Automatic laser character grinding machine

Abstract

The utility model discloses an automatic laser character grinding machine, which belongs to the technical field of circuit board processing and comprises a workbench, an X-axis module, a Y-axis module and a Z-axis module, the workbench is provided with the X-axis module; the Y-axis module is arranged on the X-axis module, and the Z-axis module is arranged on the Y-axis module; a supporting piece is arranged on the Z-axis module; the supporting piece is provided with a visual camera and a laser emitting assembly which face the workbench. The lower end of the laser emission assembly is connected with a focusing lens. The lower end of the focusing lens is provided with a measuring assembly. MARK points are identified through the intelligent camera, coordinates of the IC chip are calculated through laser ranging, and laser is controlled to automatically clear fonts on the IC chip through cooperative work of the X axis, the Y axis and the Z axis, so that the confidentiality effect is achieved.

Description

Technical Field

[0001] This utility model relates to the field of circuit board processing technology, and in particular to a laser automatic letter grinding machine. Background Technology

[0002] IC chips are used in almost all modern electronic products. With a small circuit structure, they can achieve corresponding functions and obtain good results.

[0003] For current electronic products, the model number and internal structure of the IC chips used or those circulating in the market are generally known, and the chip itself also has the corresponding model number and brand printed on its surface. Technicians can easily copy the entire internal circuit structure after opening it, resulting in poor security. The current solution is to polish the surface of the IC chip to remove the model number, brand, and other related information printed on it, in order to achieve better security.

[0004] However, current polishing mainly relies on manual labor, which not only cannot guarantee uniform polishing depth, potentially causing unevenness in the chip, but is also inefficient, unable to meet the needs of mass production, and requires a high level of worker skill. Furthermore, improper polishing, such as being too shallow to remove the chip or too deep, can easily damage the IC chip. Therefore, this application proposes a laser automatic polishing machine that at least partially solves the above problems. Utility Model Content

[0005] In view of the above problems, the present invention provides an automatic laser letter grinding machine that overcomes or at least partially solves the above problems.

[0006] To address the aforementioned issues, this utility model discloses a laser automatic letter grinding machine, comprising: a worktable and an X-axis module, a Y-axis module, and a Z-axis module composed of three linear modules;

[0007] The worktable is provided with the X-axis module; the Y-axis module is provided on the X-axis module, and the Z-axis module is provided on the Y-axis module;

[0008] The Z-axis module is equipped with a support member; the support member is equipped with a vision camera and a laser emission assembly facing the worktable;

[0009] The lower end of the laser emitting component is connected to a focusing lens; the lower end of the focusing lens is provided with a measuring component.

[0010] Furthermore, this application also proposes that the worktable is provided with a first slide rail; the X-axis module is composed of a first linear module and is parallel to the first slide rail;

[0011] A first slider is slidably mounted on the first slide rail;

[0012] The first linear module is provided with a first linear slider;

[0013] A first support plate is disposed on the first slider and the first linear slider;

[0014] The Y-axis module is mounted on the first support plate.

[0015] Furthermore, this application also proposes that the Y-axis module is provided with a second linear slider, and the end of the Y-axis module is provided with a linear drive motor;

[0016] The Z-axis module is mounted on the second linear slider.

[0017] Furthermore, this application also proposes that the Z-axis module is provided with a third linear slider;

[0018] The second support plate is disposed on the third linear slider, and the support member is connected to the second support plate.

[0019] Furthermore, this application also proposes that the worktable is provided with a clamping component at a position below the running trajectory of the vision camera;

[0020] The clamping component includes a fixed component and a movable component. The movable component is connected to a lead screw, and a lead screw motor is connected to the end of the lead screw.

[0021] Furthermore, this application also proposes to include a second slide rail parallel to the lead screw;

[0022] The movable component is connected to the second slide rail via a second slider.

[0023] Furthermore, this application also proposes that both the fixed component and the movable component are equipped with a conveyor belt.

[0024] Furthermore, this application also proposes that the bottom of the workbench is provided with adjustable support feet;

[0025] One side of the support leg is equipped with a caster wheel.

[0026] Furthermore, this application also proposes that the upper end of the movable part is provided with a dust suction port, which is connected to a dust collection device via a hose.

[0027] This utility model has the following advantages: It utilizes a worktable and an X-axis module, a Y-axis module, and a Z-axis module composed of three linear modules; the worktable is equipped with the X-axis module; the Y-axis module is mounted on the X-axis module, and the Z-axis module is mounted on the Y-axis module; a support member is mounted on the Z-axis module; a vision camera and a laser emitting assembly facing the worktable are mounted on the support member; a focusing lens is connected to the lower end of the laser emitting assembly; and a measuring component is located at the lower end of the focusing lens. The intelligent camera identifies MARK points, the coordinates of the IC chip are calculated using laser ranging, and the X, Y, and Z axes work together to control the laser to automatically clear the text on the IC chip, achieving a confidentiality effect. Attached Figure Description

[0028] Figure 1 This is a frontal view structural schematic diagram of an embodiment of the laser automatic letter grinding machine of this utility model;

