LED light source structure with high brightness

Abstract

The utility model discloses a light-emitting diode (LED) light source structure with high brightness, which comprises a substrate and a light-blocking ring connected on the substrate, the inner wall or the end part of the light-blocking ring is connected with a transparent protective layer, the transparent protective layer, the inner wall of the light-blocking ring and the substrate jointly enclose to form an accommodating cavity, a plurality of LED wafers are arranged in the accommodating cavity, the LED wafers are connected on the substrate in an inverted manner, and the LED wafers are arranged on the substrate. The surface of the LED wafer is coated with fluorine-containing fluorescent powder or the containing cavity is filled with a fluorine-containing fluorescent powder layer, the fluorine-containing fluorescent powder and the fluorine-containing fluorescent powder layer are used for converting part of light emitted by the LED wafer into light of another color and mixing the light of another color with the light emitted by the LED wafer to form white light, the LED wafer is connected to the substrate in an inverted mode, a gold thread structure is not needed, and the cost is reduced. The stability and the reliability are high, and meanwhile, the heat dissipation problem of a traditional normally-installed LED chip is also improved. The inverted structure reduces obstacles on a heat conduction path, so that heat can be more effectively conducted to the substrate from the LED chip, the heat dissipation efficiency is improved, and the service life of the LED is prolonged.

Description

Technical Field

[0001] This utility model relates to the field of lighting technology, and in particular to a high-brightness LED light source structure. Background Technology

[0002] In recent years, with the advancement of semiconductor technology and materials science, LED lighting products have been widely used and developed due to their advantages such as high efficiency, energy saving, and long lifespan. However, traditional LED light sources still have some problems in practical use, such as insufficient luminous efficacy, poor heat dissipation, and unreasonable optical design. These problems limit the performance of LED light sources in certain specific applications.

[0003] Traditional LED packaging typically uses a top-mount connection method, which connects the electrodes of the LED chip to the circuitry on the substrate using gold wires. This method not only increases production costs, but the presence of gold wires can also obstruct the light path, affecting light extraction efficiency. Furthermore, the gold wire solder joints are a potential point of failure in the entire LED light source structure, easily breaking due to thermal or mechanical stress, thus reducing product reliability.

[0004] This utility model is based on the above-mentioned circumstances. Utility Model Content

[0005] This invention overcomes the shortcomings of the prior art and provides a high-brightness LED light source structure with good light output, high reliability, and good light emission effect.

[0006] This utility model is achieved through the following technical solution:

[0007] A high-brightness LED light source structure includes a substrate and a light-blocking ring connected to the substrate. A transparent protective layer is connected to the inner wall or end of the light-blocking ring. The transparent protective layer, the inner wall of the light-blocking ring, and the substrate together form a receiving cavity. Multiple LED chips are disposed in the receiving cavity. The LED chips are flip-chip connected to the substrate. The surface of the LED chips is coated with fluorine-containing phosphor or the receiving cavity is filled with a fluorine-containing phosphor layer. The fluorine-containing phosphor and the fluorine-containing phosphor layer are used to convert part of the light emitted by the LED chips into light of another color and mix it with the light emitted by the LED chips to form white light.

[0008] In the high-brightness LED light source structure described above, a conductive circuit is provided on the substrate, and the LED chip is connected to the conductive circuit.

[0009] As described above, in a high-brightness LED light source structure, the substrate is further provided with positive and negative pins for connecting the conductive circuit to the power supply.

[0010] In the high-brightness LED light source structure described above, the positive and negative leads are located outside the light-blocking ring.

[0011] In the high-brightness LED light source structure described above, the transparent protective layer is a transparent colloid.

[0012] In the high-brightness LED light source structure described above, the light-blocking ring is made of an opaque material.

[0013] In the high-brightness LED light source structure described above, the light-blocking ring is circular.

[0014] As described above, in a high-brightness LED light source structure, the substrate is rectangular, and the positive and negative leads are rotationally symmetrically located at a pair of corners of the substrate.

