Industrial intelligent machine and industrial intelligent machine assembly
By installing a fan and heat sink on the outer surface of the AI machine's bottom shell, and combining them with thermally conductive adhesive for thermal connection with the CPU chip, the heat dissipation problem of compact AI machines is solved, achieving efficient heat dissipation and sealing protection, and improving system stability and equipment lifespan.
Patent Information
- Application Number
- CN202522564681.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-03
- Publication Date
- 2026-02-17
- Estimated Expiration
- 2035-12-03
AI Technical Summary
Compact AI devices suffer from heat dissipation difficulties, leading to chip overheating, performance degradation, and shortened device lifespan. Furthermore, effective heat dissipation is impossible in compact AI devices.
A fan is installed on the outer surface of the bottom shell of the intelligent machine and is thermally connected to the CPU chip through a heat sink. Combined with thermally conductive adhesive and external heat sink, an efficient heat dissipation channel is formed. The external fan is combined with the internal sealing structure to achieve active heat dissipation.
It improves heat dissipation efficiency, reduces CPU chip temperature, avoids performance throttling and hardware damage, enhances system stability and reliability, and maintains the device's airtightness and miniaturized design.
Smart Images
Figure CN223926838U_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of data processing equipment technology, and in particular to an AI machine and AI machine components. Background Technology
[0002] In related technologies, AI machines need to implement various data processing and data transmission functions, and in order to reduce space occupation, they also need to meet the requirements of miniaturization.
[0003] In small-scale chemical engineering computers that prioritize compact design and high-performance computing, a variety of high-power components are integrated, including a central processing unit (CPU), a graphics processing unit (GPU), various interface chips, and power management ICs. The extremely limited physical space severely restricts airflow and heat exchange efficiency, leading to a sharp increase in internal heat flux density. This inherent structural limitation results in poor overall heat dissipation, preventing timely removal of core heat. This not only causes chips to throttle due to overheating, affecting computing performance and system stability, but also accelerates component aging and shortens the equipment's lifespan under prolonged high-temperature conditions.
[0004] Due to the size limitations of compact AI devices and the constraints of the industrial environment, compact AI devices typically cannot use fans to directly cool the internal circuitry, nor can they use excessively large heat sinks, making heat dissipation quite difficult.
[0005] In summary, how to achieve efficient heat dissipation in compact AI machines is a technical problem that urgently needs to be solved. Utility Model Content
[0006] In view of this, the present disclosure provides an AI machine and AI machine components to solve the technical problem of heat dissipation difficulties in compact AI machines in the prior art.
[0007] To achieve the above objectives, the technical solution adopted in this disclosure is as follows:
[0008] A first aspect of this disclosure provides an AI machine, which includes a first circuit board, a bottom shell and a top shell arranged from bottom to top, wherein: a CPU chip is disposed on the bottom surface of the first circuit board; a fan is disposed on the outer bottom surface of the bottom shell, and the air outlet of the fan faces the area corresponding to the CPU chip on the outer surface of the bottom shell; a heat sink is disposed on the outer bottom surface of the bottom shell, and the heat sink is thermally connected to the CPU chip through the bottom shell and thermally conductive adhesive disposed on the inner side of the bottom shell.
[0009] In some embodiments, the fan is electrically connected to the AI circuitry via a plug-in interface located on the bottom housing.
[0010] In some embodiments, the AI machine further includes a second circuit board located above the first circuit board, and the second circuit board and the first circuit board are connected by studs.
[0011] In some embodiments, the heat sink includes a substrate attached to the bottom shell and parallel fins protruding from the substrate on the side away from the bottom shell.
[0012] In some embodiments, the height of the fins is the same as the thickness of the fan, and / or the height of the fins is 4 mm.
