Wafer gluing equipment capable of uniformly gluing

Abstract

The utility model relates to wafer gluing equipment with uniform gluing, which relates to the technical field of wafer gluing, and comprises a working table, a placing seat is arranged on the working table, a circular groove is formed in the top of the placing seat, a suction cup is arranged in the circular groove, a rack is arranged above the working table, a switching assembly is arranged between the working table and the rack, and the switching assembly is arranged on the working table. The switching assembly is used for enabling the workbench and the rack to rotate relatively, a spraying gun is fixedly arranged at one end of the rack, a scraping base is fixedly arranged at the other end of the rack, a lifting arm is arranged on the scraping base in a sliding mode, and a scraping plate is fixedly arranged at the bottom end of the lifting arm. The gluing device has the effect of improving the gluing quality of the semiconductor wafer.

Description

Technical Field

[0001] This utility model relates to the field of wafer coating technology, and in particular to a wafer coating device for uniform coating. Background Technology

[0002] A wafer is a silicon wafer used to manufacture silicon semiconductor circuits. Currently, a low dielectric constant film is deposited on the surface of the wafer. Before the low dielectric constant film is deposited, the wafer needs to be coated with adhesive to improve the bonding strength between the low dielectric constant film and the wafer.

[0003] A related technology, Chinese Patent No. CN220496682U, provides a coating and spraying fixture for wafer laser processing. It includes a frame, a worktable and an X-axis slide assembly mounted on the frame, the X-axis slide assembly positioned above the worktable, and a spray gun mounted on the X-axis slide assembly. A Y-axis slide assembly is mounted on the worktable, and a placement rack is mounted on the Y-axis slide assembly. The wafer is placed on the placement rack, and the Y-axis slide assembly moves the placement rack radially, transporting the wafer to the spraying area. The X-axis slide assembly then moves the spray gun, which applies the coating and spraying adhesive to the wafer.

[0004] In the process of developing this application, the inventors discovered that the technology has at least the following problems: during the process of spraying adhesive onto the wafer with a spray gun, uneven material discharge is likely to occur at the spray gun outlet, resulting in uneven distribution of adhesive on the wafer surface, which has a negative impact on the quality of subsequent chip processing. Utility Model Content

[0005] To improve the coating quality of semiconductor wafers, this application provides a wafer coating apparatus for uniform coating.

[0006] The wafer coating equipment for uniform coating provided in this application adopts the following technical solution:

[0007] A wafer coating device for uniform coating includes a worktable, a placement seat on the worktable, a circular groove on the top of the placement seat, a suction cup in the circular groove, a frame above the worktable, a switching assembly between the worktable and the frame, the switching assembly being used to allow the worktable and the frame to rotate relative to each other, a spray gun fixedly mounted at one end of the frame, a scraper fixedly mounted at the other end of the frame, a lifting arm slidably mounted on the scraper, and a scraper fixedly mounted at the bottom end of the lifting arm.

[0008] By adopting the above technical solution, the wafer is placed in a circular groove and fixed on the placement seat by a suction cup. When applying adhesive to the wafer, the switching component is controlled to rotate the frame. First, the spray gun is moved to the side closer to the placement seat. Then, the spray gun sprays adhesive onto the wafer. After the spray gun has finished spraying adhesive onto the wafer, the switching component is controlled again to rotate the frame, moving the scraper seat closer to the placement seat. Then, the lifting arm descends, driving the scraper to a suitable height. Finally, the scraper moves relative to the wafer, and the scraper scrapes the adhesive on the wafer surface, making the adhesive evenly distributed on the wafer surface and improving the adhesive coating quality of semiconductor wafers.

[0009] Preferably, a transverse groove is provided on the top of the workbench, a transverse block is slidably disposed in the transverse groove, the transverse block is connected to the placement seat, a transverse screw is rotatably disposed in the transverse groove, the transverse screw is threadedly connected to the transverse block, and a transverse motor is fixedly disposed in the transverse groove, the transverse motor is fixedly connected to the transverse screw.

[0010] By adopting the above technical solution, the transverse motor starts and drives the transverse screw to rotate. The rotation of the transverse screw drives the transverse block to move along the transverse groove. The movement of the transverse block drives the placement seat to move, thereby achieving the effect of moving the wafer along the length of the worktable.