[0015] Compared with the prior art, the present invention has the following advantages:

[0016] This design utilizes flip-chip bonding of LED chips onto a substrate, eliminating the need for gold wire connections. This results in high stability and reliability while also improving heat dissipation compared to traditional conventionally mounted LED chips. The flip-chip structure reduces obstacles in the heat conduction path, allowing heat to be transferred more efficiently from the LED chip to the substrate, thereby improving heat dissipation efficiency and extending the LED's lifespan. The light-blocking ring and transparent protective layer work together to control light distribution, reduce unnecessary light loss, and ensure more uniform light distribution. Furthermore, fluorinated phosphors or a fluorinated phosphor layer filled within the housing cavity can more effectively convert blue light or other wavelengths to produce the desired white or colored light, further enhancing luminous efficacy and color consistency. The transparent protective layer not only acts as a seal, preventing moisture, dust, and other contaminants from the external environment from entering the housing cavity, but also provides physical protection against external impacts or vibrations to the LED chip, increasing product stability and reliability. Attached Figure Description

[0017] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings, wherein:

[0018] Figure 1 This is a schematic diagram of the structure of this utility model;

[0019] Figure 2 This is a cross-sectional schematic diagram of the present invention. Detailed Implementation

[0020] The present invention will be further described below with reference to the accompanying drawings:

[0021] like Figures 1 to 2The diagram illustrates a high-brightness LED light source structure, comprising a substrate 1 and a light-blocking ring 2 connected to the substrate 1. A transparent protective layer 3 is connected to the inner wall or end of the light-blocking ring 2. The transparent protective layer 3, the inner wall of the light-blocking ring 2, and the substrate 1 together form a receiving cavity 4. A plurality of LED chips 5 are disposed in the receiving cavity 4. The LED chips 5 are flip-chip connected to the substrate 1. The surface of the LED chips 5 is coated with fluorine-containing phosphor, or the receiving cavity 4 is filled with a fluorine-containing phosphor layer 6. The fluorine-containing phosphor and the fluorine-containing phosphor layer 6 are used to convert part of the light emitted by the LED chips 5 into light of another color and mix it with the light emitted by the LED chips 5 to form white light.

[0022] This design utilizes a flip-chip connection between the LED chip 5 and the substrate 1, eliminating the need for gold wire bonding. This results in high stability and reliability while also improving the heat dissipation issues of traditional conventionally mounted LED chips 5. The flip-chip structure reduces obstacles in the heat conduction path, allowing heat to be conducted more efficiently from the LED chip 5 to the substrate 1, thereby improving heat dissipation efficiency and extending the LED's lifespan. The light-blocking ring 2 and the transparent protective layer 3 work together to help control light distribution, reduce unnecessary light loss, and make the light distribution more uniform. Furthermore, the fluorinated phosphor or the fluorinated phosphor layer 6 filled in the housing cavity 4 can more effectively convert blue light or other wavelengths of light to produce the desired white or colored light, further improving luminous efficacy and color consistency. The transparent protective layer 3 not only acts as a seal to prevent moisture, dust, and other contaminants from the external environment from entering the housing cavity, but also provides physical protection against external impacts or vibrations to the LED chip 5, increasing the product's stability and reliability.

[0023] Specifically, a conductive circuit is provided on the substrate 1, and the LED chip 5 is connected to the conductive circuit. By directly connecting the LED chip 5 to the conductive circuit on the substrate 1, the traditional wire bonding step can be eliminated. This not only simplifies the overall structure but also avoids failures caused by wire breakage or poor contact, thus improving product reliability.

[0024] Furthermore, the substrate 1 is also provided with a positive pin 71 and a negative pin 72 for connecting the conductive circuit to the power supply, thus providing a direct and robust way to connect the LED chip 5 to the external power supply, simplifying the installation process and reducing the need for complex wiring. Power connection via dedicated pins ensures a more stable and reliable current path, avoiding electrical faults caused by looseness or poor contact. In addition, the pins are typically made of corrosion-resistant materials, enhancing long-term reliability. Standardized pin interfaces facilitate efficient assembly by automated production equipment and easy integration with automated testing equipment, improving production efficiency and reducing manufacturing costs.

[0025] The positive pin 71 and negative pin 72 are located outside the light-blocking ring 2, which increases the physical distance between the pins and the LED chip 5, thus providing better electrical isolation. This helps reduce electromagnetic interference and improves the system's anti-interference capability. The pins being away from the LED chip 5 reduces the possibility of heat conduction to the pins, avoiding connection reliability issues or safety hazards caused by excessive pin temperature. The external pins make power connection more intuitive and simple, allowing installers to quickly identify the positive and negative terminals for correct connection. Furthermore, the external pins are easier to access during maintenance or replacement, without requiring the disassembly of other components.

