Automatic cleaning device for chip testing seat

Abstract

The utility model discloses an automatic cleaning device for a chip test seat, which comprises the test seat and a cleaning head, a groove is arranged on the top surface of the test seat, a plurality of probes are arranged at the bottom of the groove, at least one horizontally arranged strip-shaped hole is arranged on the side wall of the groove, at least one air hole is arranged on the outer wall of the test seat, and the probe is arranged in the air hole. The air holes are communicated with the strip-shaped holes in one-to-one correspondence; and the cleaning head is positioned above the test seat and is used for cleaning the groove and the plurality of probes. According to the technical scheme of the utility model, the air hole is communicated with the strip-shaped hole, the air hole can be connected with an external air extractor to form an air extraction path, and when the cleaning head cleans the inner wall of the groove and the probe, the air extraction path extracts air from the groove and brings pollutants in the cleaning process out of the test seat, so that the pollutants are prevented from influencing the accuracy rate of chip testing, and the test efficiency is improved. Therefore, the chip test yield and the chip production efficiency are improved.

Description

Technical Field

[0001] This utility model relates to the field of chip testing equipment technology, and in particular to an automatic cleaning device for chip testing sockets. Background Technology

[0002] Semiconductor chips are core components of modern electronic devices, boasting advantages such as high speed, high density, and low power consumption. To ensure chip performance and reliability, chips undergo various tests before leaving the factory, such as functional testing and aging testing. These tests require specialized test sockets. With increased usage time and repeated use, these test sockets accumulate contaminants such as dust, dirt, and grease. Failure to clean the test sockets promptly and remove these contaminants will affect chip testing yield and reduce chip production efficiency. Therefore, timely cleaning of chip test sockets is crucial. Utility Model Content

[0003] This invention provides an automatic cleaning device for chip test sockets, which aims to improve the cleaning effect of chip test sockets, thereby increasing chip testing yield and chip production efficiency.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] An automatic cleaning device for chip test sockets includes:

[0006] The test stand has a groove on its top surface, a plurality of probes at the bottom of the groove, at least one horizontally arranged strip hole on the side wall of the groove, and at least one air hole on the outer wall of the test stand, with the air hole and the plurality of strip holes corresponding and connected one-to-one.

[0007] A cleaning head, located above the test socket, is used to clean the groove and the probe.

[0008] In some embodiments, the test holder is provided with at least one airflow channel, and the air hole is connected to the strip hole through the airflow channel.

[0009] In some embodiments, the airflow channel is disposed on one side of the strip hole and extends along the length direction of the strip hole, and the inner end of the strip hole penetrates the inner wall of the airflow channel.

[0010] In some embodiments, the at least one airflow channel is an air extraction channel.

[0011] In some embodiments, two strip holes are provided, located on two opposite sidewalls of the groove, and the two strip holes face each other.

[0012] In some embodiments, the section of the groove near its opening is a guide section, and the cross-sectional area of ​​the guide section gradually decreases from top to bottom.

[0013] In some embodiments, the test holder includes a support block and a mounting block, the groove is disposed on the support block, the mounting block is disposed below the support block, and a plurality of probes are disposed on the top side of the mounting block, the tips of the probes being lower than the strip hole.

[0014] In some embodiments, the bottom of the groove is provided with a plurality of through holes through which the probes can pass, and the plurality of probes correspond one-to-one with the plurality of through holes.

[0015] In some embodiments, the automatic cleaning device for the test socket further includes a motion module connected to the cleaning head for driving the cleaning head to clean the test socket.

[0016] In some embodiments, the cleaning head includes a mounting plate, a connecting shaft, and a brush head. One end of the connecting shaft is connected to the mounting plate, and the other end is connected to the brush head. The mounting plate is used to connect to the motion module.

