Wafer conveying device of atomic layer deposition equipment

Abstract

The utility model provides a wafer conveying device of atomic layer deposition equipment, which relates to the technical field of wafer conveying, and comprises a wafer box in which wafers arranged in order are placed; a containing cavity is formed in the box body, a pretreatment device is arranged in the containing cavity, a reaction gas input port and an exhaust port are formed in the inner wall of the containing cavity, the reaction gas input port and the exhaust port penetrate through the inner wall of the containing cavity to the outer side face of the box body, and the exhaust port is used for exhausting gas; and the conveying part is arranged on one side of the box body, and the conveying part is used for conveying the wafer box. The reaction gas input port can accurately control the flow, the type and the proportion of reaction gas entering the box body, precise regulation and control of atomic layer deposition process parameters are achieved in combination with the vacuum environment, the conveying part automatically conveys wafer boxes and is in close fit with the pretreatment and deposition process in the box body, and automation of the production process is achieved.

Description

Technical Field

[0001] This utility model relates to the field of wafer transport technology, and more specifically, to a wafer transport device for atomic layer deposition equipment. Background Technology

[0002] Atomic layer deposition (ALD) is a technique for precisely depositing ultrathin thin films on substrate surfaces, with crucial applications in numerous fields such as semiconductor manufacturing, nanotechnology, and microelectromechanical systems (MEMS). For example, in semiconductor chip manufacturing, high-quality insulating and conductive layers need to be deposited on the wafer surface to achieve high performance and miniaturization of the chip. ALD technology enables precise control of the growth of atomic layers, allowing for precise control over the film thickness, composition, and structure, thereby meeting the stringent material performance requirements of these high-end applications.

[0003] Atomic layer deposition (ALD) requires extremely high environmental cleanliness; even the smallest particulate contaminants can affect the quality and performance of the thin film. Traditional conveying devices may generate particulate contaminants during operation, such as wear particles from mechanical parts. If these particles adhere to the wafer surface, they can form defects in the ALD film, affecting the chip's reliability and lifespan.

[0004] Therefore, there is an urgent need for a technology to replace existing wafer transport devices in order to solve the problem of how to quickly clean, improve cleaning quality, and enhance thin film performance. Summary of the Invention

[0005] In view of this, the present invention proposes a wafer transport device for atomic layer deposition equipment, which aims to solve the problem of how to quickly clean, improve cleaning quality, and improve thin film performance.

[0006] This utility model provides a wafer transport device for atomic layer deposition equipment, comprising:

[0007] A wafer box, which contains neatly arranged wafers;

[0008] The housing has an internal cavity containing a pretreatment device. The inner wall of the cavity has a reaction gas inlet and an exhaust outlet, which extend through the inner wall to the outer side of the housing. The exhaust outlet is used to discharge gas.

[0009] A conveying section is disposed on one side of the housing, the conveying section being used to convey the wafer cassette.

[0010] Furthermore, the exhaust port is used to provide a vacuum environment for the reaction, and the reaction gas inlet is used to input reaction gas to form an inert gas environment on the wafer surface.

[0011] Furthermore, both the top and bottom ends of the wafer cassette are open. The diameter of the opening at the bottom of the wafer cassette is smaller than the diameter of the wafer. A positioning device is provided at the bottom of the wafer cassette. The positioning device includes a positioning ring. A positioning slider is provided on the inner side of the positioning ring. A positioning washer is provided on the outer side of the positioning ring. The positioning washer is flush with the upper surface of the positioning ring.

[0012] Furthermore, the pretreatment device includes a drainage mechanism, a drying mechanism, a cleaning mechanism, and a first telescopic mechanism.

[0013] Furthermore, the drainage mechanism includes a drainage trough, a drainage hole is provided on the side of the drainage trough, a sealing plug is detachably connected to the drainage hole, a drainage plate is provided above the drainage trough, the drainage plate is convex in shape, and leakage holes are provided on the low water plates on both sides of the drainage plate.

[0014] Furthermore, the drying mechanism includes a dryer disposed on the inner wall of the receiving cavity.

