Wafer bearing mechanism

Abstract

The utility model relates to the technical field of semiconductor equipment, in particular to a wafer bearing mechanism, which comprises a plurality of bearing assemblies arranged at intervals along the circumference of a preset circle, a supporting block is arranged at one end, facing the center of the preset circle, of each bearing assembly, and the end, provided with the supporting block, of each bearing assembly is telescopic. The plurality of supporting blocks are matched to bear wafers of various sizes; the bearing assemblies are arranged on the two sides of the clamping assemblies, the ends, facing the preset circle center, of the clamping assemblies are provided with clamping parts, and the ends, provided with the clamping parts, of the clamping assemblies are telescopic so that the clamping parts can be matched with the supporting blocks to clamp wafers of various sizes. The wafer bearing mechanism provided by the utility model is at least suitable for clamping and fixing wafers with different sizes.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of semiconductor equipment, especially relates to a wafer bearing mechanism. BACKGROUND

[0002] The wafer bearing device is usually used for holding wafers so as to process or detect the wafers as the main structure in semiconductor processing equipment or detection equipment.

[0003] The current wafer bearing device usually has the following problems: complex structure, high cost and complex maintenance, the surface of the wafer cannot be exposed after the wafer is placed on the wafer bearing mechanism, affecting wafer detection; the wafer carried by the wafer bearing device may be offset relative to the wafer bearing device, and the wafer may also be offset relative to the target position in the process of transferring the wafer by the mechanical arm, so that process deviation is caused in the subsequent process, or detection deviation is caused in the detection process, affecting yield and detection accuracy; the wafer may be broken when clamped and fixed; the wafer bearing device corresponding to one processing equipment or one detection equipment can only carry one size of wafer, and the adaptability to different sizes of wafers is poor. SUMMARY

[0004] Therefore, the utility model aims at providing a wafer bearing mechanism, which is suitable for clamping and fixing wafers of different sizes.

[0005] To achieve the above-mentioned purpose, the technical scheme of the utility model is as follows:

[0006] The utility model provides a wafer bearing mechanism, which comprises: a plurality of bearing components arranged at intervals along the circumference of a preset circle, one end of the bearing component towards the center of the preset circle is provided with a supporting block, and the end of the bearing component with the supporting block is telescopic, so that the plurality of supporting blocks cooperate to carry wafers of multiple sizes; a clamping component, the bearing component is arranged on both sides of the clamping component, one end of the clamping component towards the center of the preset circle is provided with a clamping part, and the end of the clamping component with the clamping part is telescopic, so that the clamping part cooperates with the supporting block to clamp wafers of multiple sizes.

[0007] Further, the bearing component comprises a supporting block and a first driving unit, the supporting block is located at one end of the first driving unit towards the center of the preset circle, and the first driving unit can drive the supporting block to move along the radial direction of the preset circle, so that the plurality of supporting blocks cooperate to carry wafers of multiple sizes.

[0008] Further, the supporting block comprises a main body part and a bearing part connected with each other, the main body part is connected with the first driving unit, the bearing part is located at one end of the main body part away from the first driving unit, and the bearing part and the main body part form a stepped structure to realize the bearing and clamping of the wafer.

[0009] Further, the clamping assembly comprises a clamping part and a second driving unit, the clamping part is located at one end of the second driving unit facing the center of the preset circle, and the second driving unit can drive the clamping part to move along the radial direction of the preset circle, so that the clamping part can clamp wafers of various sizes.

[0010] Further, the clamping part is used to push the wafer to the target position, and the clamping part cooperates with the support block away from the clamping part to clamp and fix the wafer located at the target position; the length of the clamping part is adjustable in the radial direction of the preset circle, so that the clamping part can push the wafer to the target position.

[0011] Further, the clamping part comprises a third driving unit and a clamping unit, one end of the third driving unit is connected with the second driving unit, and the other end of the third driving unit is connected with the clamping unit, and the third driving unit can drive the clamping unit to move along the radial direction of the preset circle, so that the clamping unit pushes the wafer to the target position.

