Vacancy detection structure for chip packaging

Abstract

The utility model discloses a vacancy detection structure for chip packaging, which relates to the technical field of chip packaging and comprises a detection box, the top end of the detection box is provided with an observation window, one end of the detection box is provided with a through hole, and the bottom end of the inner side of the detection box is provided with an illuminating lamp. A moving frame is slidably connected to the inner side of the detection box, and bearing plates are symmetrically arranged on the inner side of the moving frame; a pressing plate is slidably connected to the inner side of the movable frame, a rubber pad is arranged on one side of the pressing plate, and a baffle is fixedly connected to the other end of the pressing plate. The movable frame is arranged on the inner side of the detection box, the bearing plate is mounted on the inner side of the movable frame, and selection can be effectively performed according to circuit boards of different sizes, so that the movable frame can correspond to the circuit boards, and the detection effect is effectively improved; light emitted by an illuminating lamp arranged at the bottom end can be effectively shielded, and the detection effect is effectively improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip packaging technical field, especially a chip packaging empty position detection structure. BACKGROUND

[0002] The chip packaging empty position detection structure is an important device for detecting the empty position defects that may occur in the chip packaging process, and the specific mode is to place the circuit board after packaging in the clamping frame, and adjust the position of the clamping frame to stably clamp the circuit board. Then, the bulb is connected with the circuit and makes it emit light, next, the moving structure is started to drive the bulb to move at the bottom end of the circuit board, and the circuit board is fully irradiated. In the irradiation process, the situation in the rack is observed from the observation hole. When the circuit board through hole has an empty position, the light will penetrate through the empty position and emit from the observation hole, forming obvious light effect, so as to realize the detection of the chip packaging empty position.

[0003] The utility model patent publication No. 202320256691.6 discloses a kind of chip packaging empty position detection structure, including rack, the clamping frame is slidably connected in one side of rack, the bottom end inboard of clamping frame is fixedly connected with baffle, the bottom end of rack is provided with moving structure, moving structure is fixedly connected with bulb, the top end of rack one side is provided with observation hole.

[0004] But the above-mentioned device still has some shortcomings in actual use, more obvious is, the empty position detection structure of existing chip packaging when using, the bearing mechanism generally set with the uniform setting of circuit board, lead to when detecting different size circuit board, lead to appear gap, affect the effect of detection, the gap generated when detecting different size circuit board cannot be blocked simultaneously, lead to still appear bright light at gap when carrying out light detection empty position, lead to detection is not accurate enough, affect the result of detection.

[0005] Therefore, it is necessary to invent a kind of chip packaging empty position detection structure to solve the above problems. UTILITY MODEL CONTENT

[0006] The utility model discloses a purpose lies in provide a kind of chip packaging vacancy detection structure, by being provided with moving frame in the inside of detection box, the inside of moving frame is equipped with bearing plate, can effectively select according to different size circuit board, to make it can correspond with circuit board, effectively improve the effect of detection, the inside of moving frame is provided with pressing plate and baffle, can effectively shield the light of illumination lamp set at bottom end, effectively improve the effect of detection, to solve the vacancy detection structure of existing chip packaging in the prior art described above when using, the bearing mechanism of its setting is generally set with the unity of circuit board, lead to when detecting circuit board of different size, lead to appear gap, affect the effect of detection, the gap generated when detecting circuit board of different size cannot be blocked simultaneously, lead to still appear bright light at gap when carrying out light detection vacancy, lead to detection is not accurate enough, affect the result of detection.

[0007] According to one aspect of the present disclosure, a chip packaging vacancy detection structure is provided as follows: a detection box is provided, the top end of the detection box is provided with an observation window, one end of the detection box is provided with a through hole, and the bottom end of the inside of the detection box is provided with an illumination lamp.

[0008] A moving frame is slidably connected to the inside of the detection box, and bearing plates are symmetrically arranged on the inside of the moving frame.

[0009] A pressing plate is slidably connected to the inside of the moving frame, a rubber pad is arranged on one side of the pressing plate, and a baffle is fixedly connected to the other end of the pressing plate.

[0010] According to the chip packaging vacancy detection structure of at least one embodiment of the present disclosure, the two sides of the moving frame are provided with mounting grooves, the inside of the mounting grooves is provided with a fixed plate, and the bearing plate is fixedly connected to one side of the fixed plate.

[0011] According to the chip packaging vacancy detection structure of at least one embodiment of the present disclosure, the inside of the mounting groove is provided with a threaded hole, one side of the threaded hole is provided with a hidden hole, the inside of the hidden hole is provided with a fastening bolt, and the fixed plate is fixedly connected to the inside of the mounting groove through the fastening bolt.

