Radiation-resistant film heater

Abstract

The utility model relates to the technical field of film heaters, in particular to an irradiation-resistant heater, which comprises an electric heating layer, a pair of leads and a pair of insulating layers. The electric heating layer is fixedly arranged between the pair of insulating layers; the head ends of the pair of wires are electrically connected with the positive electrode of the electric heating layer and the negative electrode of the electric heating layer respectively. According to the utility model, the thermoplastic connecting layer made of the thermoplastic polyimide material is adopted to replace a bonding layer of a film heater in the prior art, so that the total radiation-resistant dose of the device is improved to 1.0 * 1010rad (SI), and the device can meet the requirements of the use environment outside a spacecraft cabin; the defect that a film heater in the prior art is poor in environment adaptability is overcome.

Description

Technical Field

[0001] This utility model relates to the field of thin film heater technology, and in particular to a radiation-resistant heater. Background Technology

[0002] A thin-film heater is a sheet-shaped heating element that uses metal resistance to generate heat. During use, it can be attached to a small container to heat it, taking advantage of its thinness, flexibility, and other properties.

[0003] In the prior art, thin film heaters are mostly composed of an electric heating layer, a pair of insulating layers and a pair of adhesive layers. The electric heating layer is located between the pair of insulating layers, and any one of the adhesive layers is located between one of the insulating layers and the electric heating layer, and is used to bond the insulating layer and the electric heating layer.

[0004] Because the adhesive layer materials in existing technologies are mostly epoxy resin or acrylic adhesives, the thin-film heaters in existing technologies can only be used in applications with a total radiation dose tolerance of no more than 1.0*10. 7 Used in environments with rad(SI); however, the total radiation dose from the external environment of spacecraft cabins can generally reach 1.0*10. 9 Therefore, most existing thin-film heaters are not suitable for use in the spacecraft extravehicular environment, and have the defect of poor environmental adaptability. Utility Model Content

[0005] To address the technical problem of poor environmental adaptability of existing thin-film heaters, this utility model provides a radiation-resistant thin-film heater, comprising: an electric heating layer, a pair of wires, and a pair of insulating layers;

[0006] The heating layer is fixedly disposed between a pair of insulating layers;

[0007] The ends of a pair of wires are electrically connected to the positive and negative electrodes of the heating element, respectively.

[0008] Furthermore, the end of any conductor is located between a pair of insulation layers.

[0009] Furthermore, the device also includes: a pair of thermoplastic connecting layers, wherein one of the thermoplastic connecting layers is fixedly disposed between one of the insulating layers and the heating layer, for fixing the heating layer and the insulating layer.

[0010] Furthermore, the linewidth of the heating circuit in the heating layer is greater than 0.3 mm.

[0011] Furthermore, the spacing between the heating lines of the heating layer is 0.25mm to 0.35mm.

[0012] Furthermore, the distance between the edge of the heating layer and the edge of the insulating layer ranges from 2mm to 3mm.

[0013] Furthermore, the thickness of the insulating layer is not less than 12.5 μm.

[0014] Furthermore, the area corresponding to the position of the insulation layer and the end of the conductor is the welding area, and the thickness of the welding area of ​​the insulation layer ranges from 25μm to 35μm.

[0015] Furthermore, the insulating outer layer of the conductor is a polyimide layer.

[0016] Furthermore, the heating circuitry of the heating layer is made of constantan.

[0017] The radiation-resistant thin-film heater according to the embodiments of the present invention has the following beneficial effects:

[0018] 1. This device increases the total radiation dose tolerance to 1.0*10⁻⁶ by replacing the adhesive layer of the thin-film heater in the prior art with a thermoplastic bonding layer made of thermoplastic polyimide. 10 The rad(SI) enables this device to meet the requirements of the spacecraft's extravehicular environment, overcoming the shortcomings of existing thin-film heaters in terms of poor environmental adaptability.

[0019] 2. This device is designed with the line width of the heating circuit in the heating layer to be greater than 0.3mm and the line spacing of the heating circuit in the heating layer to be between 0.25mm and 0.35mm, so as to ensure that the device can heat to 200℃ to 240℃ within the expected time.

[0020] 3. This device improves the assembly space utilization rate by designing the distance between the edge of the heating layer and the edge of the insulation layer to be 2mm to 3mm. That is, while ensuring the heating power of the device, it avoids the phenomenon of air bubbles forming between a pair of insulation layers when the distance between the edge of the heating layer and the edge of the insulation layer is less than 2mm; and avoids the problem of excessive assembly space occupied when the distance between the edge of the heating layer and the edge of the insulation layer is greater than 3mm.

[0021] 4. This device connects the ends of a pair of wires to a pair of insulating layers by extending the ends of the wires into the space between the insulating layers and fixing the ends of the wires to the insulating layers with a pair of thermoplastic connecting layers. The thickness of the insulating layers is designed to be no less than 12.5μm, and the thickness of the welding area of ​​the insulating layers is designed to be between 25μm and 35μm. This ensures that after each wire is subjected to a 15N tensile force for 30 minutes, the relative change in its resistance value is no more than ±2%, and under a DC voltage of 500V, its insulation resistance is no less than 100MΩ, which can meet the requirements of the spacecraft's extravehicular environment.