[0013] In some embodiments, the device includes a bottom shell and a top shell arranged from bottom to top, wherein: an input / output interface module and an HDMI interface module are provided on the inner side of the bottom shell, and a USB interface module and a network cable interface module are provided on the inner side of the top shell. The interfaces of the input / output interface module, the HDMI interface module, the USB interface module, and the network cable interface module are centrally located on the first side of the device; a reserved snap-fit mounting position is provided on the second side opposite to the first side, and the area occupied by the top shell on the second side is larger than that occupied by the bottom shell on the second side, and the snap-fit mounting position is located on the top shell on the second side; the bottom shell and the top shell are provided with a fitting structure on the two sides between the first side and the second side, the fitting structure including a recess on the bottom shell and a protrusion on the top shell, the recess and the protrusion fitting together as one unit.
[0014] In some embodiments, the first edge of the protrusion is a first oblique edge that extends downward from the middle of one of the two sides and obliquely to the second side, the second edge of the protrusion is connected to the second side, the edge of the recess has a second oblique edge, and the first oblique edge and the second oblique edge are in contact.
[0015] In some embodiments, the first edge of the protrusion is a first vertical edge, the second edge of the protrusion is connected to the second side surface, the edge of the recess has a second vertical edge, and the first vertical edge and the second vertical edge are attached together.
[0016] In some embodiments, the top of the top shell is provided with an indicator decorative strip parallel to the first and second sides, and a recess is provided above the top shell, in which the indicator decorative strip is installed.
[0017] A second aspect of the present disclosure provides an AI machine component, including the AI machine of the first aspect of the present disclosure.
[0018] The beneficial effects of this disclosed embodiment compared with the prior art are as follows: The industrial computer in this disclosed embodiment successfully combines efficient active heat dissipation with the sealed protection of the enclosure by setting a fan on the outer surface of the bottom shell and thermally connecting the CPU chip through the bottom shell and the thermally conductive adhesive set on the inner side of the bottom shell via a heat sink. Through the physical isolation concept of internal heat conduction and external heat dissipation, the heat dissipation problem of miniaturized, high-protection-level industrial control computer is solved. Attached Figure Description
[0019] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0020] Figure 1 This is a three-dimensional structural diagram of an artificial intelligence machine provided in an embodiment of this disclosure;
[0021] Figure 2 This is a three-dimensional structural schematic diagram of another artificial intelligence machine provided in this embodiment of the present disclosure;
[0022] Figure 3 This is a schematic diagram of the bottom surface of the AI machine provided in this embodiment of the disclosure;
[0023] Figure 4 This is a schematic diagram of the top surface of the AI machine provided in this embodiment of the disclosure;
[0024] Figure 5 This is a schematic diagram of the structure of the first side of the AI machine provided in the embodiments of this disclosure;
[0025] Figure 6 This is a schematic diagram of the second side of the AI machine provided in an embodiment of this disclosure;
[0026] Figure 7 This is a structural schematic diagram of the third side of the AI machine provided in an embodiment of this disclosure;
[0027] Figure 8 This is a structural schematic diagram of the fourth side of the AI machine provided in the embodiments of this disclosure.
[0028] Figure label:
[0029] 110. Bottom shell; 111. Air vent; 112. Heat sink; 120. Top shell; 201. First side; 202. Second side; 203. Third side; 204. Fourth side; 205. Bottom surface; 206. Top surface; 311. Protrusion; 312. Recess; 400. Clip; 401. Mounting hole; 500. Indicator decorative strip; 601. HDMI interface; 602. Input / output interface; 603. USB interface; 604. Network cable interface; 605. Power supply interface. Detailed Implementation
[0030] To make the technical problems, technical solutions, and beneficial effects to be solved by this disclosure clearer, the disclosure will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only for explaining this disclosure and are not intended to limit this disclosure.
[0031] The artificial intelligence machine according to embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings.
