Protection structure of laser etching film

Abstract

The utility model provides a protection structure of a laser etching film, the laser etching film is provided with at least one free surface and comprises at least one first film, and the first film is arranged on the free surface of the laser etching film in a peelable manner; and at least one second film, wherein the second film is arranged on a free surface of the first film in a peelable manner. According to the technical scheme, the peelable second film has the effect of protecting the first film, the first film is prevented from being scratched in the carrying and storage process, the first film is removed before laser etching, laser enters the laser etching film through the non-damaged surface of the second film, and the laser etching quality is improved. Laser reflection and refraction caused by scratches on the surface of the protective film in the laser etching process are reduced, and breakpoints or failures occurring in the partitioning process are reduced.

Description

Technical Field

[0001] This utility model relates to the field of dimming film processing, specifically to a protective structure for a laser-etched film used in the laser etching process of film materials. Background Technology

[0002] The laser-etched film in this application is a transparent sheet material composed of layers of materials with different properties and functions. It has at least one substrate layer and other functional layers. One or more layers are etched with a laser to create patterns or partitions. For example, the electronically controlled dimming film usually uses a multilayer film composed of polyethylene terephthalate (PET) and indium tin oxide transparent electrostatic layer as the transparent conductive substrate layer for encapsulating dimming materials. In order to achieve regional control or pattern display of the dimming film, the transparent conductive layer in the dimming film is partitioned or patterned by laser etching. After partitioning, different areas can be individually powered on or off to achieve diverse dimming effects.

[0003] To ensure the best display performance of the electronically controlled dimming film, an easily peelable protective film is usually attached to the outside of the transparent conductive substrate layer. The dimming film undergoes multiple processes during actual production and manufacturing. Irreversible scratches are formed on the protective film during handling and other processes. These scratches will cause laser reflection and refraction during the laser etching process, resulting in uncontrollable breaks or failures in the partitioning process.

[0004] The current problem to be solved is to design a reasonable protective structure for the laser-etched film to reduce the reflection and refraction of scratches during the laser etching process. Utility Model Content

[0005] To address the above problems, this utility model proposes a protective structure for a laser-etched film, wherein the laser-etched film has at least one free surface, characterized in that it comprises: at least one first film, which is peelably disposed on the free surface of the laser-etched film; and at least one second film, which is peelably disposed on one free surface of the first film.

[0006] Furthermore, the first membrane is transparent.

[0007] Furthermore, the first film is fixed to the free surface of the laser-etched film by electrostatic adsorption or a removable adhesive.

[0008] Furthermore, the second membrane is fixed to a free surface of the first membrane by electrostatic adsorption or a removable adhesive.

[0009] Furthermore, the first membrane is a single-layer or multi-layer structure with a thickness ranging from 10 micrometers to 200 micrometers.

[0010] Furthermore, the second membrane is a single-layer or multi-layer structure with a thickness ranging from 10 micrometers to 100 micrometers.

[0011] Furthermore, the laser-etched film consists of a transparent polyethylene terephthalate layer and a transparent indium tin oxide layer.

[0012] Furthermore, the free surface of the transparent polyethylene terephthalate layer serves as the free surface of the laser-etched film.

[0013] Furthermore, the free surface of the transparent indium tin oxide layer serves as the free surface of the laser-etched film.

[0014] Furthermore, the laser-etched film is the transparent conductive substrate layer of the liquid crystal dimming film.

[0015] This application has at least the following advantages: Through the implementation of the technical solution of this application, in the laser etching process, the peelable second film has the function of protecting the first film, so that the first film is not scratched during handling and storage. Before laser etching, the second film is peeled off, and the laser enters the transparent laser etching film to be etched through the undamaged surface of the second film. The protective structure of the laser etching film reduces laser reflection and refraction caused by scratches during the laser etching process, and reduces the breakpoints or failures that occur during the partitioning process. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the protective structure of the laser-etched film described in this application.

[0017] Figure 2 This is an exploded view of the protective structure of the laser-etched film described in this application.

[0018] Figure 3 This is a schematic diagram of a liquid crystal dimming film with a protective structure having a double-layer laser-etched film before laser etching, as described in Embodiment 1 of this application.

[0019] Figure 4 This is a schematic diagram of a liquid crystal dimming film having a first film after the second film is removed before laser etching, as described in Embodiment 1 of this application.

[0020] Figure 5 This is a schematic diagram of a liquid crystal dimming film with a protective structure having a double-layer laser-etched film before laser etching, as described in Embodiment 2 of this application.