[0017] In the technical solution of this utility model, at least one strip hole is provided on the side wall of the groove of the test seat, and at least one air hole is provided on the outer wall of the test seat. The air hole is connected to the strip hole and can be connected to an external air extraction device to form an air extraction path. When the cleaning head cleans the inner wall of the groove and the probe, the air extraction path extracts air from the groove to promptly remove contaminants from the test seat during the cleaning process, thereby avoiding contaminants from affecting the accuracy of chip testing and improving the yield of chip testing and chip production efficiency. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the automatic cleaning device for chip test sockets in one embodiment of the present invention;

[0019] Figure 2 This is a schematic diagram of the structure of the bearing block in one embodiment of the present invention;

[0020] Figure 3 This is a top view of the support block in one embodiment of the present invention;

[0021] Figure 4 for Figure 3 Sectional view at point AA;

[0022] Figure 5 This is a schematic diagram of the mounting block in one embodiment of the present invention.

[0023] Explanation of icon numbers

[0024]

[0025] Detailed Implementation

[0026] In this utility model, the terms "set up," "equipped with," and "connected" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0027] The terms “center,” “longitudinal,” “lateral,” “length,” “width,” “thickness,” “upper,” “lower,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” “outer,” “clockwise,” “counterclockwise,” “axial,” “radial,” and “circumferential” indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0028] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0029] Furthermore, in addition to indicating direction or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this utility model according to the specific circumstances.

[0030] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0031] Please see Figure 1 This utility model provides an automatic cleaning device for chip test sockets, the cleaning device comprising:

[0032] The test base 1 has a groove 111 on its top surface, a plurality of probes 121 at the bottom of the groove 111, at least one horizontally arranged strip hole 112 on the side wall of the groove 111, and at least one air hole 113 on the outer wall of the test base 1. The air hole 113 and the strip hole 112 are connected in a one-to-one correspondence.

[0033] The cleaning head 2, located above the test seat 1, is used to clean the groove 111 and the multiple probes 121.

[0034] In this embodiment, the cleaning head 2 is used to clean the groove 111 of the test seat 1 and the multiple probes 121 at the bottom of the groove 111. Optionally, the cleaning head 2 is connected to a motion module, which can be a combination of an X-axis linear module, a Y-axis linear module, and a Z-axis linear module, used to drive the cleaning head 2 to move along the X-axis, Y-axis, and Z-axis directions respectively, so as to realize the automatic cleaning of the groove 111 and the multiple probes 121 of the test seat 1 by the cleaning head 2. Optionally, the cleaning head 2 includes a mounting plate 21, a connecting shaft 22, and a brush head 23. One end of the connecting shaft 22 is connected to the mounting plate 21, and the other end is connected to the brush head 23. The mounting plate 21 is used to connect to the motion module. The brush head 23 is detachably connected to the connecting shaft 22, which can be a magnetic connection or a snap-fit ​​connection, so as to realize quick replacement of the brush head 23 and improve cleaning efficiency.

[0035] In this embodiment, the test socket 1 is used to test the chip. Specifically, the top surface of the test socket 1 is provided with a groove 111, and the bottom of the groove 111 is provided with a plurality of probes 121. The chip is placed in the groove 111, and the plurality of probes 121 can contact the plurality of test points on the chip one by one to test the chip.

[0036] The sidewall of the groove 111 is provided with at least one strip-shaped hole 112, which extends along the length of the sidewall. The outer wall of the test seat 1 is provided with at least one air hole 113, and one strip-shaped hole 112 communicates with one air hole 113. The air hole 113 can be connected to an external air extraction device, which can extract contaminants generated during the cleaning process in the groove 111 through the air hole 113 and the strip-shaped hole 112. In this embodiment, the air hole 113 may be located on the outer sidewall of the test seat 1 corresponding to the sidewall of the groove 111; in other embodiments, the air hole 113 may be located on other outer sidewalls of the test seat 1, such as the top side of the test seat 1.

[0037] When the cleaning device of this embodiment is used to clean the test socket 1, the cleaning head 2 cleans the inner wall of the groove 111 and the probe 121 under the drive of the motion module. At the same time, the air extraction device is activated. The air extraction device removes the contaminants from the test socket 1 during the cleaning process through the strip hole 112 and the air hole 113, so as to avoid the contaminants affecting the chip test yield, thereby improving the chip test yield and chip production efficiency.

