Reaction chamber of chemical vapor deposition equipment

Abstract

The utility model provides a reaction chamber of chemical vapor deposition equipment, which comprises a chamber main body, and the chamber main body comprises a first shell and a second shell which are oppositely arranged; the second shell and the first shell are matched to form a reaction cavity; the first shell is fixedly connected with the base; the second shell is movably connected with the first shell through a guide mechanism and is driven by the lifting device to get close to or get away from the first shell, so that the reaction cavity is closed or opened; the side wall of the first housing is provided with a port, and the port is used for being connected with an external wafer transmission system. According to the reaction chamber, a three-section type chamber main body structure in the prior art is improved and designed into a two-section type structure, so that the number of sealing mechanisms required by the chamber main body is effectively reduced, and the gas leakage risk of the reaction chamber is further effectively reduced; the second shell is driven by the lifting device to open or close the reaction cavity, so that manpower is effectively saved, the efficiency of a daily maintenance process is improved, and meanwhile, accidental injury in a manual disassembly and assembly process is also avoided.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment technology, and in particular to a reaction chamber of a chemical vapor deposition apparatus. Background Technology

[0002] The semiconductor reaction chamber is a core component of semiconductor manufacturing equipment. While the structure of reaction chambers varies depending on the process, they generally include the following main parts: chamber body, base, spray head, vacuum system interface, gas supply system interface, observation window and measurement port, and slit valve port. An example of a reaction chamber in a prior art chemical vapor deposition (CVD) apparatus (such as...) Figure 1 The reaction chamber consists of three main parts: a lower shell 4, a connecting wall 5, and an upper shell 6. The lower shell 4 contains a base heating zone, and the upper shell 6 contains a spray head zone. The upper and lower shells are connected by the connecting wall 5, forming a sealed reaction chamber. The connecting wall has a valve port 51 for wafer entry and exit. The valve port 51 is the interface between the reaction chamber and the external wafer transport system, and under normal conditions, it is connected to the external wafer transport system.

[0003] The aforementioned chamber structure has the following drawbacks: It contains multiple sealing ports, such as the lower and upper shells where they meet the connecting wall, requiring sealing structures (typically O-rings). A sealing structure is also needed between the valve port and the external wafer transfer system. This three-section chamber structure requires at least three sealing structures, which inherently increases the risk of gas leakage from the reaction chamber. Furthermore, during routine preventative maintenance, the connection between the valve port and the external wafer transfer system must be disconnected before removing the connecting wall located in the middle of the reaction chamber. After maintenance, the three sections must be reassembled. During assembly, the installation position of the connecting wall must be determined based on the connection point between the valve port and the external wafer transfer system. Therefore, repeated alignment and correction are necessary when installing the connecting wall, while also considering the port's sealing performance. This significantly increases the workload of routine preventative maintenance and greatly reduces its efficiency. Utility Model Content

[0004] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a reaction chamber for a chemical vapor deposition (CVD) device to solve the problems of high gas leakage risk and low daily maintenance efficiency in the reaction chamber of CVD devices in the prior art.

[0005] To achieve the above objectives, this utility model provides a reaction chamber for a chemical vapor deposition apparatus, comprising a chamber body, wherein the chamber body includes a first shell and a second shell disposed opposite to each other; the second shell cooperates with the first shell to form a reaction chamber;

[0006] The first housing is fixedly connected to the base;

[0007] The second housing is movably connected to the first housing via a guide mechanism, and moves closer to or further away from the first housing under the action of the lifting device, thereby achieving the closing or opening of the reaction chamber.

[0008] The first housing has a port on its side wall, which is used to connect to an external wafer transfer system.

[0009] Preferably, a port is provided on the side wall of the first housing, the port being used to connect to an external wafer transfer system.

[0010] Preferably, the guiding mechanism includes multiple guiding components, which are spaced apart along the outer side of the chamber body.

[0011] Preferably, the guiding assembly includes a guide rail and a slider, the slider being slidably connected to the guide rail; the guide rail is connected to the first housing, and the slider is connected to the second housing.