[0012] Further, the second driving unit comprises a pneumatic cylinder, and the third driving unit comprises a pneumatic cylinder.

[0013] Further, the third driving unit is connected with the clamping unit through a connecting piece, the connecting piece comprises a limiting connecting part, a sliding block, a guide rail and an elastic part, wherein the first end of the limiting connecting part is connected with the third driving unit, the end of the clamping unit facing the third driving unit is connected with the first end of the limiting connecting part through the elastic part, the second end of the limiting connecting part is bent towards the clamping unit to limit part of the clamping unit on the limiting connecting part, the guide rail is arranged on the limiting connecting part, and the sliding block is arranged on the clamping unit and connected with the guide rail.

[0014] Further, the elastic part comprises a spring.

[0015] Further, the wafer carrying mechanism further comprises a mounting plate, the mounting plate has a detection through hole penetrating through the mounting plate in the thickness direction, and the plurality of carrying assemblies and the clamping assembly are arranged on the mounting plate in a ring shape along the circumference of the detection through hole; when the wafer is located at the target position, the wafer faces the detection through hole.

[0016] Compared with the prior art, the present invention can achieve the following beneficial effects: In the wafer carrier mechanism provided by the present invention, multiple support blocks corresponding to multiple carrier components are used to carry wafers. One end of the carrier component with the support block is retractable. Thus, when carrying a smaller wafer, the ends of all carrier components with the support blocks extend synchronously, and the multiple support blocks cooperate to carry a smaller wafer. When carrying a larger wafer, the ends of all carrier components with the support blocks retract synchronously in the direction away from the preset circular center, and the multiple support blocks cooperate to carry a larger wafer. The clamping part of the clamping component is used to cooperate with the support block away from the clamping component to radially clamp and fix the wafer, so that the wafer is fixed in the target position and the position of the wafer relative to the wafer carrier mechanism is fixed. One end of the clamping component with the clamping part is retractable. Thus, the clamping component can cooperate with the carrier component to clamp wafers of different sizes, so that the wafer carrier mechanism can achieve clamping and fixing of wafers of various sizes. In addition, the wafer carrier mechanism provided by the present invention has a relatively simple structure, low installation cost, and low maintenance difficulty while having superior functions. Attached Figure Description

[0017] The accompanying drawings, which form part of this utility model, are used to provide a further understanding of the utility model. The illustrative embodiments of the utility model and their descriptions are used to explain the utility model and do not constitute an undue limitation of the utility model. In the drawings:

[0018] Figure 1 This is a top view of the wafer carrier mechanism described in this utility model;

[0019] Figure 2 This is a schematic diagram of the structure of the load-bearing component described in this utility model;

[0020] Figure 3 This is a schematic diagram of the clamping assembly described in this utility model;

[0021] Figure 4 This is a schematic diagram of the clamping part of the present invention from a first perspective;

[0022] Figure 5 This is a schematic diagram of the clamping part described in this utility model from a second perspective.

[0023] Explanation of reference numerals in the attached drawings: 100, bearing assembly; 101, support block; 110, clamping assembly; 111, clamping part; 10, mounting plate; 102, first drive unit; 121, main body; 120, bearing part; 112, second drive unit; 113, third drive unit; 114, clamping unit; 117, connector; 130, limiting connection part; 132, slider; 133, guide rail; 131, elastic part; 115, first connecting plate; 118, second connecting plate; 116, drive bearing plate. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and do not constitute a limitation thereof.

[0025] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0026] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0027] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0028] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0029] The wafer carrier mechanism includes: a plurality of carrier components 100 arranged at circumferential intervals along a preset circle, each carrier component 100 having a support block 101 at one end facing the center of the preset circle, and the end of the carrier component 100 having the support block 101 being retractable so that the plurality of support blocks 101 cooperate to carry wafers of various sizes; and a clamping component 110, with the carrier components 100 disposed on both sides of the clamping component 110, each clamping component 110 having a clamping part 111 at one end facing the center of the preset circle, and the end of the clamping component 110 having the clamping part 111 being retractable so that the clamping part 111 cooperates with the support block 101 to clamp wafers of various sizes.

