Multi-layer circuit board mobile processing device
The hydraulically driven sector gear and rack mechanism, along with the buffer pad design, solves the problem of unadjustable clamping force during the processing of multilayer printed circuit boards, achieving stable clamping and precise positioning of the circuit boards, and improving drilling accuracy and product quality.
Patent Information
- Application Number
- CN202520936305.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-13
- Publication Date
- 2026-02-17
- Estimated Expiration
- 2035-05-13
AI Technical Summary
The clamping force in existing multilayer printed circuit board processing equipment cannot be adjusted, resulting in improper clamping position, which can easily cause damage and displacement of the circuit board and affect drilling accuracy.
A multi-layer circuit board moving processing device was designed. It uses a hydraulic rod driven sector gear and rack mechanism to achieve uniform clamping, combined with a buffer pad to absorb vibration, and uses a laser rangefinder for precise positioning to ensure that the circuit board is subjected to uniform force in four directions.
It achieves stable clamping and precise positioning of circuit boards, preventing offset and deformation, improving drilling accuracy and product quality, and increasing work efficiency.
Smart Images
Figure CN223928559U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of multilayer circuit board processing technology, and in particular to a multilayer circuit board moving processing device. Background Technology
[0002] Multilayer circuit boards are composite substrates made by laminating multiple conductive and insulating layers alternately. Electrical interconnection between the layers is achieved through vias. They typically have four or more layers, with high-end products reaching dozens of layers. Their core function is to support the high-density integration and high-performance operation of electronic devices. Currently, multilayer circuit boards are widely used in consumer electronics, communication equipment, automotive electronics, as well as industrial and medical fields, becoming a key technology carrier driving the development of electronic products towards high integration, high speed, and high reliability.
[0003] Currently, the clamping force provided by drilling equipment in existing processing devices on the market cannot be adjusted. Because the thickness of multilayer printed circuit boards is small, clamping multilayer printed circuit boards can easily damage them, causing deformation and rendering the products unusable. Improper clamping can also cause the multilayer printed circuit board to shift during processing, resulting in errors in the drilling position and reducing product quality.
[0004] Therefore, to address the issues of the inability to adjust the clamping force, improper clamping position, and the potential damage to multilayer printed circuit boards (PCBs), as well as the risk of displacement during processing and compromised drilling accuracy, a multilayer PCB moving processing device with a clamping force adjustment mechanism and a fulcrum adjustment structure can be designed to solve these problems. Utility Model Content
[0005] To overcome the problems of unadjustable clamping force, improper clamping position, damage to multilayer printed circuit boards, displacement of multilayer printed circuit boards during processing, and inability to guarantee drilling accuracy.
[0006] The technical solution of this utility model is as follows: a multi-layer circuit board moving processing device, including a processing platform; and a first hydraulic rod, which is fixedly connected to one side above the processing platform. A first mounting plate is fixedly connected to the output end of the first hydraulic rod. The first mounting plate is rotatably connected to two opposing first connecting rods via connecting keys. A second connecting rod is rotatably connected to the first connecting rod via connecting keys. A sector gear is rotatably connected to the second connecting rod via connecting keys. A rack is meshed on the sector gear. A baffle is fixedly connected to the rack. A vibration-absorbing buffer pad is fixedly connected to the side of the baffle closest to the circuit board.
[0007] Preferably, the operator places the circuit board between the two baffles. When the first hydraulic rod extends, it drives the first mounting plate forward. The first mounting plate drives the first connecting rod to rotate, which in turn drives the second connecting rod to rotate, causing the sector gear to rotate. The rack meshes with the sector gear, causing it to move linearly with the rotation of the sector gear. This causes the two baffles to move linearly toward the circuit board until the two buffer pads firmly clamp the circuit board. The buffer pads absorb the vibration generated during the drilling process and protect the circuit board. After processing is completed, the first hydraulic rod shortens, driving the first mounting plate backward, moving the two baffles away from the circuit board and loosening the fixation on the circuit board, making it easier for the operator to remove the finished product.
[0008] Preferably, a slide rail is fixedly connected above the processing platform, a slide groove is provided below the rack, and a slide groove is slidably connected above the slide rail.