[0011] Preferably, a longitudinal moving seat is fixedly provided on the transverse moving block, a longitudinal moving groove is opened on the top of the longitudinal moving seat, a longitudinal moving block is slidably provided in the longitudinal moving groove, the longitudinal moving block is connected to the placement seat, a longitudinal moving screw is rotatably provided in the longitudinal moving groove, the longitudinal moving screw is threadedly connected to the longitudinal moving block, a longitudinal moving motor is fixedly provided in the longitudinal moving groove, and the longitudinal moving motor is fixedly connected to the longitudinal moving screw.

[0012] By adopting the above technical solution, the longitudinal traverse motor starts and drives the longitudinal traverse screw to rotate. The rotation of the longitudinal traverse screw drives the longitudinal traverse block to move along the longitudinal traverse groove. The movement of the longitudinal traverse block drives the placement seat to move, thereby achieving the effect of moving the wafer along the width direction of the worktable.

[0013] Preferably, a rotating groove is formed on the top of the longitudinal moving block, and a rotating motor is fixedly installed in the rotating groove. The output shaft of the rotating motor is fixedly connected to the bottom of the placement seat.

[0014] By adopting the above technical solution, the rotary motor starts and drives the placement seat to rotate, and the rotation of the placement seat drives the wafer to rotate, thereby causing the wafer and the scraper to rotate relative to each other.

[0015] Preferably, the bottom of the suction cup is connected to an air pipe, which passes through the placement base, and an air valve is provided on the air pipe.

[0016] By adopting the above technical solution, when fixing the wafer in the circular groove, first open the air valve, and then draw away the gas between the suction cup and the wafer through the air pipe. Then close the air valve to fix the wafer.

[0017] Preferably, the switching assembly includes a switching seat, a switching column, a switching gear, and a switching rack. A switching groove is formed on the top of the worktable. The switching rack is slidably disposed in the switching groove. The switching gear is rotatably disposed in the switching groove. The switching gear and the switching rack mesh with each other. The top of the switching gear is fixedly connected to the bottom of the switching seat. The switching seat covers the switching groove. The switching seat is rotatably connected to the worktable. The top of the switching seat is fixedly connected to the bottom of the switching column. The top of the switching column is fixedly connected to the center of the frame.

[0018] By adopting the above technical solution, the switching rack moves to drive the switching gear to rotate, the switching gear rotates to drive the switching seat to rotate, the switching seat rotates to drive the switching column to rotate, and the switching column rotates to drive the frame to rotate, thereby achieving the effect of relative rotation between the frame and the worktable.

[0019] Preferably, a switching motor is fixedly installed in the switching slot, a switching screw is fixedly installed on the output shaft of the switching motor, a switching block is threadedly connected to the switching screw, the switching block is fixedly connected to the switching rack, a switching slide rod is fixedly installed in the switching slot, the switching slide rod is parallel to the switching screw, and the switching slide rod passes through the switching block.

[0020] By adopting the above technical solution, the switching motor starts and drives the switching screw to rotate, the rotation of the switching screw drives the switching block to move along the switching slide bar, and the switching block drives the switching rack to move.

[0021] Preferably, a lifting groove is provided on the scraper seat, a lifting block is slidably arranged in the lifting groove, the lifting block is fixedly connected to the lifting arm, a lifting screw is rotatably arranged in the lifting groove, the lifting screw is threadedly connected to the lifting block, a lifting motor is fixedly arranged in the lifting groove, and the output shaft of the lifting motor is fixedly connected to the lifting screw.

[0022] By adopting the above technical solution, the rotation of the lifting motor drives the rotation of the lifting screw, the rotation of the lifting screw drives the lifting block to move along the lifting groove, the movement of the lifting block drives the movement of the lifting arm, thereby causing the lifting arm to move along the height direction of the scraper seat.

[0023] In summary, this application includes at least one of the following beneficial technical effects:

[0024] 1. By setting up a worktable, placement seat, circular slot, suction cup, frame, switching assembly, spray gun, scraper seat, lifting arm and scraper, the adhesive is evenly distributed on the wafer surface, improving the coating quality of semiconductor wafers;

[0025] 2. By setting a switching seat, switching column, switching gear, switching rack, and switching groove, the effect of relative rotation between the machine frame and the worktable can be achieved;

[0026] 3. By setting up a lifting groove, lifting block, lifting screw and lifting motor, the lifting arm can move along the height direction of the scraper seat. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of a wafer coating device for uniform coating according to an embodiment of this application.

