Module circuit board structure

Abstract

The module circuit board structure provided by the utility model comprises a circuit board body, the circuit board body is provided with eight terminal holes and eight gold pinholes, the eight terminal holes are divided into an upper group and a lower group and are symmetrically arranged, and the eight terminal holes are respectively upper-layer terminal holes and lower-layer terminal holes. The upper-layer terminal holes and the lower-layer terminal holes are respectively provided with four hole positions and are arranged in two rows in a staggered manner; the eight gold pinholes are arranged between the two layers of terminal holes, the eight gold pinholes are divided into two rows and are transversely arranged, namely a first row of gold pinholes and a second row of gold pinholes, the eight terminal holes are electrically connected with the eight gold pinholes through wires respectively, and the front surface and the back surface of the circuit board body are respectively provided with five inter-wire-pair crosstalk groups. According to the module circuit board structure provided by the utility model, the two groups of terminal holes and gold pinholes on the circuit board body are wired and connected by adopting a double-layer circuit board structure, and crosstalk groups between wire pairs are respectively arranged on each layer of circuit board to achieve the function of reducing crosstalk, so that the circuit board can meet the CAT6A performance transmission requirement.

Description

Technical Field

[0001] This utility model relates to the field of network modules, specifically a module circuit board structure. Background Technology

[0002] When making RJ45 patch cords, punching is required, which causes the twisted pair to untwist, resulting in high coupling between adjacent wires and significant crosstalk. This crosstalk will enter the link through the module, causing FLUKE tests to fail. Therefore, this crosstalk needs to be eliminated at the module level, i.e., by embedding a PCB board behind the gold pins and adding compensation capacitors to the PCB board to suppress crosstalk. The existing network module interface has high crosstalk between the circuit board ports, affecting the propagation rate. Therefore, some new layout structures need to be designed so that the circuit board can meet the performance transmission requirements of TIA / EIA568B and CAT6A. Utility Model Content

[0003] The purpose of this utility model is to provide a modular circuit board structure to solve the technical problems in the background art.

[0004] To achieve the aforementioned objectives, this utility model provides the following technical solution:

[0005] A modular circuit board structure includes a circuit board body with eight terminal holes and eight pin holes. The eight terminal holes are arranged symmetrically in two groups, namely upper terminal holes and lower terminal holes. The upper terminal holes and lower terminal holes each have four holes arranged in two staggered rows. The eight pin holes are located between the two terminal holes and are arranged in two horizontal rows, namely a first row of pin holes and a second row of pin holes. The eight terminal holes are electrically connected to the eight pin holes via wires. The front and back of the circuit board body each have five sets of crosstalk groups between wire pairs.

[0006] The eight terminal holes are designated as first terminal hole, second terminal hole, third terminal hole, fourth terminal hole, fifth terminal hole, sixth terminal hole, seventh terminal hole, and eighth terminal hole. The first terminal hole, second terminal hole, third terminal hole, and sixth terminal hole are lower-layer terminal holes, and the fifth terminal hole, fourth terminal hole, seventh terminal hole, and eighth terminal hole are upper-layer terminal holes.

[0007] The eight gold needle holes are designated as the first gold needle hole, the second gold needle hole, the third gold needle hole, the fourth gold needle hole, the fifth gold needle hole, the sixth gold needle hole, the seventh gold needle hole, and the eighth gold needle hole. The first, third, fifth, and seventh gold needle holes form the first row of gold needle holes, and the second, fourth, sixth, and eighth gold needle holes form the second row of gold needle holes.

[0008] The five pairs of crosstalk groups located on the front of the circuit board body are the first pair crosstalk group, the second pair crosstalk group, the third pair crosstalk group, the fourth pair crosstalk group, and the fifth pair crosstalk group. The first pair crosstalk group is above the first row of gold pin holes, while the second, third, fourth, and fifth pair crosstalk groups are all located at the lower end of the circuit board body.

[0009] The five crosstalk groups located on the back of the circuit board body are the sixth, seventh, eighth, ninth, and tenth crosstalk groups. The sixth crosstalk group is located above the upper terminal hole, the seventh crosstalk group is located below the upper terminal hole, the eighth and ninth crosstalk groups are located in the middle of the circuit board body, and the tenth crosstalk group is located at the lower end of the circuit board body.

[0010] The linewidths of the first, second, third, fourth, and fifth line-pair crosstalk groups are 0.17-0.5 mm; the linewidths of the sixth, seventh, eighth, ninth, and tenth line-pair crosstalk groups are 0.1-0.4 mm. The seventh line-pair crosstalk group includes a rectangular sheet capacitor with a length of 3.2-3.5 mm and a width of 0.7-1 mm.

