Glue sealing mold of motor Hall device

Abstract

A first side plate, a second side plate, a third side plate and a fourth side plate which are vertically arranged and are respectively in close contact with the upper surface of a bottom plate are sequentially arranged and are in close connection pairwise, so that a semi-closed cavity for placing a Hall integrated circuit board is enclosed between the bottom plate and the first side plate, the second side plate, the third side plate and the fourth side plate; the other end of an external lead of a Hall element with one end electrically connected with the Hall integrated circuit board extends to the outer side of the rubber coating layer, and the upper end face, opposite to the bottom plate, of any one of the first side plate, the second side plate, the third side plate and the fourth side plate is provided with a supporting block. The supporting block is provided with a positioning through hole through which one end, far away from the Hall integrated circuit board, of the external lead passes. According to the utility model, the encapsulation of the Hall element can be realized through a simple structure, the size precision and the aesthetic property of the encapsulated product can be ensured, and the position precision and the performance stability of the processed product can also be ensured.

Description

Technical Field

[0001] This utility model relates to the field of Hall element processing technology, and in particular to a sealing mold for a motor Hall device. Background Technology

[0002] In some specialized linear motor modules, multiple motors need to be driven. To ensure the stable operation of these multi-drive linear motor modules, Hall effect sensors are required to compensate for the motors. Hall effect sensors use PU resin potting compound, which is a viscous liquid that easily adheres to the wall. Furthermore, during the curing process, the surface of the compound may sink, affecting the overall size and aesthetics of the Hall effect sensor. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a sealing mold for a motor Hall device. This sealing mold can achieve the encapsulation of the Hall device with a simple structure and ensure the dimensional accuracy and aesthetics of the encapsulated product. It can also ensure the positional accuracy and performance stability of the processed product.

[0004] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is: a sealing mold for a motor Hall device, wherein the Hall device includes: a Hall integrated circuit board, an encapsulation layer covering the outside of the Hall integrated circuit board, and external leads; the sealing mold includes: a horizontally arranged base plate and a first side plate, a second side plate, a third side plate, and a fourth side plate arranged vertically and respectively in close contact with the upper surface of the base plate; the first side plate, the second side plate, the third side plate, and the fourth side plate arranged in sequence are tightly connected to each other, thereby forming a semi-closed cavity with the base plate into which the Hall integrated circuit board can be placed;

[0005] The other end of the external lead of the Hall device, which is electrically connected to the Hall integrated circuit board at one end, extends to the outside of the encapsulation layer. A support block is installed on any one of the first side plate, the second side plate, the third side plate, and the fourth side plate, opposite to the upper end face of the base plate. A positioning through hole is opened on the support block for the end of the external lead away from the Hall integrated circuit board to pass through.

[0006] The following are further improvements to the above technical solution:

[0007] 1. In the above scheme, the main body of the support block is fixedly installed on the upper surface of the third side plate by bolts, and the outer extension of the support block extends to the top of the semi-enclosed cavity.

[0008] 2. In the above scheme, the positioning through hole is opened on the outer extension of the support block.

[0009] 3. In the above scheme, the first side plate, the second side plate, the third side plate, and the fourth side plate are all fixedly connected to the base plate by vertical bolts.

[0010] 4. In the above scheme, the first side plate and the third side plate, which are arranged in parallel opposite directions, are fixedly connected by two transverse bolts that pass through the second side plate and the third side plate respectively.

[0011] Due to the application of the above technical solution, this utility model has the following advantages compared with the prior art:

[0012] This utility model relates to a sealing mold for a Hall effect device. A first, second, third, and fourth side plate, arranged vertically and in close contact with the upper surface of a base plate, are arranged sequentially and tightly connected in pairs, forming a semi-enclosed cavity with the base plate into which a Hall effect integrated circuit board can be placed. The other end of the external lead of the Hall effect device, electrically connected to the Hall effect integrated circuit board at one end, extends to the outside of the encapsulation layer. A support block is mounted on any one of the first, second, third, or fourth side plates, opposite to the upper surface of the base plate. The support block has a positioning through-hole for the end of the external lead away from the Hall effect integrated circuit board to pass through. This design achieves encapsulation of the Hall effect device with a simple structure, ensuring dimensional accuracy and aesthetics of the encapsulated product. Furthermore, by positioning the external lead connected to the Hall effect integrated circuit board, the positioning of the Hall effect integrated circuit board and the external lead is achieved during the encapsulation process, ensuring the positional accuracy and stable performance of the processed product. Attached Figure Description

[0013] Appendix Figure 1 This is a schematic diagram of the sealing mold for the motor Hall effect device of this utility model;

[0014] Appendix Figure 2 This is a cross-sectional view of the sealing mold of this utility model in a working state;

[0015] Appendix Figure 3 This is a structural schematic diagram of the sealing mold of this utility model under another working state.