[0012] According to the chip packaging vacancy detection structure of at least one embodiment of the present disclosure, the inside of the rear end of the moving frame is provided with a through groove, and the baffle is slidably connected to the inside of the through groove.

[0013] According to the chip packaging vacancy detection structure of at least one embodiment of the present disclosure, the rear side of the detection box is fixedly connected with a driving motor, the bottom end of the moving frame is fixedly connected with a moving block, the output end of the driving motor is drivingly connected with a lead screw, and the lead screw is threadedly connected to the inside of the moving block.

[0014] The technical effects and advantages of the utility model are as follows:

[0015] (1) the utility model discloses a mobile frame is arranged on the inboard of detection box, the inboard of mobile frame is installed with the bearing plate, can effectively select according to the circuit board of different size, to make it can correspond with the circuit board, effectively improve the effect of detection, the inboard of mobile frame is provided with the pressing plate and the baffle, can effectively shield the light of the illumination lamp set on the bottom end, effectively improve the effect of detection. BRIEF DESCRIPTION OF DRAWINGS

[0016] The accompanying drawings illustrate exemplary embodiments of the present disclosure and together with the general description of the disclosure given above, and the detailed description of the embodiments below, serve to explain the principles of the present disclosure.

[0017] Figure 1 It is the overall structure schematic diagram of a chip packaging vacancy detection structure according to one embodiment of the present disclosure.

[0018] Figure 2 It is the structure schematic diagram of one of mobile frame main bodies in a chip packaging vacancy detection structure according to one embodiment of the present disclosure.

[0019] Figure 3 It is the structure schematic diagram of the second mobile frame main body in a chip packaging vacancy detection structure according to one embodiment of the present disclosure.

[0020] Figure 4 It is the internal structure schematic diagram of detection box in a chip packaging vacancy detection structure according to one embodiment of the present disclosure.

[0021] The specific reference signs in the drawings are as follows:

[0022] 1, detection box;11, observation window;12, through hole;13, illumination lamp;

[0023] 2, mobile frame;21, through slot;22, mounting groove;23, screw hole;24, hidden hole;25, moving block;

[0024] 3, fixed plate;31, bearing plate;

[0025] 4, pressing plate;41, rubber pad;42, baffle;

[0026] 5, fastening bolt;

[0027] 6, driving motor;61, lead screw. DETAILED DESCRIPTION

[0028] As Figures 1-4As shown, the chip packaging vacancy detection structure of the present disclosure can include a detection box 1, the top end of the detection box 1 is provided with an observation window 11, one end of the detection box 1 is provided with a through hole 12, and the bottom end of the inner side of the detection box 1 is provided with an illuminating lamp 13;

[0029] The inner side of the detection box 1 is slidably connected with a moving frame 2, and the inner side of the moving frame 2 is symmetrically provided with a bearing plate 31;

[0030] The inner side of the moving frame 2 is slidably connected with a pressing plate 4, one side of the pressing plate 4 is provided with a rubber pad 41, and the other end of the pressing plate 4 is fixedly connected with a baffle 42.

[0031] Therefore, by arranging the moving frame 2 on the inner side of the detection box 1 and installing the bearing plate 31 on the inner side of the moving frame 2, the circuit board of different sizes can be selected, so that it can correspond to the circuit board, and the detection effect is effectively improved. The inner side of the moving frame 2 is provided with the pressing plate 4 and the baffle 42, which can effectively shield the light emitted by the illuminating lamp 13 arranged at the bottom end, thereby effectively improving the detection effect.

[0032] As shown in the preferred embodiment, Figure 3 The two sides of the moving frame 2 are provided with mounting grooves 22, the inner side of the mounting groove 22 is provided with a fixed plate 3, and the bearing plate 31 is fixedly connected to one side of the fixed plate 3.

[0033] Therefore, by arranging the mounting groove 22, the fixed plate 3 can be fixedly installed on the inner side of the mounting groove 22, thereby facilitating replacement. The bearing plate 31 is fixedly connected to one side of the fixed plate 3, and the bearing plate 31 of different sizes can be replaced according to different circuit boards. The size of the fixed plate 3 is the same, and it can be fixed on the inner side of the mounting groove 22, thereby facilitating replacement work.

[0034] As shown in the preferred embodiment, Figure 2 and Figure 3 In the present disclosure, the inner side of the mounting groove 22 is provided with a threaded hole 23, one side of the threaded hole 23 is provided with a hidden hole 24, the inner side of the hidden hole 24 is provided with a fastening bolt 5, and the fixed plate 3 is fixedly connected to the inner side of the mounting groove 22 through the fastening bolt 5.

