Chip testing seat cleaning device and chip testing equipment
By using an automated chip test socket cleaning device, the technical means of low cleaning efficiency and incomplete cleaning in existing technologies have been realized, thereby improving cleaning efficiency and quality.
Patent Information
- Application Number
- CN202323384005.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-11
- Publication Date
- 2026-02-24
- Estimated Expiration
- 2033-12-11
AI Technical Summary
In existing technologies, chip test sockets have low cleaning efficiency and are not thoroughly cleaned, which affects the accuracy and reliability of chip testing.
A vibration device is used to drive the cleaning component to rub against the pin surface of the chip test socket, removing impurities such as solder dross and oxide layer. Automated cleaning is achieved through an automated cleaning device.
It improves cleaning efficiency, ensures cleaning quality, avoids manual intervention, solves the problem of inadequate cleaning in existing technologies, and realizes automated chip testing.
Smart Images
Figure CN223932169U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chip testing equipment, and in particular to a chip test socket cleaning device and a chip testing equipment. Background Technology
[0002] Semiconductor chips are core components of modern electronic devices, boasting advantages such as high speed, high density, and low power consumption. To ensure chip performance and reliability, chips undergo various tests before leaving the factory, including functional testing, aging testing, and fault analysis. These tests require specialized test sockets. With increased usage time and repeated use, test sockets accumulate impurities such as dust, dirt, grease, and oxides. Failure to clean the test sockets promptly can affect the accuracy of chip testing and even lead to chip damage or failure. Therefore, cleaning the test sockets is crucial.
[0003] Currently, most test sockets are cleaned manually using tools such as brushes, cotton swabs, and vacuum cleaners to physically clean them. This removes solder slag, oxide layers, and other contaminants from the inside of the test socket and the surface of the pins, ensuring the cleanliness of the test socket and pins and preventing loose connections between the pins and the chip.
[0004] However, this method of cleaning test sockets has the following shortcomings: In automated testing operations, a large number of test sockets will be used. Using manual tools to clean the test sockets will undoubtedly result in low cleaning efficiency and may also lead to incomplete cleaning of the test sockets. Utility Model Content
[0005] The main purpose of this invention is to provide a chip test socket cleaning device, which aims to solve the problems of low cleaning efficiency and incomplete cleaning of chip test sockets.
[0006] To achieve the above objectives, this utility model proposes a chip test socket cleaning device, which includes:
[0007] Installation main body;
[0008] A vibration device, mounted on the mounting body, is used to generate vibration;
[0009] A cleaning component, detachably connected to the mounting body, is driven by the vibration device and is used to clean the pins of the test socket.
[0010] An electronic control component is electrically connected to the vibration device and is used to control the operation of the vibration device.
[0011] In some embodiments, the mounting body includes a mounting plate, and the mounting plate is provided with a mating part;
[0012] The cleaning component includes a body, and a mounting part is provided on the side of the body facing the mounting plate. The mounting part is mated with the mating part, so that the body and the mounting plate are connected relative to each other.
[0013] In some embodiments, the cleaning assembly further includes a cleaning section disposed on the side of the body opposite to the mounting plate.
[0014] In some embodiments, the electronic control component includes:
[0015] The control board is electrically connected to the vibration device;
[0016] An energy storage device is mounted on the mounting body and is electrically connected to the vibration device and the control main board to provide power.
[0017] In some embodiments, the mounting body further includes a housing covering the vibration device and the electronic control components.
[0018] In some embodiments, the mounting plate has an adsorption element on the side facing the cleaning component for adsorbing the cleaning component.
[0019] This utility model further proposes a chip testing device, comprising:
[0020] A chip test socket, wherein a sensing element is provided inside the chip test socket;
[0021] A transfer robot is used to transfer the chip test socket cleaning device into the chip test socket;
[0022] And the chip test socket cleaning device as claimed in the foregoing.
[0023] In some embodiments, the chip testing equipment further includes a dust extraction device, the actuator of which is connected to the inside of the chip testing socket and is used to extract impurities from the chip testing socket.
[0024] The beneficial effects of this utility model are as follows: Vibration is generated by a vibration device to drive the cleaning component to continuously rub against the surface of the pins on the chip test socket, thereby removing impurities such as solder dross and oxide layers from the pin surface. During automated cleaning of the chip test socket, a transfer robot transports the chip test socket cleaning device to the chip test socket requiring cleaning. Then, the electronic control component receives and processes control signals to control the vibration device to drive the cleaning component to vibrate, causing it to continuously rub against the surface of the pins on the chip test socket, thus removing impurities such as solder dross and oxide layers, achieving automated cleaning. Compared to existing methods that use manual cleaning tools to clean chip test sockets, this utility model's chip test socket cleaning device, by transmitting vibration to the cleaning component, causes the cleaning component to continuously rub against the inner wall of the chip test socket and the surface of the pins, removing impurities such as solder dross and oxide layers from the pin surface, thus achieving automated cleaning without manual intervention and improving cleaning efficiency. Simultaneously, the thorough friction between the cleaning component and the pins ensures that cleaning is not incomplete, guaranteeing cleaning quality. Attached Figure Description
[0025] Figure 1 This is a schematic diagram of the structure of an embodiment of the chip test socket cleaning device of this utility model;
[0026] Figure 2 This is an exploded view of an embodiment of the chip test socket cleaning device of this utility model.
