Plasma treatment equipment capable of rapidly feeding

Abstract

The utility model discloses and provides plasma processing equipment capable of rapidly loading, which comprises a plasma processor main body, a vacuum bin body is arranged in the plasma processor main body, a mounting frame is arranged in the vacuum bin body, a plurality of groups of movable sliding rails are arranged, one side of each group of movable sliding rails is provided with a connecting plate, and the other side of each group of movable sliding rails is provided with a connecting plate. A long rod is arranged on the outer surface of the connecting plate, a handle is fixedly installed on the outer surface of the long rod, the whole placing frame and wafers on the whole placing frame can be easily driven to be stably and synchronously moved out of the interior of a vacuum bin body by holding the handle and applying pulling force, the feeding and discharging efficiency is remarkably improved, meanwhile, the labor intensity of workers is reduced, and the production efficiency is improved. And the long rod is tightly connected with the multiple sets of connecting plates, so that synchronous movement of all the movable sliding rails is guaranteed, and the stability and reliability of the feeding process are further improved.

Description

Technical Field

[0001] This utility model relates to the field of plasma processor technology, specifically to a plasma processing device capable of rapid material loading. Background Technology

[0002] In current plasma processing equipment, the loading and unloading processes have always been key factors affecting production efficiency. Traditional plasma processing equipment generally relies on a single moving slide rail for material handling and positioning during loading. This single-track design not only limits the speed of material handling but also makes the entire loading process cumbersome and inefficient. Operators need to manually move materials one by one on a single slide rail, which is not only time-consuming but also labor-intensive. Utility Model Content

[0003] (I) Purpose of the utility model

[0004] In view of this, the purpose of this utility model is to provide a plasma processing device that can quickly feed materials, thereby solving the problems mentioned in the background above.

[0005] (II) Technical Solution

[0006] A plasma processing device with rapid material loading includes a plasma processor body. The plasma processor body has a vacuum chamber inside, and a mounting frame is installed within the vacuum chamber. Multiple sets of sliding grooves are formed on both sides of the mounting frame, and movable slide rails are movably mounted on the inner walls of each set of sliding grooves. A placement rack is connected to one side of each movable slide rail for placing wafers. The movable slide rails are divided into multiple sets, and a connecting plate is provided on one side of each set of movable slide rails. A long rod is provided on the outer surface of the connecting plate, and a handle is fixedly installed on the outer surface of the long rod.

[0007] Preferably, a limiting tube is installed on the outer surface of the connecting plate, and a long rod is rotatably installed on the inner wall of the limiting tube. The limiting tube provides a fixed rotation track for the long rod, preventing the long rod from deviating or shaking during rotation.

[0008] Preferably, the outer surface of the handle is covered with a rubber sleeve. The rubber sleeve provides a better grip and comfort, reducing friction and pressure on the operator's hands when using the handle.

[0009] Preferably, two sets of fixing plates are fixedly installed on one outer surface of the multiple sets of movable slide rails, and the two sets of fixing plates are fixedly installed with connecting plates by multiple sets of screws. The tightening action of the screws can ensure that the position of the connecting plate on the movable slide rail will not change due to external force, thereby ensuring the stability and durability of the entire feeding mechanism, while facilitating disassembly and installation.

[0010] Preferably, the placement rack is made of ceramic material, which has excellent high temperature resistance and chemical stability, and can resist the high temperature and corrosive gases generated during plasma treatment.

[0011] Preferably, the outer surface of the placement rack has multiple sets of through slots, which can reduce the weight of the placement rack and facilitate operation and movement.

[0012] Preferably, the outer surface of the placement rack is provided with a limiting ring, which can effectively prevent the wafer from slipping or shifting during movement or processing.

[0013] As can be seen from the above technical solutions, this application has the following beneficial effects:

[0014] 1. This utility model allows the entire placement rack and the wafers on it to be easily and synchronously moved out of the vacuum chamber by holding the handle and applying a pulling force, which significantly improves the efficiency of loading and unloading. At the same time, the tight connection between the long rod and multiple sets of connecting plates ensures the synchronous movement of all movable slide rails, further improving the stability and reliability of the loading process.

[0015] 2. This utility model further enhances wafer stability through the design of a limiting ring on the outer surface of the placement rack. During movement or processing, the limiting ring effectively prevents the wafer from slipping or shifting, thereby ensuring wafer safety and processing accuracy. Attached Figure Description

[0016] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0017] Figure 2 This is a schematic diagram of the first three-dimensional structure of the vacuum chamber of this utility model;

[0018] Figure 3 This is a schematic diagram of the second three-dimensional structure of the vacuum chamber of this utility model;

[0019] Figure 4 This utility model Figure 2 Enlarged view of point A in the middle;

[0020] Figure 5 This utility model Figure 3 Enlarged diagram of point B in the middle.

[0021] In the diagram: 1. Plasma processor body; 2. Vacuum chamber; 3. Mounting frame; 4. Movable slide rail; 5. Placement rack; 6. Wafer; 7. Handle; 8. Long rod; 9. Connecting plate; 911. Limiting tube; 311. Slide groove; 511. Fixing plate; 512. Screw; 711. Rubber sleeve; 712. Through groove; 713. Limiting ring. Detailed Implementation

[0022] The following description is exemplary in nature and is not intended to limit the scope, application, or use of this disclosure. It should be understood that in all these figures, the same or similar reference numerals indicate the same or similar parts and features. The figures are merely schematic representations of the concept and principles of embodiments of this disclosure and do not necessarily show the specific dimensions and scale of the various embodiments of this disclosure. Certain details or structures of embodiments of this disclosure may be exaggerated in particular portions of certain figures.

