Special-shaped aluminum VC uniform-temperature plate, efficient heating and cooling mechanism and device comprising special-shaped aluminum VC uniform-temperature plate
By using a shaped aluminum VC heat exchange plate to transfer heat between the two surfaces of the object to be processed, the problem of low heat transfer efficiency on a single surface in existing technologies is solved, achieving efficient and durable heat conduction, adapting to different application scenarios and reducing processing difficulty.
Patent Information
- Application Number
- CN202520438881.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-13
- Publication Date
- 2026-02-17
- Estimated Expiration
- 2035-03-13
AI Technical Summary
Existing aluminum VC heat exchangers are inefficient when transferring heat to objects with large axial dimensions, as they only transfer heat on one side of the surface, and may increase processing costs or equipment complexity.
The irregularly shaped aluminum VC heat spreader has a non-coplanar first and second plate area structure, which respectively contact the two surfaces of the object to be processed to form a containment space. By bending it into a U-shaped structure, the heat conduction efficiency is ensured to be unaffected, avoiding the need for additional heat conduction elements.
It improves heat transfer efficiency, reduces energy loss, enhances durability, adapts to different heat transfer application scenarios, and reduces processing difficulty.
Smart Images
Figure CN223925541U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of heat exchange technology, specifically to an irregularly shaped aluminum VC heat exchange plate, a high-efficiency heating and cooling mechanism, and a device containing the same. Background Technology
[0002] For products or equipment that require frequent switching between heating and cooling modes, TEC semiconductor chips are typically used as the cold / heat source. This is because the cooling or heating effects can be achieved simply by adjusting the direction of the current input to the TEC semiconductor chip.
[0003] Currently, when using TEC semiconductor wafers to heat or cool objects with a certain length in the axial direction (such as cylindrical, barrel-shaped, or bottle-shaped objects), in order to ensure more efficient heat conduction, it is necessary to set up an additional heat conduction element with higher efficiency to transfer the cold or hot energy of the TEC semiconductor wafer to the object to be processed.
[0004] Aluminum VC vapor chambers are widely used in environments requiring high heat transfer efficiency due to their excellent thermal conductivity. Inside the aluminum VC vapor chamber are several capillary cores arranged alternately (or in a mesh pattern) along the transverse and longitudinal directions of the plate. Within these capillary cores is a working fluid (such as pure water) that undergoes a phase change based on temperature. The working fluid changes between vapor and liquid phases within the aluminum VC vapor chamber based on the temperature difference across the two sides, continuously circulating within the capillary cores, thereby achieving rapid heat transfer. Due to the complex capillary core structure, aluminum VC vapor chambers are mostly used in a flat, plate-like shape.
[0005] Therefore, when using an aluminum VC vapor chamber as a heat transfer device for TEC semiconductor wafers, it needs to contact both the TEC semiconductor wafer and the object being processed. Consequently, the aluminum VC vapor chamber is usually only placed on one side of the object being processed. However, when the object being processed has a large axial dimension, if heat transfer can only occur on one side of the object, the efficiency of heat transfer will be greatly reduced. Utility Model Content
[0006] To address the aforementioned technical problems, this utility model provides an irregularly shaped aluminum VC heat spreader, comprising a first plate area and a second plate area that is non-coplanar but integrally connected to the first plate area. The first plate area is used for heat conduction on at least a portion of a first surface of the object to be processed, and the second plate area is used for heat conduction on at least a portion of a second surface of the object to be processed. The first and second plate areas together form a receiving space for accommodating the object to be processed, and at least a portion of the second plate area is parallel to the axial direction of the object to be processed. This utility model's aluminum VC heat spreader breaks away from the existing flat plate structure of aluminum VC heat spreaders. By using a continuous and complete aluminum VC heat spreader to conduct heat on both surfaces of the object to be processed without the need for separate heat conduction elements, the original heat conduction performance of the aluminum VC heat spreader is not affected, and it also has the effect of heat conduction on objects with large dimensions in the height direction.
