Drug-loaded microneedle
By introducing a heating element and a heat-conducting plate structure into the drug-loaded microneedles, the dissolution of soluble microneedles is accelerated, solving the problem of excessively long dissolution time for drug-loaded microneedles and improving skin comfort.
Patent Information
- Application Number
- CN202423029065.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-09
- Publication Date
- 2026-02-24
- Estimated Expiration
- 2034-12-09
AI Technical Summary
The dissolution time of soluble microneedles in drug-loaded microneedles is too long, resulting in prolonged skin adhesion time and causing discomfort.
Introducing exothermic substances, such as quicklime, sodium carbonate, iron powder, lithium powder, coke powder, and activated carbon, into drug-loaded microneedles generates heat through contact with air, accelerating the dissolution of soluble microneedles. Combining this with insulation and heat-conducting plates improves heat transfer efficiency.
It shortens the dissolution time of soluble microneedles and improves skin comfort.
Smart Images

Figure CN223930535U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of drug-loaded microneedle technology, specifically relating to a drug-loaded microneedle. Background Technology
[0002] Drug-loaded microneedles consist of soluble microneedles formed by drug solidification and a patch substrate. When the soluble microneedles are inserted into the skin, the active drug ingredient dissolves subcutaneously. The soluble microneedles are positioned on the ventral side of the patch substrate, which is fitted with adhesive tape to adhere to the skin.
[0003] Soluble microneedles typically take more than 2 hours to dissolve, which is quite long. This prolonged contact between the patch substrate and the skin can cause discomfort. Utility Model Content
[0004] The purpose of this invention is to provide a drug-loaded microneedle that can be heated to increase the dissolution rate of soluble microneedles, shorten the dissolution time, and increase skin comfort.
[0005] To achieve the above objectives, the technical solution provided by a specific embodiment of this utility model is as follows:
[0006] A drug-loaded microneedle includes a patch substrate, a receiving plate disposed on the back of the patch substrate, a sealing plate disposed on the receiving plate, a wiping part disposed on the sealing plate, and a heating space formed between the patch substrate, the receiving plate and the sealing plate, wherein a heating element is disposed within the heating space.
[0007] In one or more embodiments of this utility model, the sealing plate is adhered to the receiving plate.
[0008] In one or more embodiments of this utility model, a heat-insulating plate is provided above the heating element.
[0009] In one or more embodiments of this utility model, a heat-conducting plate is provided at the bottom of the heating element.
[0010] In one or more embodiments of this utility model, the heat-conducting plate is in contact with the patch substrate.
[0011] In one or more embodiments of this utility model, the wiping part includes a first wiping block and a second wiping block.
[0012] In one or more embodiments of this utility model, a plurality of fixing blocks corresponding to the first wiping block and the second wiping block are fixedly connected to the sealing plate.
[0013] In one or more embodiments of this utility model, a handle is fixedly connected to the sealing plate.
[0014] In one or more embodiments of this utility model, the handle is an elastic band.
[0015] In one or more embodiments of this utility model, a fixed shaft is fixedly connected to the handle, and a fixing hole matching the fixed shaft is provided in the fixing block.
[0016] Compared with the prior art, the drug-loaded microneedle of this invention can be heated to increase the dissolution rate of soluble microneedles, shorten the dissolution time, and increase skin comfort. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 This is a schematic diagram of the structure of a drug-loaded microneedle in one embodiment of the present invention;
[0019] Figure 2 This is a cross-sectional view of a drug-loaded microneedle in one embodiment of the present invention;
[0020] Figure 3 This is an exploded view of a drug-loaded microneedle in one embodiment of the present invention;
[0021] Figure 4 This is a partial structural schematic diagram of a drug-loaded microneedle in one embodiment of the present invention.
[0022] Explanation of key figure labels:
[0023] 11. Patch substrate; 21. Receiving plate; 22. Heating element; 23. Sealing plate; 24. Insulation plate; 25. Heat-conducting plate; 31. Handle; 32. First wiping block; 33. Second wiping block; 41. Fixing block; 42. Fixing hole; 43. Fixing shaft. Detailed Implementation
[0024] To enable those skilled in the art to better understand the technical solutions of this utility model, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.
[0025] like Figures 1-4 As shown, in one embodiment of this utility model, a drug-loaded microneedle includes a patch substrate 11 and a plurality of soluble microneedles containing drug. The plurality of soluble microneedles are arranged on the ventral side of the patch substrate 11. Adhesive tape is provided on the ventral side of the patch substrate 11, outside the soluble microneedles, so that the patch substrate 11 can be adhered to the skin through the adhesive tape, and the soluble microneedles can penetrate into the skin layer to dissolve.
[0026] A receiving plate 21 is provided on the back of the patch substrate 11. The receiving plate 21 is fixedly connected to the patch substrate 11. The shape of the receiving plate 21 matches the patch substrate 11. The receiving plate 21 is a circular baffle that matches the patch substrate 11. A sealing plate 23 is bonded to the receiving plate 21. A heating space is formed between the patch substrate 11, the receiving plate 21 and the sealing plate 23. A heating element 22 is stored in the heating space.