[0021] Figure 6 This is a schematic diagram of a liquid crystal dimming film having a first film after the second film is removed before laser etching, as described in Embodiment 2 of this application.

[0022] 100 — Laser-etched film with a protective structure of first and second films before laser etching.

[0023] 101 — Laser etching film after removing the second film, entering the laser etching process.

[0024] 11 - Laser Etched Film

[0025] 111—PET layer in the transparent conductive substrate layer of liquid crystal dimming film

[0026] 112—ITO layer in the transparent conductive substrate layer of the liquid crystal dimming film

[0027] 12—Laser Etching Film Free Surface

[0028] 21—First Membrane

[0029] 211—First film substrate layer

[0030] 212—First film adhesive layer

[0031] 22—First Membrane—Free Surface

[0032] 31—Second Membrane

[0033] 313—Second release layer

[0034] 312—Second film substrate layer

[0035] 311—Second film adhesion layer

[0036] 41—Liquid Crystal Layer Detailed Implementation

[0037] The following is in conjunction with the appendix Figure 1-3 This application will be described in further detail below.

[0038] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments.

[0039] The protective structure of the laser etching film in this application is used to protect the laser etching film from the influence of scratches on the surface of the first film during the laser etching process, eliminate laser reflection or refraction caused by scratches on the surface of the first film, and reduce defects generated during the laser etching process.

[0040] As one embodiment, the protective structure mentioned in this application has at least a first film and a second film. The first film and the second film are single-layer or multi-layer structures. The single-layer structure is a substrate layer, and the multi-layer structure is a combination of a substrate layer and other functional layers. The functional layers are one or more of an adhesive layer or a release layer. The adhesive layer can be an electrostatic adsorption layer or an adhesive layer.

[0041] In one implementation, the first film is a single-layer polymer film with electrostatic adsorption on its surface, or a double-layer polymer film with an adhesive layer, which can be adhered to the free surface of the laser etching film. After the processing is completed, it is peeled off from the free surface. The first film needs to have good transmittance to the laser used in the processing.

[0042] In one embodiment, the second film is a single-layer polymer film with electrostatic adsorption on its surface, or a double-layer polymer film with an adhesive layer, which can be bonded to the free surface of the first film. The free surface faces away from the laser-etched film. After the processing is completed, it can be peeled off from the first surface. The second film does not need to be transparent to the laser used in the processing.

[0043] In one embodiment, the first or second membrane has a release layer on the side opposite to the adhesive layer.

[0044] As one implementation, the peel strength between the first film and the protected surface is preferably greater than 1 gf / 25 mm and less than 200 gf / 25 mm.

[0045] As one implementation method, the peel strength between the first film and the protected surface is preferably 5, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 100, 110, 120, 130, 140, 150, 160, 170, 180, 190, or 200 (all values ​​are in gf / 25mm).

[0046] As one implementation, the peel strength between the second film and the first surface is preferably 1, 4, 8, 12, 18, 24, 28, 32, 38, 42, 48, 53, 58, 62, 68, 73, 78, 82, 88, 92, 98, 108, 118, 128, 138, 148, 158, 168, 178, 188 (all values ​​are in gf / 25mm).

[0047] In one implementation, the peel strength between the first film and the protected surface is greater than the peel strength between the second film and the first surface.

[0048] In one embodiment, the first film is a transparent polymer, and the substrate can be selected from PET, PC, PMMA, PE, OPP, and CPP.

[0049] In one embodiment, the second film is a transparent or opaque polymer, and the substrate can be selected from PET, PC, PMMA, PE, OPP, and CPP.

[0050] In one implementation, the first film thickness is one of 10 micrometers, 15 micrometers, 20 micrometers, 25 micrometers, 30 micrometers, 35 micrometers, 40 micrometers, 45 micrometers, and 50 micrometers, 60 micrometers, 70 micrometers, 80 micrometers, 90 micrometers, 100 micrometers, 120 micrometers, 135 micrometers, 150 micrometers, 165 micrometers, 180 micrometers, 190 micrometers, and 200 micrometers.

[0051] In one embodiment, the second film thickness is one of 10 micrometers, 15 micrometers, 20 micrometers, 25 micrometers, 30 micrometers, 35 micrometers, 40 micrometers, 45 micrometers, and 50 micrometers, 60 micrometers, 70 micrometers, 80 micrometers, 90 micrometers, and 100 micrometers.