[0038] Please see Figures 2-4 In some embodiments, the test socket 1 is provided with at least one airflow channel 10, and the air hole 113 is connected to the strip hole 112 through the airflow channel 10. In this embodiment, the air hole 113 can carry the gas in the groove 111 through the strip hole 112 to the air hole 113 via the airflow channel 10, so as to discharge the gas in the groove 111 from the chip test socket 1. In this embodiment, the airflow channel 10 can be cylindrical.

[0039] In some embodiments, the airflow channel 10 is disposed on one side of the strip hole 112 and extends along the length direction of the strip hole 112, and the inner end of the strip hole 112 penetrates the inner wall of the airflow channel 10.

[0040] In this embodiment, the airflow channel 10 and the strip hole 112 are both arranged in the same direction. The inner end of the strip hole 112 penetrates the inner wall of the airflow channel 10, which means that the airflow channel 10 can communicate with the groove 111 through the strip hole 112. In this embodiment, the strip hole 112 can be rectangular.

[0041] In some embodiments, at least one airflow channel 10 is an air extraction channel 10.

[0042] In some embodiments, two strip holes 112 are provided, located on two opposite sidewalls of the groove 111, and facing each other. Two vent holes 113 and two airflow channels 10 are also provided. In one embodiment, the two vent holes 113, the airflow channels 10, and the strip holes 112 respectively form two extraction air paths, drawing gas out of the groove 111 from its two sidewalls. In another embodiment, one vent 113, the airflow channel 10, and the strip hole 112 form a blowing air path, and another vent 113, the airflow channel 10, and the strip hole 112 form a suction air path. Thus, the strip hole 112 connected to the blowing vent blows air into the groove 111, while the strip hole 112 connected to the suction vent draws air from the groove 111. Through the combination of blowing and suction, a high-speed airflow layer is formed in the groove 111. The high-speed airflow layer carries away dust and other contaminants attached to the groove 111 or on the probe 121 through the strip hole 112 connected to the suction vent. During this process, dust and other contaminants falling from above the groove 111 are directly sent out with the high-speed airflow layer and will not fall into the groove 111 or onto the probe 121. Therefore, it can effectively prevent contaminants in the groove 111 and on the probe 121 from affecting the chip test results.

[0043] Please see Figure 2 In some embodiments, the section of the groove 111 near its opening is a guide section 114, and the cross-sectional area of ​​the guide section 114 gradually decreases from top to bottom.

[0044] In this embodiment, the section of the groove 111 near the opening is an outwardly inclined surface. During the chip placement process, the guide section 114 can tolerate a larger positional error, allowing the chip to adjust its position during the downward movement and finally fall into the preset position. In this embodiment, the guide section 114 mainly serves to guide the chip when it is placed in the groove 111.

[0045] In some embodiments, the test seat 1 includes a support block 11 and a mounting block 12. A groove 111 is provided on the support block 11, the mounting block 12 is provided below the support block 11, and a plurality of probes 121 are provided on the top side of the mounting block 12, with the top tip of the probes 121 being lower than the strip hole 112.

[0046] Furthermore, the bottom of the groove 111 is provided with a plurality of through holes 115 through which probes 121 can pass, and the plurality of probes 121 correspond one-to-one with the plurality of through holes 115.

[0047] In this embodiment, the mounting block 12 is located below the support block 11. The top side of the mounting block 12 is provided with multiple probes 121 passing through the through-holes 115. The top of each probe 121 is lower than the strip-shaped hole 112. Therefore, when the chip is placed in the recess 111 for testing, the probes 121 can pass through the through-holes 115 to contact the chip for testing. In this embodiment, with the combined action of blowing air through the blowing holes and drawing air through the drawing holes, the airflow flowing through the recess 111 can form a high-speed airflow layer above the top of the probes 121, thereby preventing contaminants from falling into the chip test socket 1 and adhering to the top of the probes 121, thus affecting subsequent chip testing.

[0048] In this embodiment, the bottom of the groove 111 is provided with a plurality of through holes 115 for the probe 121 to pass through. The through holes 115 are located directly below the area between the two strip holes 112. That is to say, the area between the two strip holes 112 can cover all the through holes 115, so that when the gas between the two strip holes 112 flows through the groove 111, it can cover all the probes 121, which can avoid cleaning dead corners and thus improve the cleaning power of contaminants in the groove 111.