[0012] Preferably, the lifting device includes a drive motor and a lead screw transmission mechanism; the second housing is connected to the first housing through the lead screw transmission mechanism, and the lead screw transmission mechanism drives the second housing to move closer to or away from the first housing under the drive of the drive motor, thereby realizing the closing or opening of the reaction chamber.

[0013] Preferably, the lifting device is a drive cylinder, the cylinder barrel of the drive cylinder is connected to the first housing, and the piston of the drive cylinder is connected to the second housing.

[0014] Preferably, a sealing element is provided between the first housing and the second housing of the reaction chamber.

[0015] Preferably, at least one observation port is provided on the side wall of the first housing, and the observation port is used to observe the reaction in the reaction chamber.

[0016] Preferably, the distance between the upper edge of the port and the upper edge of the first housing is greater than 5 mm.

[0017] Preferably, the port has a connecting flange.

[0018] Preferably, the first housing has a first cavity, the second housing has a second cavity, and the first cavity and the second cavity constitute the reaction chamber; the first cavity is provided with a base for supporting the wafer, and the second cavity is provided with a spray head for uniformly spraying process gas onto the wafer surface.

[0019] The beneficial effects of this utility model are as follows: by improving the existing three-section chamber main body structure into a two-section structure, this utility model effectively reduces the number of sealing mechanisms required for the main body of the chamber, thereby effectively reducing the risk of gas leakage in the reaction chamber.

[0020] The second housing is opened or closed by a lifting device, which effectively saves manpower, improves the efficiency of daily maintenance, and avoids accidental injuries during manual disassembly and installation.

[0021] The second housing is connected to the first housing through a guide mechanism, which enables the first and second housings to be precisely aligned and fitted when they are opened and then closed again, while also improving the overall structural rigidity.

[0022] By placing the port for interfacing with the external wafer transmission system on the first housing, the disassembly and installation of the port connection points are eliminated during routine equipment maintenance, greatly improving the efficiency of daily maintenance. At the same time, it also reduces the risk of reduced port sealing and gas leakage caused by repeated disassembly and installation. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the overall structure of the reaction chamber of a chemical vapor deposition apparatus disclosed in the prior art;

[0024] Figure 2 This is a schematic diagram of the overall structure (closed state) of the reaction chamber of the chemical vapor deposition apparatus disclosed in this embodiment of the present invention.

[0025] Figure 3 This is a schematic diagram of the overall structure of the reaction chamber of the chemical vapor deposition apparatus disclosed in this embodiment of the present invention (open state).

[0026] Figure 4 This is a schematic diagram showing the connection between the reaction chamber of the chemical vapor deposition equipment disclosed in this embodiment of the invention and the external wafer transport system;

[0027] Figure 5 This is a schematic diagram of the lifting device in an embodiment of the present invention.

[0028] Figure label:

[0029] 1-Cavity body; 11-First shell; 12-Second shell; 111-First cavity; 13-First observation port; 14-Second observation port; 15-Port; 151-Connecting flange;

[0030] 2-Guiding mechanism; 21-First guiding assembly; 22-Second guiding assembly;

[0031] 3-Lifting device; 31-Frame; 32-Screw; 33-First support seat; 34-Second support seat; 35-Moving block; 36-Guide plate; 37-Drive motor.

[0032] 4-Lower housing; 5-Connecting wall; 6-Upper housing; 51-Valve port; 7-External wafer transfer system; Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art to which this utility model pertains. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed after the word and its equivalents, but does not exclude other elements or objects. Unless otherwise specified, the term "connection" as used herein can refer to a direct connection or an indirect connection, i.e., a connection through an intermediate object.

[0034] refer to Figure 2 and Figure 3 This utility model provides a reaction chamber for a chemical vapor deposition apparatus, including a chamber body 1. The chamber body 1 includes a first shell 11 and a second shell 12 disposed opposite to each other; the second shell 12 cooperates with the first shell 11 to form a reaction chamber. The space in the reaction chamber corresponding to the first shell 11 forms a base heating zone, and the space in the reaction chamber corresponding to the second shell 12 forms a spray head zone.

