Slip ring brush module

Abstract

The utility model discloses a slip ring electric brush module. The slip ring electric brush module comprises a PCB, brush wires and wires. Wherein two side edges of the PCB are symmetrically provided with a plurality of grooves, and a brush wire bonding pad is arranged between each pair of grooves; a wire bonding pad is arranged on one side adjacent to the two side edges of the PCB; a correspondingly communicated circuit path is arranged between the brush wire bonding pad and the wire bonding pad; the brush wire is arranged in the groove, and at least one part of the brush wire is welded on the brush wire bonding pad; the wire is welded on the wire bonding pad. According to the technical scheme, reliability is high, automatic production can be achieved, and a large amount of time and labor are saved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of slip ring, especially a slip ring brush module applied to cap type slip ring and small volume and small power slip ring. BACKGROUND

[0002] The slip ring brush module is widely applied to cap type slip ring and small volume and small power slip ring. Taking the existing cap type slip ring as an example, the brush module is manually threaded on the injection molded shell after the brush wire is formed, and then the lead wire is manually welded on the brush wire one by one. Because the brush wire is very thin, the manual threading of the brush is difficult; at the same time, the loops on the module are relatively narrow, the welding difficulty is great, the welding requirement is high, the product assembly efficiency is low, the defective rate is high, and the quality consistency cannot be guaranteed; in addition, the existing structure may also cause the brush wire to deform and be defective during the transportation and turnover after the brush wire is formed. CONTENT

[0003] In order to overcome the defects of the prior art, a slip ring brush module is provided, which not only has high reliability, but also can realize automatic production and save a lot of time and labor.

[0004] A slip ring brush module, comprising:

[0005] A PCB board, a plurality of grooves are symmetrically arranged on the two side edges of the PCB board, and a brush wire pad is arranged between each pair of grooves; a lead wire pad is arranged on a side adjacent to the two side edges of the PCB board; the brush wire pad and the lead wire pad have corresponding and communicating circuit paths therebetween;

[0006] A brush wire, the brush wire is installed in the groove and at least a part of the brush wire is welded on the brush wire pad;

[0007] A lead wire, the lead wire is welded on the lead wire pad.

[0008] Preferably, the groove is a U-shaped groove.

[0009] Preferably, the PCB board is a double-layer circuit board.

[0010] Preferably, the PCB board is rectangular.

[0011] Preferably, the lead wire pad comprises a plurality of lead wire welding sites corresponding to the lead wire one by one; the number of the brush wire pads is consistent with the number of the lead wire welding sites, and the brush wire pads and the lead wire welding sites have one-to-one corresponding and communicating circuit paths.

[0012] Preferably, the plurality of lead wire welding sites are sequentially arranged along the edge of the PCB board.

[0013] The slip ring brush module provided by this utility model uses a specially designed PCB board with brush filament pads and wire pads corresponding to the interconnected circuit paths. After the brush filaments are installed in the grooves on the PCB board and formed, they are soldered to the brush filament pads for fixation. Simultaneously, the wires are soldered to the wire pads, and then adhesive is applied to cover the solder joints. The forming and fixing of the brush filaments, the soldering of the wires, and the application of adhesive to the solder joints can all be automated. Compared with existing technologies, this slip ring brush module is not only simple in structure, easy to assemble, and highly reliable, but also allows for automated production, resulting in high efficiency, convenience, and better product quality consistency. Attached Figure Description

[0014] Fig. 1 This is a perspective view of the slip ring brush module in an embodiment of this utility model;

[0015] Fig. 2 This is another perspective view of the slip ring brush module in the embodiment of this utility model;

[0016] Fig. 3 This is a front view of the PCB board in an embodiment of this utility model;

[0017] The markings in the accompanying drawings are as follows:

[0018] 1. PCB board; 11. Groove; 12. Brush pad; 13. Wire pad; 14. Wire soldering position; 2. Brush; 3. Wire. Detailed Implementation

[0019] To make the technical problems, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0020] Provide a slip ring brush module, such as Figs. 1 to 3 As shown, the assembly includes: a PCB board 1, brush filaments 2, and conductive wires 3. The PCB board has multiple symmetrically arranged grooves 11 on both sides, with a brush filament pad 12 between each pair of grooves. A conductive wire pad 13 is provided on one side adjacent to the two sides of the PCB board. Corresponding circuit paths connect the brush filament pads and the conductive wire pads. The brush filaments are installed in the grooves and at least a portion is soldered to the brush filament pads. The conductive wires are soldered to the conductive wire pads.

[0021] Specifically, during production and assembly, each brush filament is first installed on the corresponding groove and then soldered onto the brush filament pad for fixation. Next, the wires are soldered onto the wire pads, and finally, adhesive is applied to cover the solder joints. Since the brush filament pads and wire pads form a one-to-one circuit path, automated brush filament and wire soldering processes on the PCB are sufficient, ensuring high efficiency and consistent quality while saving significant time and labor costs.

[0022] Furthermore, the grooves on the PCB board are U-shaped, and the PCB board is rectangular. The U-shaped grooves are located on the two longer sides of the PCB board, while the wire pads are located on the shorter sides. Understandably, the specific shapes of the grooves and the PCB board are not limited to these. Preferably, the PCB board is a double-layer circuit board.

[0023] Furthermore, the wire pads include multiple wire soldering positions 14 corresponding one-to-one with the wires; the number of brush pads is the same as the number of wire soldering positions, and each brush pad has a corresponding circuit path. That is, each wire soldering position corresponds to one brush pad, which facilitates the customization of a preset number of circuit paths according to the actual application needs of the slip ring, making the applicability of this slip ring brush module wider.

[0024] Preferably, multiple wire soldering positions are arranged sequentially along the edge of the PCB board to meet the needs of automated soldering.

[0025] The above is a description of the slip ring brush module of this utility model, which is used to help understand this utility model; however, the implementation of this utility model is not limited to the above embodiments. Any changes, modifications, substitutions, combinations, or simplifications made without departing from the principle of this utility model shall be considered as equivalent substitutions and shall be included within the protection scope of this utility model.

Claims

1. A slip ring brush module, characterized in that, The application relates to a PCB (printed circuit board) and a brush wire and a wire thereof. The PCB comprises: a PCB board, which is symmetrically provided with a plurality of grooves on two side edges, and a brush wire pad is arranged between each pair of grooves; a wire pad is arranged on one side adjacent to the two side edges of the PCB board; the brush wire pad and the wire pad have corresponding and communicated circuit channels; a brush wire, which is mounted in the groove and at least partially welded on the brush wire pad; 2. The slip ring brush module of claim 1, wherein, a wire, which is welded on the wire pad.

3. The slip ring brush module of claim 1, wherein, The groove is a U-shaped groove.

4. The slip ring brush module of claim 1, wherein, The PCB board is a double-layer circuit board.

5. The slip ring brush module of any one of claims 1 to 4, wherein, The PCB board is rectangular.

6. The slip ring brush module of claim 5, wherein, The wire pad comprises a plurality of wire welding positions corresponding to the wires one by one; the number of the brush wire pads is consistent with that of the wire welding positions, and the brush wire pads and the wire welding positions have one-to-one corresponding and communicated circuit channels. The plurality of wire welding positions are sequentially arranged along the edge of the PCB board.

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