[0049] Please see Figure 5 In some embodiments, the mounting block 12 and the carrier block 11 are restricted from relative movement in the horizontal direction by a positioning structure, thereby preventing the mounting block 12 from shifting from the chip test socket 1; and the mounting block 12 and the carrier block 11 are locked together by multiple screws. In this embodiment, the positioning structure may use a pin to restrict the horizontal movement of the mounting block 12 and the carrier block 11. In this embodiment, the pin may be located at the edge of the top side of the mounting block 12. In this embodiment, the top side of the mounting block 12 and the bottom side of the carrier block 11 are provided with corresponding threaded holes to secure the mounting block 12 and the carrier block 11 with screws.

[0050] Optionally, the positioning structure includes multiple positioning pins 122 and multiple positioning holes, with one of the positioning pins 122 and the positioning holes located on the top side of the mounting block 12 and the other on the bottom side of the support block 11. In this embodiment, the positioning pin 122 can be a pin, and in this embodiment, the positioning pin 122 is located on the top side of the mounting block 12, and the positioning hole is located on the bottom side of the support block 11; in other embodiments, the positioning pin 122 can also be located on the bottom side of the support block 11, and the positioning hole can be located on the top side of the mounting block 12.

[0051] Please see Figure 1 In some embodiments, the test base 1 further includes a base 13 located below the mounting block 12, with the mounting block 12 mounted on the base 13. In this embodiment, the base 13 mainly serves a supporting function.

[0052] It should be noted that the X, Y, and Z axis directions described in this embodiment are the directions indicated in the accompanying drawings of this application.

[0053] The above description is only a specific embodiment of this application. It should be noted that for those skilled in the art, many improvements and modifications can be made without departing from the principle of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. An automatic cleaning device for chip test sockets, characterized in that, include: The test holder has a groove on its top surface, a plurality of probes at the bottom of the groove, at least one horizontally arranged strip hole on the side wall of the groove, and at least one air hole on the outer wall of the test holder, with the air hole and the strip hole corresponding and connected to each other. A cleaning head, located above the test socket, is used to clean the groove and the plurality of probes.

2. The automatic cleaning device for chip test sockets according to claim 1, characterized in that, The test fixture is provided with at least one airflow channel, and the air hole is connected to the strip hole through the airflow channel.

3. The automatic cleaning device for chip test sockets according to claim 2, characterized in that, The airflow channel is located on one side of the strip-shaped hole and extends along the length of the strip-shaped hole, with the inner end of the strip-shaped hole penetrating the inner wall of the airflow channel.

4. The automatic cleaning device for chip test sockets according to claim 2, characterized in that, The at least one airflow channel is an exhaust airflow channel.

5. The automatic cleaning device for chip test sockets according to claim 1, characterized in that, The number of the strip holes is set to two, and the two strip holes are located on two opposite sidewalls of the groove, and the two strip holes are facing each other.

6. The automatic cleaning device for chip test sockets according to claim 1, characterized in that, The section of the groove near its opening is a guide section, and the cross-sectional area of ​​the guide section gradually decreases from top to bottom.

7. The automatic cleaning device for chip test sockets according to claim 1, characterized in that, The test fixture includes a support block and a mounting block. The groove is located on the support block, and the mounting block is located below the support block. A plurality of probes are located on the top side of the mounting block, and the top tip of each probe is lower than the strip hole.

8. The automatic cleaning device for chip test sockets according to claim 7, characterized in that, The bottom of the groove is provided with multiple through holes through which the probes can pass, and the multiple probes correspond one-to-one with the multiple through holes.

9. The automatic cleaning device for chip test sockets according to claim 1, characterized in that, It also includes a motion module, which is connected to the cleaning head and is used to drive the cleaning head to clean the test seat.

10. The automatic cleaning device for chip test sockets according to claim 9, characterized in that, The cleaning head includes a mounting plate, a connecting shaft, and a brush head. One end of the connecting shaft is connected to the mounting plate, and the other end is connected to the brush head. The mounting plate is used to connect to the motion module.

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