[0022] It should be understood that both the foregoing general description and the following detailed description are exemplary and intended to provide further illustration of the claimed technology. Attached Figure Description

[0023] Figure 1 This is an exploded view of the structure according to an embodiment of the present utility model;

[0024] Figure 2 This is a schematic diagram of the stacked structure according to an embodiment of the present utility model;

[0025] Figure 3 This is a schematic diagram of the assembly of the heating layer according to an embodiment of the present utility model;

[0026] Figure 4 for Figure 3 A magnified view of a portion of region A in the middle.

[0027] Explanation of reference numerals in the attached diagram:

[0028] 1-Heating layer, 2-Wire, 3-Insulation layer, 4-Thermoplastic connection layer, a1-Line width, a2-Line spacing, a3-Distance between the edge of the heating layer and the edge of the insulation layer. Detailed Implementation

[0029] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, further illustrating the present invention.

[0030] The foregoing and other technical contents, features, and effects of this utility model will be clearly presented in the following detailed description of the embodiments with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as up, down, left, right, front, or back, are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for illustrative purposes and not for limiting the present utility model. Furthermore, in all embodiments, the same reference numerals denote the same elements.

[0031] like Figure 1 As shown, the radiation-resistant thin-film heater proposed in Embodiment 1 of this utility model includes: an electric heating layer 1, a pair of wires 2 and a pair of insulating layers 3.

[0032] Specifically, such as Figure 1 As shown, the heating layer 1 is fixedly disposed between a pair of insulating layers 3. Preferably, the insulating layer 3 is a polyimide film. The ends of a pair of wires 2 are electrically connected to the positive electrode and the negative electrode of the heating layer 1, respectively.

[0033] Example 1

[0034] In this embodiment, the insulating layer 3 is formed by the user applying liquid polyimide to the outer surface of the heating layer 1 and letting it dry; the user connects the ends of a pair of wires 2 to the power supply, and the heating circuit heats up after being energized, thus achieving the purpose of heating.

[0035] Furthermore, such as Figures 1-4 As shown, the head of any conductor 2 is located between a pair of insulating layers 3.

[0036] Furthermore, such as Figures 1-4 As shown, the device further includes: a pair of thermoplastic connecting layers 4, wherein any one of the thermoplastic connecting layers 4 is fixedly disposed between one of the insulating layers 3 and the heating layer 1, for fixing and connecting the heating layer 1 and the insulating layer 3. Preferably, the thermoplastic connecting layer 4 is a thermoplastic polyimide layer.

[0037] This device increases the total radiation dose tolerance to 1.0*10⁻⁶ by replacing the adhesive layer of the thin-film heater in the prior art with a thermoplastic connecting layer 4 made of thermoplastic polyimide. 10 The rad(SI) enables this device to meet the requirements of the spacecraft's extravehicular environment, overcoming the shortcomings of existing thin-film heaters in terms of poor environmental adaptability.

[0038] Furthermore, such as Figures 1-4 As shown, the line width a1 of the heating circuit of heating layer 1 is greater than 0.3 mm.

[0039] Furthermore, such as Figures 1-4 As shown, the spacing a2 of the heating circuits in the heating layer 1 ranges from 0.25mm to 0.35mm.

[0040] This device designs the line width a1 of the heating circuit of the heating layer 1 to be greater than 0.3 mm, and the line spacing a2 of the heating circuit of the heating layer 1 to be 0.25 mm to 0.35 mm, to ensure that the device can heat to 200℃ to 240℃ within the expected time.

[0041] Furthermore, such as Figures 1-4 As shown, the distance a3 between the edge of the heating layer and the edge of the insulating layer ranges from 2mm to 3mm.

[0042] This device designs the distance a3 between the edge of the heating layer and the edge of the insulation layer to be 2mm to 3mm. This avoids the formation of bubbles or delamination between the two insulation layers 3 due to the distance a3 being too small after prolonged heating. It also achieves the goal of maximizing heating efficiency within a limited assembly space.

[0043] Furthermore, such as Figures 1-4 As shown, the thickness of insulating layer 3 is not less than 12.5 μm.

[0044] Furthermore, such as Figures 1-4 As shown, the area corresponding to the position of the insulating layer 3 and the end of the wire 2 is the welding area (not shown in the figure), and the thickness range of the welding area of ​​the insulating layer 3 is 25μm to 35μm.

[0045] This device connects the ends of a pair of wires 2 to a pair of insulating layers 3 by extending the ends of the wires 2 into the insulating layers 3 and fixing the ends of the wires 2 to the insulating layers 3 by a pair of thermoplastic connecting layers 4. The thickness of the insulating layers 3 is designed to be no less than 12.5 μm, and the thickness of the welding area of ​​the insulating layers 3 is designed to be between 25 μm and 35 μm. This ensures that after each wire 2 is subjected to a 15 N tensile force for 30 minutes, the relative change in its resistance value is no more than ±2%, and under a DC voltage of 500 V, its insulation resistance is no less than 100 MΩ, which can meet the requirements of the spacecraft extravehicular environment.