[0015] Furthermore, the cleaning mechanism includes a water supply pipe, which is ring-shaped. Several nozzles are provided on the inner side of the water supply pipe, and the nozzles form a 45° angle with the water supply pipe. A support column is fixed to the lower surface of the water supply pipe, and the bottom of the support column is connected to the upper surface of the high water plate of the drainage plate. A water delivery pipe is provided on the upper surface of the water supply pipe, which passes through the receiving cavity to the outside of the box. A water pump is provided at the end of the water delivery pipe.

[0016] Furthermore, the first telescopic mechanism includes a first telescopic rod, the bottom of which is rotatably connected to the upper surface of the high water plate of the drainage board, and a positioning slide rail is provided at the top of the first telescopic rod. The positioning slide rail corresponds to the shape of the positioning slider. A rotary motor is provided on the lower surface of the high water plate of the drainage board, and the output end of the rotary motor shaft is connected to the bottom of the first telescopic rod.

[0017] Furthermore, the upper side of the box body is provided with strip-shaped square holes, the top of the box body is provided with a door, the strip-shaped square holes are fitted onto the door, the upper and lower ends of the door are provided with drive plates, the drive plates are L-shaped, the bottom of the drive plates are provided with racks, the two sides of the box body are respectively provided with two sets of drive motors, the output end of the drive motor shaft is connected to a gear, the gear meshes with the rack, and the door is a two-door, the two doors are provided correspondingly.

[0018] Furthermore, the conveying unit includes:

[0019] The support assembly is provided with a base, the side of which is connected to the outer side of the drainage channel. Two support plates are provided on the upper surface of the base, and a base platform is provided on the upper surface of the two support plates. A second telescopic rod is fixed to the upper surface of the base platform, and a platform support frame is provided on the upper surface of the base.

[0020] The conveying assembly includes a vertical connecting plate and a horizontal connecting plate, which are sleeved on a platform support frame. Horizontal support plates are fixed to both sides of the vertical connecting plate, and the horizontal support plates are fixed to the horizontal connecting plates. The lower surface of the horizontal connecting plate is connected to the top of the second telescopic rod, and a third telescopic rod is provided at the bottom of the vertical connecting plate. The end of the third telescopic rod away from the vertical connecting plate is connected to the base.

[0021] Furthermore, the conveying assembly also includes a transverse platform, which is disposed above the transverse connecting plate and slidably connected to the transverse support plate. The transverse platform is sleeved on both sides of the transverse support plate, and push plates are provided on both sides of the transverse platform. The push plates are perpendicularly fixed to the transverse platform. A push rod is provided on the side of the push plate near the platform support frame. A hydraulic press is connected to the end of the push rod away from the push plate. The hydraulic press is connected to the transverse support plate through a fixed frame. A clamping groove is provided in the middle of the upper surface of the transverse platform. The diameter of the clamping groove is smaller than the diameter of the positioning washer.

[0022] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0023] 1. Wafer bins provide a standardized carrying unit for wafers, facilitating the handling, transportation, and flow of multiple wafers as a whole on the production line. At the same time, the orderly arrangement also facilitates the counting and management of wafer quantities, improving logistics efficiency in the production process.

[0024] 2. The pretreatment unit inside the enclosure can perform pretreatment operations such as cleaning on the wafer. Cleaning can remove impurities, particles, and other contaminants from the wafer surface, providing a clean surface for subsequent processes such as atomic layer deposition, which helps to improve the quality of thin film deposition.

[0025] 3. By creating a vacuum environment through the exhaust port, the residual air and other impurities in the chamber can be reduced to the greatest extent. The inert gas environment formed on the wafer surface can protect the wafer surface from the effects of oxidation, corrosion and other chemical reactions. Attached Figure Description

[0026] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0027] Figure 1 A schematic diagram of the wafer conveying device for an atomic layer deposition equipment provided in this embodiment of the present invention;

[0028] Figure 2 This is a schematic diagram of the structure of the wafer cassette provided in an embodiment of the present invention;

[0029] Figure 3 This is a schematic diagram of the internal structure of the box provided in an embodiment of the present utility model;

[0030] Figure 4 A cross-sectional view of the box body provided in an embodiment of this utility model;

[0031] Figure 5 A schematic diagram of the structure of the first compression rod provided in an embodiment of this utility model;

[0032] Figure 6 This is a schematic diagram of the conveying section provided in an embodiment of the present utility model.

