieved in the material frame adsorption process through the collaborative design of the adsorption disc and the positioning pin, when the material frame is placed on the adsorption disc, the positioning pin is automatically embedded into the positioning groove to complete accurate alignment, and stable negative pressure is formed through cooperation of vacuum adsorption and air holes; according to the scheme, the advantages of vacuum adsorption are reserved, meanwhile, the problems that in the prior art, a material frame slides, and maintenance is tedious are solved, and efficient guarantee is provided for high-precision transmission of wafers.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of material frame adsorption, specifically relates to a material basket adsorption disc. BACKGROUND

[0002] In a semiconductor wafer transmission system, the adsorption disc is the core component for moving and positioning the material frame, and its stability directly determines the position accuracy of the wafer in the transmission process. The prior art generally adopts a conventional adsorption disc structure to fix the material frame bottom surface by vacuum negative pressure adsorption, but there are significant defects in actual application: due to the lack of mechanical positioning structure, the material frame only relies on the vacuum adsorption force to maintain contact with the disc surface. When the adsorption disc carries the material frame to move at high speed, stop suddenly or is subjected to equipment vibration, inertial force or external disturbance easily causes relative sliding between the material frame and the adsorption disc. Such displacement, although in the micro scale (such as tens of microns), can cause a chain problem in the subsequent process - for example, the mechanical arm cannot accurately align when grabbing the wafer due to the deviation of the actual position of the material frame from the preset coordinates, or the measurement reference is misaligned due to the displacement of the material frame in the detection station, thereby affecting the production yield and efficiency.

[0003] More seriously, the traditional pure adsorption scheme lacks displacement compensation mechanism when the vacuum system pressure fluctuates instantaneously (such as pump start-stop, pipeline leakage). Once the adsorption force drops temporarily, the material frame may completely separate from the adsorption disc, causing the wafer to fall or collide and be damaged. SUMMARY

[0004] The purpose of the utility model is to provide a material basket adsorption disc to solve the technical problem of lack of active positioning mechanism mentioned above, which causes uncontrollable displacement of the material frame under the influence of inertial force or vibration.

[0005] To solve the above technical problems, the utility model provides a material basket adsorption disc, which comprises an adsorption disc, a vacuum hole is arranged in the middle of the adsorption disc, a positioning pin is fixed coaxially on the adsorption disc, one end of the positioning pin close to the vacuum hole is a hollow structure, and a plurality of air holes are arranged on the side wall of the one end of the positioning pin close to the vacuum hole.

[0006] Further, a pressure sensor is arranged on the middle upper end of the positioning pin, and an electromagnet device is vertically arranged on the end of the positioning pin away from the vacuum hole.

[0007] Further, the electromagnet device comprises a limiting rod, and the electromagnet device controls the extension and retraction of the limiting rod.

[0008] Further, the plurality of air holes are arranged at equal intervals.

[0009] Further, the longitudinal section of the end of the positioning pin away from the vacuum hole is in the shape of a capsule.

[0010] Further, a limiting block is arranged around the vacuum hole on the adsorption disc, the limiting blocks are arranged in a circle, and the limiting blocks are arranged in intervals.

[0011] The material basket adsorption disc has the advantages that, compared with the prior art, the material basket adsorption disc is designed in cooperation with the positioning pin, automatic positioning and dynamic protection are realized in the material frame adsorption process, when the material frame is placed on the adsorption disc, the positioning pin is automatically inserted into the positioning groove to complete accurate positioning, and stable negative pressure is formed in cooperation of vacuum adsorption and the air vent; while the advantages of vacuum adsorption are retained, the problems of material frame sliding and complicated maintenance in the traditional technology are solved, and efficient protection is provided for high-precision wafer transmission. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 It is a schematic diagram of a three-dimensional structure of the adsorption disc and the material frame.

[0013] Figure 2 It is a schematic diagram of a vertical sectional structure of the adsorption disc.

[0014] Figure 3 It is a schematic diagram of a three-dimensional structure of the positioning pin.

[0015] Figure 4 It is a schematic diagram of a three-dimensional structure of the cover plate.

[0016] Figure 5 It is a schematic diagram of a three-dimensional structure of the rubber gasket.

[0017] Figure 6 It is a schematic diagram of a three-dimensional structure of the material frame.

[0018] Figure 7 It is a schematic diagram of a vertical sectional structure of the material frame.

