Vacuum chuck and processing equipment

Abstract

The utility model belongs to the technical field of semiconductor equipment, and discloses a vacuum chuck and processing equipment. The vacuum chuck is used for adsorbing a silicon ring and specifically comprises a chuck body and positioning rings, the peripheral surfaces of the positioning rings are matched with the inner wall of the silicon ring for positioning, the chuck body is provided with adsorption areas corresponding to the outer sides of the positioning rings, the adsorption areas are used for adsorbing the silicon ring, the outer diameters of different positioning rings are different, one positioning ring can be selected to be connected with the chuck body, and the other positioning ring can be selected to be connected with the chuck body. Therefore, the area of the adsorption area is changed, and the silicon rings with different inner diameters can be positioned.

Description

TECHNICAL FIELD

[0001] The utility model relates to semiconductor equipment technical field especially, relates to a vacuum chuck and processing equipment. BACKGROUND

[0002] In the semiconductor processing and manufacturing process, wafers are usually fixed and transferred by vacuum adsorption technology. The ceramic chuck has the characteristics of small aperture and high porosity, can form uniform and stable adsorption force, is a common vacuum adsorption platform, and is widely used in wafer grinding, polishing, uniform glue, testing, and back reduction, scribing, cleaning, handling and other processes. When fixing the wafer, the gas in the internal cavity of the ceramic chuck is extracted by the vacuum device, so as to form a negative pressure between the wafer and the ceramic chuck, and then the wafer is fixed on the adsorption surface of the ceramic chuck.

[0003] As shown in Figure 1 and Figure 2 , the existing ceramic chuck can only adsorb the wafer of conventional size, which is usually made of microporous ceramic 11, ceramic base 12 and microporous ceramic 13 high temperature sintering, and then the microporous ceramic 11 realizes the adsorption of wafers of different sizes by the microporous ceramic 13 as the isolation ring. However, the microporous ceramic 13 and the microporous ceramic 11 are in the same plane, and the silicon ring 41 is used as the base material of the semiconductor chip, and the shape is ring-shaped. The existing ceramic chuck cannot accurately position and adsorb the silicon ring 41, and in addition, the existing ceramic chuck can only adsorb a certain size of workpiece, and the compatibility is low, which leads to low work efficiency.

[0004] Therefore, a vacuum chuck is needed to solve the above problems. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a vacuum chuck and processing equipment capable of adsorbing silicon rings of different sizes.

[0006] To achieve this purpose, the utility model adopts the following technical scheme:

[0007] A vacuum chuck for adsorbing a silicon ring, the vacuum chuck comprising:

[0008] A chuck body and a positioning ring, the positioning ring is detachably connected with the chuck body, the outer circumferential surface of the positioning ring is used for cooperating with the inner wall of the silicon ring to position, the chuck body is provided with an adsorption area corresponding to the outside of the positioning ring, and the adsorption area is used for adsorbing the silicon ring.

[0009] The positioning ring is provided with a plurality of positioning rings, the outer diameters of different positioning rings are different, and a plurality of positioning rings are connected with the chuck body alternatively to change the area of the adsorption area.

[0010] Preferably, the chuck body is provided with a mounting groove, and the positioning ring is provided with a mounting boss which is arranged in the mounting groove.

[0011] Preferably, the positioning ring is connected with the chuck body by a fastener, or the positioning ring is magnetically connected with the chuck body.

[0012] Preferably, the adsorption area is provided with a plurality of adsorption holes, at least part of the adsorption holes gradually increase in diameter along the radial direction of the chuck body, and / or the distribution density of the adsorption holes gradually increases along the radial direction of the chuck body.

[0013] Preferably, the chuck body comprises an upper base, a lower base and a porous disc, the positioning ring and the porous disc are connected with the upper base, the adsorption area is arranged on the porous disc, and the lower base is arranged on the side of the upper base away from the positioning ring and the porous disc.

[0014] Preferably, the chuck body is provided with a drainage area for draining the cooling water accumulated in the silicon ring, the upper base is provided with a drainage hole corresponding to the drainage area, and the drainage hole is located on the inner side of the upper base corresponding to the positioning ring.

[0015] Preferably, the lower base is provided with a drainage channel communicated with the drainage hole.