[0033] In the diagram: 100-Wafer box; 101-Receiving cavity; 102-Wafer; 103-Positioning device; 104-Positioning washer; 105-Positioning ring; 106-Positioning slider; 200-Box body; 210-Drainage groove; 211-Sealing plug; 220-Reaction gas inlet; 230-Exhaust port; 240-Box door; 241-Drive board; 250-Drive motor; 251-Gear; 260-Strip square hole; 300-Conveying section; 310-Platform support frame; 330-Base; 340-Support plate; 350-Second Telescopic rod; 360-Base; 400-Conveying assembly; 410-Transverse support plate; 420-Push rod; 421-Push plate; 422-Hydraulic press; 430-Clamping groove; 440-Transverse platform; 450-Transverse connecting plate; 510-Water pump; 520-Water pipe; 530-Water supply pipeline; 531-Sprayer head; 540-Leakage hole; 550-Dryer; 560-Drainage plate; 570-First telescopic rod; 580-Rotary motor; 600-Positioning slide rail; 700-Third telescopic rod; 710-Vertical connecting plate. Detailed Implementation

[0034] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this utility model, but are not intended to limit the scope of this utility model.

[0035] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0036] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0037] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0038] See Figure 1 As shown, this embodiment provides a wafer transport device for an atomic layer deposition (ALD) apparatus, including:

[0039] The wafer box 100 contains neatly arranged wafers 102.

[0040] The housing 200 has an internal cavity 101, which is equipped with a pretreatment device. The inner wall of the cavity 101 has a reaction gas inlet 220 and an exhaust port 230. The reaction gas inlet 220 and the exhaust port 230 penetrate the inner wall of the cavity 101 to the outer side of the housing 200. The exhaust port 230 is used to discharge gas.

[0041] The conveying unit 300 is disposed on one side of the housing 200 and is used to convey the wafer cassette 100.

[0042] Specifically, the exhaust port 230 is used to provide a vacuum environment for the reaction, and the reaction gas inlet 220 is used to input reaction gas to form an inert gas environment on the surface of the wafer 102.

[0043] As described above, the wafers 102 to be processed are neatly arranged and placed in the wafer cassette 100. After the wafer cassette 100 enters the receiving cavity 101, the inlet is quickly closed, and the pre-processing device in the receiving cavity 101 starts working. According to the process requirements, the wafers 102 are pre-processed to remove particulate impurities from their surface. The vacuum system connected through the exhaust port 230 starts working, gradually extracting air and other gases from the receiving cavity 101 to create a vacuum environment for the reaction. After reaching the predetermined vacuum level, an inert gas, such as argon (Ar) or nitrogen (N2), is introduced into the receiving cavity 101 through the reaction gas inlet 220. The inert gas slowly fills the receiving cavity 101, gradually forming an inert gas environment on the surface of the wafers 102.

[0044] Understandably, this environment can protect the surface of wafer 102 from chemical effects such as oxidation and corrosion, providing a stable background atmosphere for subsequent reactions such as atomic layer deposition, while also helping to reduce reaction risks and ensure operational safety.

[0045] See Figure 2 As shown, both the upper and lower ends of the wafer cassette 100 are open. The diameter of the lower opening of the wafer cassette 100 is smaller than the diameter of the wafer 102. A positioning device 103 is provided at the bottom of the wafer cassette 100. The positioning device 103 includes a positioning ring 105. A positioning slider 106 is provided on the inner side of the positioning ring 105. A positioning washer 104 is provided on the outer side of the positioning ring 105. The positioning washer 104 is flush with the upper surface of the positioning ring 105.

[0046] Understandably, the wafer cassette 100 has openings at both the top and bottom. This design makes it easier to insert and remove the wafer 102 from the cassette 100. The diameter of the lower opening is smaller than the diameter of the wafer 102, providing some positioning and support for the wafer 102. When the wafer 102 is placed inside the wafer cassette 100, the edge of the lower opening contacts the edge of the wafer 102, restricting the horizontal movement of the wafer 102 and ensuring that the wafer 102 maintains a relatively stable position inside the cassette. The positioning washer 104 provides a flat support surface, ensuring that the wafer 102 maintains good flatness in the horizontal direction.