[0009] Preferably, a second mounting plate is fixedly connected to the side of the processing platform away from the first hydraulic rod, and a T-shaped frame is rotatably connected to the second mounting plate via a connecting key. A third connecting rod is rotatably connected to the other end of the T-shaped frame via a connecting key.
[0010] Preferably, the third connecting rod is fixedly connected to the top plate on the side near the circuit board, and a telescopic rod is rotatably connected between the second mounting plate and the T-shaped frame.
[0011] Preferably, two first linear modules are symmetrically fixedly connected above the processing platform, a second linear module is slidably connected above the two first linear modules, and a slider is slidably connected below the second linear modules.
[0012] Preferably, a second hydraulic rod is fixedly connected below the slider, a motor is fixedly connected below the output end of the second hydraulic rod, and a drill bit is threadedly connected to the output end of the motor.
[0013] Preferably, two laser rangefinders are symmetrically fixedly connected below the slider. The laser rangefinders are electrically connected to a first linear module and a second linear module. A protective pad is fixed above the processing platform.
[0014] The beneficial effects of this utility model are:
[0015] The device utilizes a first hydraulic rod to drive the rotation between connecting rods, thereby rotating the sector gear. This, in turn, enables the rack-and-pinion control baffle to clamp the circuit board, providing uniform clamping force from both sides of the circuit board to prevent it from shifting and causing errors in the drilling position. A buffer pad is also installed on the baffle to absorb impacts and vibrations during processing, preventing deformation that could affect subsequent processing and result in low-quality products. A top plate is also installed at the front end of the circuit board to further secure it and prevent slippage. The circuit board is firmly fixed in four directions, ensuring even force distribution at each support point. Workers only need to place the circuit board in the device, which automatically and securely fixes it without requiring size adjustments, thus improving work efficiency. Attached Figure Description
[0016] Figure 1 The diagram shown is a schematic representation of the overall three-dimensional structure of this utility model.
[0017] Figure 2 The diagram shown is a schematic representation of the baffle movement structure of this utility model.
[0018] Figure 3 The diagram shown is a schematic representation of the top plate movement structure of this utility model.
[0019] Figure 4 The diagram shown is a schematic representation of the slider motion structure of this utility model.
[0020] Figure 5 The diagram shown is a top-down view of the laser rangefinder of this utility model.
[0021] Explanation of reference numerals in the attached drawings: 1. Machining platform; 101. Slide rail; 2. First hydraulic rod; 3. First mounting plate; 4. First connecting rod; 5. Second connecting rod; 6. Sector gear; 7. Rack; 701. Slide groove; 8. Baffle; 9. Buffer pad; 10. Protective pad; 11. Second mounting plate; 12. T-shaped frame; 13. Third connecting rod; 14. Top plate; 15. Telescopic rod; 16. First linear module; 17. Second linear module; 18. Slider; 19. Second hydraulic rod; 20. Motor; 21. Drill bit; 22. Laser rangefinder. Detailed Implementation
[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments.
[0023] Please see Figures 1-5This utility model provides an embodiment: a multi-layer circuit board moving processing device, including a processing platform 1; it also includes a first hydraulic rod 2, which is fixedly connected to one side of the processing platform 1. The output end of the first hydraulic rod 2 is fixedly connected to a first mounting plate 3. The first mounting plate 3 is rotatably connected to two opposing first connecting rods 4 via connecting keys. A second connecting rod 5 is rotatably connected to the first connecting rod 4 via connecting keys. A sector gear 6 is rotatably connected to the second connecting rod 5 via connecting keys. A rack 7 is meshed with the sector gear 6. A baffle 8 is fixedly connected to the rack 7. A suction device is fixedly connected to the side of the baffle 8 near the circuit board. The vibration-absorbing buffer pad 9 is used to absorb vibrations. The worker places the circuit board between the two baffles 8. When the first hydraulic rod 2 extends, it drives the first mounting plate 3 forward. The first mounting plate 3 drives the first connecting rod 4 to rotate, which in turn drives the second connecting rod 5 to rotate, causing the sector gear 6 to rotate. This engages the rack 7 with the sector gear 6, causing the rack 7 to move linearly with the rotation of the sector gear 6. This, in turn, drives the two baffles 8 to move linearly toward the circuit board until the two buffer pads 9 firmly clamp the circuit board. The buffer pads 9 absorb the vibrations generated during the drilling process, protecting the circuit board. After processing is complete, the first hydraulic rod 2 shortens. The first mounting plate 3 is moved backward, causing the two baffles 8 to move away from the circuit board, loosening the fixation on the circuit board, and making it easier for workers to remove the finished product. A slide rail 101 is fixedly connected above the processing platform 1. A slide groove 701 is provided below the rack 7, and a slide groove 701 is slidably connected above