[0016] Preferably, the chuck body is further provided with a cooling water tank, the cooling water tank is arranged on the side of the lower base close to the upper base to cool the upper base and the porous disc, and / or the cooling water tank is arranged on the side of the upper base close to the porous disc to cool the porous disc.

[0017] Preferably, the chuck body is arranged on a mounting platform, and the lower surface of the chuck body is provided with a sealing groove for mounting a sealing ring to realize the sealing fit of the chuck body and the mounting platform.

[0018] A processing equipment comprises a processing device and the vacuum chuck, and the processing device is used for grinding the surface of the silicon ring adsorbed by the vacuum chuck.

[0019] The processing equipment has the following beneficial effects:

[0020] This invention provides a vacuum suction cup and a processing device. The processing device includes a processing unit and a vacuum suction cup. The vacuum suction cup is used to adsorb silicon rings, and the processing unit is used to perform grinding, thinning, and other processing on the surface of the silicon ring adsorbed by the vacuum suction cup. The vacuum suction cup includes a suction cup body and a positioning ring. The positioning ring is detachably connected to the suction cup body, and its outer circumferential surface is used to position the inner wall of the silicon ring. The suction cup body has an adsorption area corresponding to the outer side of the positioning ring for adsorbing the silicon ring. That is, when the suction cup body adsorbs the silicon ring, the silicon ring is located on the adsorption area, and the inner wall of the silicon ring abuts against the outer wall of the positioning ring. Multiple positioning rings are provided, and different positioning rings have different outer diameters. Operators can replace positioning rings with different outer diameters to connect to the suction cup body to change the area of ​​the adsorption area, thereby achieving the positioning and adsorption of silicon rings with different inner diameters, improving the versatility and compatibility of the vacuum suction cup. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of a ceramic suction cup provided by existing technology;

[0022] Figure 2 This is a schematic diagram of the structure of a ceramic chuck adsorbing a silicon ring, provided by existing technology;

[0023] Figure 3 This is a schematic diagram of the structure of the vacuum suction cup provided by this utility model;

[0024] Figure 4 This is a schematic diagram of the structure of the vacuum suction cup adsorbing the silicon ring provided by this utility model;

[0025] Figure 5 This is a partial schematic diagram of the drainage area of ​​the vacuum suction cup provided by this utility model;

[0026] Figure 6 This is an enlarged view of the drainage channel of the vacuum suction cup provided by this utility model;

[0027] Figure 7 This is a partial schematic diagram of the vacuum channel of the vacuum suction cup provided by this utility model;

[0028] Figure 8 This is a partial schematic diagram of the cooling water tank and water inlet of the vacuum suction cup provided by this utility model;

[0029] Figure 9 This is a partial schematic diagram of the cooling water tank and water outlet of the vacuum suction cup provided by this utility model;

[0030] Figure 10 This is a partial schematic diagram of the sealing groove of the vacuum suction cup provided by this utility model.

[0031] Figure 1 and Figure 2 middle:

[0032] 11, microporous ceramic; 12, ceramic base; 13, microporous gas permeable ceramic; 41, silicon ring.

[0033] Figures 3-10 In the description of the present application, unless otherwise explicitly specified and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0034] 31, positioning ring; 32, porous disc; 34, upper base; 33, lower base; 35, drain plug; 341, drain hole; 342, vacuum groove; 343, first vacuum hole; 331, drain channel; 332, second vacuum hole; 333, cooling water groove; 334, water inlet hole; 335, connecting hole; 336, receiving groove; 337, sealing groove; 41, silicon ring; 42, fastener. DETAILED DESCRIPTION

[0035] The present application will be further described in detail below in conjunction with the drawings and examples. It can be understood that the specific examples described herein are only used to explain the present application, and not to limit the present application. In addition, it should be noted that, in order to facilitate the description, only the part related to the present application is shown in the drawings, not all the structures.

[0036] In the description of the present application, unless otherwise explicitly specified and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0037] In the present application, unless otherwise explicitly specified and limited, the first feature "on" or "under" the second feature can include the direct contact of the first and second features, or it can include the contact of the first and second features through another feature between them. Moreover, the first feature "on", "above" and "above" the second feature includes the first feature directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature includes the first feature directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0038] In the description of the present embodiment, the terms "upper", "lower", "right", and the like, orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second" are only used to distinguish in the description, and have no special meaning.