[0028] Figure 2 This is a cross-sectional view illustrating the connection between the placement seat and the workbench in the embodiments of this application.

[0029] Figure 3 This is a cross-sectional view illustrating the connection relationship between the placement seat and the longitudinal sliding seat in the embodiments of this application.

[0030] Figure 4 This is a cross-sectional view illustrating the connection between the switching rack and the worktable in the embodiments of this application.

[0031] Figure 5 This is a cross-sectional view illustrating the connection between the scraper and the scraper seat in the embodiments of this application.

[0032] Explanation of reference numerals in the attached drawings: 1. Workbench; 11. Frame; 2. Placement seat; 21. Circular groove; 22. Suction cup; 24. Air pipe; 25. Air valve; 3. Switching assembly; 31. Switching seat; 32. Switching column; 33. Switching gear; 34. Switching rack; 4. Switching groove; 41. Switching motor; 42. Switching block; 43. Switching screw; 44. Switching slide bar; 5. Spray gun; 6. Scraper; 61. Scraper seat; 611. Lifting groove; 612. Lifting block; 613. Lifting screw; 614. Lifting motor; 62. Lifting arm; 7. Horizontal movement groove; 71. Horizontal movement block; 72. Horizontal movement screw; 73. Horizontal movement motor; 8. Longitudinal movement groove; 81. Longitudinal movement block; 82. Longitudinal movement screw; 83. Longitudinal movement motor; 84. Longitudinal movement seat; 9. Rotary groove; 91. Rotary motor. Detailed Implementation

[0033] The following is in conjunction with the appendix Figure 1-5 This application will be described in further detail.

[0034] This application discloses a wafer coating apparatus for uniformly applying adhesive. (Refer to...) Figures 1 to 3The system includes a worktable 1, on which a placement seat 2 is mounted. A circular groove 21 is formed on the top of the placement seat 2. A suction cup 22 is installed inside the circular groove 21. An air pipe 24 is connected to the bottom of the suction cup 22, passing through the placement seat 2. An air valve 25 is installed on the air pipe 24. When fixing the wafer in the circular groove 21, the air valve 25 is first opened to remove the gas between the suction cup 22 and the wafer through the air pipe 24. Then, the air valve 25 is closed to fix the wafer. A frame 11 is mounted above the worktable 1. A switching assembly 3 is installed between the worktable 1 and the frame 11 to allow relative rotation between the worktable 1 and the frame 11. A spray gun 5 is mounted at one end of the frame 11, and a scraper seat 61 is mounted at the other end. A lifting arm 62 is slidably mounted on the scraper seat 61, and a scraper 6 is mounted at the bottom of the lifting arm 62. When applying adhesive to the wafer, the switching motor 41 rotates the frame 11, first moving the spray gun 5 closer to the placement seat 2. Then, the horizontal movement motor 73 and the vertical movement motor 83 work together to move the wafer directly below the spray gun 5, after which the spray gun 5 sprays adhesive onto the wafer. After the spray gun 5 has finished spraying adhesive onto the wafer, the switching motor 41 is rotated again, moving the scraper seat 61 closer to the placement seat 2. Then, the lifting arm 62 descends, moving the scraper 6 to a suitable height. Finally, the horizontal movement motor 73, the vertical movement motor 83, and the rotary motor 91 work together to move the scraper 6 relative to the wafer, scraping the adhesive onto the wafer surface. This ensures the adhesive is evenly distributed on the wafer surface, improving the quality of semiconductor wafer adhesive application.