the slide rail 101. When the rack 7 moves, the slide groove 701 slides on the slide rail 101, limiting the movement of the rack 7. A second mounting plate 11 is fixedly connected to the side of the processing platform 1 away from the first hydraulic rod 2. A T-shaped frame 12 is rotatably connected to the second mounting plate 11 via a connecting key. A third connecting rod is rotatably connected to the other end of the T-shaped frame 12 via a connecting key. 13. When the T-shaped frame 12 rotates toward the processing platform 1, it drives the third connecting rod 13 to move linearly toward the processing platform 1. When the T-shaped frame 12 rotates in the opposite direction, the third connecting rod 13 moves away from the processing platform 1. The top plate 14 is fixedly connected to the side of the third connecting rod 13 closest to the circuit board. A telescopic rod 15 is rotatably connected between the second mounting plate 11 and the T-shaped frame 12. When the telescopic rod 15 extends, the third connecting rod 13 moves linearly toward the processing platform 1, driving the top plate 14 to move linearly toward the circuit board and fixing the circuit board. When the telescopic rod 15 shortens, the third connecting rod 13 moves away from the processing platform 1, causing the top plate 14 to release the circuit board.
[0024] Please see Figures 1-5In this embodiment, two first linear modules 16 are symmetrically fixedly connected above the processing platform 1. A second linear module 17 is slidably connected above the two first linear modules 16. A slider 18 is slidably connected below the second linear modules 17. The first linear modules 16 drive the second linear modules 17 to perform vertical horizontal movement, and the second linear modules 17 drive the slider 18 to perform horizontal movement. The first linear modules 16 and the second linear modules 17 cooperate to move the slider 18 towards the drilling position. A second hydraulic rod 19 is fixedly connected below the slider 18. A motor 20 is fixedly connected below the output end of the second hydraulic rod 19. A drill bit 21 is threadedly connected to the output end of the motor 20. When the second hydraulic rod 19 extends, it drives the motor 20 to perform linear movement towards the circuit board. The motor 20 outputs torque to the drill bit 21, causing the drill bit 21 to drill holes in the circuit board. When the second hydraulic rod 19 shortens, it drives the motor 20 and the drill bit 21 to move upward. The motor 20 stops rotating, and the operator can change the drill bit 21. Two laser rangefinders 22 are symmetrically fixedly connected below the slider 18. The laser rangefinders 22 are electrically connected to the first linear module 16 and the second linear module 17. A protective pad 10 is fixed above the processing platform 1. The two laser rangefinders 22 accurately measure the drilling position and transmit the measurement signal to the first linear module 16 and the second linear module 17. The first linear module 16 and the second linear module 17 control the slider 18 to move precisely to drill holes. The protective pad 10 protects the processing platform 1.
[0025] During operation, the worker places the circuit board between the two baffles 8. When the first hydraulic rod 2 extends, it drives the first mounting plate 3 forward. The first mounting plate 3 drives the first connecting rod 4 to rotate, which in turn drives the second connecting rod 5 to rotate, causing the sector gear 6 to rotate. The rack 7 meshes with the sector gear 6, causing the rack 7 to move linearly with the rotation of the sector gear 6. This causes the slide groove 701 to slide on the slide rail 101, limiting the movement of the rack 7. This causes the two baffles 8 to move linearly toward the circuit board until the two buffer pads 9 firmly clamp the circuit board. The buffer pads 9 absorb the vibration generated during the drilling process, protecting the circuit board. At the same time, the telescopic rod 15 extends, and the T-shaped frame 12 rotates toward the processing platform 1, driving the third connecting rod 13 to move linearly toward the processing platform 1. This also causes the top plate 14 to move linearly toward the circuit board, fixing the circuit board from the front end. Then, two laser rangefinders 22 accurately measure the drilling position. The measured signal is transmitted to the first linear module 16 and the second linear module 17. The first linear module 16 drives the second linear module 17 to move vertically horizontally, and the second linear module 17 drives the slider 18 to move horizontally. The first linear module 16 and the second linear module 17 work together to move the slider 18 to the drilling position. When the second hydraulic rod 19 extends, it drives the motor 20 to move linearly towards the circuit board. The motor 20 outputs torque to the drill bit 21, causing the drill bit 21 to drill holes in the circuit board. When the second hydraulic rod 19 shortens, it drives the motor 20 and the drill bit 21 to move upward. The motor 20 stops rotating, and the operator can change the drill bit 21. After processing is completed, the first hydraulic rod 2 and the telescopic rod 15 shorten, causing the first mounting plate 3 to move backward, moving the two baffles 8 away from the circuit board and loosening the fixation on the circuit board. The third connecting rod 13 moves away from the processing platform 1, causing the top plate 14 to loosen the circuit board, and the operator can then remove the finished product.
