Silicon-based evaporation feeding device

Abstract

The utility model relates to the technical field of displayers, in particular to a silicon-based evaporation feeding device which comprises a silicon wafer support (1). The top of the silicon wafer support (1) is provided with a sensor assembly. The bottom of the silicon wafer support (1) is provided with a supporting rotation assembly. The supporting rotating assembly comprises a suction cup structure. A wafer is arranged on the silicon wafer bracket (1); the sucker structure is connected to the bottom of the wafer; the sensor assembly and the supporting and rotating assembly are both connected with a controller (101). The supporting rotating assembly can do telescopic motion in the vertical direction and can rotate flexibly at the same time. The sucker structure can be tightly sucked at the bottom of the wafer; when wafer edge searching operation is carried out, the supporting and rotating assembly can support and rotate a wafer; according to the device, the edge searching action of the wafer can be completed in an environment without roller contact, dust particles and wafer scratches can be effectively avoided, and the product yield can be effectively improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to display technology field, specifically, the utility model relates to a silicon base evaporation loading device. BACKGROUND

[0002] In the micro oled (micro organic light emitting diode) industry, at present, when evaporation is carried out, generally, EFEM (Equipment Front End Module) equipment is used for loading, and the loading mode needs to drive the wafer to rotate in the loading process, and performs edge searching action, and in the wafer rotating process, due to the friction between the roller and the wafer, dust particles are easy to be generated, and the wafer is easy to be scratched, thereby affecting the product yield.

[0003] The applicant finds that the Chinese patent document with publication number 217903093U discloses a wafer gap edge searching device and a photoetching system on November 25, 2022; the edge searching device includes a table for carrying a wafer; a first optical fiber sensor, a second optical fiber sensor and a third optical fiber sensor, the first optical fiber sensor includes a first optical fiber bundle port, the second optical fiber sensor includes a second optical fiber bundle port; the connecting line of the vertical projection of the first optical fiber bundle port and the second optical fiber bundle port on the plane where the wafer is located constitutes a first connecting line; when the symmetry axis of the wafer gap coincides with the perpendicular line of the first connecting line, the vertical projection of the first optical fiber bundle port and the second optical fiber bundle port on the plane where the wafer is located is located in the gap; the third optical fiber sensor includes a third optical fiber bundle port; the connecting line of the vertical projection of the third optical fiber bundle port on the plane where the wafer is located and the center of the circle and the perpendicular line of the first connecting line passing through the center of the circle form a preset angle; the device cannot solve the above technical problems.

[0004] Therefore, in order to improve or solve at least one of the above problems, it is necessary to provide a silicon base evaporation loading device which can realize wafer edge searching operation and avoid dust particles and wafer scratches. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a silicon base evaporation loading device which can realize wafer edge searching operation and avoid dust particles and wafer scratches.

[0006] In order to solve the above technical problems, the technical scheme adopted by the utility model is as follows: a silicon base evaporation loading device, including a silicon wafer support; a sensor assembly is arranged on the top of the silicon wafer support; a supporting rotating assembly is arranged on the bottom of the silicon wafer support; the supporting rotating assembly includes a suction cup structure; a wafer is arranged on the silicon wafer support; the suction cup structure is connected to the bottom of the wafer; the sensor assembly and the supporting rotating assembly are both connected with a controller.

[0007] The silicon wafer support comprises a bottom plate; the bottom plate is provided with a mounting hole; the suction disc structure comprises a suction disc; the suction disc is arranged in the mounting hole and connected with the bottom of the wafer.

[0008] The support rotating assembly comprises a mounting sleeve; the suction disc is arranged at the end of the mounting sleeve.

[0009] The mounting sleeve is respectively connected with a sleeve rotating motor and a telescopic air cylinder.

[0010] As an option, the suction disc is a vacuum suction disc; the mounting sleeve is provided with an air pipe; the air pipe is connected with the suction disc, and the air pipe is connected with a vacuum pump.

[0011] As another option, the suction disc is an electrostatic chuck; the mounting sleeve is provided with a power supply circuit; the power supply circuit is connected with the suction disc, and the power supply circuit is connected with a power supply.

[0012] The silicon wafer support is provided with an edge searching cavity; the edge searching cavity is provided with a mounting seat; the wafer is arranged on the mounting seat.

[0013] The sensor assembly comprises a mounting bracket; the mounting bracket comprises a rotating shaft; the rotating shaft is connected with a rotating disc; the bottom of the rotating disc is provided with a rotation sensor; the rotating shaft is connected with a rotating shaft rotating motor.

[0014] The controller is a PLC controller.

[0015] The beneficial effects of the present application are:

[0016] The device is provided with a support rotating assembly at the bottom of the silicon wafer support; the support rotating assembly can perform vertical telescopic movement and flexible rotation; the support rotating assembly is provided with a suction disc structure; the suction disc structure can tightly suck the bottom of the wafer; when performing wafer edge searching operation, the support rotating assembly can support and rotate the wafer; the device cancels the roller structure in the existing silicon evaporation feeding device, can realize wafer edge searching operation in a roller-free contact environment, can effectively avoid dust particles and wafer scratches, and can effectively improve product yield. BRIEF DESCRIPTION OF DRAWINGS

[0017] The specific implementation manner of the present application will be further described in combination with the drawings, in which:

[0018] Figure 1 It is a structural schematic view of the silicon evaporation feeding device.