[0016] In the above figures: 101, Hall effect integrated circuit board; 102, encapsulation layer; 103, external lead wire; 1, first side plate; 2, second side plate; 3, third side plate; 4, fourth side plate; 5, base plate; 6, semi-enclosed cavity; 71, vertical bolt; 72, horizontal bolt; 8, positioning through hole; 9, support block; 91, body part; 92, extension part. Detailed Implementation

[0017] The present patent can be further understood through the specific embodiments given below, but they are not intended to limit the present patent.

[0018] Embodiment 1: a glue sealing mold for a motor Hall device, the Hall device comprising: a Hall integrated circuit board 101, a glue coating layer 102 coated on the outer side of the Hall integrated circuit board 101, and an external lead 103, the glue sealing mold comprising: a bottom plate 5 arranged horizontally, and a first side plate 1, a second side plate 2, a third side plate 3, and a fourth side plate 4 arranged vertically and in close contact with the upper surface of the bottom plate 5, the first side plate 1, the second side plate 2, the third side plate 3, and the fourth side plate 4 being arranged in sequence and being tightly connected between each other, thereby forming a semi-closed cavity 6 with the bottom plate 5, in which the Hall integrated circuit board 101 can be placed.

[0019] The other end of the external lead 103 of the Hall device electrically connected to one end of the Hall integrated circuit board 101 extends to the outside of the glue coating layer 102, and any one of the first side plate 1, the second side plate 2, the third side plate 3, and the fourth side plate 4 is provided with a support block 9 opposite to the upper end surface of the bottom plate 5, and the support block 9 is provided with a positioning through hole 8 through which the external lead 103 away from the one end of the Hall integrated circuit board 101 passes.

[0020] The body part 91 of the support block 9 is fixedly installed on the upper end surface of the third side plate 3 by means of bolts, and the extension part 92 of the support block 9 extends to the upper side of the semi-closed cavity 6, and the positioning through hole 8 is arranged on the extension part 92 of the support block 9.

[0021] Embodiment 2: a glue sealing mold for a motor Hall device, the Hall device comprising: a Hall integrated circuit board 101, a glue coating layer 102 coated on the outer side of the Hall integrated circuit board 101, and an external lead 103, the glue sealing mold comprising: a bottom plate 5 arranged horizontally, and a first side plate 1, a second side plate 2, a third side plate 3, and a fourth side plate 4 arranged vertically and in close contact with the upper surface of the bottom plate 5, the first side plate 1, the second side plate 2, the third side plate 3, and the fourth side plate 4 being arranged in sequence and being tightly connected between each other, thereby forming a semi-closed cavity 6 with the bottom plate 5, in which the Hall integrated circuit board 101 can be placed.

[0022] The other end of the external lead 103 of the Hall device electrically connected to one end of the Hall integrated circuit board 101 extends to the outside of the glue coating layer 102, and any one of the first side plate 1, the second side plate 2, the third side plate 3, and the fourth side plate 4 is provided with a support block 9 opposite to the upper end surface of the bottom plate 5, and the support block 9 is provided with a positioning through hole 8 through which the external lead 103 away from the one end of the Hall integrated circuit board 101 passes.

[0023] The first side plate 1, the second side plate 2, the third side plate 3 and the fourth side plate 4 are fixedly connected with the bottom plate 5 through vertical bolts 71 respectively; the first side plate 1 and the third side plate 3 are fixedly connected through two horizontal bolts 72 respectively penetrating the second side plate 2 and the third side plate 3.