[0026] Through the above steps, the first hydraulic rod 2 drives the rotation between the connecting rods, thereby rotating the sector gear 6. This allows the rack 7 to control the baffle 8 to clamp the circuit board, providing uniform clamping force from both sides of the circuit board to prevent it from shifting and causing errors in the drilling position. A buffer pad 9 is also installed on the baffle 8 to absorb the impact and vibration experienced by the circuit board during processing, preventing deformation and affecting subsequent processing, thus ensuring low product quality. A top plate 14 is also installed at the front end of the circuit board to further secure it from the front, preventing slippage. The circuit board is firmly fixed from four directions, ensuring uniform force distribution at each support point. The operator only needs to place the circuit board; the device automatically and firmly fixes it without requiring size adjustments, improving work efficiency. This solves the problems of unadjustable clamping force, improper clamping position, damage to multi-layer printed circuit boards, and shifting of multi-layer printed circuit boards during processing, which compromises drilling accuracy.
Claims
1. A multi-layer circuit board mobile processing device, comprising a processing platform (1); characterized in that: Also include the first hydraulic rod (2), processing platform (1) above one side of the fixed connection has the first hydraulic rod (2), the first hydraulic rod (2) output end fixedly connected with the first mounting plate (3), the first mounting plate (3) is rotatably connected with two opposite first connecting rod (4) through the connecting key, the first connecting rod (4) is rotatably connected with the second connecting rod (5) through the connecting key, the second connecting rod (5) is rotatably connected with the sector gear (6) through the connecting key, the sector gear (6) is meshed with the rack (7), the rack (7) is fixedly connected with the baffle (8), the baffle (8) is fixedly connected with the vibration absorbing buffer pad (9) on the side close to the circuit board.
2. The multi-layer circuit board mobile processing apparatus according to claim 1, characterized by: The processing platform (1) is fixedly connected with the slide rail (101) above, and the slide rail (101) is slidably connected with the sliding groove (701) above.
3. The multi-layer circuit board mobile processing apparatus according to claim 1, characterized by: The processing platform (1) is fixedly connected with the second mounting plate (11) away from the first hydraulic rod (2) on one side, and the T-shaped frame (12) is rotatably connected with the second mounting plate (11) through the connecting key.
4. The multilayer circuit board mobile processing apparatus according to claim 1, characterized by: The third connecting rod (13) is fixedly connected with the top plate (14) on the side close to the circuit board, and the second mounting plate (11) and the T-shaped frame (12) are rotatably connected with the telescopic rod (15).
5. The multilayer circuit board mobile processing apparatus according to claim 1, characterized by: The processing platform (1) is fixedly connected with two first linear modules (16) above, and the second linear module (17) is slidably connected with the two first linear modules (16) above.
6. The multilayer circuit board mobile processing apparatus according to claim 1, characterized by: The second hydraulic rod (19) is fixedly connected with the sliding block (18) below, and the motor (20) is fixedly connected with the second hydraulic rod (19) output end below.
7. The multilayer circuit board mobile processing apparatus according to claim 1, characterized by: The sliding block (18) is fixedly connected with two laser range finders (22) below, and the laser range finders (22) are electrically connected with the first linear module (16) and the second linear module (17), and the processing platform (1) is fixedly connected with the protective pad (10).