[0027] Explanation of icon numbers:
[0028] The system includes a mounting body 100, a mounting plate 101, a mating part 101a, a housing 102, a vibration device 200, a cleaning component 300, a main body 301, a mounting part 301a, a cleaning part 302, an electrical control component 400, a control main board 401, and an energy storage device 402.
[0029] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0030] The solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this utility model.
[0031] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.
[0032] It should also be noted that when a component is described as "fixed to" or "set on" another component, it can be directly on the other component or there may be an intervening component present. When a component is described as "connected to" another component, it can be directly connected to the other component or there may be an intervening component present.
[0033] Furthermore, the use of terms such as "first" and "second" in this utility model is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this utility model.
[0034] This utility model proposes a chip test socket cleaning device, which is mainly used for cleaning chip test sockets. For example, the internal parts of the chip test socket are cleaned by the vibration cleaning component 300.
[0035] like Figure 1 and Figure 2 As shown, the chip test socket cleaning device proposed in this utility model includes a mounting body 100, a vibration device 200, and a cleaning component 300, wherein:
[0036] A vibration device 200 is mounted on the mounting body 100 and is used to generate vibration. A cleaning component 300 is located on the side of the mounting body 100 opposite to the vibration device 200. The cleaning component 300 is detachably connected to the mounting body 100 and is driven by the vibration device to clean the pins of the test socket. An electrical control component 400 is electrically connected to the vibration device 200 and is used to control the operation of the vibration device 200. It should be noted that in this embodiment, the vibration device can be mounted on the mounting plate 101. Of course, in other embodiments, the vibration device 200 can be mounted on the housing 102, and no particular limitation is made here.
[0037] In addition, the vibration device 200 in this embodiment can be a vibration motor driving the cleaning component. Of course, in other embodiments, an ultrasonic motor can also drive the brush to vibrate and achieve cleaning. An ultrasonic motor is a type of motor that utilizes the inverse piezoelectric effect of piezoelectric materials and ultrasonic vibration to convert the microscopic deformation of the material into the macroscopic motion of the rotor through mechanical resonance amplification and frictional coupling. This vibration can be transmitted to the brush through a mechanical structure or frictional coupling, causing it to generate high-frequency micro-vibrations, thereby achieving a cleaning effect.
[0038] Since chip test sockets are mostly installed inside chip testing equipment, manual cleaning is difficult. Furthermore, there are many chip test sockets, and manual cleaning cannot clean all the pins in a timely manner. Disassembling the chip test sockets for cleaning would undoubtedly increase the workload. Therefore, in this embodiment, the chip test socket cleaning device automatically initiates a cleaning process for the chip test sockets according to a preset program after use.
[0039] During the cleaning process, the transfer robot moves to the location of the chip test socket cleaning device and transports it to the chip test socket that needs cleaning, so that the cleaning component 300 contacts the pins of the chip test socket. At this time, the sensors in the chip test socket (such as photoelectric sensors or fiber optic sensors) detect the insertion signal of the chip test socket cleaning device and feed the signal back to the host computer. The host computer then remotely controls the chip test socket cleaning device to work. After receiving the control signal, the corresponding electronic control component 400 controls the vibration device 200 to work. The vibration device 200 generates vibration at a certain frequency and transmits it to the cleaning component 300, causing the cleaning component 300 to rub against the inner wall of the chip test socket and the contact part of the pins, thereby peeling off impurities such as solder dross and oxide layers from the surface of the pins.
[0040] The chip test socket cleaning device of this embodiment generates vibration through the vibration device 200, which drives the cleaning component 300 to continuously rub against the surface of the pins of the chip test socket, thereby removing impurities such as solder dross and oxide layers from the pin surface. During automated cleaning of the chip test socket, a transfer robot transports the chip test socket cleaning device to the chip test socket requiring cleaning. Then, the electronic control component receives and processes control signals to control the vibration device 200 to drive the cleaning component 300 to vibrate, causing it to continuously rub against the surface of the pins of the chip test socket, thereby removing impurities such as solder dross and oxide layers from the pin surface, thus achieving automated cleaning. Compared to existing solutions that use manual cleaning tools to clean chip test sockets, the chip test socket cleaning device of this embodiment, by transmitting vibration to the cleaning component, causes the cleaning component to continuously rub against the inner wall of the chip test socket and the surface of the pins to remove impurities such as solder dross and oxide layers from the pin surface, thus achieving automated cleaning without manual intervention and improving cleaning efficiency. At the same time, the cleaning component fully rubs against the pins, preventing incomplete cleaning and ensuring cleaning quality.