[0011] Compared with the prior art, the modular circuit board structure provided by this utility model has a simple and compact layout. It adopts a double-layer circuit board structure to connect two sets of terminal holes and gold pin holes on the circuit board body. Crosstalk groups between wire pairs are set on each layer of the circuit board. The arrangement of ten different crosstalk groups between wire pairs achieves the function of reducing crosstalk, improving the signal transmission speed, and the circuit board can meet the CAT6A performance transmission requirements. Attached Figure Description

[0012] Figure 1 : A schematic diagram of the front structure of this application;

[0013] Figure 2 : A schematic diagram of the rear structure of this application;

[0014] Figure 3 This application provides a schematic diagram of the crosstalk connections between various pairs of wires on the circuit board. Detailed Implementation

[0015] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0016] Specific Implementation Example 1: Please refer to Figures 1 to 3 In this embodiment of the utility model, a modular circuit board structure includes a circuit board body 1. The circuit board body 1 is provided with eight terminal holes C and eight pin holes S. The eight terminal holes are arranged symmetrically in two groups, namely upper terminal holes and lower terminal holes. The upper terminal holes and the lower terminal holes are each provided with four holes and arranged in two staggered rows. The eight pin holes are provided between the two layers of terminal holes and are arranged in two horizontal rows, namely the first row of pin holes and the second row of pin holes. The eight terminal holes are electrically connected to the eight pin holes through wires. The front and back of the circuit board body 1 are provided with five groups of crosstalk between wire pairs.

[0017] The eight terminal holes are designated as terminal hole C1, terminal hole C2, terminal hole C3, terminal hole C4, terminal hole C5, terminal hole C6, terminal hole C7, and terminal hole C8. Terminal holes C1, C2, C3, and C6 are the lower-level terminal holes, while terminal holes C5, C4, C7, and C8 are the upper-level terminal holes.

[0018] The eight gold needle holes are designated as the first gold needle hole S1, the second gold needle hole S2, the third gold needle hole S3, the fourth gold needle hole S4, the fifth gold needle hole S5, the sixth gold needle hole S6, the seventh gold needle hole S7, and the eighth gold needle hole S8. The first gold needle hole S1, the third gold needle hole S3, the fifth gold needle hole S5, and the seventh gold needle hole S7 form the first row of gold needle holes, while the second gold needle hole S2, the fourth gold needle hole S4, the sixth gold needle hole S6, and the eighth gold needle hole S8 form the second row of gold needle holes.

[0019] The five pairs of crosstalk groups located on the front of the circuit board body 1 are the first pair crosstalk group 2, the second pair crosstalk group 3, the third pair crosstalk group 4, the fourth pair crosstalk group 5, and the fifth pair crosstalk group 6. The first pair crosstalk group 2 is above the first row of gold pin holes, while the second pair crosstalk group 3, the third pair crosstalk group 4, the fourth pair crosstalk group 5, and the fifth pair crosstalk group 6 are all located at the lower end of the circuit board body 1.

[0020] The five crosstalk groups located on the back of the circuit board body 1 are the sixth crosstalk group 7, the seventh crosstalk group 8, the eighth crosstalk group 9, the ninth crosstalk group 10, and the tenth crosstalk group 11. The sixth crosstalk group 7 is above the upper terminal hole, the seventh crosstalk group 8 is below the upper terminal hole, the eighth crosstalk group 9 and the ninth crosstalk group 10 are both in the middle of the circuit board body 1, and the tenth crosstalk group 11 is at the lower end of the circuit board body 1.

[0021] The linewidths of the first line-pair crosstalk group 2, the second line-pair crosstalk group 3, the third line-pair crosstalk group 4, the fourth line-pair crosstalk group 5, and the fifth line-pair crosstalk group 6 are 0.17-0.5 mm. In this embodiment, the linewidth of the first line-pair crosstalk group 2 is 0.3 mm, the linewidth of the second line-pair crosstalk group 3 is 0.23 mm, the linewidth of the third line-pair crosstalk group 4 is between 0.176-0.48 mm, and the linewidth of the third line-pair crosstalk group 4 is composed of different linewidths. The linewidth of the fourth line-pair crosstalk group 5 is 0.25 mm, and the linewidth of the fifth line-pair crosstalk group 6 is between 0.18-0.35 mm, and the linewidth of the fifth line-pair crosstalk group 6 is composed of different linewidths.