[0007] Furthermore, there are two second plate areas, positioned opposite each other at both ends of the first plate area. The two second plate areas and the first plate area are formed by bending the same aluminum VC heat spreader. Therefore, by providing two second plate areas that can conduct heat to a portion of the second surface of the object being treated, a better heat conduction effect can be achieved along the length of the second surface of the object, significantly improving heat conduction efficiency compared to traditional methods that only heat or cool one side of the object. Moreover, the opposing second plate areas can define the position of the object being treated, thus allowing for matching different heat conduction application scenarios.
[0008] Furthermore, a transition surface protruding outwards in a direction away from the object to be processed is formed at the junction of the first and second plate areas. Therefore, by setting the transition surface, the original internal structure of the aluminum VC heat exchanger is not damaged, and its thermal conductivity is not negatively affected.
[0009] Furthermore, the aluminum VC heat exchanger is U-shaped. This structure is adopted to avoid damaging the internal structure of the aluminum VC heat exchanger, ensuring that its heat transfer efficiency is not affected; however, it eliminates the need for additional heat-conducting elements, minimizing energy loss during heat transfer.
[0010] This utility model also provides a high-efficiency heating and cooling mechanism for heating or cooling an object to be processed with at least a portion of its area having a columnar shape. The mechanism includes a TEC semiconductor wafer and the aforementioned aluminum VC heat spreader, wherein the first plate area of the aluminum VC heat spreader is in contact with the TEC semiconductor wafer.
[0011] This utility model has the following beneficial effects:
[0012] ① By utilizing the rapid temperature conduction function of the aluminum VC heat exchange plate and setting it into a structure with a non-coplanar first plate area and a second plate area, the structure of existing similar products that only set an aluminum VC heat conduction plate on one side of the bottom or top of the object to be processed is broken, which greatly improves the heat conduction efficiency when heating or cooling the object to be processed.
[0013] ② This application extends an aluminum VC vapor chamber with a complete and continuous structure from the first surface to the second surface of the object to be processed, and at least a portion of the second plate area is parallel to the axial direction of the object to be processed. Therefore, without additional intermediate structure connecting the aluminum VC vapor chamber and the TEC semiconductor chip, heat transfer is achieved between the first and second surfaces of the object to be processed, and efficient heat conduction along the axial direction of the object to be processed is achieved, minimizing energy loss during the transfer process.
[0014] ③ The aluminum VC heat exchanger of this application has a shape for conducting heat to the first and second surfaces of the object to be processed. It only uses an aluminum VC heat exchanger that can conduct heat to both the first and second surfaces of the object to be processed at the same time, without destroying the original complete structure of the aluminum VC heat exchanger, so that its heat conduction performance is not affected.
[0015] Furthermore, the aluminum VC heat spreader and the object to be treated are separate components, and the aluminum VC heat spreader and the object to be treated are detachably connected. Therefore, by setting the aluminum VC heat spreader and the object to be treated as separate components, this application avoids the possibility of the aluminum VC heat spreader being contaminated by beverages, food, etc. inside the object to be treated; it also prevents the aluminum VC heat spreader from being corroded by beverages, food, etc. (especially acidic ones) inside the object to be treated, thus increasing the durability of the efficient heating and cooling mechanism of this application.
[0016] Furthermore, the width of the first plate area is the same as the width of the second plate area. Therefore, the processing difficulty of the aluminum VC heat exchanger is reduced, and only a simple bending operation using a common aluminum VC heat exchanger structure (such as a square or rectangular plate) is required to meet the usage requirements.
[0017] Furthermore, a heat dissipation section is provided on the side of the TEC semiconductor wafer away from the aluminum VC heat spreader.
[0018] Furthermore, it also includes a heat insulation sleeve fitted over the outside of the aluminum VC heat exchanger. Therefore, it can effectively reduce energy loss during the heating or cooling process.
[0019] Furthermore, it also includes an outer sheath located on the outside, the inner diameter of which is larger than the outer diameter of the aluminum VC heat spreader.