[0041] As the chip test socket cleaning device is used for an extended period, the parts that contact the pins will inevitably deform. This means that the cleaning component 300 needs to be replaced periodically to ensure effective cleaning. Therefore, in this embodiment, please refer to... Figure 1 and Figure 2 The installation body 100 includes an installation plate 101, on which a mating part 101a is provided; the cleaning component 300 includes a body 301, on which a mounting part 301a is provided on the side of the body 301 facing the installation plate 101, and the mounting part 301a is connected to the mating part 101a so that the body 301 and the installation plate 101 are connected relative to each other.
[0042] In this embodiment, when replacing the cleaning component 300, the chip test socket cleaning device simply separates the body 301 of the cleaning component 300 from the mounting plate 101, thus disassembling the cleaning component 300. Then, the cleaning component 300 in good condition is connected and installed to the mounting plate 101, completing the replacement of the cleaning component 300, which is very convenient. Furthermore, when the cleaning performance of the cleaning component 300 deteriorates, only the cleaning component 300 needs to be replaced; there is no need to replace the mounting body 100, vibration device 200, electronic control components, or other parts, avoiding resource waste.
[0043] It should be noted that the mounting plate 101 in this embodiment is sheet-shaped. Specifically, the mounting body 100 is made of a material with a certain degree of rigidity, such as steel sheet, which helps to increase the vibration frequency. In this way, the vibration can be better transmitted to the cleaning component 300 to achieve a better cleaning effect.
[0044] In addition, to increase cleaning efficiency, the number of vibration devices 200 can be increased. For example, multiple vibration devices 200 can be evenly and spaced on the mounting plate 101, and the electronic control component 400 can control multiple vibration devices 200 respectively, so that multiple vibration devices 200 can work together.
[0045] In one embodiment, the mounting plate 101 and the body 301 can be connected by a snap-fit mechanism. Specifically, the mounting plate 101 has a slot on the side facing the body 301, and a latch is provided on the mounting plate 101. This snap-fit connection between the body 301 and the mounting plate 101 facilitates subsequent replacement. It should be noted that in this embodiment, the slot is only provided on the side of the mounting plate 101 facing the body 301. Of course, in other embodiments, the slot can be located on the body 301 itself; this is not a particular limitation.
[0046] In another embodiment, the mounting plate 101 has an adsorption element on the side facing the cleaning component 300 for adsorbing the cleaning component 300. Specifically, the mounting plate 101 has a magnet on the side facing the cleaning component 300, and the cleaning component 300 is made of a ferromagnetic metal or alloy. Thus, the mounting plate 101 is magnetically connected to the main body, making it easier to replace the cleaning component 300.
[0047] Continue reading Figure 2 In this embodiment, the cleaning component 300 includes a cleaning part 302, which is disposed on the side of the main body 301 facing away from the mounting body 100. It should be noted that the cleaning part 302 in this embodiment can be a brush. Specifically, driven by the vibration device 200, the brush continuously rubs against the pins of the chip test socket to remove impurities such as solder dross and oxide layers from the pin surface. Furthermore, this embodiment only uses the cleaning part 302 disposed on the main body 301 as an example. Of course, in other embodiments, the cleaning part 302 can also simultaneously cover the mounting body 100 to fully contact the inner wall of the test socket.
[0048] Furthermore, in this embodiment, the cleaning unit is preferably a nano-brush. Since nano-brushes can penetrate into tiny crevices and surfaces, they can remove solder slag and other residues more thoroughly, improving the cleaning effect. In addition, nano-brushes are not easily deformed, can be used for a long time, avoid frequent replacements, and save resources.
[0049] Once the chip test socket cleaning device is delivered to the chip test socket requiring cleaning, it needs to be started and its operating status during the cleaning process needs to be monitored in order to make corresponding adjustments based on the actual operating conditions. Therefore, in this embodiment, refer to... Figure 2The electronic control component 400 includes a control motherboard 401, electrically connected to the vibration device 200. The control motherboard 401 is used to remotely receive control commands transmitted from the host computer and control the vibration device 200 to operate according to the control commands. The vibration device vibrates at a certain frequency and transmits the vibration to the cleaning component 300. A power storage device 402 is mounted on the mounting body 100 and electrically connected to the vibration device and the control motherboard 401, providing power. It should be noted that in this embodiment, the power storage device 402 uses wireless charging to replenish its power. Specifically, after the chip test socket cleaning device is used, the transfer robot transports it to a designated placement location to replenish its power for the next use (i.e., the wireless charging area), which is very convenient.