[0035] The first housing 11 is fixedly connected to the base (not shown).

[0036] The second housing 12 is movably connected to the first housing 11 through the guide mechanism 2, and moves closer to or further away from the first housing 11 under the drive of the lifting device 3, thereby realizing the closing or opening of the reaction chamber. Figure 2 The diagram schematically illustrates the structure of the second housing and the first housing in their closed states. Figure 3The diagram schematically illustrates the reaction chamber in the open state, in which the second housing rises relative to the first housing and separates from the first housing under the action of the lifting device, thereby opening the reaction chamber.

[0037] Compared to the three-section chamber structure in the prior art, the chamber body 1 in this embodiment reduces and simplifies the composition structure, improving the three-section structure in the prior art to a two-section structure. This two-section structure design can reduce one sealing mechanism compared to the three-section structure in the prior art, which can effectively reduce the risk of gas leakage in the reaction chamber.

[0038] In this embodiment, the second housing 12 is opened or closed by the lifting device 3, which effectively saves manpower, improves the efficiency of daily maintenance, and avoids accidental injury during manual disassembly and installation.

[0039] In this embodiment, the second housing 12 is connected to the first housing 11 through the guide mechanism 2, so that the first housing 11 and the second housing 12 can achieve precise alignment and cooperation after opening and closing, and at the same time improve the overall structural rigidity.

[0040] Furthermore, the first housing 11 has a first cavity 111 (such as...) Figure 2 The second housing 12 has a second cavity (not shown), and the first cavity 111 and the second cavity together form a reaction chamber. The first cavity 111 contains a base (not shown) for supporting the wafer. The base integrates heating functionality, enabling precise temperature control of the wafer to meet the stringent temperature requirements of different processes. The second cavity contains a spray head (not shown), which is responsible for uniformly spraying process gases onto the wafer surface, ensuring uniform gas distribution within the cavity. This is crucial for processes such as chemical vapor deposition (CVD), ensuring uniform film deposition on the wafer.

[0041] refer to Figure 2 and Figure 4 In some embodiments, a port 15 is provided on the side wall of the first housing 11. Port 15 is used for connection to an external wafer transfer system (not shown). After the port 15 is connected to the external wafer transfer system 7 (e.g....), Figure 4 , Figure 4 The diagram schematically illustrates a connection port of the external wafer transport system 7, used for wafer loading and unloading. Figure 4 The diagram demonstrates how the external wafer transfer system 7 achieves rapid wafer transfer while maintaining the chamber vacuum. Furthermore, an O-ring is provided between port 15 and the connection port of the external wafer transfer system 7, which effectively improves the sealing performance between port 15 and the external wafer transfer system 7.

[0042] In this embodiment, port 15 is located on the first housing 11, which effectively simplifies the daily maintenance procedure of the equipment, improves the maintenance efficiency, and also avoids the risk of reduced airtightness and gas leakage caused by repeated disassembly and installation of port 15. The specific analysis is as follows: In the existing three-section structure, the valve port 51 is located in the middle section of the three-section structure (e.g., Figure 1 The connection is located on the connecting wall 5. During each equipment maintenance, the connection between the valve port 51 and the external wafer transfer system 7 must be disconnected first, and then the connecting wall 5, located in the middle of the reaction chamber, must be removed. After maintenance, a three-section assembly is performed. During assembly, the installation position of the connecting wall 5 needs to be determined based on the engagement position between the valve port 51 and the external wafer transfer system 7. Therefore, repeated alignment and correction are required when installing the connecting wall 5, while also considering the sealing of the port 15. This significantly increases the workload of routine preventative equipment maintenance and greatly reduces the efficiency of daily maintenance. In this embodiment, the port 15 is located on the first housing 11 (e.g., Figure 4 During routine maintenance, the first housing 11 remains stationary. The second housing 12 can be raised by lifting to open the reaction chamber, making maintenance work convenient. During this process, since the first housing 11 remains stationary, the connection between port 15 and the external wafer transmission system 7 does not need to be disconnected, saving the disassembly and installation work at the port 15 connection point. This greatly improves the efficiency of routine maintenance and also reduces the risk of reduced sealing of port 15 and gas leakage due to repeated disassembly and installation.