[0032] Figure 1 This is a three-dimensional structural diagram of an artificial intelligence machine provided in an embodiment of this disclosure; Figure 2 This is a three-dimensional structural schematic diagram of another artificial intelligence machine provided in this embodiment of the present disclosure; Figure 3 This is a schematic diagram of the bottom surface of the AI machine provided in this embodiment of the disclosure; Figure 4 This is a schematic diagram of the top surface of the AI machine provided in this embodiment of the disclosure; Figure 5 This is a schematic diagram of the structure of the first side of the AI machine provided in the embodiments of this disclosure; Figure 6 This is a schematic diagram of the second side of the AI machine provided in an embodiment of this disclosure; Figure 7 This is a structural schematic diagram of the third side of the AI machine provided in an embodiment of this disclosure; Figure 8 This is a structural schematic diagram of the fourth side of the AI machine provided in this embodiment. The following is in conjunction with... Figures 1 to 8 Let's describe the artificial intelligence machine provided in the embodiments of this disclosure.
[0033] like Figure 1 and Figure 2 As shown, the AI device of this embodiment includes a first circuit board, a bottom shell 110 and a top shell 120 arranged from bottom to top. A central processing unit (CPU) chip is disposed on the bottom surface of the first circuit board. A heat sink 112 and a fan are disposed on the outer bottom surface of the bottom shell, with the fan's exhaust port 111 facing the area 101 corresponding to the CPU chip on the outer surface of the bottom shell. The heat sink 112 is thermally connected to the CPU chip through the bottom shell and thermally conductive adhesive disposed on the inner side of the bottom shell. The area of the bottom shell where the area 101 corresponding to the CPU chip is located is the mapping area of the CPU chip on the bottom shell.
[0034] The technical solution of this disclosure constructs a highly efficient, low thermal resistance heat conduction channel from the heat source to the outside environment: CPU chip → thermally conductive adhesive → bottom case → heat sink. Finally, the airflow blown by the fan directly acts on the heat sink, quickly carrying away the accumulated heat. This design avoids inefficient air circulation inside the sealed chassis, resulting in higher heat dissipation efficiency and effectively addressing the high heat generation problem of CPU chips in small industrial control computers. Placing the fan and heat sink outside the bottom case significantly saves valuable space inside the industrial control computer. This allows for a more compact circuit board layout and makes it possible to integrate more functional chips within a miniaturized chassis. Simultaneously, the internal structure is simplified, reducing assembly complexity.
[0035] Since the cooling system primarily operates externally, the internal casing of the industrial computer can be a complete, sealed structure without openings. This effectively prevents dust, oil, moisture, and other contaminants from entering the chassis through the ventilation holes, significantly improving the long-term reliability and lifespan of the industrial computer in harsh industrial environments.
[0036] By employing efficient heat dissipation methods to maintain the CPU chip temperature at a low level, performance throttling, system restarts, and even hardware damage caused by overheating are directly avoided. Meanwhile, the fan is electrically connected to the industrial computer's circuitry via a connector on the bottom casing. If the external fan fails, maintenance and replacement are convenient without affecting the host's sealing. All of these factors enhance the overall system stability and reliability of the industrial computer.
[0037] In this embodiment, the heat sink includes a substrate attached to the bottom shell and parallel fins protruding from the substrate on the side away from the bottom shell. The height of the fins is the same as the thickness of the fan, and the height of the fins can be 4 mm, but is not limited to this.
[0038] In some embodiments, a recess can be made in the substrate or the substrate and the bottom shell, so that the fan is partially embedded in the recess, and the fan's air outlet is completely exposed outside the recess. The air blown by the fan flows in the gaps between the fins. The extension direction of each fin is consistent with the direction of the air blown by the fan, and the blown air flows through the bottom shell position corresponding to the CPU chip, thereby achieving better heat dissipation.
[0039] Digging pits in the substrate or substrate and bottom shell can prevent the fan and the fan blade cover plate on the outer surface of the fan from protruding from the fins, thus improving the flatness of the industrial machine.
[0040] In this embodiment, the industrial computer further includes a second circuit board, which is located above the first circuit board, and the second circuit board and the first circuit board are connected by studs. This solution can further reduce the size of the industrial computer.