[0029] Figure 2 This is a three-dimensional structural diagram of an embodiment of the laser automatic letter grinding machine of this utility model. Detailed Implementation

[0030] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0031] This utility model provides an embodiment of a laser automatic letter grinding machine, such as... Figures 1 to 2 As shown, it may specifically include: a worktable 101 and an X-axis module 102, a Y-axis module 103, and a Z-axis module 104 composed of three linear modules; the worktable 101 is provided with the X-axis module 102; the Y-axis module 103 is provided on the X-axis module 102, and the Z-axis module 104 is provided on the Y-axis module 103; a support member 105 is provided on the Z-axis module 104; a vision camera 106 and a laser emitting assembly 107 facing the worktable are provided on the support member 105; a focusing lens 108 is connected to the lower end of the laser emitting assembly 107; a measuring assembly 109 is provided at the lower end of the focusing lens 108. The height of the IC chip is measured by a laser rangefinder, and the laser focal length is automatically adjusted by a servo motor, which solves the problems of error and inconvenience of manual measurement. The coordinates of the IC chip are calculated by recognizing the MARK point (optical point on the circuit board or mark on the IC chip) by a smart camera. The X, Y and Z axes work together to control the laser to automatically clear the font on the IC chip, so as to achieve the confidentiality effect.

[0032] By employing a laser rangefinder to measure the height of the IC chip, the laser focal length can be automatically adjusted. Compared to manual polishing, this allows for precise control of the polishing depth, preventing unevenness on the chip and significantly improving polishing quality. A smart camera identifies the mark points and calculates the IC chip coordinates; the X, Y, and Z axes work together to automatically remove lettering with the laser. Automated operation replaces manual polishing, meeting the needs of mass production and significantly improving production efficiency. This highly automated equipment eliminates the need for manual polishing based on worker experience, reducing quality fluctuations caused by differences in worker skill levels and lowering the company's skill requirements. The automatic laser polishing machine precisely controls the polishing degree, preventing damage to the IC chip due to improper polishing, improving product yield, and addressing the problem of chip damage or poor polishing results caused by excessive or insufficient polishing during manual polishing.

[0033] It should be noted that circuit boards usually have corresponding markings at the locations where chips need to be installed. In addition, each IC chip also has corresponding pin markings to facilitate pin location identification. Dot markings are generally used on the chip to indicate the location of the first pin.

[0034] In one embodiment of this application, as Figure 1 and Figure 2 As shown, the worktable 101 is provided with a first slide rail 124; the X-axis module 102 is composed of a first linear module and is parallel to the first slide rail 124; a first slider 123 is slidably disposed on the first slide rail 124; a first linear slider 122 is disposed on the first linear module; a first support plate 121 is disposed on the first slider 123 and the first linear slider 122; the Y-axis module 103 is disposed on the first support plate 121. A second linear slider 132 is disposed on the Y-axis module 103, and a linear drive motor 131 is disposed at one end of the Y-axis module 103; the Z-axis module 104 is disposed on the second linear slider 132. A third linear slider is disposed on the Z-axis module 104; a second support plate 121 is disposed on the third linear slider, and a support member 105 is connected to the second support plate 121.

[0035] The worktable is equipped with a first slide rail 124, in which the X-axis module 102 is parallel to the first slide rail 124. The first slider 123 and the first linear slider 122 jointly support the first support plate 121, providing a stable mounting base for the Y-axis module 103. This makes the movement in the X-axis direction smoother, reduces the impact of unstable movement on the grinding accuracy, further ensures the uniformity of grinding depth, and improves the grinding quality. The Y-axis module 103 is connected to the Z-axis module 104 through a second linear slider 132, and a linear drive motor 131 is provided at the end of the Y-axis module 103. This makes the movement adjustment in the Y-axis direction more flexible. The position of the laser emitting component 107 in the Y-axis direction can be precisely adjusted according to the position and size of different IC chips. In conjunction with the X-axis and Z-axis, it can grind chips in different positions more efficiently, improving the adaptability of the equipment to diverse chip grinding tasks. This means that grinding is not limited to chips of a specific size, and the Z-axis adjustment can also better adapt it to IC chips of different heights. Through the connection of the aforementioned series of support plates and linear sliders, the X, Y, and Z axis modules are arranged in an orderly manner, resulting in a more compact and rational overall structural layout of the equipment. Within a limited space, the movement requirements of each axis module are met, while also facilitating equipment installation, debugging, and maintenance, reducing subsequent maintenance costs and improving the stability and reliability of the equipment. Furthermore, the connection between the X, Y, and Z axis modules via linear sliders and support plates enhances the coordination of their movements. Combined with intelligent camera recognition of MARK points to calculate IC chip coordinates, each axis can more precisely control the laser emission components to reach designated positions, achieving accurate erasure of the IC chip text and further improving the accuracy and consistency of security processing.