[0035] Therefore, by arranging the threaded hole 23, the fastening bolt 5 is arranged on the inner side of the threaded hole 23, the rear end of the fixed plate 3 is provided with a hole corresponding to the fastening bolt 5, so that the fastening bolt 5 can be threadedly connected to the inner side of the fixed plate 3, thereby effectively fixing the fixed plate 3 to the inner side of the mounting groove 22. The arrangement of the hidden hole 24 can effectively hide the fastening bolt 5.

[0036] As shown in the preferred embodiment, Figure 2 and Figure 3As shown, in a preferred embodiment, a through groove 21 is provided on the inner side of the rear end of the movable frame 2, and the baffle 42 is slidably connected to the inner side of the through groove 21.

[0037] Therefore, by setting the through groove 21, the baffle 42 can slide inside the through groove 21, making the movement of the baffle 42 more stable.

[0038] like Figure 4 As shown in this disclosure, a drive motor 6 is fixedly connected to the rear side of the detection box 1, a moving block 25 is fixedly connected to the bottom end of the moving frame 2, and a lead screw 61 is driven to the output end of the drive motor 6. The lead screw 61 is threaded to the inner side of the moving block 25.

[0039] Therefore, by setting up a drive motor 6, the drive motor 6 can effectively drive the lead screw 61 to rotate. The lead screw 61 is threadedly connected to the moving block 25, so that the rotation of the lead screw 61 can effectively drive the moving block 25 to move. The moving block 25 is fixedly connected to the bottom end of the moving frame 2, so that the moving frame 2 can be effectively moved, making it convenient to move the moving frame 2 from the outside of the test box 1 to the inside of the test box 1, place the circuit board, and then transport it to the inside of the test box 1 for testing.

[0040] In actual use, start the drive motor 6 to drive the moving frame 2 to slide out from the inside of the detection box 1. Select a carrier plate 31 of different sizes according to the size of the circuit board to be detected. After selection, fix the fixing plate 3 to the inside of the mounting groove 22, place the circuit board to be detected on the top of the carrier plate 31, and push the pressure plate 4 close to the circuit board so that there are no gaps around the circuit board, which is convenient for subsequent observation.

[0041] Then start the drive motor 6 to move the moving frame 2 into the inside of the test box 1, turn on the light 13, and observe through the observation window 11. If light leakage occurs on the circuit board, it means there is a void and it needs to be re-encapsulated; otherwise, it does not need to be.

[0042] Those skilled in the art should understand that the above embodiments are merely for illustrating the present disclosure and are not intended to limit the scope of the disclosure. Those skilled in the art can make other changes or modifications based on the above disclosure, and these changes or modifications still fall within the scope of the present disclosure.

Claims

1. A chip packaging vacancy detection structure, comprising a detection box (1), the top end of the detection box (1) is provided with an observation window (11), one end of the detection box (1) is provided with a through hole (12), the bottom end of the inner side of the detection box (1) is provided with an illuminating lamp (13); characterized in that The inner side of the detection box (1) is slidably connected with a moving frame (2), the inner side of the moving frame (2) is symmetrically provided with a bearing plate (31); The inner side of the moving frame (2) is slidably connected with a pressing plate (4), one side of the pressing plate (4) is provided with a rubber pad (41), the other end of the pressing plate (4) is fixedly connected with a baffle (42).

2. The void detection structure for a chip package according to claim 1, wherein: Both sides of the moving frame (2) are provided with mounting grooves (22), the inner side of the mounting groove (22) is provided with a fixed plate (3), and the bearing plate (31) is fixedly connected to one side of the fixed plate (3).

3. The void detection structure for a chip package according to claim 2, wherein: The inner side of the mounting groove (22) is provided with a threaded hole (23), one side of the threaded hole (23) is provided with a hidden hole (24), the inner side of the hidden hole (24) is provided with a fastening bolt (5), and the fixed plate (3) is fixedly connected to the inner side of the mounting groove (22) through the fastening bolt (5).

4. The void detection structure for a chip package according to claim 3, wherein: The inner side of the rear end of the moving frame (2) is provided with a through groove (21), and the baffle (42) is slidably connected to the inner side of the through groove (21).

5. The void detection structure for a chip package according to claim 4, wherein: The rear side of the detection box (1) is fixedly connected with a driving motor (6), the bottom end of the moving frame (2) is fixedly connected with a moving block (25), the output end of the driving motor (6) is drivingly connected with a lead screw (61), and the lead screw (61) is threadedly connected to the inner side of the moving block (25).

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