[0020] Furthermore, the aluminum VC heat spreader is integrated with the object to be processed. Attached Figure Description
[0021] Figure 1 This is a three-dimensional structural diagram of the high-efficiency heating and cooling mechanism of Embodiment 1 of this utility model without the outer protective sleeve.
[0022] Figure 2 This is a three-dimensional structural diagram of the aluminum VC heat spreader according to Embodiment 1 of this utility model;
[0023] Figure 3 This is a cross-sectional structural diagram showing the object to be processed placed in the receiving space.
[0024] Figure 4 This is a schematic diagram of the three-dimensional structure of the object to be processed;
[0025] Figure 5 This is a three-dimensional structural diagram of the object to be processed being placed in the receiving space.
[0026] Figure 6 This is a schematic diagram illustrating the usage state when cooling the object being processed.
[0027] In the picture:
[0028] 1. Object to be processed; 11. First surface; 12. Second surface; 2. TEC semiconductor wafer; 3. Aluminum VC heat spreader; 31. First plate area; 32. Second plate area; 33. Accommodation space; 34. Transition surface; 4. Heat dissipation part; 5. Heat insulation sleeve; 6. Outer sheath. Detailed Implementation
[0029] The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making a clearer and more definite definition of the scope of protection of the present invention.
[0030] Example 1:
[0031] See appendix Figure 1-6 As shown, this embodiment is a high-efficiency heating and cooling mechanism used to heat or cool an object 1 that has a columnar shape in at least a portion of its surface. The "columnar shape" of the object 1 here does not refer to a standard cylinder, prism, or other columnar shape; it can also be an irregular shape, as long as it has a roughly cylindrical appearance. The object 1 can also be bottle-shaped, as long as a portion of the bottle body or the entire bottle has a columnar structure that can be placed into the receiving space 33 that houses the object 1. The object 1 has an internal cavity for containing liquid or other materials to be heated.
[0032] The high-efficiency heating and cooling mechanism of this invention includes a TEC semiconductor chip 2 and an aluminum VC heat spreader 3. See attached diagram for details. Figure 2 As shown, the aluminum VC heat spreader 3 has a first plate area 31 that contacts the working surface of the TEC semiconductor wafer 2 and a second plate area 32 that is not coplanar with the first plate area 31 but integrally connected. The first plate area 31 can be attached to at least a portion of the first surface 11 of the object to be processed 1, and the second plate area 32 is attached to at least a portion of the second surface 12 of the object to be processed 1. The first plate area 31 and the second plate area 32 together form a receiving space 33 for accommodating the object to be processed 1. At least a portion of the second plate area 32 is parallel to the axial direction of the object to be processed 1.
[0033] See appendix Figure 4 As shown, the first surface 11 and the second surface 12 are two different surfaces of the object 1 to be processed. For example, in some embodiments, the first surface 11 is the bottom or top surface of the object 1 to be processed, and the second surface 12 can be the corresponding side surface.
[0034] When utilizing the aluminum VC vapor chamber plate 3 for heat conduction in a heating / cooling mechanism, it is often simply placed on one side of the object to be processed 1. However, when the object to be processed 1 is a large object in the axial direction (such as a columnar, barrel-shaped, or bottle-shaped object), heat transfer efficiency is greatly reduced if heat can only be transferred on one side. Note that "one side" here can also refer to the side wall of a columnar object, as this structure can be prepared by rolling a rectangular aluminum VC vapor chamber plate 3. However, when placing the aluminum VC vapor chamber plate on the columnar side wall of the object to be processed 1, an additional heat conduction structure for connection with the TEC semiconductor chip 2 is required. This still reduces heat conduction efficiency or increases the overall processing cost of the equipment.