[0041] In some applications, clips need to be installed on the side of the AI device to secure it to the guide rails of other devices. The AI device's casing typically consists of a top shell and a bottom shell. After installation, maintenance, upgrades, or replacement of internal modules may require disassembling the top and bottom shells. The clips installed on the side of the AI device are usually fixed to both the top and bottom shells simultaneously. This can lead to the user needing to release the clips from the guide rails before disassembling the casing. This often requires separating the top and bottom shells, creating a structural lock, significantly increasing the difficulty and time cost of disassembly, and potentially damaging the casing or interfaces.
[0042] like Figure 1 and Figure 2As shown in the figure, the AI device provided in this embodiment includes a bottom shell 110 and a top shell 120 arranged from bottom to top. The AI device internally includes an input / output interface module, an HDMI interface module, a USB interface module, and a network cable interface module. The interfaces of the input / output interface module, HDMI interface module, USB interface module, and network cable interface module are centrally located on the first side 201 of the AI device. A reserved snap-fit mounting position is provided on the second side 202 opposite to the first side, and a snap-fit 400 can be installed at this mounting position. The bottom shell and top shell have fitting structures on two sides between the first and second sides, namely the third side 203 and the fourth side 204. The fitting structures include a recess 312 on the bottom shell and a protrusion 311 on the top shell, and the recess and protrusion are fitted together as one unit. In this embodiment, the area occupied by the top shell on the second side is larger than the area occupied by the bottom shell on the second side, and the snap-fit mounting position is located on the top shell 120 on the second side. The technical solution of this disclosure provides an interlocking structure on the top and bottom shells, and sets the buckle installation position on the bottom shell. This ensures that the AI machine is securely installed on the guide rail by the buckle, while also allowing the top and bottom shells to be easily separated when needed.
[0043] Specifically, such as Figure 1 and Figure 2 As shown, the top shell 120 and the bottom shell 110 occupy approximately the same area on the first side 201.
[0044] The industrial control machine provided in this embodiment uses a 24V DC power supply and includes one low-power industrial control computer, as well as... Figure 5 The diagram shows two USB ports 603, one HDMI port 601, multiple input / output ports 602, three network cable ports 604, and one power supply port 605. The input / output port module includes at least a serial communication interface or a CAN communication interface. The control circuit of the low-power industrial computer is the aforementioned main control module.
[0045] The hard drive of the AI in the disclosed embodiments can be an M.2 hard drive that supports the Non-Volatile Memory Host Controller Interface (NVMe) specification. NVMe is a high-speed communication protocol designed specifically for modern solid-state drives (SSDs). It can bypass the bottlenecks of traditional hard drive protocols such as SATA (Serial Advanced Technology Attachment), allowing the full performance of the SSD to be unleashed.
[0046] In this embodiment of the invention, all three network cable interfaces 604 of the intelligent machine can be gigabit ports, which can use a single-port gigabit Ethernet adapter Intel I210.
[0047] The AI machine in the disclosed embodiment can be configured with two COM (Cluster Communication Port) ports and one CAN (Controller Area Network) port.
[0048] The operating environment temperature and humidity of the AI machine in the disclosed embodiments is -10℃ to 60℃, and the relative humidity is 0% to 95% in a non-condensing environment. The storage environment temperature and humidity is -20℃ to 70℃, and the relative humidity is 0% to 95% in a non-condensing environment.
[0049] The outer casing of the AI machine in the disclosed embodiment can be 98mm*88mm*40mm, and its main material can be aluminum alloy AL6061 and SGCC (hot-dip galvanized steel sheet).
[0050] The AI-powered machine in the disclosed embodiments supports memory modules with a capacity of 4GB, memory modules with C-die memory chips, DDR4 (Double Data Rate Generation IV Synchronous Dynamic Random Access Memory) or DDR5 (Double Data Rate Generation V Synchronous Dynamic Random Access Memory) type memory modules, and small form factor dual in-line memory modules. The AI-powered machine's central processing unit uses the Intel quad-core Alder Lake-N series N100 processor.