[0019] Wherein: 1, the adsorption disc; 2, the positioning pin; 21, the air vent; 22, the pressure sensor; 231, the limiting rod; 3, the material frame; 4, the positioning plate; 41, the rubber gasket; 42, the mounting groove; 43, the cover plate; 5, the positioning groove; 51, the limiting hole; 52, the buffer pad; 6, the bottom block; 7, the protruding block; 8, the limiting block. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the utility model will be clearly and completely described in combination with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only one of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all the other embodiments obtained by the person skilled in the art without creative labor belong to the protection scope of the utility model.

[0021] In order to make the purpose, technical scheme and advantages of the present application clearer, the present application will be further described in detail below with reference to the drawings and specific embodiments.

[0022] In the following description, reference is made to "one embodiment", "an embodiment", "one example", "an example" etc. to mean that a particular feature, structure, characteristic, property, element or limitation described in connection with the embodiment or example can be included in at least one embodiment or example of the application. The appearance of the phrase in various places in the specification are not necessarily all referring to the same embodiment or example. Some embodiments can be understood to include a combination of elements or features while other embodiments can not include the same element or feature. Operation in one embodiment or example of the application as described does not preclude the same feature, structure or characteristic in other embodiments or examples of the application.

[0023] In the present embodiment, as shown in Figure 1 The middle part of the adsorption disc 1 is a vacuum hole, and the vacuum hole forms a stable negative pressure through the air hole 21. The adsorption disc 1 is coaxially provided with a positioning pin 2 at the upper part of the vacuum hole. The positioning pin 2 is fixedly connected with the adsorption disc 1. The end of the positioning pin 2 close to the vacuum hole is hollow. The hollow part of the positioning pin 2 is provided with an air hole 21, which is in communication with the outside. The other end of the positioning pin 2 is provided with an electromagnet device on the upper and lower sides. The middle part of the positioning pin 2 is provided with a pressure sensor 22. The pressure sensor 22 adopts Sensirion SDP800 series, which is a prior art and will not be described in detail. The pressure sensor 22 is used for real-time monitoring of adsorption force to ensure stable adsorption. One side of the material frame 3 is a positioning plate 4, which is connected with the adsorption disc 1 through a rubber gasket 41. The mounting groove 42 on the positioning plate 4 is matched with the rubber gasket 41. The design of the rubber gasket 41 not only provides good sealing performance, but also plays a role in shock absorption, which helps to prolong the service life of the adsorption disc 1 and related components.

[0024] A cover plate 43 is correspondingly arranged on the positioning plate 4, and the cover plate 43 is fixed with the positioning plate 4 through screws. The positioning plate 4 is provided with a positioning groove 5 corresponding to the positioning pin 2. The positioning groove 5 is provided with a limiting hole 51 corresponding to the electromagnet device. The top wall of the limiting hole 51 is provided with a buffer pad 52. The thickness of the buffer pad 52 is 2mm±0.1mm. The stable negative pressure formed by the vacuum hole and the air hole 21, combined with the precise cooperation of the positioning pin 2 and the positioning groove 5, ensures the stability and accuracy of the material frame 3 during the adsorption process, effectively preventing slipping and deviation.

[0025] The electromagnet device includes a limiting rod 231. The electromagnet device controls the extension and retraction of the limiting rod 231. The electromagnet device adopts SMC VQZ series, which is a prior art and will not be described in detail. The limiting rod 231 remains in a retracted state under the action of magnetic force, avoiding interference with the normal adsorption positioning of the material frame 3. The electromagnet device can automatically control the extension and retraction of the limiting rod 231 without manual intervention, improving the automation level of the system and reducing the operation complexity.

[0026] When the material frame 3 slips, lateral extrusion force is generated between the positioning pin 2 and the positioning groove 5, causing the pressure sensor 22 to detect a sudden increase in value, the electromagnetic iron device to be closed, the limiting rod 231 to be inserted into the limiting hole 51 of the material frame 3, and finally to be in contact with the buffer pad 52 to form a mechanical hard limit, preventing the material frame 3 from further displacement; the pressure sensor 22 in the middle of the positioning pin 2 can monitor in real time, and once an abnormality (such as an increase in lateral extrusion force caused by the slip of the material frame 3) is found, the electromagnetic iron device is triggered to act, realizing fast response and mechanical hard limit, and improving the safety and reliability of the system.

[0027] After the adsorption recovers to be stable, the electromagnetic iron device is opened to pull back the limiting rod 231 to the retracted position.

[0028] The buffer pad 52 provides buffering to reduce the vibration caused to the material frame 3 during the limiting process, thereby avoiding the influence on the wafer material in the material frame 3.