[0030] In some examples, refer to Figure 1 The wafer carrier mechanism includes four carrier components 100, which cooperate to carry the wafer. The two carrier components 100 away from the clamping component 110 are also used to cooperate with the clamping component 110 to radially clamp and fix the wafer. Specifically, the clamping component 110 with one end of the clamping part 111 and the carrier component 100 with one end of the support block 101 are extended or retracted to a position that matches the wafer size. A robot or other wafer handling mechanism places the wafer on the wafer carrier mechanism. At this time, the clamping part 111 is not in contact with the wafer, and the wafer is carried by the four support blocks 101. After the wafer is placed on the support blocks 101, the clamping part 111 pushes the wafer to the target position and clamps and fixes the wafer in the target position with the two support blocks 101 away from the clamping part 111.

[0031] In some embodiments, the wafer carrier mechanism further includes a mounting plate 10 having a detection through hole extending through the mounting plate 10 in the thickness direction, and a plurality of carrier components 100 and clamping components 110 being arranged circumferentially on the mounting plate 10 along the detection through hole; when the wafer is in the target position, the wafer is directly facing the detection through hole.

[0032] After the wafer carrier mechanism provided by this utility model clamps and fixes the wafer, both surfaces of the wafer are exposed. The wafer carrier mechanism will not cause excessive obstruction to the surface of the wafer, thus enabling the processing or inspection of the wafer surface.

[0033] In some embodiments, the wafer carrier mechanism provided by this utility model can be applied to optical defect detection.

[0034] It should be noted that the preset circle involved in this utility model embodiment is a preset circle set according to the wafer size. This utility model embodiment does not limit the size of the preset circle, as long as it can ensure that the multiple carrier components 100 can carry the wafer.

[0035] In some embodiments, reference Figure 2 The support assembly 100 includes a support block 101 and a first driving unit 102. The support block 101 is located at the end of the first driving unit 102 facing the center of a preset circle, and the first driving unit 102 can drive the support block 101 to move radially along the preset circle, so that multiple support blocks 101 cooperate to support wafers of various sizes. In other words, the first driving unit 102 is used to realize the extension and retraction of the support assembly 100, thereby realizing the support of wafers of various sizes.

[0036] In some embodiments, the first drive unit 102 includes a cylinder, the free end of which is connected to the support block 101 to drive the support block 101 to move radially along a preset circle.

[0037] In some embodiments, reference Figure 2 The support block 101 includes a main body portion 121 and a support portion 120 connected to each other. The main body portion 121 is connected to the first driving unit 102, and the support portion 120 is located at the end of the main body portion 121 away from the first driving unit 102. The support portion 120 and the main body portion 121 form a stepped structure to realize the support and clamping of the wafer. When multiple support blocks 101 cooperate to support the wafer, the surface of the support portion 120 extending horizontally in the stepped structure is used to support the wafer; when multiple support blocks 101 cooperate with the clamping portion 111 to clamp the wafer, the side of the main body portion 121 extending vertically in the stepped structure is used to clamp the wafer.

[0038] In some embodiments, reference Figure 1 The clamping assembly 110 includes a clamping part 111 and a second driving unit 112. The clamping part 111 is located at one end of the second driving unit 112 facing the center of a preset circle, and the second driving unit 112 can drive the clamping part 111 to move radially along the preset circle so that the clamping part 111 can clamp wafers of various sizes.

[0039] In some embodiments, the clamping part 111 is used to push the wafer to the target position, and the clamping part 111 cooperates with the support block 101 away from the clamping part 111 to clamp and fix the wafer located at the target position. The clamping part 111 pushing the wafer to the target position can be achieved by the second driving unit 112.