[0051] like Figure 2 As shown, the top shell occupies almost the entire area of the second side 202, while the bottom shell has only one edge located on the second side.
[0052] In another embodiment, by providing a bend at the edge of the bottom shell that bends upward from the edge of the bottom shell on the bottom surface, and inserting the bend into the gap between the bottom shell and the top shell, the top shell can occupy the entire area of the second side surface.
[0053] In the embodiments disclosed herein, such as Figure 6 As shown, the bottom shell has a mounting hole 401 on the snap-fit mounting position on the second side 202, and the snap-fit 400 is fixedly connected to the bottom shell through the mounting hole.
[0054] like Figure 2 The heat sink 112 shown is a metal heat sink. The heat sink is thermally connected to the main control module through the bottom shell and the thermally conductive adhesive set on the inside of the bottom shell, so as to better dissipate the heat of the main control module to the external space of the AI machine.
[0055] like Figure 4As shown, an indicator decorative strip 500 is provided on the top surface 206. In some embodiments, the top of the top shell is provided with an indicator decorative strip parallel to the first and second side surfaces, and a recess is provided above the top shell, in which the indicator decorative strip is installed. This indicator decorative strip has a decorative function and can also be used to indicate the snap-fit direction when the snap-fit is installed on the guide rail of the connecting device.
[0056] like Figure 1 As shown, in this embodiment of the disclosure, the first edge of the protrusion 311 is a first inclined edge extending downward from the middle of one of the two side surfaces and inclined towards the second side surface. The second edge of the protrusion is connected to the second side surface, and the edge of the recess 312 has a second inclined edge. The first and second inclined edges fit together. Figure 7 and Figure 8 As shown, the two sides mentioned above are the third side 203 and the fourth side 204.
[0057] by Figure 7 Taking the third side as an example, the dividing line between the top shell and the bottom shell on the left side of the third side is roughly in the middle of the third side. The top shell and bottom shell on the right side of the third side have protruding and recessed structures, respectively. The top shell and bottom shell each occupy half of the left side of the third side, allowing the top shell and bottom shell to... Figure 7 The left side portion shown has sufficient space on its inner side to accommodate the internal modules, as well as interfaces for the internal modules on the first side. The right side portion of the third side has a large top shell area, allowing it to occupy a large area on the second side, thus providing sufficient space for the snap-fit mounting position.
[0058] like Figure 7 and Figure 8 As shown, the top shell is symmetrically arranged on both sides of the third and fourth sides, and the bottom shell is symmetrically arranged on both sides of the third and fourth sides. Figure 8 As shown, on the fourth side, the right-side portion of the top shell and bottom shell each occupy half, allowing the top shell and bottom shell to... Figure 8 The right-hand side shown has sufficient space on its inner side to accommodate the internal modules, as well as interfaces for the internal modules on the first side. The top shell on the left side of the third side occupies a large portion of the area, allowing it to occupy a large portion of the second side, thus providing sufficient space for the snap-fit mounting position.
[0059] In other embodiments, the first edge of the protrusion is a first vertical edge, the second edge of the protrusion is connected to the second side surface, and the edge of the recess has a second vertical edge, with the first and second vertical edges fitting together. Specifically, the first edge of the protrusion is a first vertical edge extending vertically downward from the middle of the two side surfaces, the second edge of the protrusion is connected to the second side surface, and the edge of the recess is a second vertical edge extending vertically downward from the middle of the two side surfaces. Taking the third side surface as an example, the dividing line between the top shell and the bottom shell on the left side of the third side surface is approximately at the middle of the third side surface, and the top shell and the bottom shell on the right side surface of the third side surface have protruding and recessed structures, respectively. The top shell and the bottom shell each occupy half of the left side surface of the third side surface, which allows sufficient space on the inner side of the left side surface of the top shell and the bottom shell to accommodate the internal modules and the interface for the internal modules on the first side surface. The top shell occupies a larger area on the right side surface of the third side surface, which allows the top shell to occupy a larger area on the second side surface, thereby providing sufficient space for the snap-fit installation position.