[0035] This application sets the aluminum VC heat spreader 3 into a structure with a first plate area 31 and a second plate area 32 that are not coplanar. While maintaining the integrity and completeness of the aluminum VC heat spreader 3 structure, it breaks away from the existing similar products that only set one aluminum VC heat spreader 3 on the bottom or top single surface of the object to be treated 1. Instead, the same aluminum VC heat spreader 3 structure is set on both different surfaces of the object to be treated 1, which greatly improves the heat conduction efficiency and ensures that the heat conduction effect of the aluminum VC heat spreader 3 is not affected.
[0036] The utility model was tested by the user, and the efficient heating and cooling mechanism in the embodiments of this utility model was compared with similar products in the prior art to heat and cool water in a 500ml water cup.
[0037] The results show that, using the efficient heating and cooling mechanism of this application, a temperature increase of 40°C can be achieved within 20 minutes and a temperature increase of 30°C within 10 minutes under the same heating power. In contrast, competing products only achieve a temperature increase of 15°C within 10 minutes.
[0038] The high-efficiency heating and cooling mechanism of this application can achieve a temperature reduction of 6.2°C within 20 minutes under the same cooling power. In contrast, competing products only reduce the temperature by 1°C within 20 minutes.
[0039] Table 1 compares the heating performance of the high-efficiency heating and cooling mechanism of this invention with similar products.
[0040]
[0041] Table 2 compares the cooling performance of the high-efficiency heating and cooling mechanism of this invention with similar products.
[0042]
[0043] Furthermore, this application extends an aluminum VC vapor chamber plate 3 with a complete and continuous structure from the first surface 11 to the second surface 12 of the object to be processed, without the need for an additional intermediate heat conduction structure connecting the aluminum VC vapor chamber plate 3 and the TEC semiconductor chip 2, thus minimizing energy loss during the transfer process. Moreover, by utilizing a complete aluminum VC vapor chamber plate 3 to achieve heat transfer between the first surface 11 and the second surface 12 of the object to be processed, its high heat conduction efficiency is preserved because the capillary structure inside the aluminum VC vapor chamber plate 3 is not destroyed.
[0044] In some embodiments, the TEC semiconductor chip 2 and the aluminum VC heat spreader 3 can be connected by an adhesive with good thermal conductivity, or other structures (such as a heat insulation sleeve 5 or an outer sheath 6) can be used to limit the positions of the TEC semiconductor chip 2 and the aluminum VC heat spreader 3.
[0045] In some embodiments, the aluminum VC heat spreader 3 and the object to be treated 1 are separate components, and the aluminum VC heat spreader 3 and the object to be treated 1 are detachably connected. For example, the object to be treated 1 can be a beverage bottle, packaging bottle, beverage box, or ordinary water cup (the wall of the water cup needs to have heat conduction function). Therefore, by setting the aluminum VC heat spreader 3 and the object to be treated 1 as separate components, this application avoids the possibility of the aluminum VC heat spreader 3 causing contamination to the beverages, food, etc. inside the object to be treated 1; it also prevents the aluminum VC heat spreader 3 from being corroded by the beverages, food, etc. (especially acidic ones) inside the object to be treated 1, thus increasing the durability of the efficient heating and cooling mechanism of this application.
[0046] In some embodiments, there are two second plate areas 32, which are disposed opposite to each other at both ends of the first plate area 31. The two second plate areas 32 and the first plate area 31 are formed by bending an aluminum VC heat spreader 3 with an integral structure. Therefore, by providing two second plate areas 32 that are in contact with the second surface 12 of the object to be processed, a better heat conduction effect can be achieved in the length direction of the second surface 12 of the object to be processed. Compared with the traditional form of heating or cooling only on one side of the surface of the object to be processed, the heat conduction efficiency is greatly improved. Moreover, the two oppositely disposed second plate areas 32 can define the position of the object to be processed, and thus can be matched with different heat conduction application scenarios of the object to be processed.
[0047] In some embodiments, a transition surface 34 protruding outward in a direction away from the object to be processed 1 is formed at the junction of the first plate area 31 and the second plate area 32. This is because a plurality of capillary wick structures are provided inside the aluminum VC heat spreader 3, and the provision of this transition surface 34 will not damage the capillary wick structures inside the aluminum VC heat spreader 3, nor will it have a negative impact on its thermal conductivity.