[0040] In some embodiments, the clamping portion 111 is used to push the wafer to a target position, and the clamping portion 111 cooperates with the support block 101 located away from the clamping portion 111 to clamp and fix the wafer located at the target position; the length of the clamping portion 111 is adjustable in the radial direction along a preset circle so that the clamping portion 111 can push the wafer to the target position. That is, the second driving component is used to drive the clamping portion 111 to move so that the clamping component 110 can adapt to wafers of different sizes. In addition, the length of the clamping portion 111 itself is adjustable to push the wafer to the target position.

[0041] In some embodiments, reference Figure 3 The clamping part 111 includes a third driving unit 113 and a clamping unit 114. One end of the third driving unit 113 is connected to the second driving unit 112, and the other end of the third driving unit 113 is connected to the clamping unit 114. The third driving unit 113 can drive the clamping unit 114 to move radially along a preset circle, so that the clamping unit 114 pushes the wafer to the target position. That is, the second driving assembly is used to drive the clamping part 111 to move, so that the clamping assembly 110 can adapt to wafers of different sizes, and the second driving unit 112 drives the clamping part 111 to push the wafer to the target position.

[0042] In some embodiments, the second drive unit 112 includes a cylinder, and the third drive unit 113 includes a cylinder.

[0043] In some embodiments, reference Figure 3 The second drive unit 112 can be connected to the clamping part 111 through the first connecting plate 115 and the second connecting plate 118.

[0044] In some embodiments, the third drive unit 113 may be disposed on the drive support plate 116, the drive support plate 116 is connected to the second connecting plate 118, and the second connecting plate 118 is connected to the second drive unit 112 through the first connecting plate 115.

[0045] In some embodiments, reference Figure 4 and Figure 5The third drive unit 113 is connected to the clamping unit 114 via a connector 117. The connector 117 includes a limiting connection part 130, a slider 132, a guide rail 133, and an elastic part 131. The first end of the limiting connection part 130 is connected to the third drive unit 113. One end of the clamping unit 114 facing the third drive unit 113 is connected to the first end of the limiting connection part 130 via the elastic part 131. The second end of the limiting connection part 130 is bent toward the clamping unit 114 to limit part of the clamping unit 114 on the limiting connection part 130. The guide rail 133 is disposed on the limiting connection part 130, and the slider 132 is disposed on the clamping unit 114. The slider 132 is connected to the guide rail 133. The guide rail 133 and slider 132 are used to ensure that the third drive unit 113 pushes the clamping unit 114 to move radially along the preset circle, thus playing a guiding role. The second end of the limiting connection part 130 bends toward the clamping unit 114 to limit the clamping unit 114. The elastic part 131 makes the contact between the clamping unit 114 and the wafer elastic, which plays a buffering role during the clamping process, so that the clamping unit 114 can not only clamp the wafer, but also avoid the clamping unit 114 from generating overpressure on the wafer.

[0046] It should be noted that the clamping unit 114 may include a limiting part and a gripper connected to each other. The gripper is located at the end of the limiting part away from the third driving unit 113. The limiting part is limited on the limiting connection part 130. The gripper is used to push the wafer and clamp the wafer.

[0047] In some embodiments, the elastic part 131 includes a spring, a damper, or a pneumatic buffer. The present invention preferably uses a spring as the elastic part 131, which avoids the elastic part 131 occupying too much space and helps to reduce the weight of the connector 117 and the installation cost.

[0048] In some embodiments, the wafer carrier mechanism provided by this utility model is applicable to the processing and inspection of currently mainstream 8-inch and 12-inch wafers. In other embodiments, the wafer carrier mechanism provided by this utility model can also be applied to the processing and inspection of 4-inch, 6-inch, 8-inch, and 12-inch wafers.

[0049] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this utility model disclosure can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution disclosed in this utility model can be achieved, and this is not limited herein.

[0050] The specific embodiments described above do not constitute a limitation on the scope of protection of this utility model. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.