[0039] The utility model provides a kind of vacuum chuck and processing equipment, processing equipment includes processing device and vacuum chuck, vacuum chuck is used to adsorb silicon ring 41, processing device is used to the surface of silicon ring 41 adsorbed by vacuum chuck is ground and thinned etc. Figure 3 And Figure 4 The vacuum chuck includes a chuck body and a positioning ring 31, the chuck body is detachably connected with the positioning ring 31, when the silicon ring 41 is placed on the vacuum chuck, the outer periphery of the positioning ring 31 cooperates with the inner wall of the silicon ring 41 to position, at the same time, the silicon ring 41 is adsorbed and fixed by the adsorption area, realizing the positioning of the silicon ring 41, the positioning ring 31 is provided with a plurality of, different positioning rings 31 can be connected with the chuck body, and the outer diameters of different positioning rings 31 are different, so that the chuck body can be selectively connected, solving the problem that the existing chuck cannot accurately position the silicon ring 41, and different outer diameter positioning rings 31 can be replaced to be connected with the chuck body to change the area of the adsorption area, realizing the positioning of the silicon ring 41 with different inner diameters.

[0040] The chuck body is provided with a drainage area corresponding to the inner side of the positioning ring 31 and an adsorption area corresponding to the outer side of the positioning ring 31, that is, the drainage area, the positioning ring 31 and the adsorption area are sequentially arranged outward from the center of the chuck body. When the silicon ring 41 is processed, the drainage area is located inside the silicon ring 41, so that the cooling water accumulated in the silicon ring 41 can be drained; in addition, the chuck body is provided with a drainage area, so that the cooling water accumulated in the silicon ring 41 can be drained from the drainage area, avoiding the accumulation of cooling water with grinding particles in the silicon ring 41, which affects the surface processing quality of the silicon ring 41; in addition, the chuck body is also provided with a cooling water tank 333, and the cooling medium in the cooling water tank 333 can cool the chuck body 32, avoiding the thermal deformation of the chuck after multiple adsorption operations due to heat accumulation.

[0041] Further, the chuck body is also provided with a mounting groove for mounting the positioning ring 31, and the bottom of the positioning ring 31 is provided with a mounting boss corresponding thereto, which is arranged in the mounting groove, so as to accurately mount the positioning ring 31 and the chuck body. Specifically, when the silicon ring 41 is positioned, a Cartesian rectangular coordinate system can be established on the upper surface of the chuck body, and the positioning ring 31 positions the silicon ring 41 in the X-axis direction and the Y-axis direction.

[0042] In addition, in order to ensure the stability of the connection between the positioning ring 31 and the suction cup body, the positioning ring 31 can be installed on the suction cup body by using a fastener 42, which can be a screw. Of course, in other embodiments, the positioning ring 31 can also be installed on the suction cup body by using a magnetic attraction method. Specifically, the suction cup body is made of steel, and the material of the positioning ring 31 is a magnet.

[0043] With reference to Figures 5-10 The vacuum suction cup includes an upper base body 34, a lower base body 33, and a porous disc 32. The positioning ring 31 and the porous disc 32 are connected with the upper base body 34. The suction area is arranged on the porous disc 32, and the porous disc 32 is provided with suction holes for suctioning the silicon ring 41. The lower base body 33 is arranged on the side away from the positioning ring 31 and the porous disc 32. The upper base body 34 is provided with a drainage hole 341, which is arranged corresponding to the drainage area. The lower base body 33 is provided with a drainage channel 331 communicating with the drainage hole 341. When the silicon ring 41 is processed, in order to avoid the influence of the high temperature of the surface of the silicon ring 41 on the processing quality, the silicon ring 41 needs to be watered to cool down. The cooling water will then gather in the silicon ring 41. The suction cup body is provided with a drainage area, so that the cooling water gathered in the silicon ring 41 first passes through the drainage hole 341 on the upper base body 34, and then passes through the drainage channel 331 on the lower base body 33 to be discharged outside the vacuum suction cup. Specifically, the lower base body 33 is provided with a receiving groove 336. One end of the drainage channel 331 communicates with the groove bottom of the receiving groove 336, and the other end is arranged on the outer side wall of the lower base body 33. The cooling water enters the receiving groove 336 in the lower base body 33 through the drainage hole 341 of the upper base body 34, then enters the drainage channel 331, and finally is discharged from the outer side wall of the lower base body 33. Preferably, one end of the drainage channel 331 communicates with the circumferential surface close to the groove wall of the groove bottom of the receiving groove 336. The groove bottom of the receiving groove 336 is an inclined wall and the height decreases from the center to the circumference. Thus, the cooling water entering the receiving groove 336 flows to the drainage channel 331 under the action of gravity on the inclined wall, so as to quickly remove the cooling water in the receiving groove 336 in time and avoid the accumulation of cooling water in the receiving groove 336.