[0060] This disclosure also provides an AI machine component, which includes the AI machine described above.
[0061] According to the embodiments of this disclosure, the industrial control machine and its components are provided by setting a fan on the outer surface of the bottom shell and thermally connecting the CPU chip through the bottom shell and the thermally conductive adhesive set on the inner side of the bottom shell via a heat sink. This successfully combines efficient active heat dissipation with the sealed protection of the enclosure. By using the physical isolation approach of internal heat conduction and external heat dissipation, the heat dissipation problem of miniaturized, high-protection-level industrial control machines is solved.
[0062] Furthermore, the technical solution of this embodiment adopts a highly integrated interface module and an optimized compact structural design. By setting a fitting structure on the top and bottom shells and setting the buckle installation position on the bottom shell, it can be ensured that the AI machine is firmly installed on the guide rail by the buckle, while the top and bottom shells can be easily separated when needed, effectively solving the contradiction between the installation convenience and maintainability of the AI machine.
[0063] The above are merely preferred embodiments of this disclosure and are not intended to limit this disclosure. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.
Claims
1. A machine tool, characterized by comprising: The industrial computer comprises a first circuit board, a bottom shell and a top shell arranged from bottom to top, wherein: A central processing unit (CPU) chip is arranged on the bottom surface of the first circuit board; A fan is arranged on the outer bottom surface of the bottom shell, and the air outlet of the fan faces an area on the outer surface of the bottom shell corresponding to the CPU chip; A heat sink is arranged on the outer bottom surface of the bottom shell, and the heat sink is in thermal connection with the CPU chip through the bottom shell and heat-conducting glue arranged on the inner side of the bottom shell.
2. The machine of claim 1, wherein, The fan is electrically connected with the industrial computer circuit through a plug-in interface arranged on the bottom shell.
3. The machine of claim 1, wherein, The industrial computer further comprises a second circuit board, which is arranged above the first circuit board and connected with the first circuit board through a stud.
4. The machine of claim 1, wherein, The heat sink comprises a substrate attached to the bottom shell and parallel fins protruding from one side of the substrate away from the bottom shell.
5. The machine of claim 4, wherein, The height of the fins is the same as the thickness of the fan, and the height of the fins is 4 mm.
6. The machine of claim 1, wherein, The industrial computer comprises an input / output interface module, an HDMI interface module, a USB interface module and a network interface module, and the interfaces of the input / output interface module, the HDMI interface module, the USB interface module and the network interface module are arranged on the first side of the industrial computer; A reserved buckle mounting position is arranged on the second side opposite to the first side, the area occupied by the top shell on the second side is larger than the area occupied by the bottom shell on the second side, and the buckle mounting position is arranged on the top shell of the second side; The bottom shell and the top shell are provided with a fitting structure on the two sides between the first side and the second side, and the fitting structure comprises a recess on the bottom shell and a protrusion on the top shell, and the recess and the protrusion are fitted as a whole.
7. The machine of claim 6, wherein, The first edge of the protrusion is a first inclined edge extending downward from the middle of one of the two sides and inclined to the second side, the second edge of the protrusion is connected with the second side, the edge of the recess has a second inclined edge, and the first inclined edge and the second inclined edge are fitted.
8. The machine of claim 6, wherein, The first edge of the protrusion is a first vertical edge, the second edge of the protrusion is connected with the second side, the edge of the recess has a second vertical edge, and the first vertical edge and the second vertical edge are fitted.
9. The machine of claim 6, wherein, The top of the top shell is provided with an indication decoration strip parallel to the first side and the second side, and a recess pit is arranged above the top shell, and the indication decoration strip is mounted in the recess pit.
10. A work machine assembly, characterized by, The industrial computer comprises the industrial computer according to any one of claims 1 to 9.