[0029] The rubber gasket 41 includes a bottom block 6 and a convex block 7, the convex block 7 is in the form of a circular ring, the inner diameter of the convex block 7 is smaller than the inner diameter of the adsorption disc 1, the outer diameter of the convex block 7 is greater than the outer diameter of the adsorption disc 1, the bottom block 6 and the mounting groove 42 are in clearance fit, and the bottom block 6 and the convex block 7 of the rubber gasket 41 are designed, and the positioning groove 5 and the convex block 7 are coaxially arranged, so that the connection between the positioning plate 4 and the adsorption disc 1 is not only tight but also flexible, easy to install and adjust, and suitable for material frames 3 of different sizes and shapes.

[0030] The adsorption disc 1 is provided with a vacuum hole in the middle, the adsorption disc 1 is coaxially fixed with the positioning pin 2, the end of the positioning pin 2 close to the vacuum hole is in a hollow structure, and a plurality of air permeable holes 21 are arranged through the side wall of the end of the positioning pin 2 close to the vacuum hole.

[0031] The middle upper end of the positioning pin 2 is provided with a pressure sensor 22, and the end of the positioning pin 2 away from the vacuum hole is vertically provided with an electromagnetic iron device.

[0032] The plurality of air permeable holes 21 are arranged in equal intervals; the longitudinal section of the end of the positioning pin 2 away from the vacuum hole is in the form of a capsule, and the plurality of air permeable holes 21 are arranged in equal intervals, which not only improves the air permeation efficiency, but also enhances the stability and durability of the structure.

[0033] The adsorption disc 1 is provided with a limiting block 8 around the vacuum hole, the limiting block 8 is arranged in a circumferential array, the limiting block 8 is arranged in intervals, the limiting block 8 forms a mechanical stop, limits the radial displacement of the material frame 3, and further enhances the stability and carrying capacity of the adsorption disc 1.

[0034] Work flow:

[0035] When the material frame 3 is placed on the adsorption disc 1, the negative pressure formed by the vacuum holes and the air holes 21 tightly adsorbs the material frame 3 on the adsorption disc 1. The cooperation of the positioning pin 2 and the positioning groove 5 further ensures the position accuracy of the material frame 3.

[0036] The pressure sensor 22 is located in the middle of the positioning pin 2 and is used to monitor the adsorption force in real time. Once the adsorption force is detected to be reduced or the material frame 3 is slipped, the value of the pressure sensor 22 will quickly rise.

[0037] When the pressure sensor 22 detects an abnormality, the electromagnet device is closed, the limiting rod 231 is ejected after losing the magnetic force, and is inserted into the limiting hole 51 of the material frame 3 to contact the buffer pad 52 to form a mechanical hard limit, thereby preventing the material frame 3 from further displacement.

[0038] When the adsorption is restored to be stable, the electromagnet device is restarted, the limiting rod 231 is pulled back to the retracted position, and the material frame 3 is again in the normal adsorption state.

[0039] The buffer pad 52 provides buffering during the limiting process, reduces the impact on the material frame 3, and protects the wafer material in the material frame 3 from being damaged.

[0040] The above description of the disclosed embodiments is to enable a person skilled in the art to implement or use the utility model. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the utility model. Therefore, the utility model will not be limited to these embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A basket suction plate, characterized by: The adsorption disc is provided with a vacuum hole in the middle part, a positioning pin is coaxially fixed on the adsorption disc, the end of the positioning pin close to the vacuum hole is hollow structure, and a plurality of air holes are arranged on the side wall of the end of the positioning pin close to the vacuum hole.

2. A stocker suction pad according to claim 1, characterized in that: A pressure sensor is arranged on the upper end of the middle part of the positioning pin, and an electromagnet device is vertically arranged on the end of the positioning pin away from the vacuum hole.

3. A stock basket suction plate according to claim 2, characterized in that: The electromagnet device comprises a limiting rod, and the electromagnet device controls the ejection and retraction of the limiting rod.

4. A stocker suction plate according to claim 1, characterized in that: The plurality of air holes are arranged in equal intervals.

5. A stocker suction plate according to claim 1, characterized in that: The longitudinal section of the end of the positioning pin away from the vacuum hole is in capsule shape.

6. A stocker suction plate according to claim 1, characterized in that: Limiting blocks are arranged around the vacuum hole on the adsorption disc, the limiting blocks are arranged in a circle, and the limiting blocks are arranged in intervals.

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