Multi-layer circuit board capable of avoiding poor bonding force after lamination

Abstract

The utility model discloses a multilayer circuit board capable of avoiding poorer bonding force after lamination, which belongs to the technical field of electronic manufacturing, and comprises a multilayer circuit board main body, the multilayer circuit board main body comprises a bottom layer circuit board and a superposed circuit board, and the superposed circuit board is provided with a plug hole; the alignment assembly comprises a fixing column and a bending piece, the bending piece is arranged on the upper end face of the fixing column, the fixing column is inserted into the inserting hole, and the bending piece is made of a soft metal material; according to the utility model, through the arrangement of the alignment assembly, in the processing process, firstly, a worker places the bottom layer circuit board at the lowest part, then places the superposed circuit boards on the upper end surface of the bottom layer circuit board one by one, and ensures that the fixed columns are inserted into the insertion holes, so that the bottom layer circuit board and the superposed circuit boards are aligned with each other; therefore, the contact area between the layers is maximized, and insufficient pressing force after combination caused by poor alignment is avoided.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the electronic manufacturing technical field, concretely relates to a multilayer circuit board which avoids poor bonding force after pressing. BACKGROUND

[0002] Nowadays, with the development of electronic equipment to miniaturization and light weight, more electronic components and functions need to be integrated in a limited space, and the complexity of modern electronic systems also requires circuit boards to support complex circuit design, so it is usually necessary to set up a multilayer circuit board.

[0003] The manufacturing process of the multilayer circuit board is a complex and precise process flow involving multiple steps and strict quality control. First, the technician uses software to complete the circuit layout and wiring design, selects the appropriate substrate, and attaches copper foil to the substrate. Then, the circuit diagram is transferred to the copper foil using a process. Then, the inner layer circuit board and the prepreg are alternately stacked to form a multilayer structure, and the stacked preform is pressed together under high temperature and pressure. Finally, the outer layer circuit pattern is transferred, and the unprotected copper foil is removed, leaving the outer layer circuit pattern. The finished product is tested and quality controlled before completion.

[0004] However, during the pressing of the circuit board, if the alignment between the circuit boards is poor, the contact area between the layers is reduced, affecting the flow and distribution of the resin between the layers, resulting in insufficient bonding force after pressing. Insufficient bonding force will cause the circuit board to separate between layers when subjected to thermal stress, mechanical stress or environmental stress, and poor interlayer bonding will also cause the conductive path to break, causing an open circuit or increased resistance, affecting the normal operation of the circuit. Therefore, a multilayer circuit board that avoids poor bonding force after pressing is needed to solve the above problems. SUMMARY

[0005] The utility model aims at providing a multilayer circuit board that avoids poor bonding force after pressing to solve the problems raised in the background art.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a multilayer circuit board that avoids poor bonding force after pressing, comprising:

[0007] A multilayer circuit board body, the multilayer circuit board body includes a bottom layer circuit board and a plurality of stacked circuit boards, the stacked circuit boards are installed on the upper end surface of the bottom layer circuit board at intervals, and the stacked circuit boards have plug-in holes around them.

[0008] An alignment assembly includes a fixing post and a bending piece. The lower end of the fixing post is fixedly mounted on the upper surface of the bottom circuit board. The bending piece is disposed on the upper surface of the fixing post. The fixing post is inserted into the insertion hole, and the length of the fixing post is the same as the thickness of the multiple stacked circuit boards. Multiple bending pieces are provided, and the sidewalls of the multiple bending pieces are mutually abutted. The bending pieces are made of soft metal material.

[0009] As a preferred embodiment, the alignment assembly further includes two pairs of snap-fit ​​plates, with two snap-fit ​​plates in each pair, and the two snap-fit ​​plates are respectively attached to the sidewall of the multilayer circuit board body.

[0010] As a preferred embodiment, the alignment assembly further includes a bonding plate having a mounting groove, the bonding plate being inserted into the mounting groove around its perimeter, and the bonding plate being placed on the lower end face of the bottom circuit board.

[0011] As a preferred embodiment, the alignment assembly further includes pull ropes and fixing studs. The locking plate has threaded holes, and multiple pairs of fixing studs are provided. Multiple pull ropes are provided, with both ends of each pull rope connected to each pair of fixing studs. The fixing studs are threadedly connected to the threaded holes.

[0012] As a preferred embodiment, the fixing stud has a rotating component at one end near the pulling rope, the locking plate has a placement groove, the rotating component is positioned above the placement groove, and the sidewall of the multilayer circuit board body is placed inside the placement groove.