[0027] The heating element 22 is made of the same material as existing heating packs, containing quicklime, sodium carbonate, iron powder, lithium powder, coke powder, activated carbon, etc. When the sealing plate 23 is removed, the heating element 22 generates heat upon contact with the air. The heat is transferred to the patch substrate 11, and then to the soluble microneedles on the underside of the patch substrate 11 and the skin. This increases the dissolution of the soluble microneedles and shortens the dissolution time, while also making the skin more comfortable.
[0028] The receiving plate 21 contains an insulation plate 24 and a heat-conducting plate 25, which are fixedly connected to the inner wall of the receiving plate 21. The insulation plate 24 is located above the heating element 22 and is made of fibrous insulation cotton. It does not isolate air, allowing the heating element 22 to generate heat through normal contact with the air. The insulation prevents heat loss from the top, causing the heat to concentrate and flow downwards, specifically towards the skin and the soluble microneedles.
[0029] The heat-conducting plate 25 is in contact with the back of the patch substrate 11. The heat-conducting plate 25 is made of a material with good heat transfer effect, such as a metal plate. The heat generated by the heat-generating object 22 is easily transferred to the patch substrate 11 through the heat-conducting plate 25, so that the skin and soluble microneedles under the patch substrate 11 are heated.
[0030] A wiping section is provided above the sealing plate 23, comprising a first wiping block 32 and a second wiping block 33. The first wiping block 32 and the second wiping block 33 are made of disinfectant cotton. The first wiping block 32 is located on the second wiping block 33 to save space. A plurality of fixing blocks 41 corresponding to the first wiping block 32 and the second wiping block 33 are fixedly connected to the sealing plate 23, and the first wiping block 32 and the second wiping block 33 can be fixed by the fixing blocks 41.
[0031] Before the patch substrate 11 is adhered to the skin, the first wiping block 32 can be removed to wipe and disinfect the area where the patch substrate 11 will be applied to the skin, preventing infection. When the soluble microneedles are dissolved and the patch substrate 11 is peeled off, some adhesive tape and residual drug residue may remain on the skin. These can be cleaned using the second wiping block 33 to remove them from the skin.
[0032] A fixed shaft 43 is fixedly connected to the handle 31. A fixing hole 42 matching the fixed shaft 43 is provided on the fixing block 41. The handle 31 is an elastic band. When the patch substrate 11 is applied to the skin, the sealing plate 23 is removed, and the second wiping block 33 is still fixed to the sealing plate 23. The handle 31 can wrap around the wrist, and the fixed shaft 43 engages in the fixing hole 42, thus temporarily fixing the sealing plate 23 to the wrist, preventing the second wiping block 33 from being discarded. When the patch substrate 11 is removed, cleaning is performed using the second wiping block 33. (See details...) Figure 4 As shown.
[0033] When using, refer to Figures 1-4 As shown, before applying the patch substrate 11 to the skin, the first wiping block 32 is removed, and the skin application site is disinfected. Then, the patch substrate 11 is applied to the disinfected skin area. The sealing plate 23 is peeled off using the handle 31. The heating element 22 inside the receiving plate 21 generates heat upon contact with air. This heat is transferred to the skin and soluble microneedles beneath the patch substrate 11, increasing comfort and accelerating the dissolution of the soluble microneedles. Once the soluble microneedles have dissolved completely, the patch substrate 11 is peeled off, and the area where it was peeled off is cleaned again using the second wiping block 33 to remove any remaining tape and medication residue.
[0034] Compared with the prior art, the drug-loaded microneedle of this invention can be heated to increase the dissolution rate of soluble microneedles, shorten the dissolution time, and increase skin comfort.
[0035] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.
[0036] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.
Claims
1. A drug-loaded microneedle, comprising a patch substrate, characterized in that, A receiving plate is provided on the back of the patch substrate, a sealing plate is provided on the receiving plate, and a wiping part is provided on the sealing plate. A heating space is formed between the patch substrate, the receiving plate and the sealing plate, and a heating element is provided in the heating space.
2. The drug-loaded microneedle according to claim 1, characterized in that, The sealing plate is bonded to the receiving plate.
3. The drug-loaded microneedle according to claim 1, characterized in that, A heat-insulating plate is installed above the heating element.
4. The drug-loaded microneedle according to claim 1, characterized in that, A heat-conducting plate is provided at the bottom of the heating element.
5. A drug-loaded microneedle according to claim 4, characterized in that, The heat-conducting plate is in contact with the patch substrate.
6. A drug-loaded microneedle according to claim 1, characterized in that, The wiping section includes a first wiping block and a second wiping block.
7. A drug-loaded microneedle according to claim 6, characterized in that, The sealing plate is fixedly connected with multiple fixing blocks corresponding to the first wiping block and the second wiping block.
8. A drug-loaded microneedle according to claim 7, characterized in that, A handle is fixedly connected to the sealing plate.
9. A drug-loaded microneedle according to claim 8, characterized in that, The handle is an elastic band.
10. A drug-loaded microneedle according to claim 9, characterized in that, A fixed shaft is fixedly connected to the handle, and a fixing hole matching the fixed shaft is opened in the fixing block.