[0052] In one implementation, the side of the laser-etched film facing away from the laser incident surface has a third protective film, which can be attached to the laser-etched film by electrostatic adsorption or a removable adhesive. The third protective film can be a single-layer or multi-layer structure.

[0053] As one implementation, the laser etching film mentioned in this application is a transparent layered sheet that has good light transmittance for the laser applied to it for etching. The laser used can be one or more of ultraviolet light, visible light, infrared light, or other lasers.

[0054] In one embodiment, the laser-etched film is a multilayer transparent layered material. It can be glass with functional coatings, such as glass with a reflection reduction layer, a transparent conductive layer, and a refractive index adjustment layer, or it can be a polymer with functional coatings, such as a polymer film with one or more of the following: a reflection reduction layer, a transparent conductive layer, a refractive index adjustment layer, a water-blocking layer, and a breakdown-resistant layer. The polymer can be selected from one or more of PET, PC, PMMA, PE, OPP, and CPP.

[0055] As one implementation method, the laser-etched film is a commonly used transparent conductive substrate layer in dimming film components. It is composed of transparent polyethylene terephthalate (PET) and transparent indium tin oxide (ITO). It can be a two-layer structure of PET / ITO or a three-layer structure of ITO / PET / ITO. Typically, a laser is used to etch the ITO layer in the transparent conductive layer, which can divide the transparent conductive layer into sections, and the divided areas can be independently controlled by circuits.

[0056] In one implementation, the laser-etched film is a transparent conductive substrate layer on one side of the dimming film assembly.

[0057] In one implementation, the laser-etched film is a transparent conductive substrate layer on both sides of the dimming film assembly.

[0058] As one implementation method, in order to protect the outer surface of the transparent conductive substrate layer from scratches during processing, it usually has a protective film on its surface before use, which is the first film mentioned in this application.

[0059] In one implementation, the first film is applied to the free surface of the laser-etched film by electrostatic adsorption or an adhesive layer;

[0060] As one implementation method, the free surface of the laser-etched film can be an ITO layer or a PET layer in a transparent conductive substrate layer; this is related to the direction of laser incident, and the laser incident surface is the free surface of the laser-etched film.

[0061] In one implementation, the laser is incident perpendicularly from the PET side of the PET / ITO transparent conductive substrate, in which case the free surface of the PET layer serves as the free surface of the laser etching film.

[0062] In one implementation, the laser is incident perpendicularly from the ITO side of the PET / ITO transparent conductive substrate. In this case, the free surface of the ITO layer serves as the free surface of the laser etching film.

[0063] In one implementation, the laser is incident perpendicularly from the ITO side of the ITO / PET / ITO transparent conductive substrate. In this case, the free surface of the ITO layer on either side serves as the free surface of the laser etching film.

[0064] In one implementation, the laser is incident vertically from both sides of the ITO on the ITO of the ITO / PET / ITO transparent conductive substrate, respectively. In this case, the free surfaces of the laser-etched film are two independent free surfaces of the ITO layer.

[0065] Example 1

[0066] like Figure 1 As shown, the protective structure of the laser-etched film consists of a first film 21 and a second film 31. Figure 3 and Figure 4 The protective structure of the laser-etched film is shown in two states: with a second film and with the second film removed.

[0067] In this embodiment, the laser-etched film 11 is a double-layer structure consisting of a PET layer 111 and an ITO layer 112 in the transparent conductive substrate layer of the liquid crystal dimming film.

[0068] The first film 21 in the protective structure of the laser etched film is a double transparent film 212 with PET as the substrate layer 211 and pressure-sensitive adhesive as the adhesive layer, with a total thickness of 200 micrometers. The adhesive layer is bonded to the free surface outside the transparent conductive substrate layer PET of the liquid crystal dimming film. The free surface is the protected surface. The peel strength between the first film 21 and the protected surface is 20gf / 25mm.

[0069] The second film 31 is a three-layer film with PET as the substrate layer 312 and having an electrostatic adsorption layer 311 and a release layer 313. It has a thickness of 100 micrometers and is electrostatically adsorbed on the first surface 22 of the first film on the side away from the laser-etched film. The peel strength between the second film 31 and the first surface 22 is 5gf / 25mm. The release layer 313 is located on the side of the PET substrate layer away from the adhesive layer.