[0047] See Figure 3 and Figure 4 As shown, the pretreatment device includes a drainage mechanism, a drying mechanism, a cleaning mechanism, and a first telescopic mechanism.

[0048] Specifically, the drainage mechanism includes a drainage trough 210, a drainage hole is provided on the side of the drainage trough 210, a sealing plug 211 is detachably connected to the drainage hole, a drainage plate 560 is provided above the drainage trough 210, the drainage plate 560 is convex in shape, and the low water plates on both sides of the drainage plate 560 are provided with leakage holes 540.

[0049] Specifically, the drying mechanism includes a dryer 550 disposed on the inner wall of the receiving cavity 101.

[0050] Specifically, the cleaning mechanism includes a water supply pipe 530, which is ring-shaped. Several nozzles 531 are provided on the inner side of the water supply pipe 530. The nozzles 531 form an angle of 45° with the water supply pipe 530. A support column is fixed to the lower surface of the water supply pipe 530. The bottom of the support column is connected to the upper surface of the high water plate of the drainage plate 560. A water delivery pipe 520 is provided on the upper surface of the water supply pipe 530. The water delivery pipe 520 passes through the receiving cavity 101 to the outside of the box 200. A water pump 510 is provided at the end of the water delivery pipe 520.

[0051] See Figure 5 As shown, the first telescopic mechanism includes a first telescopic rod 570. The bottom of the first telescopic rod 570 is rotatably connected to the upper surface of the high water plate of the drainage plate 560. A positioning slide rail 600 is provided at the top of the first telescopic rod 570. The positioning slide rail 600 corresponds to the shape of the positioning slider 106. A rotary motor 580 is provided on the lower surface of the high water plate of the drainage plate 560. The output end of the rotating shaft of the rotary motor 580 is connected to the bottom of the first telescopic rod 570.

[0052] As described above, the wafer cassette 100 containing wafer 102 is transported to a designated position within the housing cavity 101 of the enclosure 200. The water supply pump 510 is then activated, and water flows through the water supply pipe 520 into the annular water supply pipe 530. Since the nozzle 531 forms a 45° angle with the water supply pipe 530, the cleaning fluid sprayed from the nozzle 531 is directed at a certain angle onto the surface of wafer 102. This angle design allows the cleaning fluid to more comprehensively cover the surface of wafer 102, effectively rinsing away impurities, particles, and other contaminants. After rinsing wafer 102, the cleaning fluid flows down its surface, passing through the drain holes 540 on the lower water plates on both sides of the drain plate 560, and collects in the drain trough 210. The drain plate 560 is convex in shape, and the higher water plate provides support for the water supply pipe 530 and related components. After cleaning, if drainage is required, the sealing plug 211 on the drain hole can be removed. The drainage holes on the side of the drainage trough 210 are used to drain the wastewater after cleaning. Then, the dryer 550, located on the inner wall of the receiving cavity 101, is turned on. The dryer 550 starts working, blowing hot air into the receiving cavity 101 to dry the cleaned wafer 102. The hot air is evenly blown onto the surface of the wafer 102, causing residual moisture to evaporate quickly, ensuring that the wafer 102 is completely dry before entering the next process. During the above process, the rotating shaft of the rotary motor 580 drives the bottom of the first telescopic rod 570 to rotate, allowing the first telescopic rod 570 to rotate within a certain angle range. The positioning slide rail 600 at the top of the first telescopic rod 570 corresponds in shape to the positioning slider 106. The positioning slide rail 600 cooperates with the positioning slider 106 in the wafer cassette 100 positioning device 103, driving the wafer cassette 100 to rotate, achieving a comprehensive pre-treatment effect.