[0022] The linewidths of the sixth line-pair crosstalk group 7, the seventh line-pair crosstalk group 8, the eighth line-pair crosstalk group 9, the ninth line-pair crosstalk group 10, and the tenth line-pair crosstalk group 11 are 0.1-0.4 mm. The seventh line-pair crosstalk group 8 includes a rectangular sheet capacitor 801 with a length of 3.2-3.5 mm and a width of 0.7-1 mm. In this embodiment, the linewidth of the sixth line-pair crosstalk group 7 is 0.177 mm, the linewidth of the seventh line-pair crosstalk group 8 is 0.2 mm, and the rectangular capacitor 801 area has a size of 3.2*0.7 mm. The linewidths of the eighth line-pair crosstalk group 9, the ninth line-pair crosstalk group 10, and the tenth line-pair crosstalk group 11 are all 0.2 mm.

[0023] Compared with the prior art, the modular circuit board structure provided by this utility model has a simple and compact layout. It adopts a double-layer circuit board structure to connect two sets of terminal holes and gold pin holes on the circuit board body. Crosstalk groups between wire pairs are set on each layer of the circuit board. The arrangement of ten different crosstalk groups between wire pairs achieves the function of reducing crosstalk, improving the signal transmission speed, and the circuit board can meet the CAT6A performance transmission requirements.

[0024] It will be apparent to those skilled in the art that this invention is not limited to the details of the foregoing exemplary embodiments, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0025] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A module wiring board structure, characterized by: The application relates to a circuit board body provided with eight terminal holes and eight gold pin holes, the eight terminal holes are symmetrically arranged in two groups, namely an upper layer of terminal holes and a lower layer of terminal holes, the upper layer of terminal holes and the lower layer of terminal holes are respectively provided with four hole positions and are staggered arranged in two rows, the eight gold pin holes are arranged between the two layers of terminal holes, the eight gold pin holes are horizontally arranged in two rows, namely a first row of gold pin holes and a second row of gold pin holes, the eight terminal holes are electrically connected with the eight gold pin holes through wires, and the front surface and the back surface of the circuit board body are respectively provided with five groups of crosstalk interference groups.

2. The module board structure according to claim 1, wherein: The eight terminal holes are respectively a first terminal hole, a second terminal hole, a third terminal hole, a fourth terminal hole, a fifth terminal hole, a sixth terminal hole, a seventh terminal hole and an eighth terminal hole, the first terminal hole, the second terminal hole, the third terminal hole and the sixth terminal hole are lower layer terminal holes, and the fifth terminal hole, the fourth terminal hole, the seventh terminal hole and the eighth terminal hole are upper layer terminal holes.

3. The module board structure according to claim 2, wherein: The eight gold pin holes are respectively a first gold pin hole, a second gold pin hole, a third gold pin hole, a fourth gold pin hole, a fifth gold pin hole, a sixth gold pin hole, a seventh gold pin hole and an eighth gold pin hole, the first gold pin hole, the third gold pin hole, the fifth gold pin hole and the seventh gold pin hole are the first row of gold pin holes, and the second gold pin hole, the fourth gold pin hole, the sixth gold pin hole and the eighth gold pin hole are the second row of gold pin holes.

4. The module board structure according to claim 3, wherein: The five groups of crosstalk interference groups on the front surface of the circuit board body are respectively a first group of crosstalk interference groups, a second group of crosstalk interference groups, a third group of crosstalk interference groups, a fourth group of crosstalk interference groups and a fifth group of crosstalk interference groups, the first group of crosstalk interference groups is above the first row of gold pin holes, and the second group of crosstalk interference groups, the third group of crosstalk interference groups, the fourth group of crosstalk interference groups and the fifth group of crosstalk interference groups are all located at the lower end of the circuit board body.

5. The module board structure according to claim 4, wherein: The five groups of crosstalk interference groups on the back surface of the circuit board body are respectively a sixth group of crosstalk interference groups, a seventh group of crosstalk interference groups, an eighth group of crosstalk interference groups, a ninth group of crosstalk interference groups and a tenth group of crosstalk interference groups, the sixth group of crosstalk interference groups is above the upper layer of terminal holes, the seventh group of crosstalk interference groups is below the upper layer of terminal holes, the eighth group of crosstalk interference groups and the ninth group of crosstalk interference groups are all located at the middle part of the circuit board body, and the tenth group of crosstalk interference groups is located at the lower end of the circuit board body.

6. The module board structure according to claim 5, wherein: The line width of the first group of crosstalk interference groups, the second group of crosstalk interference groups, the third group of crosstalk interference groups, the fourth group of crosstalk interference groups and the fifth group of crosstalk interference groups is 0.17-0.5 mm, the line width of the sixth group of crosstalk interference groups, the seventh group of crosstalk interference groups, the eighth group of crosstalk interference groups, the ninth group of crosstalk interference groups and the tenth group of crosstalk interference groups is 0.1-0.4 mm, and the seventh group of crosstalk interference groups comprises a rectangular sheet-shaped capacitor sheet, the length of the capacitor sheet is 3.2-3.5 mm, and the width of the capacitor sheet is 0.7-1 mm.

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