[0044] In order to realize the adsorption and separation of the silicon ring 41, the vacuum channel is arranged on the suction cup body, which can be in negative pressure to make the vacuum suction cup adsorb the silicon ring 41, or in positive pressure to separate the silicon ring 41. The vacuum groove 342 and the first vacuum hole 343 are arranged on the upper base 34, the adsorption holes on the porous disc 32, the vacuum groove 342 and the first vacuum hole 343 are communicated, the second vacuum hole 332 is arranged on the lower base 33, the first vacuum hole 343 and the second vacuum hole 332 are communicated, that is, the adsorption holes, the vacuum groove 342, the first vacuum hole 343 and the second vacuum hole 332 jointly constitute the vacuum channel. Optionally, the upper base 34, the lower base 33 and the porous disc 32 are sintered at high temperature to form the suction cup body, so as to avoid vacuum leakage and thus adsorption failure. Further, the vacuum groove 342 is arranged in a vortex shape on the upper surface of the upper base 34, the first vacuum hole 343 penetrates the upper base 34 along the axis direction of the upper base 34 and is communicated with the vacuum groove 342, and the second vacuum hole 332 penetrates the lower base 33 along the axis direction of the lower base 33 and is communicated with the first vacuum hole 343.

[0045] Further, when the suction cup body adsorbs the silicon ring 41, the second vacuum hole 332 can be circumscribed by the vacuum generating device to form negative pressure in the vacuum channel, so that the silicon ring 41 is tightly adsorbed on the porous disc 32. When the silicon ring 41 needs to be separated from the suction cup body after processing, cleaning medium can be introduced into the second vacuum hole 332 to form positive pressure in the vacuum channel, so that the silicon ring 41 can be separated from the porous disc 32, and the cleaning medium can clean the vacuum channel and the porous disc 32. Of course, in other embodiments, the vacuum groove 342 can also have a plurality of ring-shaped arrangements on the upper surface of the upper base 34, and the plurality of ring-shaped grooves are arranged around the same center. Correspondingly, the first vacuum hole 343 and the second vacuum hole 332 are also arranged in plurality and one-to-one correspondence. The cleaning medium is preferably a two-fluid, specifically a mixture of compressed gas and cleaning liquid.

[0046] In addition, a plurality of adsorption holes are arranged on the porous disc 32, at least part of the adsorption holes gradually increase in diameter radially outward of the porous disc 32, and / or the distribution density of the plurality of adsorption holes gradually increases radially outward of the porous disc 32. This arrangement can ensure that the suction force of the outer side of the porous disc 32 is greater than that of the inner side, thereby preventing deformation of the outer side of the porous disc 32 due to excessive stress.

[0047] The cooling channel further comprises a water inlet hole 334 and a water outlet, the water inlet hole 334 and the water outlet are in communication with the cooling water groove 333, the water inlet hole 334 is connected with a cooling device, the cooling medium enters the cooling water groove 333 from the water inlet hole 334, carries away the heat of the suction disc body in the processing process, and then is discharged outside the suction disc body from the water outlet. Further, the cooling water groove 333 is arranged on one side of the lower base body 33 close to the upper base body 34, so as to cool the upper base body 34 and the porous disc 32, and / or is arranged on one side of the upper base body 34 close to the porous disc 32, so as to directly cool the porous disc. The cooling water groove 333 is arranged in a vortex shape on the upper surface of the lower base body 33, the water inlet hole 334 penetrates the lower base body 33 along the axis direction of the lower base body 33 and is in communication with the cooling water groove 333, and the water outlet is arranged on the outer wall of the lower base body 33. Of course, in other embodiments, the cooling water groove 333 can also be multiple and arranged in a ring shape on the upper surface of the lower base body 33, and the multiple ring-shaped grooves are arranged around the same center, and correspondingly, the water inlet hole 334 and the water outlet are also multiple and one-to-one corresponding.