[0019] The marks in the above drawings are:

[0020] The marks in the drawings are:

[0021] 1. Silicon wafer support; 101. Controller.

[0022] 2. Base plate, 201. Mounting holes.

[0023] 3. Suction cup,

[0024] 4. Install the sleeve; 401. Sleeve rotary motor; 402. Telescopic cylinder.

[0025] 5. Edge-finding cavity, 501, mounting base,

[0026] 6. Mounting bracket, 601. Rotating shaft, 602. Turntable, 603. Rotation sensor, 604. Rotating shaft motor. Detailed Implementation

[0027] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings, in order to help those skilled in the art to have a more complete, accurate and in-depth understanding of the inventive concept and technical solution of this utility model, and to facilitate its implementation.

[0028] Figure 1 The silicon-based vapor deposition feeding device shown includes a silicon wafer support 1; a sensor assembly is provided on the top of the silicon wafer support 1; a support rotation assembly is provided at the bottom of the silicon wafer support 1; the support rotation assembly includes a suction cup structure; a wafer is placed on the silicon wafer support 1; the suction cup structure is connected to the bottom of the wafer; both the sensor assembly and the support rotation assembly are connected to a controller 101.

[0029] The supporting rotating component can extend and retract vertically and rotate flexibly. It features a suction cup structure that can firmly hold the wafer to the bottom. During wafer edge-finding operations, the supporting rotating component lifts and rotates the wafer. This device eliminates the roller structure found in existing silicon-based vapor deposition feeding devices, enabling edge-finding to be completed without roller contact. This effectively avoids dust particles and wafer scratches, significantly improving product yield.

[0030] The silicon wafer support 1 includes a base plate 2; the base plate 2 is provided with mounting holes 201; the suction cup structure includes a suction cup 3; the suction cup 3 is disposed in the mounting holes 201 and is connected to the bottom of the wafer.

[0031] Mounting hole 201 is a through hole; suction cup 3 can pass through mounting hole 201 to perform vertical extension and retraction; suction cup 3 is firmly attached to the bottom of the wafer, which can realize a stable connection between the wafer and the supporting rotating component, thereby enabling the wafer to lift and rotate.

[0032] The supporting rotating assembly includes a mounting sleeve 4; a suction cup 3 is located at the end of the mounting sleeve 4.

[0033] The mounting sleeve 4 is a hollow tube structure; the mounting sleeve 4 is fixedly connected to the bottom of the suction cup 3; the mounting sleeve 4 can drive the suction cup 3 to perform lifting and rotating operations.

[0034] The mounting sleeve 4 is connected to the sleeve rotation motor 401 and the telescopic cylinder 402 respectively.

[0035] The piston rod of the telescopic cylinder 402 is connected to the bottom of the mounting sleeve 4; the extension and retraction of the piston rod of the telescopic cylinder 402 can drive the mounting sleeve 4 to rise and fall in the vertical direction; a driven gear is fixedly connected to the outer wall of the mounting sleeve 4; a drive gear is provided on the sleeve rotation motor 401; the drive gear meshes with the driven gear, thereby driving the mounting sleeve 4 to rotate.

[0036] The suction cup 3 is a vacuum suction cup; the mounting sleeve 4 is equipped with an air pipe; the air pipe is connected to the suction cup 3, and the air pipe is connected to a vacuum pump.

[0037] The suction cup 3 can be a vacuum suction cup; the vacuum pump draws a vacuum through the air pipe, which can control the suction cup 3 to stick firmly to the bottom surface of the wafer; the vacuum pump breaks the vacuum through the air pipe, which can realize the separation of the suction cup 3 from the wafer.

[0038] The suction cup 3 is an electrostatic chuck; the mounting sleeve 4 is equipped with a power supply line; the power supply line is connected to the suction cup 3 and is also connected to a power source.

[0039] The chuck 3 can be an electrostatic chuck; the electrostatic chuck is mainly composed of an electrode layer, an insulating layer and a substrate; the electrode layer generates an electrostatic field when a voltage is applied, the insulating layer isolates the electrode from the wafer, and the substrate provides support; during operation, a voltage is applied to the electrode layer, and opposite charges are generated on the chuck and the wafer surface, and electrostatic adsorption is achieved by relying on Coulomb force to fix the wafer; when it is necessary to release the wafer, the voltage is reduced or removed, the charges on the chuck and the wafer surface are neutralized, the electrostatic adsorption force disappears, and the wafer can be removed.

[0040] The silicon wafer support 1 has an edge-finding cavity 5; the edge-finding cavity 5 has a mounting base 501; the wafer is placed on the mounting base 501.