[0043] refer to Figure 2 In some embodiments, the guide mechanism 2 includes multiple guide components, which are spaced apart along the outer side of the chamber body 1; in this embodiment, the guide mechanism 2 includes a first guide component 21 and a second guide component 22, which cooperate with the lifting device 3 to maintain a balanced force on the hand of the second housing 12.

[0044] In some embodiments, the guide assembly includes a guide rail and a slider (not shown), with the slider slidably connected to the guide rail; the guide rail is connected to the first housing 11, and the slider is connected to the second housing 12. The guide mechanism 2, composed of the guide rail and the slider, has good structural rigidity and precision, effectively maintaining a more stable and reliable movement of the second housing 12 relative to the first housing 11, and ensuring precise alignment of the second housing 12 and the first housing 11 during the opening and closing process.

[0045] In some embodiments, the lifting device 3 includes a drive motor 37 and a lead screw drive mechanism; the second housing 12 is connected to the first housing 11 through the lead screw drive mechanism, and the lead screw drive mechanism drives the second housing 12 to move closer to or away from the first housing 11 under the drive of the drive motor, thereby realizing the closing or opening of the reaction chamber.

[0046] refer to Figure 5 Specifically, the lead screw transmission mechanism includes a frame 31, a lead screw 32, a first support base 33, a second support base 34, a moving block 35, and a guide plate 36. The first support base 33 and the second support base 34 are fixedly connected to the frame 31, and both ends of the lead screw 32 are rotatably connected to the first support base 33 and the second support base 34, respectively. The moving block 35 is threadedly connected to the lead screw 32, and both sides of the moving block 35 are slidably connected to the guide plate 36, which is fixedly mounted on the frame. A drive motor 37 is fixedly mounted on the frame, and the power output end of the drive motor is connected to one end of the lead screw via a coupling. In this embodiment, the frame 31 is fixedly connected to the first housing, and the moving block 35 is fixedly connected to the second housing.

[0047] The lead screw drive mechanism has a compact structure, good load capacity, and strong smoothness of movement. It can achieve stable lifting of the second housing 12 and precise docking with the first housing 11.

[0048] In other embodiments, the lifting device 3 is a drive cylinder, the cylinder barrel of which is connected to the first housing 11, and the piston of which is connected to the second housing 12.

[0049] In some embodiments, a sealing element is provided between the first housing 11 and the second housing 12 of the reaction chamber. In this embodiment, the sealing element is an O-ring; an O-ring is a rubber sealing ring with a circular cross-section, usually made of nitrile rubber, fluororubber, etc., which is low in cost and simple to manufacture. During installation, it is compressed to produce elastic deformation, forming contact pressure at the contact surface to achieve a seal. In this embodiment, the first housing 11 has a first annular groove (not shown) for installing the O-ring, specifically formed on the end face where the first housing 11 and the second housing 12 mate.

[0050] In some embodiments, at least one observation port is provided on the side wall of the first housing 11 for observing the reaction within the reaction chamber. In this embodiment, the first housing 11 has a first observation port 13 and a second observation port 14, which face different directions to facilitate observation of the reaction chamber from different angles. Specifically, both the first and second observation ports 13 and 14 are rectangular observation ports of 20cm × 5cm. The vertical distance between the upper edges of the first and second observation ports 13 and 14 and the joint surface between the first housing 11 and the second housing 12 is greater than or equal to 2cm. Within this size range, deformation of the first and second observation ports 13 and 14 under high temperature and contact pressure can be effectively prevented. In this embodiment, the upper edges of the first and second observation ports 13 and 14 are 2cm away from the upper opening of the first housing 11.

[0051] In some embodiments, the distance between the upper edge of port 15 and the upper edge of the first housing 11 is greater than 2 cm. Within this size range, the port 15 can be effectively prevented from deforming under high temperature and contact pressure. Port 15 is a 20 cm × 5 cm rectangular structure.