[0050] In addition, the chip test socket cleaning device in this embodiment is equipped with a power storage device 402 for power supply, which avoids cumbersome wiring layout, makes the overall mobility better, and is not limited by control lines, power lines, etc.
[0051] See Figure 1 and Figure 2 In automated cleaning operations, chip test socket cleaning devices inevitably experience some bumps and knocks. To avoid damage to components such as the energy storage device 402 and the control motherboard 401, in this embodiment, the mounting body 100 also includes a housing 102 covering the vibration device 200 and the electronic control components. The housing 102 can effectively prevent the energy storage device 402, the control motherboard 401 and other components from being directly impacted, thus playing a protective role.
[0052] To further enhance the protective effect, an elastic material, such as rubber or silicone, can be coated on the surface of the shell 102 to absorb external impacts.
[0053] The chip testing equipment further proposed in this utility model includes a chip test socket, a transfer robot, and a chip test socket cleaning device. The specific structure of the chip test socket cleaning device is as described in the above embodiments. Since this chip testing equipment adopts all the technical solutions of all the above embodiments, it has at least all the technical effects brought about by the technical solutions of the above embodiments, and will not be described in detail here. The chip test socket is equipped with a sensing element inside, and the transfer robot is used to transfer the chip test socket cleaning device into the chip test socket.
[0054] It should be noted that some chip test sockets have a pin protection mechanism, meaning that a protective structure is used to protect the pins of the chip test socket. The pins can only be extended by pressing the protective structure. This is to prevent the pins from being damaged or contaminated during testing, which could affect the accuracy and reliability of the test results. The pins of this type of chip test socket are supported by springs or tabs. When the chip is installed on the test socket, the protective structure is pressed down, exposing the pins and allowing them to form a good electrical connection with the pads or contacts on the chip. When the chip is removed, the pins spring back to their original position, preventing contact with the outside environment. Therefore, when cleaning this type of chip test socket, a certain amount of force needs to be applied to the pin protection structure to expose the pins, and then cleaning can be performed using appropriate cleaning tools. In other words, during the cleaning process, while the transfer robot transports the chip test socket cleaning device to the chip testing area, it simultaneously operates the protective structure to expose the pins, allowing the cleaning component 300 to fully contact the pins for cleaning.
[0055] In some embodiments, the chip testing equipment also includes a dust extraction device. Specifically, the actuating end of the dust extraction device is connected to the inside of the chip test socket to extract impurities inside the chip test socket. In this way, in conjunction with the chip test socket cleaning device, impurities such as solder dross can be cleaned up more quickly, further improving cleaning efficiency and cleaning effect.
[0056] The above description is only a part or preferred embodiment of this utility model. Neither the text nor the drawings should limit the scope of protection of this utility model. All equivalent structural transformations made using the content of this utility model specification and drawings under the overall concept of this utility model, or direct / indirect applications in other related technical fields, are included within the scope of protection of this utility model.
Claims
1. A chip test socket cleaning device, characterized in that, include: Installation main body; A vibration device, mounted on the mounting body, is used to generate vibration; A cleaning component, detachably connected to the mounting body, is driven by the vibration device and is used to clean the pins of the test socket. An electronic control component is electrically connected to the vibration device and is used to control the operation of the vibration device.
2. The chip test socket cleaning device according to claim 1, characterized in that, The mounting body includes a mounting plate, and the mounting plate is provided with a mating part; The cleaning component includes a body, and a mounting part is provided on the side of the body facing the mounting plate. The mounting part is mated with the mating part, so that the body and the mounting plate are connected relative to each other.
3. The chip test socket cleaning device according to claim 2, characterized in that, The cleaning component also includes a cleaning section located on the side of the main body opposite to the mounting plate.
4. The chip test socket cleaning device according to claim 1, characterized in that, The electronic control component includes: The control board is electrically connected to the vibration device; An energy storage device is mounted on the mounting body and is electrically connected to the vibration device and the control main board to provide power.
5. The chip test socket cleaning device according to any one of claims 2-4, characterized in that, The mounting body also includes a housing that covers the vibration device and the electronic control components.
6. The chip test socket cleaning device according to claim 2, characterized in that, The mounting plate has an adsorption element on the side facing the cleaning component for adsorbing the cleaning component.
7. A chip testing device, characterized in that, include: A chip test socket, wherein a sensing element is provided inside the chip test socket; A transfer robot is used to transfer the chip test socket cleaning device into the chip test socket; And the chip test socket cleaning device according to any one of claims 1-6.
8. The chip testing equipment according to claim 7, characterized in that, It also includes a vacuuming device, the actuator of which is connected to the inside of the chip test socket and is used to remove impurities from the chip test socket.