Ultrahigh-power SMD (Surface Mount Device) diode

Abstract

The utility model relates to the technical field of surface-mounted diodes, in particular to an ultra-high power surface-mounted diode, which comprises an epoxy plastic package shell, at least two layers of chips are wrapped in the epoxy plastic package shell, the two layers of chips are stacked, and the upper parts and the lower parts of the two layers of chips are respectively connected with copper pins. The two copper pins extend to the outside of the epoxy plastic package shell respectively, and heat dissipation pieces wrapping the top and the bottom of the epoxy plastic package shell are further arranged on the upper portions and the lower portions of the two layers of chips; according to the ultra-high power surface-mounted diode, at least two layers of chips are arranged and superposed, so that the ultra-high power surface-mounted diode not only has the characteristic of high voltage resistance, but also reduces the transverse occupied area of the surface-mounted diode, and one end of each copper pin is bent and faces the bottom direction of the epoxy plastic package shell, so that the welding point positions are more dense, and the volume of a circuit board is further reduced; the surface-mounted diode adapts to the development trend of product miniaturization, and meanwhile, the performance of the surface-mounted diode is more stable, so that the market competitiveness is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to patch diode technical field, concretely is a kind of ultrahigh power patch diode. BACKGROUND

[0002] Ordinary type ultrahigh power diode belongs to a kind of semiconductor rectifier, is widely used in various high-frequency power supply, automobile electronics, computer display and negative ion generator and other equipment, its output current is from 20 milliampere to 1000 milliampere classification, and transient pulse power is 600W, 1000W, 3000W, 5000W etc. according to chip specification different category.But current product often adopts axial type package, element occupies larger space, with the development trend of product miniaturization, it is urgent to design a kind of higher 8000W high power patch diode. SUMMARY

[0003] In view of the deficiencies of prior art, the utility model provides an ultrahigh power patch diode, solve the technical problem that the space of existing patch diode is occupied big.

[0004] To solve the above technical problems, the utility model provides the following technical scheme: an ultrahigh power patch diode, including epoxy plastic sealing shell, the epoxy plastic sealing shell is covered at least two layers of chips, and two layers of chips are stacked, and the upper and lower parts of two layers of chips are connected with copper pin respectively, two copper pins extend to the outside of epoxy plastic sealing shell respectively, and the upper and lower parts of two layers of chips are also provided with the heat sink that covers the top and bottom of epoxy plastic sealing shell.

[0005] Preferably, the bottom of epoxy plastic sealing shell is provided with the supporting leg that protrudes downward at four corners.

[0006] Preferably, the end of copper pin at the outside of epoxy plastic sealing shell is bent and towards the bottom direction of epoxy plastic sealing shell.

[0007] Preferably, the heat sink includes the heat conduction sheet that is attached to the surface of chip, and the heat conduction sheet is provided with the avoiding slot for the connection of chip and copper pin.

[0008] Preferably, the end surface of heat conduction sheet is also provided with the cooling fin.

[0009] Preferably, the outer edge of opposite end surface of two layers of chips is provided with the positioning slot, and chip is embedded on positioning member through positioning slot, and positioning member is covered in epoxy plastic sealing shell.

[0010] By the above technical scheme, the utility model provides an ultrahigh power patch diode, at least has the following beneficial effects:

[0011] 1. This ultra-high power surface mount diode, by setting at least two layers of chips and stacking them, not only has the characteristics of high voltage resistance, but also reduces the lateral area occupied by the surface mount diode. Furthermore, one end of the copper lead is bent and faces the bottom of the epoxy plastic encapsulation shell, making the solder points more dense, thereby further reducing the size of the circuit board and adapting to the development trend of product miniaturization. At the same time, it makes the performance of the surface mount diode more stable, thereby improving its market competitiveness.

[0012] 2. This ultra-high power surface mount diode, by setting up a heat sink, greatly increases the heat generated during use due to the use of multi-layer chips. The heat sink conducts the heat generated by the chip during operation to the outside, which facilitates heat exchange between the chip and the outside air to achieve a good heat dissipation effect.

[0013] 3. This ultra-high power surface mount diode, by setting up support feet, avoids stress concentration on the copper pins when encountering external impacts, as the support feet are in direct contact with the circuit board. This prevents the copper pins from falling off or breaking due to force. At the same time, the support feet raise the bottom of the epoxy plastic encapsulation shell by a certain space, which facilitates air passage and heat exchange with the heat sink at the bottom, further improving the heat dissipation effect.

[0014] 4. This ultra-high power surface mount diode, by setting positioning components, can ensure accurate docking between multi-layer chips and reduce deviations when connecting multi-layer chips. Attached Figure Description

[0015] The accompanying drawings, which are included to provide a further understanding of the present invention, form part of this application:

[0016] Figure 1 This is a three-dimensional structural diagram of the entire utility model;

[0017] Figure 2 This is a schematic diagram of the overall bottom structure of this utility model;

[0018] Figure 3 This is a cross-sectional view of the present invention from the front.

[0019] Figure 4 This is a schematic diagram of the structure of the heat sink of this utility model;

[0020] Figure 5 This is a schematic diagram of the disassembled chip and positioning component of this utility model;

[0021] Figure label:

[0022] 1. Epoxy encapsulated housing; 101. Support foot; 2. Chip; 201. Positioning groove; 3. Copper pin; 4. Heat sink; 401. Thermal pad; 4011. Clearance groove; 402. Heat sink; 5. Positioning component. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] A surface mount diode (SMD) is a type of diode manufactured using surface mount technology. These diodes are typically characterized by their miniaturization, portability, and high integration, making them suitable for the design requirements of modern electronic components. They are commonly used in the rectifier sections of DC power supplies and for reverse voltage protection, such as in transient voltage suppressor (TVS) diodes.