[0048] In some embodiments, the aluminum VC heat spreader 3 is U-shaped. Here, "U-shaped" does not refer to a strict U-shape, but rather a structure resembling a U. This structure is used to avoid damaging the internal structure of the aluminum VC heat spreader 3, while eliminating the need for separate aluminum VC heat spreaders 3, thus not significantly increasing processing costs.
[0049] In some embodiments, the width of the first plate area 31 is the same as the width of the second plate area 32. Therefore, the processing difficulty of the aluminum VC heat spreader 3 is reduced, and only a simple bending operation using a common plate-shaped (such as square or rectangular) aluminum VC heat spreader 3 structure is required to meet the usage requirements.
[0050] In some embodiments, a heat sink 4 is provided on the side of the TEC semiconductor chip 2 away from the aluminum VC heat spreader 3. For example, the heat sink 4 can be a heat sink fin assembly or other heat dissipation structure. The overall shape of the heat sink 4 can be square, circular, or any other arbitrary shape. In some embodiments, the shape of the heat sink 4 is matched with the shape of other structures on the opposite side of the high-efficiency heating and cooling mechanism to the TEC semiconductor chip 2. Therefore, the high-efficiency heating and cooling mechanism as a whole has a high aesthetic appeal.
[0051] In some implementations, see Appendix Figure 6As shown, the first surface 11 can be either the bottom or the top of the object 1 to be processed. Therefore, when cooling the object 1, the heat sink 4 is facing upwards, making it less likely to be blocked by a table or other objects, and it will not affect the heat dissipation effect. At this time, the object 1 is placed with its top facing the side closer to the TEC semiconductor chip 2 and its bottom facing the side closer to the table or other supporting surface. The high-efficiency heating and cooling mechanism is then fitted onto the outside of the object 1 to achieve the cooling effect. Conversely, when heating the object 1, its bottom can be positioned closer to the TEC semiconductor chip 2. In this case, the side of the TEC semiconductor chip 2 closest to the aluminum VC heat spreader 3 heats up, while the side closest to the heat sink 4 cools down. At this time, the heat sink 4 does not function. The heat sink 4 can be directly supported on the table, and the object 1 can be placed in the receiving space 33 of the high-efficiency heating and cooling mechanism to achieve the heating effect.
[0052] In some embodiments, a heat insulation sleeve 5 is also included, which is fitted over the outside of the aluminum VC heat exchanger 3. Therefore, energy loss during heating or cooling can be effectively reduced, further improving the efficiency of heating or cooling the object 1 being processed.
[0053] In some embodiments, an outer sheath 6 is also included, the inner diameter of which is larger than the maximum outer diameter of the aluminum VC heat spreader 3. In other possible embodiments, the outer sheath 6 is located outside the heat insulation sleeve 5. The outer sheath 6 can support the bottom of the object 1 being processed when the heat dissipation part 4 needs to be placed on top during cooling of the object 1, and when the high-efficiency heating and cooling mechanism is flipped over.
[0054] In some embodiments, the opening at the end of the outer sheath 6 away from the TEC semiconductor chip 2 is closed, thus enabling the entire high-efficiency heating and cooling mechanism that has been inverted to support the object to be processed 1, making it easy for the user to pick up and put down.
[0055] Example 2:
[0056] The difference between this embodiment and Embodiment 1 is that the aluminum VC heat spreader 3 and the object to be treated 1 are integral parts. In this case, the aluminum VC heat spreader 3 and the object to be treated 1 can be directly glued together or connected together by other means (such as snap-fit), but the aluminum VC heat spreader 3 does not constitute the wall structure of the object to be treated 1. For example, if the object to be treated 1 is a cup, it can be directly glued to the aluminum VC heat spreader 3, thereby forming a cup product with integrated rapid heating and cooling functions. This method still retains the advantages of Embodiment 1, and will not cause mutual interference or corrosion between the liquid inside the object to be treated 1 and the aluminum VC heat spreader 3.