[0041] Mounting base 501 has a ring structure; mounting base 501 is located on the top of the base plate 2 of silicon wafer support 1; the wafer is located in the edge-finding cavity 5 and is placed on mounting base 501.

[0042] The sensor assembly includes a mounting bracket 6; the mounting bracket 6 includes a rotating shaft 601; the rotating shaft 601 is connected to a turntable 602; a rotation sensor 603 is provided at the bottom of the turntable 602; and the rotating shaft 601 is connected to a rotating shaft motor 604.

[0043] A rotating shaft 601 is fixedly connected to the top of a turntable 602; a driven gear is fixedly connected to the outer wall of the rotating shaft 601; a drive gear is provided on the rotating shaft rotation motor 604; the drive gear meshes with the driven gear, thereby driving the rotating shaft 601 to rotate; a rotation sensor 603 is fixedly connected to the bottom of the turntable 602.

[0044] Controller 101 is a PLC controller.

[0045] The controller 101 can be a PLC controller, a microcontroller, an industrial computer (industrial control computer), or a PAC (programmable automation controller); the controller 101 is connected to the sleeve rotary motor 401, the telescopic cylinder 402, the rotation sensor 603, and the shaft rotary motor 604 respectively; the controller 101 is connected to a power supply or a vacuum pump.

[0046] The specific workflow of this utility model is as follows:

[0047] The wafer to be edge-searched is placed on the silicon wafer support 1; after the wafer is detected to have entered the edge-searching cavity 5, the turntable 602 drives the rotation sensor 603 to rotate to perform the edge-searching operation.

[0048] Based on the data sensed by the rotation sensor 603, the controller 101 calculates the wafer offset angle;

[0049] The suction cup 3 grips the wafer and extends vertically upwards, causing the wafer to detach from the silicon wafer support 1; the suction cup 3 gripping the wafer rotates and calibrates its position according to the calculated offset angle.

[0050] After position calibration, the chuck 3 grips the wafer and descends onto the silicon wafer support 1; the chuck 3 releases its grip, allowing the wafer to detach.

[0051] The turntable 602 drives the rotation sensor 603 to perform the edge-finding action again, and determines that the edge-finding position is correct; after confirming that the edge-finding is completed, the suction cup 3 and the rotation sensor 603 return to the initial position, completing the edge-finding action.

[0052] The present invention has been described above by way of example with reference to the accompanying drawings. Obviously, the specific implementation of the present invention is not limited to the above-described manner. Any non-substantial improvements made using the inventive concept and technical solution of the present invention; or the direct application of the inventive concept and technical solution to other situations without modification, are all within the protection scope of the present invention.

Claims

1. A silicon-based vapor deposition feeding device, characterized in that: The device includes a silicon wafer support (1); a sensor assembly is provided on the top of the silicon wafer support (1); a support and rotation assembly is provided on the bottom of the silicon wafer support (1); the support and rotation assembly includes a suction cup structure; a wafer is provided on the silicon wafer support (1); the suction cup structure is connected to the bottom of the wafer; both the sensor assembly and the support and rotation assembly are connected to a controller (101).

2. A silicon-based vapor deposition feeding device according to claim 1, characterized in that: The silicon wafer support (1) includes a base plate (2); the base plate (2) is provided with mounting holes (201); the suction cup structure includes a suction cup (3); the suction cup (3) is disposed in the mounting holes (201), and the suction cup (3) is connected to the bottom of the wafer.

3. A silicon-based vapor deposition feeding device according to claim 2, characterized in that: The supporting rotation assembly includes a mounting sleeve (4); the suction cup (3) is located at the end of the mounting sleeve (4).

4. A silicon-based vapor deposition feeding device according to claim 3, characterized in that: The mounting sleeve (4) is connected to a sleeve rotary motor (401) and a telescopic cylinder (402).

5. A silicon-based vapor deposition feeding device according to claim 4, characterized in that: The suction cup (3) is a vacuum suction cup; the mounting sleeve (4) is provided with an air pipe; the air pipe is connected to the suction cup (3), and the air pipe is connected to a vacuum pump.

6. A silicon-based vapor deposition feeding device according to claim 4, characterized in that: The suction cup (3) is an electrostatic chuck; the mounting sleeve (4) is provided with a power supply line; the power supply line is connected to the suction cup (3) and the power supply line is connected to a power source.

7. A silicon-based vapor deposition feeding apparatus according to any one of claims 2-4, characterized in that: The silicon wafer support (1) is provided with an edge-finding cavity (5); the edge-finding cavity (5) is provided with a mounting base (501); the wafer is mounted on the mounting base (501).

8. A silicon-based vapor deposition feeding device according to claim 7, characterized in that: The sensor assembly includes a mounting bracket (6); the mounting bracket (6) includes a rotating shaft (601); the rotating shaft (601) is connected to a turntable (602); a rotation sensor (603) is provided at the bottom of the turntable (602); and the rotating shaft (601) is connected to a rotating shaft motor (604).

9. A silicon-based vapor deposition feeding device according to claim 8, characterized in that: The controller (101) is a PLC controller.

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