[0013] As a preferred embodiment, the lower end face of the bottom circuit board has a limiting block, and multiple limiting blocks are provided, with the sidewall of the bonding plate placed between the multiple limiting blocks.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] This invention features an alignment assembly comprising a fixing post and bending pieces. The lower end of the fixing post is fixedly mounted on the upper surface of the bottom circuit board, and the bending pieces are disposed on the upper surface of the fixing post. The fixing post is inserted into a insertion hole, and the sidewalls of multiple bending pieces are mutually abutted. The bending pieces are made of a soft metal material. During processing, the worker first places the bottom circuit board at the bottom, at which point the sidewalls of the multiple bending pieces are abutted. Then, stacked circuit boards are placed one by one on the upper surface of the bottom circuit board, ensuring that the fixing post is inserted into the insertion hole. In this way, the bottom circuit board and the multiple stacked circuit boards are aligned with each other, maximizing the contact area between layers and avoiding insufficient pressing force after bonding.

[0016] This invention comprises a locking plate, an adhesive plate, a pull rope, and fixing studs. The locking plate is attached to the side wall of the multilayer circuit board body. The locking plate has a mounting groove into which the adhesive plate is inserted. The locking plate has threaded holes, and the two ends of the pull rope are connected to each pair of fixing studs, which are threadedly connected to the threaded holes. After the bottom circuit board and the stacked circuit board are placed, multiple bending pieces are pressed down in a direction away from each other until the bending pieces are attached to the upper surface of the top stacked circuit board, thus fixing the bottom circuit board and the stacked circuit board to each other to prevent deviation during pressing. Then, multiple locking plates are attached to the side of the multilayer circuit board body, ensuring that the side wall of the multilayer circuit board body is placed in the placement groove and the periphery of the adhesive plate is placed in the mounting groove. Finally, the worker rotates the fixing studs into the two opposite threaded holes to reduce the probability of deformation or warping of the multilayer circuit board body after pressing. Attached Figure Description

[0017] Figure 1 This is a three-dimensional schematic diagram of the present invention;

[0018] Figure 2 This is a partial exploded view of the main body of the multilayer circuit board of this utility model;

[0019] Figure 3 This is a structural diagram of the alignment component of this utility model;

[0020] Figure 4 This is a partial exploded view of the alignment component of this utility model at one angle;

[0021] Figure 5 This is a partial exploded view of the alignment component of this utility model from another angle.

[0022] In the diagram: 1. Multilayer circuit board body; 11. Bottom circuit board; 111. Limiting block; 12. Stacked circuit board; 121. Insertion hole; 2. Alignment assembly; 21. Fixing post; 22. Bending piece; 23. Clamping plate; 231. Mounting groove; 232. Threaded hole; 233. Placement groove; 24. Adhesive plate; 25. Pull rope; 251. Rotating component; 26. Fixing stud. Detailed Implementation

[0023] The present invention will be further described below with reference to the embodiments.

[0024] The following embodiments are used to illustrate the present invention, but should not be used to limit the scope of protection of the present invention. The conditions in the embodiments can be further adjusted according to specific conditions, and simple improvements to the method of the present invention under the premise of the concept of the present invention are all within the scope of protection claimed by the present invention.

[0025] Please see Figures 1-5This utility model provides a multilayer circuit board that avoids poor bonding strength after lamination, comprising:

[0026] The multilayer circuit board body 1 includes a bottom circuit board 11 and multiple stacked circuit boards 12. The stacked circuit boards 12 are stacked and mounted on the top surface of the bottom circuit board 11 at intervals. Each stacked circuit board 12 has a plug hole 121 around its perimeter.

[0027] Alignment component 2 includes a fixing post 21 and a bending piece 22. The lower end of the fixing post 21 is fixedly installed on the upper end face of the bottom circuit board 11. The bending piece 22 is disposed on the upper end face of the fixing post 21. The fixing post 21 is inserted into the insertion hole 121. The length of the fixing post 21 is the same as the thickness of the multiple stacked circuit boards 12. Multiple bending pieces 22 are provided. The side walls of the multiple bending pieces 22 are attached to each other. The bending pieces 22 are made of soft metal material.

[0028] The alignment component 2 also includes a snap-fit ​​plate 23, which is provided in two pairs, with two snap-fit ​​plates 23 in each pair, and the two snap-fit ​​plates 23 are respectively attached to the side wall of the multilayer circuit board body 1.

[0029] The alignment assembly 2 also includes a bonding plate 24, a snap-fit ​​plate 23 having a mounting groove 231, the bonding plate 24 being inserted into the mounting groove 231 around its perimeter, and the bonding plate 24 being placed on the lower end face of the bottom circuit board 11.

[0030] Alignment assembly 2 also includes pull ropes 25 and fixing studs 26. The locking plate 23 has threaded holes 232. Multiple pairs of fixing studs 26 are provided, and multiple pull ropes 25 are provided. The two ends of each pull rope 25 are connected to each pair of fixing studs 26, and the fixing studs 26 are threadedly connected to the threaded holes 232.