[0053] Understandably, the positioning slide rail 600 at the top of the first telescopic rod 570 cooperates with the positioning slider 106 in the positioning device 103 of the wafer cassette 100, which not only precisely adjusts the position of the wafer 102, but also firmly fixes the wafer 102 in the required position after adjustment. This precise positioning function ensures the stability of the wafer 102 during the preprocessing process, and works in conjunction with the positioning device 103 of the wafer cassette 100 to ensure the positional accuracy of the wafer 102 throughout the preprocessing process, thereby improving the consistency and reliability of the preprocessing effect and providing subsequent processes with accurately positioned and well-preprocessed wafers 102.

[0054] Specifically, the upper side of the box body 200 is provided with a strip-shaped square hole 260, and the top of the box body 200 is provided with a door 240. The strip-shaped square hole 260 is fitted onto the door 240. The upper and lower ends of the door 240 are provided with drive plates 241. The drive plates 241 are L-shaped and the bottom of the drive plates 241 is provided with a rack. Two sets of drive motors 250 are provided on the two sides of the box body 200 respectively. The output end of the drive motor 250 shaft is connected to a gear 251. The gear 251 meshes with the rack. The door 240 is a two-door, and the two doors 240 are provided correspondingly.

[0055] As can be seen from the above, when the enclosure door 240 needs to be opened, the control system sends a command to the two sets of drive motors 250, and the drive motors 250 start to run. The gear 251 connected to the output end of the drive motor 250 shaft begins to rotate. Since the gear 251 meshes with the rack at the bottom of the drive plate 241, the rack will be subjected to a horizontal force as the gear 251 rotates. Because the drive plate 241 is L-shaped and fixed at both ends of the enclosure door 240, the drive plate 241 will move horizontally under the drive of the rack, thereby causing the enclosure door 240 to slide open to both sides along the strip-shaped square hole 260. Since the enclosure door 240 has two doors that are correspondingly set, the two doors will move in opposite directions at the same time, thereby opening the top of the enclosure 200 and providing a passage for the wafer box 100 to enter and exit or for internal maintenance operations.

[0056] Understandably, the two sliding doors 240 open to the sides, quickly and fully exposing the top space of the enclosure 200. This is extremely convenient for transporting the wafer cassette 100, allowing it to smoothly enter and exit the enclosure 200. In automated production processes, the quick-opening and closing doors 240 can reduce waiting time during wafer 102 transport, improving overall production efficiency.

[0057] See Figure 6 As shown, the conveying unit 300 includes:

[0058] The support assembly is provided with a base 330, the side of the base 330 is connected to the outer side of the drainage channel 210, two support plates 340 are provided on the upper surface of the base 330, a base platform 360 is provided on the upper surface of the two support plates 340, a second telescopic rod 350 is fixedly connected to the upper surface of the base platform 360, and a platform support frame 310 is provided on the upper surface of the base 330.

[0059] The conveying assembly 400 includes a vertical connecting plate 710 and a horizontal connecting plate 450. The vertical connecting plate 710 and the horizontal connecting plate 450 are sleeved on the platform support frame 310. The horizontal support plate 410 is fixedly connected to both sides of the vertical connecting plate 710. The horizontal support plate 410 is fixedly connected to the horizontal connecting plate 450. The lower surface of the horizontal connecting plate 450 is connected to the top of the second telescopic rod 350. A third telescopic rod 700 is provided at the bottom of the vertical connecting plate 710. The end of the third telescopic rod 700 away from the vertical connecting plate 710 is connected to the base 330.

[0060] Specifically, the conveying assembly 400 also includes a transverse platform 440, which is disposed above the transverse connecting plate 450 and slidably connected to the transverse support plate 410. The transverse platform 440 is sleeved on both sides of the transverse support plate 410. Push plates 421 are provided on both sides of the transverse platform 440. The push plates 421 are perpendicularly fixed to the transverse platform 440. Push rods 420 are provided on the surface of the push plates 421 near the platform support frame 310. The end of the push rods 420 away from the push plates 421 is connected to a hydraulic press 422. The hydraulic press 422 is connected to the transverse support plate 410 through a fixed frame. A clamping groove 430 is provided in the middle of the upper surface of the transverse platform 440. The diameter of the clamping groove 430 is smaller than the diameter of the positioning washer 104.