[0052] In some embodiments, port 15 has a connecting flange 151, and port 15 is fixedly connected to the external wafer transfer system 7 through the connecting flange 151. The connecting flange 151 has a second annular groove for installing a seal, and the seal is fitted into the second annular groove. The seal can be an O-ring.

[0053] In summary, the reaction chamber of this chemical vapor deposition equipment is redesigned from a three-section chamber structure to a two-section structure, effectively reducing the number of sealing mechanisms required for the main chamber and thus significantly lowering the risk of gas leakage. The lifting device opens or closes the reaction chamber via the second housing, saving manpower, improving the efficiency of daily maintenance, and avoiding accidental injuries during manual disassembly and installation. The second housing is connected to the first housing via a guide mechanism, ensuring precise alignment and fit between the two housings after opening and closing, while also improving overall structural rigidity. The port for interfacing with the external wafer transfer system is located on the first housing, eliminating the need for disassembly and installation at the port connection during routine equipment maintenance, greatly improving maintenance efficiency, and reducing the risk of reduced port sealing and gas leakage due to repeated disassembly and installation. Therefore, this invention effectively overcomes the various shortcomings of existing technologies and has high industrial application value.

[0054] The above description is merely a specific implementation of the embodiments of this application, but the protection scope of the embodiments of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the embodiments of this application should be covered within the protection scope of the embodiments of this application. Therefore, the protection scope of the embodiments of this application should be determined by the protection scope of the claims.

Claims

1. A reaction chamber of a chemical vapor deposition apparatus, characterized in that: The chamber includes a main body, which comprises a first shell and a second shell disposed opposite to each other; the second shell cooperates with the first shell to form a reaction chamber. The first housing is fixedly connected to the base; The second housing is movably connected to the first housing through a guide mechanism, and moves closer to or further away from the first housing under the action of the lifting device, thereby realizing the closing or opening of the reaction chamber; The first housing has a port on its side wall, which is used to connect to an external wafer transfer system.

2. The reaction chamber of the chemical vapor deposition apparatus according to claim 1, characterized in that: The guiding mechanism includes multiple guiding components, which are spaced apart along the outer side of the chamber body.

3. The reaction chamber of the chemical vapor deposition apparatus according to claim 2, characterized in that: The guiding assembly includes a guide rail and a slider, the slider being slidably connected to the guide rail; the guide rail is connected to the first housing, and the slider is connected to the second housing.

4. The reaction chamber of the chemical vapor deposition apparatus according to claim 1, characterized in that: The lifting device includes a drive motor and a lead screw transmission mechanism; the second housing is connected to the first housing through the lead screw transmission mechanism, and the lead screw transmission mechanism drives the second housing to move closer to or away from the first housing under the drive of the drive motor, thereby realizing the closing or opening of the reaction chamber.

5. The reaction chamber of the chemical vapor deposition apparatus according to claim 1, characterized in that: The lifting device is a drive cylinder, the cylinder barrel of the drive cylinder is connected to the first housing, and the piston of the drive cylinder is connected to the second housing.

6. The reaction chamber of the chemical vapor deposition apparatus according to claim 1, characterized in that: A seal is provided between the first and second housings of the reaction chamber.

7. The reaction chamber of the chemical vapor deposition apparatus according to claim 1, characterized in that: At least one observation port is provided on the side wall of the first housing, and the observation port is used to observe the reaction in the reaction chamber.

8. The reaction chamber of the chemical vapor deposition apparatus according to claim 1, characterized in that: The distance between the upper edge of the port and the upper edge of the first housing is greater than 5 mm.

9. The reaction chamber of the chemical vapor deposition apparatus according to claim 1, characterized in that: The port has a connecting flange.

10. The reaction chamber of the chemical vapor deposition apparatus according to claim 1, characterized in that: The first housing has a first cavity, and the second housing has a second cavity, the first cavity and the second cavity together forming the reaction chamber; The first cavity is provided with a base for supporting the wafer, and the second cavity is provided with a spray head for uniformly spraying process gas onto the wafer surface.

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