[0035] In order to make the wafer move relative to the scraper 6, refer to Figures 1 to 3A transverse groove 7 is formed on the top of the workbench 1. A transverse block 71 slides within the transverse groove 7, and a longitudinal seat 84 is mounted on the transverse block 71. A transverse screw 72 is rotatably mounted within the transverse groove 7 and is threadedly connected to the transverse block 71. A transverse motor 73 is mounted within the transverse groove 7 and is welded to one end of the transverse screw 72. A longitudinal groove 8 is formed on the top of the longitudinal seat 84. A longitudinal block 81 slides within the longitudinal groove 8. A longitudinal screw 82 is rotatably mounted within the longitudinal groove 8 and is threadedly connected to the longitudinal block 81. A longitudinal motor 83 is mounted within the longitudinal groove 8 and is welded to one end of the longitudinal screw 82. A rotation groove 9 is formed on the top of the longitudinal block 81. A rotary motor 91 is mounted within the rotation groove 9, and the output shaft of the rotary motor 91 is welded to the bottom of the placement seat 2. The transverse motor 73 starts, driving the transverse screw 72 to rotate. The rotation of the transverse screw 72 causes the transverse block 71 to move along the transverse groove 7. The movement of the transverse block 71 causes the placement seat 2 to move, thereby achieving the effect of moving the wafer along the length direction of the worktable 1. The longitudinal motor 83 starts, driving the longitudinal screw 82 to rotate. The rotation of the longitudinal screw 82 causes the longitudinal block 81 to move along the longitudinal groove 8. The movement of the longitudinal block 81 causes the placement seat 2 to move, thereby achieving the effect of moving the wafer along the width direction of the worktable 1. The rotary motor 91 starts, driving the placement seat 2 to rotate. The rotation of the placement seat 2 causes the wafer to rotate, thereby causing the wafer to rotate relative to the scraper 6.

[0036] In order to make the frame 11 rotate relative to the worktable 1, refer to Figure 2 and Figure 4A switching groove 4 is formed on the top of the worktable 1, and a switching motor 41 is installed in the switching groove 4. A switching screw 43 is installed on the output shaft of the switching motor 41, and the switching screw 43 is rotatably connected to the inner wall of the switching groove 4. A switching slide rod 44 is installed in the switching groove 4, and the switching slide rod 44 is parallel to the switching screw 43. A switching block 42 is installed on both the switching slide rod 44 and the switching screw 43, and the switching block 42 is threadedly connected to the switching screw 43. The switching slide rod 44 passes through the switching block 42. The switching assembly 3 includes a switching seat 31, a switching column 32, a switching gear 33, and a switching rack 34. The switching rack 34 is installed on the switching block 42, and the switching gear 33 is rotatably disposed in the switching groove 4, and the switching gear 33 and the switching rack 34 mesh with each other. The top of the switching gear 33 is welded to the bottom of the switching seat 31, the switching seat 31 covers the switching groove 4, and the switching seat 31 is rotatably connected to the top of the worktable 1. The top of the switching seat 31 is welded to the bottom of the switching column 32, and the top of the switching column 32 is welded to the center of the frame 11. The switching motor 41 starts, driving the switching screw 43 to rotate. The rotation of the switching screw 43 causes the switching block 42 to move along the switching slide bar 44, which in turn causes the switching rack 34 to move. The movement of the switching rack 34 causes the switching gear 33 to rotate, which in turn causes the switching seat 31 to rotate. The rotation of the switching seat 31 causes the switching column 32 to rotate, which in turn causes the frame 11 to rotate, thus achieving the effect of relative rotation between the frame 11 and the worktable 1.

[0037] To adjust the height of scraper 6, refer to... Figure 1 and Figure 5 A lifting groove 611 is provided on the scraper seat 61. A lifting block 612 is slidably disposed within the lifting groove 611 and is welded to the lifting arm 62. A lifting screw 613 is rotatably disposed within the lifting groove 611 and is threadedly connected to the lifting block 612. A lifting motor 614 is installed within the lifting groove 611, and the output shaft of the lifting motor 614 is welded to the lifting screw 613. The rotation of the lifting motor 614 drives the lifting screw 613 to rotate, which in turn drives the lifting block 612 to move along the lifting groove 611. The movement of the lifting block 612 drives the lifting arm 62 to move, thereby moving the lifting arm 62 along the height direction of the scraper seat 61.

[0038] The implementation principle of a wafer coating device for uniform adhesive application according to an embodiment of this application is as follows: When coating a wafer, the switching motor 41 is controlled to rotate the frame 11, first moving the spray gun 5 closer to the placement seat 2. Then, the horizontal movement motor 73 and the vertical movement motor 83 work together to move the wafer directly below the spray gun 5, after which the spray gun 5 sprays adhesive onto the wafer. After the spray gun 5 has finished spraying adhesive onto the wafer, the switching motor 41 is controlled again to rotate the frame 11, moving the scraper seat 61 closer to the placement seat 2. Then, the lifting arm 62 descends, driving the scraper 6 to move to a suitable height. Finally, the horizontal movement motor 73, the vertical movement motor 83, and the rotary motor 91 work together to move the scraper 6 relative to the wafer, and the scraper 6 scrapes the adhesive on the wafer surface. This ensures that the adhesive is evenly distributed on the wafer surface, improving the coating quality of semiconductor wafers.