[0046] Furthermore, such as Figures 1-4 As shown, the insulating outer layer of conductor 2 is a polyimide layer.

[0047] Furthermore, such as Figures 1-4 As shown, the heating circuit of the heating layer 1 is made of constantan material. In this embodiment, the heating layer 1 is a heating circuit made of constantan material heating alloy foil processed by etching process.

[0048] Example 2

[0049] Based on Embodiment 1, this embodiment stacks the thermoplastic connecting layer 4 on the insulating layer 3, then stacks the electric heating layer 1 on the thermoplastic connecting layer 4, and then performs hot pressing, thereby using the thermoplastic connecting layer 4 to fix the insulating layer 3 and the electric heating layer 1 together; the user connects the tail ends of a pair of wires 2 to the power supply, and the electric heating circuit heats up after being energized, ultimately achieving the purpose of heating.

[0050] Above, refer to Figures 1-4 The radiation-resistant thin-film heater according to an embodiment of the present invention has the following beneficial effects:

[0051] 1. This device increases the total radiation tolerance to 1.0*10⁻⁶ by replacing the adhesive layer of the thin-film heater in the prior art with a thermoplastic connecting layer 4 made of thermoplastic polyimide. 10 The rad(SI) enables this device to meet the requirements of the spacecraft's extravehicular environment, overcoming the shortcomings of existing thin-film heaters in terms of poor environmental adaptability.

[0052] 2. This device designs the line width a1 of the heating circuit of the heating layer 1 to be greater than 0.3mm, and the line spacing a2 of the heating circuit of the heating layer 1 to be 0.25mm to 0.35mm, to ensure that the device can heat to 200℃ to 240℃ within the expected time.

[0053] 3. This device improves the assembly space utilization rate by designing the distance a3 between the edge of the heating layer and the edge of the insulation layer to be within the range of 2mm to 3mm. That is, while ensuring the heating power of the device, it avoids the phenomenon of air bubbles forming between a pair of insulation layers 3 that often occurs when the distance a3 between the edge of the heating layer and the edge of the insulation layer is less than 2mm; and avoids the problem of excessive assembly space occupied when the distance a3 between the edge of the heating layer and the edge of the insulation layer is greater than 3mm.

[0054] 4. This device connects the ends of a pair of wires 2 to a pair of insulating layers 3 by extending the ends of the wires 2 into the insulating layers 3 and fixing the ends of the wires 2 to the insulating layers 3 by a pair of thermoplastic connecting layers 4. The thickness of the insulating layers 3 is designed to be no less than 12.5μm, and the thickness of the welding area of ​​the insulating layers 3 is designed to be between 25μm and 35μm. This ensures that after each wire 2 is subjected to a 15N tensile force for 30 minutes, the relative change in its resistance value is no greater than ±2%, and under a DC voltage of 500V, its insulation resistance is no less than 100MΩ, which can meet the requirements of the spacecraft extravehicular environment.

[0055] It should be noted that, in this specification, the terms "comprising," "including," or any other variations thereof are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0056] Although the present invention has been described in detail through the above preferred embodiments, it should be understood that the above description should not be considered as a limitation of the present invention. Various modifications and substitutions to the present invention will be apparent to those skilled in the art after reading the above content. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims

1. A radiation tolerant thin film heater, characterized by, The electric heating layer, a pair of conductive wires and a pair of insulating layers are included. The electric heating layer is fixedly arranged between the pair of insulating layers. The head end of each of the pair of conductive wires is electrically connected to the positive pole of the electric heating layer and the negative pole of the electric heating layer respectively.

2. The radiation tolerant thin film heater of claim 1, wherein, The head end of each of the pair of conductive wires is located between the pair of insulating layers.

3. The radiation tolerant thin film heater of claim 1, wherein, A pair of thermoplastic connecting layers are further included, each of the thermoplastic connecting layers is fixedly arranged between one of the insulating layers and the electric heating layer, and is used for fixedly connecting the electric heating layer and the insulating layer.

4. The radiation tolerant thin film heater of claim 1, wherein, The line width of the electric heating circuit of the electric heating layer is greater than 0.3 mm.

5. The radiation tolerant thin film heater of claim 1, wherein, The line spacing of the electric heating circuit of the electric heating layer ranges from 0.25 mm to 0.35 mm.

6. The radiation tolerant thin film heater of claim 1, wherein, The distance between the edge of the electric heating layer and the edge of the insulating layer ranges from 2 mm to 3 mm.

7. The radiation tolerant thin film heater of claim 1, wherein, The thickness of the insulating layer is not less than 12.5 μm.

8. The radiation tolerant thin film heater of claim 1, wherein, The area of the insulating layer corresponding to the position of the head end of the conductive wire is a welding area, and the thickness of the welding area of the insulating layer ranges from 25 μm to 35 μm.

9. The radiation tolerant thin film heater of claim 1, wherein, The insulating sheath of the conductive wire is a polyimide layer.

10. The radiation tolerant thin film heater of claim 1, wherein, The electric heating circuit of the electric heating layer is a constantan material circuit.

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