[0023] Please see Figure 1-5 One embodiment provided by this utility model:

[0024] A plasma processing device with rapid material loading includes a plasma processor body 1. The plasma processor body 1 has a vacuum chamber 2 inside. A mounting frame 3 is installed in the vacuum chamber 2. Multiple sets of sliding grooves 311 are opened on both sides of the mounting frame 3. The inner walls of the multiple sets of sliding grooves 311 are movably mounted with movable slide rails 4. A placement rack 5 is connected to one side of the movable slide rail 4. The placement rack 5 is used to place wafers 6. The movable slide rails 4 are divided into multiple sets. A connecting plate 9 is provided on one side of each set of movable slide rails 4. A long rod 8 is provided on the outer surface of the connecting plate 9. A handle 7 is fixedly installed on the outer surface of the long rod 8.

[0025] Furthermore, a limiting tube 911 is installed on the outer surface of the connecting plate 9, and a long rod 8 is rotatably installed on the inner wall of the limiting tube 911. The limiting tube 911 provides a fixed rotation track for the long rod 8, preventing the long rod 8 from deviating or shaking during rotation.

[0026] Furthermore, the outer surface of the handle 7 is covered with a rubber sleeve 711. The rubber sleeve 711 provides a better grip and comfort, reducing friction and pressure on the operator's hands when using the handle 7.

[0027] Furthermore, two sets of fixing plates 511 are fixedly installed on one side of the outer surface of the multiple sets of movable slide rails 4, and the two sets of fixing plates 511 are fixedly installed with connecting plates 9 by multiple sets of screws 512. Through the fastening action of the screws 512, it can be ensured that the position of the connecting plate 9 on the movable slide rail 4 will not change due to external force, thereby ensuring the stability and durability of the entire feeding mechanism, while facilitating disassembly and installation.

[0028] Furthermore, the placement rack 5 is made of ceramic material, which has excellent high temperature resistance and chemical stability, and can resist the high temperature and corrosive gases generated during plasma treatment.

[0029] Furthermore, the outer surface of the placement rack 5 is provided with multiple sets of through grooves 712. The multiple sets of through grooves 712 can reduce the weight of the placement rack 5 and facilitate operation and movement.

[0030] Furthermore, a limiting ring 713 is provided on the outer surface of the placement rack 5, which can effectively prevent the wafer 6 from slipping or shifting during movement or processing.

[0031] Working principle: When loading wafer 6, the operator first holds handle 7 and applies pulling force. The long rod 8 not only serves as a supporting structure for handle 7, but also plays a key role in connecting multiple sets of connecting plates 9.

[0032] Because the long rod 8 is tightly connected to multiple sets of connecting plates 9, when the handle 7 is pulled, the long rod 8 will drive all the connecting plates 9 to move synchronously. The other side of the connecting plates 9 is connected to the movable slide rails 4, which slide smoothly along the grooves 311 opened on both sides of the mounting frame 3. This design ensures that the placement rack 5 and the wafers 6 on it can be smoothly and synchronously removed from the vacuum chamber 2.

[0033] After the placement rack 5 is completely removed from the vacuum chamber 2, the operator can easily place the wafer 6 on the outer surface of the placement rack 5 from bottom to top. The placement rack 5 is made of ceramic material, which not only has good high-temperature resistance but also effectively prevents the wafer 6 from being contaminated or damaged during processing.

[0034] To ensure the stability and safety of wafer 6 on the placement rack 5, a limiting ring 713 is also provided on the outer surface of the placement rack 5. The limiting ring 713 can effectively prevent wafer 6 from slipping or shifting during movement or handling.

[0035] After placing wafer 6, the operator simply reverses the lever 7 to push the placement rack 5 and wafer 6 onto it into the vacuum chamber 2. At this point, the plasma processor body 1 will begin performing the required plasma treatment on wafer 6.

[0036] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A plasma processing device capable of rapid material loading, comprising a plasma processor body (1), wherein a vacuum chamber (2) is provided inside the plasma processor body (1), characterized in that: The vacuum chamber (2) is equipped with an installation frame (3). Multiple sets of sliding grooves (311) are opened on both sides of the installation frame (3). The inner walls of the multiple sets of sliding grooves (311) are movably equipped with movable slide rails (4). A placement rack (5) is connected to one side of the movable slide rail (4). The placement rack (5) is used to place wafers (6). The movable slide rails (4) are divided into multiple sets. A connecting plate (9) is provided on one side of each set of movable slide rails (4). A long rod (8) is provided on the outer surface of the connecting plate (9). A handle (7) is fixedly installed on the outer surface of the long rod (8).

2. The plasma treatment equipment with rapid material feeding according to claim 1, characterized in that: The outer surface of the connecting plate (9) is fitted with a limiting tube (911), and a long rod (8) is rotatably mounted on the inner wall of the limiting tube (911).

3. The plasma treatment equipment with rapid material feeding according to claim 1, characterized in that: The outer surface of the handle (7) is covered with a rubber sleeve (711).

4. The plasma treatment equipment with rapid material feeding according to claim 1, characterized in that: Two sets of fixing plates (511) are fixedly installed on one side of the outer surface of the multiple sets of movable slide rails (4), and the two sets of fixing plates (511) are fixedly installed with connecting plates (9) by multiple sets of screws (512).

5. The plasma treatment equipment with rapid material feeding according to claim 1, characterized in that: The placement rack (5) is made of ceramic material.

6. The plasma treatment equipment with rapid material feeding according to claim 1, characterized in that: The outer surface of the placement rack (5) has multiple sets of through grooves (712).

7. The plasma treatment equipment with rapid material feeding according to claim 1, characterized in that: The outer surface of the placement rack (5) is provided with a limiting ring (713).

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