[0070] An ultraviolet laser is incident perpendicularly from the PET side of a PET / ITO transparent conductive substrate to etch the ITO layer. The etched PET / ITO transparent conductive substrate can be used as a transparent conductive substrate layer for a polymer-dispersed liquid crystal dimming film.

[0071] Example 2

[0072] The difference between this embodiment and Embodiment 1 is that the free surface of the laser-etched film is a transparent conductive substrate layer on both sides of the liquid crystal dimming film. Figure 5 and Figure 6 The protective structure of the laser-etched film is shown in two states: with a second film and with the second film removed.

[0073] Example 2

[0074] The difference between this embodiment and Embodiment 1 is that the second film in the protective structure of the laser-etched film does not have a release layer.

[0075] Example 3

[0076] The difference between this embodiment and Embodiment 1 is that the total thickness of the first membrane is 10 micrometers and the total thickness of the second membrane is 10 micrometers.

[0077] Example 4

[0078] The difference between this embodiment and Embodiment 1 is that the first film in the protective structure of the laser-etched film is a transparent PP film with a thickness of 50 micrometers, which is bonded to the outer surface of the transparent conductive substrate layer ITO. The free surface of the PET outer side serves as the protected surface, and the peel strength between the first film and the protected surface is 10gf / 25mm. The second film is a transparent PP film with a thickness of 30 micrometers, which is bonded to the free surface of the first film on the side away from the laser-etched film. The peel strength between the second film and the first surface is 5gf / 25mm. The laser is incident perpendicularly from the ITO side of the PET / ITO transparent conductive substrate to complete the etching of the ITO layer.

[0079] Example 5

[0080] The difference between this embodiment and Embodiment 1 is that the first film is bonded to the protected surface by pressure-sensitive adhesive, and the peel strength between the first film and the protected surface is 200gf / 25mm; the peel strength between the second film and the first surface is 100gf / 25mm.

[0081] Example 6

[0082] The difference between this embodiment and Embodiment 2 is that the laser-etched film is a transparent conductive substrate with a three-layer structure of ITO / PET / ITO. The laser is incident perpendicularly from any ITO side, and the free surface of the ITO layer near the laser side serves as the protected surface. The first film is bonded to the protected surface with a peel strength of 50gf / 25mm. The second film is bonded to the free surface of the side of the first film facing away from the laser-etched film with a peel strength of 20gf / 25mm. The laser is incident from the outside of the second film, completing the etching of the ITO layer on the protected surface.

[0083] Example 7

[0084] The difference between this embodiment and embodiment 4 is that both sides of the laser etching film have a protective structure for the laser etching film. The laser is incident vertically from both sides of the ITO / PET / ITO transparent conductive substrate ITO in sequence, and the ITO layer near the laser side is etched to complete the etching of the two ITO layers. Before each etching, the second film is removed and the first film is retained.

Claims

1. A protective structure for a laser-etched film, said laser-etched film having at least one free surface, characterized in that, include: At least one first film is peelably disposed on the free surface of the laser-etched film; as well as At least one second membrane is peelably disposed on a free surface of the first membrane.

2. The protective structure of the laser-etched film according to claim 1, characterized in that, The first membrane is transparent.

3. The protective structure of the laser-etched film according to claim 1, characterized in that, The first film is fixed to the free surface of the laser-etched film by electrostatic adsorption or a removable adhesive.

4. The protective structure of the laser-etched film according to claim 1, characterized in that, The second membrane is fixed to a free surface of the first membrane by electrostatic adsorption or a removable adhesive.

5. The protective structure of the laser-etched film according to claim 1, characterized in that, The first membrane is a single-layer or multi-layer structure with a thickness ranging from 10 micrometers to 200 micrometers.

6. The protective structure of the laser-etched film according to claim 1, characterized in that, The second membrane is a single-layer or multi-layer structure with a thickness ranging from 10 micrometers to 100 micrometers.

7. The protective structure of the laser-etched film according to claim 1, characterized in that, The laser-etched film consists of a transparent polyethylene terephthalate layer and a transparent indium tin oxide layer.

8. The protective structure of the laser-etched film according to claim 7, characterized in that, The free surface of the transparent polyethylene terephthalate layer serves as the free surface of the laser-etched film.

9. The protective structure of the laser-etched film according to claim 7, characterized in that, The free surface of the transparent indium tin oxide layer serves as the free surface of the laser-etched film.

10. The protective structure of the laser-etched film according to claim 1, characterized in that, The laser-etched film is a transparent conductive substrate layer of the liquid crystal dimming film.

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