[0048] With reference to Figure 9 , the water outlet can be provided with a drain plug 35, the surface of the drain plug 35 is threaded, and when the cooling medium is discharged from the water outlet, it is discharged through the threaded gap on the surface of the drain plug 35, thereby slowing down the flow rate of the cooling medium, so that the cooling medium can fully carry away the heat in the suction disc body.

[0049] It can be understood that the vacuum channel, the drainage channel 331 and the cooling channel in the utility model are three independent channels, and the three channels are not in communication with each other.

[0050] With reference to Figure 10 , the suction disc body can be arranged on the mounting platform, so that the subsequent processing device can stably process the silicon ring 41, and specifically, the lower surface of the lower base body 33 is provided with a sealing groove 337, the sealing groove 337 is used for installing a sealing ring to realize the sealing fit of the suction disc body and the mounting platform. Figure 3 , the lower base body 33 is further provided with a connecting hole 335, and a worker can fix the entire vacuum suction disc on the mounting platform by penetrating the connecting hole 335 with a connecting piece, so as to ensure the mounting stability of the vacuum suction disc.

[0051] Obviously, the above embodiments of the present application are merely examples for clearly illustrating the present application, and are not intended to limit the implementation modes of the present application. For those skilled in the art, various obvious changes, re-adjustments and replacements can be made without departing from the protection scope of the present application. Here, it is not necessary and also impossible to enumerate all the implementation modes. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application claim.

Claims

1. A vacuum chuck, characterized by The vacuum chuck comprises: a chuck body and a positioning ring (31) detachably connected with the chuck body, an outer peripheral surface of the positioning ring (31) being used to cooperate with an inner wall of the silicon ring (41) for positioning, the chuck body being provided with an adsorption area outside the positioning ring (31), the adsorption area being used to adsorb the silicon ring (41); and the chuck body being provided with a drainage area inside the positioning ring (31). A plurality of positioning rings (31) are provided, different positioning rings (31) have different outer diameters, and a plurality of positioning rings (31) are selectively connected with the chuck body to change the area of the adsorption area.

2. The vacuum chuck according to claim 1, characterized in that The chuck body is provided with a mounting groove, and the positioning ring (31) is provided with a mounting boss, which is arranged in the mounting groove.

3. The vacuum chuck according to claim 1, characterized in that The positioning ring (31) is connected with the chuck body by a fastener (42), or the positioning ring (31) is magnetically connected with the chuck body.

4. The vacuum chuck of claim 1, wherein The adsorption area is provided with a plurality of adsorption holes, at least part of the adsorption holes gradually increase in hole diameter along the radial direction of the chuck body outward, and / or the distribution density of the plurality of adsorption holes gradually increases along the radial direction of the chuck body outward.

5. The vacuum chuck according to any of claims 1 to 4, characterized in that The chuck body comprises an upper base body (34), a lower base body (33) and a porous disc (32), the positioning ring (31) and the porous disc (32) are connected with the upper base body (34), the adsorption area is arranged on the porous disc (32), and the lower base body (33) is arranged on a side of the upper base body (34) away from the positioning ring (31) and the porous disc (32).

6. The vacuum chuck of claim 5, wherein The chuck body is provided with a drainage area for draining cooling water accumulated in the silicon ring (41), the upper base body (34) is provided with a drainage hole (341) corresponding to the drainage area, and the drainage hole (341) is located on an inner side of the upper base body (34) corresponding to the positioning ring (31).

7. The vacuum chuck according to claim 6, characterized in that The lower base body (33) is provided with a drainage channel (331) in communication with the drainage hole (341).

8. The vacuum chuck of claim 5, wherein, The chuck body is further provided with a cooling water tank (333), the cooling water tank (333) is arranged on a side of the lower base body (33) close to the upper base body (34) to cool the upper base body (34) and the porous disc (32); and / or the cooling water tank (333) is arranged on a side of the upper base body (34) close to the porous disc (32) to cool the porous disc (32).

9. The vacuum chuck according to any of claims 1-4, characterized in that The chuck body is arranged on a mounting platform, a lower surface of the chuck body is provided with a sealing groove (337), and the sealing groove (337) is used to mount a sealing ring to realize sealed fitting of the chuck body and the mounting platform.

10. A processing apparatus characterized by comprising: The machining device is used for grinding the surface of the silicon ring (41) adsorbed by the vacuum chuck.

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