[0025] Due to the large space requirement of existing technologies, please refer to... Figures 1-5 This utility model provides an ultra-high power surface mount diode, which stacks two layers of chips 2. This not only provides high voltage resistance but also reduces the lateral area occupied by the surface mount diode. Furthermore, one end of the copper lead 3 is bent and faces the bottom of the epoxy encapsulation shell 1, making the solder joints more densely packed, thereby further reducing the size of the circuit board and adapting to the trend of product miniaturization. It has the advantage of small footprint. The surface mount diode includes an epoxy encapsulation shell 1, within which at least two layers of chips 2 are encapsulated and stacked. The upper and lower parts of the two layers of chips 2 are respectively connected to copper leads 3, which extend to the outside of the epoxy encapsulation shell 1. Heat sinks 4 are also provided on the upper and lower parts of the two layers of chips 2, covering the top and bottom of the epoxy encapsulation shell 1. The epoxy encapsulation shell 1 protects the chips 2 and other components, while the copper leads 3 are used to connect to solder joints on the circuit board. Finally, the heat sink 4 can quickly dissipate the heat generated by the chips 2 during operation, achieving effective heat dissipation.

[0026] Since the existing epoxy encapsulation shell 1 does not contact the circuit board and is only connected and fixed to the circuit board through copper pins 3, the copper pins 3 will be subjected to force and may fall off or break when impacted. To address this issue, downward protruding support feet 101 are provided at the four corners of the bottom of the epoxy encapsulation shell 1. When encountering external impact, since the support feet 101 are in direct contact with the circuit board, stress concentration at the copper pins 3 can be avoided, thus preventing the copper pins 3 from falling off or breaking. At the same time, the support feet 101 raise the bottom of the epoxy encapsulation shell 1 by a certain amount of space, thereby facilitating air passage and heat exchange with the heat sink 4 at the bottom, further improving the heat dissipation effect.

[0027] Since the copper leads 3 of existing surface mount diodes all extend outwards, the distance between the two solder joints connected to the copper leads 3 is relatively large, resulting in fewer solder joint positions on a circuit board of the same area. To address this issue, the end of the copper lead 3 outside the epoxy encapsulation shell 1 is bent and faces the bottom of the epoxy encapsulation shell 1. Because one end of the copper lead 3 is bent and faces the bottom of the epoxy encapsulation shell 1, the solder joints can be made more dense, thereby further reducing the size of the circuit board and adapting to the trend of product miniaturization.

[0028] Due to the use of multi-layered chips, the heat generated during use is significantly increased. For details regarding this issue, please refer to [link / reference needed]. Figure 4 The heat sink 4 includes a heat-conducting sheet 401 that is attached to the surface of the chip 2. The heat-conducting sheet 401 is provided with a clearance groove 4011 for connecting the chip 2 and the copper pin 3. The heat-conducting sheet 401 is used to conduct the heat generated by the chip 2 during operation to the outside, which facilitates heat exchange between the chip 2 and the outside air to achieve a good heat dissipation effect.

[0029] Furthermore, to improve heat dissipation, a heat sink 402 is provided on the end face of the heat-conducting plate 401; the heat sink 402 can increase the heat dissipation area of ​​the heat-conducting plate 401, thereby accelerating heat exchange.

[0030] Since multi-layer chips 2 are used, it is necessary to ensure that the connection between the multi-layer chips 2 is aligned during production. In order to improve product quality, positioning grooves 201 are provided at the outer edges of the opposite end faces of the two layers of chips 2, and the chips 2 are embedded in the positioning component 5 through the positioning grooves 201. The positioning component 5 is covered in the epoxy plastic encapsulation shell 1. The positioning component 5 is used to enable the multi-layer chips 2 to have a positioning function when connected, ensuring accurate docking between the multi-layer chips 2 and reducing the deviation when connecting the multi-layer chips 2.

[0031] It should be noted that the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An ultra-high power surface mount diode, comprising an epoxy encapsulation shell (1), characterized in that: The epoxy encapsulation shell (1) contains at least two layers of chips (2), which are stacked. The upper and lower parts of the two layers of chips (2) are connected to copper pins (3), which extend to the outside of the epoxy encapsulation shell (1). The upper and lower parts of the two layers of chips (2) are also provided with heat sinks (4) covering the top and bottom of the epoxy encapsulation shell (1).

2. The ultra-high power surface mount diode according to claim 1, characterized in that: The epoxy encapsulated shell (1) is provided with downward protruding feet (101) at the four corners of its bottom.

3. The ultra-high power surface mount diode according to claim 1, characterized in that: The copper pin (3) is bent at one end outside the epoxy encapsulation shell (1) and faces the bottom of the epoxy encapsulation shell (1).

4. The ultra-high power surface mount diode according to claim 1, characterized in that: The heat sink (4) includes a heat-conducting sheet (401) that is attached to the surface of the chip (2), and the heat-conducting sheet (401) is provided with a relief groove (4011) for connecting the chip (2) and the copper pin (3).

5. The ultra-high power surface mount diode according to claim 4, characterized in that: A heat sink (402) is also provided on the end face of the heat-conducting plate (401).

6. The ultra-high power surface mount diode according to claim 1, characterized in that: A positioning groove (201) is provided at the outer edge of the opposite end face of the two layers of chips (2), and the chips (2) are fitted onto the positioning member (5) through the positioning groove (201), and the positioning member (5) is covered in the epoxy plastic encapsulation shell (1).

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