[0039] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A wafer coating apparatus for uniform coating, comprising a worktable (1), a placement seat (2) disposed on the worktable (1), a circular groove (21) formed on the top of the placement seat (2), and a suction cup (22) disposed within the circular groove (21), characterized in that: A frame (11) is provided above the workbench (1), and a switching component (3) is provided between the workbench (1) and the frame (11). The switching component (3) is used to make the workbench (1) and the frame (11) rotate relative to each other. A spray gun (5) is fixedly provided at one end of the frame (11), and a scraper seat (61) is fixedly provided at the other end of the frame (11). A lifting arm (62) is slidably provided on the scraper seat (61), and a scraper (6) is fixedly provided at the bottom end of the lifting arm (62).

2. The wafer coating equipment for uniform coating according to claim 1, characterized in that: A transverse groove (7) is provided on the top of the workbench (1). A transverse block (71) is slidably arranged in the transverse groove (7). The transverse block (71) is connected to the placement seat (2). A transverse screw (72) is rotatably arranged in the transverse groove (7). The transverse screw (72) is threadedly connected to the transverse block (71). A transverse motor (73) is fixedly arranged in the transverse groove (7). The transverse motor (73) is fixedly connected to the transverse screw (72).

3. The wafer coating equipment for uniform coating according to claim 2, characterized in that: A longitudinal moving seat (84) is fixedly installed on the transverse moving block (71). A longitudinal moving groove (8) is opened on the top of the longitudinal moving seat (84). A longitudinal moving block (81) is slidably installed in the longitudinal moving groove (8). The longitudinal moving block (81) is connected to the placement seat (2). A longitudinal moving screw (82) is rotatably installed in the longitudinal moving groove (8). The longitudinal moving screw (82) is threadedly connected to the longitudinal moving block (81). A longitudinal moving motor (83) is fixedly installed in the longitudinal moving groove (8). The longitudinal moving motor (83) is fixedly connected to the longitudinal moving screw (82).

4. The wafer coating equipment for uniform coating according to claim 3, characterized in that: The top of the longitudinal moving block (81) has a rotating groove (9), and a rotating motor (91) is fixedly installed in the rotating groove (9). The output shaft of the rotating motor (91) is fixedly connected to the bottom of the placement seat (2).

5. The wafer coating equipment for uniform coating according to claim 1, characterized in that: The bottom of the suction cup (22) is connected to an air pipe (24), which passes through the placement seat (2), and an air valve (25) is provided on the air pipe (24).

6. The wafer coating equipment for uniform coating according to claim 1, characterized in that: The switching assembly (3) includes a switching seat (31), a switching column (32), a switching gear (33), and a switching rack (34). A switching groove (4) is opened on the top of the workbench (1). The switching rack (34) is slidably disposed in the switching groove (4). The switching gear (33) is rotatably disposed in the switching groove (4). The switching gear (33) and the switching rack (34) mesh with each other. The top of the switching gear (33) is fixedly connected to the bottom of the switching seat (31). The switching seat (31) covers the switching groove (4). The switching seat (31) is rotatably connected to the workbench (1). The top of the switching seat (31) is fixedly connected to the bottom of the switching column (32). The top of the switching column (32) is fixedly connected to the center of the frame (11).

7. The wafer coating equipment for uniform coating according to claim 6, characterized in that: A switching motor (41) is fixedly installed in the switching slot (4). A switching screw (43) is fixedly installed on the output shaft of the switching motor (41). A switching block (42) is threadedly connected to the switching screw (43). The switching block (42) is fixedly connected to the switching rack (34). A switching slide rod (44) is fixedly installed in the switching slot (4). The switching slide rod (44) is parallel to the switching screw (43). The switching slide rod (44) passes through the switching block (42).

8. The wafer coating equipment for uniform coating according to claim 1, characterized in that: A lifting groove (611) is provided on the scraper seat (61). A lifting block (612) is slidably arranged in the lifting groove (611). The lifting block (612) is fixedly connected to the lifting arm (62). A lifting screw (613) is rotatably arranged in the lifting groove (611). The lifting screw (613) is threadedly connected to the lifting block (612). A lifting motor (614) is fixedly arranged in the lifting groove (611). The output shaft of the lifting motor (614) is fixedly connected to the lifting screw (613).

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