[0036] The aforementioned workbench 101 is also equipped with a clamping component located below the running trajectory of the vision camera 106. The clamping component includes a fixed component and a movable component 201. The movable component 201 is connected to a lead screw 202, and a lead screw motor 203 is connected to the end of the lead screw 202. The lead screw motor 203 drives the rotation of the lead screw 202, thereby controlling the relative position of the movable component 201 with respect to the fixed component to accommodate circuit boards of different sizes. For example, when the IC chip is on a relatively large circuit board, the lead screw motor 203 can be used to adjust the lead screw 202 so that the movable component 201 can accommodate the larger circuit board relative to the fixed component. Conversely, the adjustment can be reversed.

[0037] Furthermore, it also includes a second slide rail 204 parallel to the lead screw 202; the movable component 201 is connected to the second slide rail 204 via a second slider. The connection between the second slider and the second slide rail 204 via the movable component 201 ensures relatively smooth movement of the movable component. Both the fixed component and the movable component 201 are equipped with conveyor belts, which can operate synchronously, enabling automatic conveying of circuit boards. Based on this structure, an automatic feeding mechanism can be connected. After the automatic feeding mechanism delivers the circuit boards to the conveyor belt positions of the fixed component and the movable component 201, the belts automatically transport the circuit boards to their respective positions. Moreover, after processing, a receiving mechanism can be installed at the end of the conveyor belt to achieve fully automated processing from feeding and processing to recycling.

[0038] It should be noted that corresponding sensors can be set on the equipment to detect the position of circuit boards and clamping parts. The setting of sensors is a common practice in this field. The feeding mechanism and receiving mechanism are only used to illustrate an achievable application scenario. Their specific structures are not within the scope of protection of this application and will not be described in detail here.

[0039] In one embodiment of this application, the bottom of the workbench 101 is provided with a retractable support leg 111; one side of the support leg 111 is provided with a caster wheel 112. When transportation is required, the support leg 111 can be raised and the caster wheel 112 can be placed on the ground for easy handling; in addition, when placing the equipment, the height of the support leg 111 can be adjusted to prevent the equipment from being unstable due to uneven ground, thus ensuring stable operation of the equipment.

[0040] like Figure 2 As shown, the upper end of the movable part 201 is also provided with a dust suction port 205. The dust suction port 205 is connected to a dust collection device through a hose. When the character markings on the IC chip are removed by laser, some smoke and dust may be generated. The dust is sucked into the dust collection device through the dust suction port 205 for processing, so as to avoid the smoke and dust from escaping into the air and being detrimental to the environment. This can play a certain environmental protection role.

[0041] Although preferred embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the present invention.

[0042] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes said element.

[0043] The above provides a detailed description of the automatic laser letter grinding machine provided by this utility model. Specific examples have been used to illustrate the principle and implementation of this utility model. The description of the above embodiments is only for the purpose of helping to understand the method and core idea of ​​this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of ​​this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A laser automatic letter grinding machine, characterized in that, include: The worktable and the X-axis module, Y-axis module and Z-axis module consisting of three linear modules; The worktable is equipped with the X-axis module; The Y-axis module is provided on the X-axis module, and the Z-axis module is provided on the Y-axis module; The Z-axis module is equipped with a support member; the support member is equipped with a vision camera and a laser emission assembly facing the worktable; The lower end of the laser emitting component is connected to a focusing lens; the lower end of the focusing lens is equipped with a measuring component.

2. The laser automatic letter grinding machine according to claim 1, characterized in that, The worktable is provided with a first slide rail; the X-axis module is composed of a first linear module and is parallel to the first slide rail. A first slider is slidably mounted on the first slide rail; The first linear module is provided with a first linear slider; A first support plate is disposed on the first slider and the first linear slider; The Y-axis module is mounted on the first support plate.

3. The laser automatic letter grinding machine according to claim 2, characterized in that, The Y-axis module is provided with a second linear slider, and the end of the Y-axis module is provided with a linear drive motor; The Z-axis module is mounted on the second linear slider.

4. The laser automatic letter grinding machine according to claim 3, characterized in that, The Z-axis module is equipped with a third linear slider; The second support plate is disposed on the third linear slider, and the support member is connected to the second support plate.

5. The laser automatic letter grinding machine according to claim 1, characterized in that, The workbench is also equipped with a clamping component located below the running trajectory of the vision camera; The clamping component includes a fixed component and a movable component. The movable component is connected to a lead screw, and a lead screw motor is connected to the end of the lead screw.

6. The laser automatic letter grinding machine according to claim 5, characterized in that, It also includes a second slide rail parallel to the lead screw; The movable component is connected to the second slide rail via a second slider.

7. The laser automatic letter grinding machine according to claim 6, characterized in that, Both the fixed and movable components are equipped with conveyor belts.

8. The laser automatic letter grinding machine according to claim 6, characterized in that, The bottom of the workbench is equipped with adjustable support feet; One side of the support leg is equipped with a caster wheel.

9. The laser automatic letter grinding machine according to claim 6, characterized in that, The upper end of the movable part is also provided with a dust suction port, which is connected to a dust collection device via a hose.

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