[0026] LED flip-chip technology is a semiconductor packaging technique that changes the way traditional LED chips are connected. In traditional LED packaging, the chip is usually mounted face up, with electrodes led out and connected to external circuits via gold wires. In contrast, flip-chip technology mounts the LED chip face down on a substrate 1, directly connecting and physically securing it to the substrate 1 via metal bumps or pads on the bottom of the chip.

[0027] In one embodiment, the LED chip 5 is a blue LED chip, and the fluorinated phosphor is YAG:Ce phosphor. Of course, the LED chip 5 can also be an LED chip of other colors, where the fluorinated phosphor converts part of the light emitted by the LED chip into another color and mixes it with the light emitted by the LED chip to form white light. Alternatively, the LED chip 5 can be composed of multiple colors of LED chips, where the fluorinated phosphor converts part of the light emitted by one or more colors of LED chips into other colors and mixes it with the light emitted by the multiple colors of LED chips to form white light.

[0028] In one embodiment, the transparent protective layer 3 is a transparent colloid, thereby minimizing the loss of light during transmission and ensuring that the light emitted by the LED chip 5 can be efficiently transmitted to the external environment, which helps to improve the overall light output efficiency and brightness.

[0029] The light-blocking ring 2 is made of an opaque material and completely blocks the light emitted by the internal LED chip 5, ensuring that all light propagates in the designed direction and avoiding unnecessary light loss and stray light impacting the surrounding environment. By preventing light leakage from unexpected directions, the opaque light-blocking ring 2 helps to concentrate and guide light, improving light utilization efficiency. This not only enhances lighting intensity but may also reduce the number of LEDs required, thereby reducing energy consumption and cost. The light-blocking ring 2 can be attached to the substrate 1 using adhesive or threaded fasteners or other connection methods. A transparent adhesive is attached to the inside or top of the light-blocking ring 2 using adhesive or other connection methods.

[0030] Furthermore, the light-blocking ring 2 is circular in shape. This effectively concentrates light in the central area, forming a well-defined light spot. The circular design helps achieve a more uniform light distribution, reducing the brightness difference between the edges and the center.

[0031] In one embodiment, the substrate 1 is rectangular, and the positive electrode pin 71 and negative electrode pin 72 are rotationally symmetrically located at opposite corners of the substrate 1. This maximizes the use of available space, providing more room for internal components, facilitating compact design, and supporting higher-density LED integration. The pins being located diagonally away from the center reduces the likelihood of heat conduction to the pins, preventing overheating that could affect connection reliability. Furthermore, this layout optimizes heat dissipation paths, promoting heat dissipation from the substrate. Larger pin spacing helps reduce electromagnetic interference and improves electromagnetic compatibility.

Claims

1. A high-brightness LED light source structure, characterized in that: The device includes a substrate (1) and a light-blocking ring (2) connected to the substrate (1). A transparent protective layer (3) is connected to the inner wall or end of the light-blocking ring (2). The transparent protective layer (3), the inner wall of the light-blocking ring (2), and the substrate (1) together form a receiving cavity (4). A plurality of LED chips (5) are disposed in the receiving cavity (4). The LED chips (5) are flip-chip connected to the substrate (1). The surface of the LED chips (5) is coated with fluorine phosphor or the receiving cavity (4) is filled with a fluorine phosphor layer (6). The fluorine phosphor and the fluorine phosphor layer (6) are used to convert part of the light emitted by the LED chips (5) into light of another color and mix it with the light emitted by the LED chips (5) to form white light.

2. The high-brightness LED light source structure according to claim 1, characterized in that: The substrate (1) is provided with a conductive circuit, and the LED chip (5) is connected to the conductive circuit.

3. The high-brightness LED light source structure according to claim 2, characterized in that: The substrate (1) is also provided with a positive pin (71) and a negative pin (72) for connecting the conductive circuit to the power supply.

4. The high-brightness LED light source structure according to claim 3, characterized in that: The positive electrode pin (71) and the negative electrode pin (72) are located on the outside of the light-blocking ring (2).

5. A high-brightness LED light source structure according to any one of claims 1-4, characterized in that: The transparent protective layer (3) is a transparent colloid.

6. A high-brightness LED light source structure according to any one of claims 1-4, characterized in that: The light-blocking ring (2) is made of an opaque material.

7. The high-brightness LED light source structure according to claim 6, characterized in that: The light-blocking ring (2) is circular.

8. The high-brightness LED light source structure according to claim 4, characterized in that: The substrate (1) is rectangular, and the positive electrode pin (71) and the negative electrode pin (72) are respectively arranged at a pair of corners of the substrate (1) in a rotationally symmetrical manner.

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