[0031] The fixing stud 26 has a rotating part 251 at one end near the pulling rope 25, the locking plate 23 has a placement groove 233, the rotating part 251 is placed above the placement groove 233, and the side wall of the multilayer circuit board body 1 is placed inside the placement groove 233.

[0032] The lower end of the bottom circuit board 11 has a limiting block 111, and multiple limiting blocks 111 are provided. The side wall of the bonding plate 24 is placed between multiple limiting blocks 111.

[0033] Working principle and usage process of this utility model:

[0034] During the processing, the worker first places the bottom circuit board 11 at the bottom, at which point the sidewalls of the multiple bending pieces 22 are in contact. Then, the stacked circuit boards 12 are placed one by one on the upper surface of the bottom circuit board 11, and the fixing posts 21 installed on the upper surface of the bottom circuit board 11 are inserted into the insertion holes 121 on each stacked circuit board 12. In this way, the bottom circuit board 11 and the multiple stacked circuit boards 12 are aligned with each other to maximize the contact area between the layers and avoid insufficient pressing force after bonding due to poor alignment.

[0035] After the bottom circuit board 11 and the stacked circuit board 12 are placed, the multiple bent pieces 22 on each fixed post 21 are pressed down in a direction away from each other until the bent pieces 22 are attached to the upper surface of the top stacked circuit board 12, so that the bottom circuit board 11 and the stacked circuit board 12 are fixed to each other to prevent deviation during pressing.

[0036] After the bottom circuit board 11 and the stacked circuit board 12 are fixed, the worker places the bonding plate 24 between the multiple limiting blocks 111 on the lower end face of the bottom circuit board 11; then, the worker attaches multiple locking plates 23 to the side of the multilayer circuit board body 1 in sequence, ensuring that the side wall of the multilayer circuit board body 1 is placed in the placement groove 233 and the periphery of the bonding plate 24 is placed in the mounting groove 231; finally, the worker uses the rotating part 251 to rotate the fixing studs 26 at both ends of each pull rope 25 into the two opposite threaded holes 232. In this way, by setting the locking plate 23, the bonding plate 24 and the pull rope 25, the probability of deformation or warping of the multilayer circuit board body 1 after pressing is reduced.

[0037] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A multilayer circuit board that avoids poor bonding strength after lamination, characterized in that, include: The multilayer circuit board body (1) includes a bottom circuit board (11) and a plurality of stacked circuit boards (12). The stacked circuit boards (12) are stacked on the upper surface of the bottom circuit board (11) at intervals. Each stacked circuit board (12) has a plug hole (121) around its perimeter. Alignment component (2), the alignment component (2) includes a fixing post (21) and a bending piece (22). The lower end of the fixing post (21) is fixedly installed on the upper surface of the bottom circuit board (11). The bending piece (22) is disposed on the upper surface of the fixing post (21). The fixing post (21) is inserted into the insertion hole (121). The length of the fixing post (21) is the same as the thickness of the multiple stacked circuit boards (12). Multiple bending pieces (22) are provided. The sidewalls of the multiple bending pieces (22) are attached to each other. The bending pieces (22) are made of soft metal material.

2. A multilayer circuit board according to claim 1 that avoids poor bonding strength after lamination, characterized in that: The alignment component (2) further includes a snap-fit ​​plate (23), which is provided in two pairs, with two snap-fit ​​plates (23) in each pair, and the two snap-fit ​​plates (23) are respectively attached to the side wall of the multilayer circuit board body (1).

3. A multilayer circuit board according to claim 2 that avoids poor bonding strength after lamination, characterized in that: The alignment component (2) further includes a bonding plate (24), the bonding plate (23) having a mounting groove (231), the bonding plate (24) being inserted into the mounting groove (231) around its perimeter, and the bonding plate (24) being placed on the lower end face of the bottom circuit board (11).

4. A multilayer circuit board according to claim 3 that avoids poor bonding strength after lamination, characterized in that: The alignment assembly (2) further includes a pull rope (25) and a fixing stud (26). The locking plate (23) has a threaded hole (232). There are multiple pairs of fixing studs (26) and multiple pull ropes (25). The two ends of each pull rope (25) are connected to each pair of fixing studs (26). The fixing studs (26) are threadedly connected to the threaded hole (232).

5. A multilayer circuit board according to claim 4 that avoids poor bonding strength after lamination, characterized in that: The fixing stud (26) has a rotating part (251) at one end near the pulling rope (25), the locking plate (23) has a placement groove (233), the rotating part (251) is placed above the placement groove (233), and the side wall of the multilayer circuit board body (1) is placed inside the placement groove (233).

6. A multilayer circuit board according to claim 3 that avoids poor bonding strength after lamination, characterized in that: The lower end face of the bottom circuit board (11) has a limiting block (111), and multiple limiting blocks (111) are provided. The side wall of the bonding plate (24) is placed between multiple limiting blocks (111).

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