[0024] In use, the Hall integrated circuit board is installed on the inner side of the first side plate and kept at a distance from the inner side surface of the first side plate, and the other end of the external lead wire electrically connected with one end of the Hall integrated circuit board is directed upward;

[0025] The lower end of the first side plate is tightly installed on the upper surface of the bottom plate, and the lower end of each of the second side plate and the fourth side plate is tightly installed on the upper surface of the bottom plate, at this time, the first side plate is connected between one end of each of the second side plate and the fourth side plate, and the third side plate is arranged between the other end of each of the second side plate and the fourth side plate and tightly installed on the upper surface of the bottom plate, and each of the second side plate and the fourth side plate is tightly connected with the first side plate and the third side plate on the outer side of both ends thereof, thereby forming a semi-closed cavity for injecting glue between the first side plate, the second side plate, the third side plate, the fourth side plate and the bottom plate which are tightly connected with each other, and the Hall integrated circuit board installed on the inner side of the first side plate is located in the semi-closed cavity;

[0026] The other end of the external lead wire opposite to the Hall integrated circuit board is penetrated through a positioning through hole on a support block, and the support block is installed on the upper end surface of the third side plate;

[0027] The encapsulation glue is injected into the semi-closed cavity, and after shaping and cooling, the Hall device is obtained by demolding.

[0028] The further explanation of the above embodiment is as follows:

[0029] The Hall element is designed to have the function and be convenient to install at the same time;

[0030] The semi-closed structure is adopted, only the upper glue injection port is reserved, the rest of the components are tightly combined, the traditional screw locking type is used to fix the shape of the Hall element, and the height of the jig plate around the Hall element is the length of the Hall element, which ensures the distance between the product and the output line of the motor.

[0031] Only the screw locking is needed to fix, the jig is flexible and convenient to install, and the cost is low; the face-to-face cooperation between the jig plates ensures the overall size accuracy of the Hall element; the fixed height of the jig plate ensures the total length of the Hall element, and avoids the interference with the output line of the motor.

[0032] The whole structure is simple, compact and reliable, the whole jig can be directly put into a glue filling machine to perform glue filling operation, convenient for personnel operation, there is no groove structure, easy demolding, and the Hall element cannot be demolded; the glue filling process can be formed at one time, without secondary processing, reducing the working steps and saving time.

[0033] When the glue sealing mold of the motor Hall device is used, the Hall device can be encapsulated through a simple structure, the size precision and the appearance of the product after encapsulation can be ensured, the positioning of the external lead connected with the Hall integrated circuit board can be realized, the positioning of the Hall integrated circuit board and the external lead during the glue filling process can be realized, and the position precision and the stability of the performance of the obtained product can be ensured.

[0034] The above embodiments are only for illustrating the technical concept and characteristics of the utility model, the purpose is to enable people skilled in the art to understand the content of the utility model and implement it, and cannot limit the protection scope of the utility model. Any equivalent change or modification according to the spirit and essence of the utility model should be covered in the protection scope of the utility model.

Claims

1. An encapsulation mold for a motor Hall device, the Hall device comprising: The application discloses a Hall integrated circuit board (101), a glue coating layer (102) coated outside the Hall integrated circuit board (101) and an external lead (103), characterized in that: the glue coating mold comprises a bottom plate (5) horizontally arranged and a first side plate (1), a second side plate (2), a third side plate (3) and a fourth side plate (4) vertically arranged and closely contacting with the upper surface of the bottom plate (5), the first side plate (1), the second side plate (2), the third side plate (3) and the fourth side plate (4) are closely connected in pairs and form a semi-closed cavity (6) for placing the Hall integrated circuit board (101) with the bottom plate (5); one end of the external lead (103) of the Hall device electrically connected with the Hall integrated circuit board (101) extends to the outside of the glue coating layer (102), any one of the first side plate (1), the second side plate (2), the third side plate (3) and the fourth side plate (4) is provided with a support block (9) opposite to the upper end surface of the bottom plate (5), and the support block (9) is provided with a positioning through hole (8) for the external lead (103) to pass through.

2. The potting mold for motor Hall devices according to claim 1, characterized by: The body part (91) of the support block (9) is fixedly installed on the upper end surface of the third side plate (3) through a bolt, and the extension part (92) of the support block (9) extends to the upper side of the semi-closed cavity (6).

3. The potting mold for motor Hall devices according to claim 2, characterized by: The positioning through hole (8) is arranged on the extension part (92) of the support block (9).

4. The potting mold for motor Hall devices according to claim 1, characterized by: The first side plate (1), the second side plate (2), the third side plate (3) and the fourth side plate (4) are fixedly connected with the bottom plate (5) through vertical bolts (71).

5. The encapsulation mold for motor Hall devices according to claim 1, characterized in that: The first side plate (1) and the third side plate (3) arranged in parallel are fixedly connected through two horizontal bolts (72) penetrating through the second side plate (2) and the third side plate (3) respectively.

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