Claims

1. A wafer carrier mechanism, characterized in that, include: Multiple support components (100) are arranged at circumferential intervals along a preset circle. Each support component (100) has a support block (101) at one end facing the center of the preset circle. The end of the support component (100) with the support block (101) is retractable so that the multiple support blocks (101) can cooperate to support wafers of various sizes. A clamping assembly (110) is provided on both sides of the clamping assembly (110). The clamping assembly (110) has a clamping part (111) at one end facing the preset circular center. The clamping assembly (110) with the clamping part (111) is retractable so that the clamping part (111) cooperates with the support block (101) to clamp wafers of various sizes.

2. The wafer carrier mechanism according to claim 1, characterized in that, The support component (100) includes the support block (101) and the first driving unit (102). The support block (101) is located at one end of the first driving unit (102) facing the center of the preset circle, and the first driving unit (102) can drive the support block (101) to move radially along the preset circle so that multiple support blocks (101) can cooperate to support wafers of various sizes.

3. The wafer carrier mechanism according to claim 2, characterized in that, The support block (101) includes a main body (121) and a support part (120) connected to each other. The main body (121) is connected to the first driving unit (102). The support part (120) is located at the end of the main body (121) away from the first driving unit (102). The support part (120) and the main body (121) form a stepped structure to realize the support and clamping of the wafer.

4. The wafer carrier mechanism according to claim 1, characterized in that, The clamping assembly (110) includes the clamping part (111) and the second driving unit (112). The clamping part (111) is located at one end of the second driving unit (112) facing the center of the preset circle, and the second driving unit (112) can drive the clamping part (111) to move radially along the preset circle so that the clamping part (111) can clamp wafers of various sizes.

5. The wafer carrier mechanism according to claim 4, characterized in that, The clamping part (111) is used to push the wafer to the target position, and the clamping part (111) cooperates with the support block (101) away from the clamping part (111) to clamp and fix the wafer located at the target position; The length of the clamping part (111) is adjustable in the radial direction along the preset circle so that the clamping part (111) can push the wafer to the target position.

6. The wafer carrier mechanism according to claim 5, characterized in that, The clamping part (111) includes a third driving unit (113) and a clamping unit (114). One end of the third driving unit (113) is connected to the second driving unit (112), and the other end of the third driving unit (113) is connected to the clamping unit (114). The third driving unit (113) can drive the clamping unit (114) to move radially along the preset circle so that the clamping unit (114) pushes the wafer to the target position.

7. The wafer carrier mechanism according to claim 6, characterized in that, The second drive unit (112) includes a cylinder, and the third drive unit (113) includes a cylinder.

8. The wafer carrier mechanism according to claim 6, characterized in that, The third driving unit (113) is connected to the clamping unit (114) via a connector (117). The connector (117) includes a limiting connection part (130), a slider (132), a guide rail (133), and an elastic part (131). The first end of the limiting connection part (130) is connected to the third driving unit (113), and the end of the clamping unit (114) facing the third driving unit (113) is connected to the clamping unit (114) via the elastic part (132). 31) The first end of the limiting connection part (130) is connected to the second end of the limiting connection part (130) and bent toward the clamping unit (114) to limit part of the clamping unit (114) on the limiting connection part (130). The guide rail (133) is disposed on the limiting connection part (130), and the slider (132) is disposed on the clamping unit (114). The slider (132) is connected to the guide rail (133).

9. The wafer carrier mechanism according to claim 8, characterized in that, The elastic part (131) includes a spring.

10. The wafer carrier mechanism according to claim 1, characterized in that, The wafer carrier mechanism further includes a mounting plate (10), the mounting plate (10) having a detection through hole that penetrates the mounting plate (10) along the thickness direction, and a plurality of the carrier components (100) and the clamping components (110) being arranged circumferentially on the mounting plate (10) along the detection through hole; When the wafer is located at the target position, the wafer is directly facing the detection via.

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