[0057] Example 3:
[0058] The difference between this embodiment and Embodiment 2 is that the aluminum VC heat spreader 3 is pre-placed in the mold during the formation of the wall of the object to be treated 1. Therefore, after the object to be treated 1 is formed, the aluminum VC heat spreader 3 is already injection-molded or integrated into the wall of the object to be treated 1. This method avoids adding excessive processing steps, and the existing aluminum VC heat spreader can be directly used after being bent into the shape of Embodiment 1. Compared to the processing method of directly setting capillary core structures and pre-filling working fluid into the bottom and wall of the object to be treated 1, directly using the existing aluminum VC heat spreader 3 as part of forming the wall of the object to be treated simplifies the processing. The difference between this embodiment and Embodiment 2 is that the aluminum VC heat spreader 3 no longer relies on bonding the two together to conduct heat to the object to be treated 1, but rather the aluminum VC heat spreader 3 is fused into the interior of the wall of the object to be treated 1.
[0059] Example 4:
[0060] This embodiment is a device with heating and cooling functions, which includes at least one high-efficiency heating and cooling mechanism as described in Embodiment 1.
[0061] The above embodiments are only for illustrating the technical concept and features of this utility model. Their purpose is to enable those skilled in the art to understand the content of this utility model and implement it. They cannot be used to limit the protection scope of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be covered within the protection scope of this utility model.
Claims
1. A profiled aluminum VC heat spreader (3) characterized by, The first plate area (31) is used for conducting heat to at least part of the first surface (11) of the object (1) to be processed, and the second plate area (32) is used for conducting heat to at least part of the second surface (12) of the object (1) to be processed, and the first plate area (31) and the second plate area (32) together form a containing space (33) for containing the object (1) to be processed, and at least part of the second plate area (32) is parallel to the axial direction of the object (1) to be processed.
2. The aluminum VC uniform heat plate according to claim 1, characterized in that: The number of the second plate area (32) is two, and the two second plate areas (32) are oppositely arranged at the two ends of the first plate area (31), and the two second plate areas (32) and the first plate area (31) are formed by bending the same aluminum VC uniform plate (3).
3. The aluminum VC uniform heat plate according to claim 2, characterized in that: A transition surface is formed at the connection between the first plate area (31) and the second plate area (32), and the transition surface protrudes outward in a direction away from the object (1) to be processed.
4. The aluminum VC uniform heat plate according to claim 3, characterized in that: The aluminum VC uniform plate (3) is in a U shape.
5. A high-efficiency temperature raising and lowering mechanism for raising or lowering the temperature of an object (1) to be processed having a columnar shape in at least a part of the region, comprising a TEC semiconductor sheet (2), characterized in that, The aluminum VC uniform plate (3) of any one of claims 1-4 is used, and the first plate area (31) of the aluminum VC uniform plate (3) is in contact with the TEC semiconductor sheet (2).
6. The high-efficiency temperature swing mechanism of claim 5, wherein: The aluminum VC uniform plate (3) is a separate part from the object (1) to be processed, and the aluminum VC uniform plate (3) is separably connected with the object (1) to be processed.
7. The high-efficiency temperature swing mechanism according to any one of claims 5-6, wherein: A heat dissipation part (4) is arranged on the side of the TEC semiconductor sheet (2) away from the aluminum VC uniform plate (3).
8. The high-efficiency temperature swing mechanism according to any one of claims 4-6, wherein: A heat insulation sleeve (5) is further arranged outside the aluminum VC uniform plate (3).
9. The high-efficiency temperature swing mechanism according to any one of claims 4-6, wherein: The aluminum VC uniform plate (3) is an integral part of the object (1) to be processed.
10. A device with temperature raising and lowering functions, characterized by: The aluminum VC uniform plate of any one of claims 1-3 or the high-efficiency temperature rising and falling mechanism of any one of claims 4-9 is used.