[0061] Understandably, the vertical connecting plate 710 and the horizontal connecting plate 450 of the conveying assembly 400 are fitted onto the platform support frame 310 and can move along the platform support frame 310. The horizontal support plate 410 connects the vertical connecting plate 710 and the horizontal connecting plate 450, forming a stable structure. The third telescopic rod 700 connects the bottom of the vertical connecting plate 710 to the base 330, also in its initial state, providing support and a certain degree of freedom of movement for the vertical connecting plate 710. The horizontal platform 440 is fitted onto both sides of the horizontal support plate 410 and can slide on the horizontal support plate 410. The push plate 421 is vertically fixed to both sides of the horizontal platform 440, and the push rod 420 connects the push plate 421 to the hydraulic press 422. The hydraulic press 422 is connected to the horizontal support plate 410 through a fixed frame, and at this time, the hydraulic press 422 is in an unstarted state. The clamping groove 430 in the middle of the upper surface of the horizontal platform 440 is prepared for placing the wafer cassette 100.

[0062] Specifically, after the wafer cassette 100 completes its pre-processing, the first telescopic mechanism transports the wafer cassette 100 outside the housing 200. When the conveying unit 300 grasps the wafer cassette 100, according to the control system's command, the second telescopic rod 350 and the third telescopic rod 700 extend or retract, causing the transverse connecting plate 450 and its connected vertical connecting plate 710, transverse support plate 410, etc., to rise or fall as a whole, adjusting the height of the conveying assembly 400 to match the height of the wafer cassette 100. When the conveying assembly 400 moves to the appropriate position, aligning the clamping slot 430 on the transverse platform 440 with the wafer cassette 100, the hydraulic press 422 starts. Utilizing the cooperation between the clamping slot 430 and the wafer cassette 100, the wafer cassette 100 is securely clamped onto the transverse platform 440. After the wafer cassette 100 is securely clamped, the positioning slide rail 600 disengages from the positioning slider 106, and the first telescopic rod 570 returns to its initial position. Subsequently, the second telescopic rod 350 and the third telescopic rod 700 work together to adjust the height again, so that the wafer cassette 100 reaches a suitable conveying height, thus avoiding collisions with other equipment components during the conveying process.

[0063] Understandably, after the wafer cassette 100 is securely clamped, the positioning slide rail 600 disengages from the positioning slider 106, and the first telescopic rod 570 returns to its initial position. This operation ensures that the smoothness of the conveying process is not affected by interference from the positioning device 103. Simultaneously, the reset of the first telescopic rod 570 prepares for the next pre-processing operation, ensuring that all parts of the equipment can work in an orderly, cyclical manner, thus improving the reliability and stability of the equipment operation.

[0064] Compared with existing technologies, the advantages of this invention are that the wafer box 100 provides a standardized carrying unit for the wafer 102, facilitating the handling, transportation, and flow of multiple wafers 102 as a whole on the production line. Simultaneously, the orderly arrangement facilitates the counting and management of the number of wafers 102, improving logistics efficiency in the production process. The pre-treatment device installed inside the box 200 can perform pre-treatment cleaning of the wafers 102. Cleaning removes impurities, particles, and other contaminants from the surface of the wafers 102, providing a clean surface for subsequent processes such as atomic layer deposition, thus improving the quality of thin film deposition. The vacuum environment created by the exhaust port 230 minimizes residual air and other impurity gases within the box 200, forming an inert gas environment on the surface of the wafers 102 to protect it from oxidation, corrosion, and other chemical effects.

[0065] It will be understood by those skilled in the art that the above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A wafer conveying device for atomic layer deposition equipment, characterized in that, include: A wafer case, the interior of which is used to hold wafers; The housing has an internal cavity containing a pretreatment device. The inner wall of the cavity has a reaction gas inlet and an exhaust outlet, which extend through the inner wall to the outer side of the housing. The exhaust outlet is used to discharge gas. A conveying section is disposed on one side of the housing, the conveying section being used to convey the wafer cassette.

2. The wafer conveying device for atomic layer deposition equipment according to claim 1, characterized in that, The wafer cassette has openings at both the top and bottom. The diameter of the opening at the bottom of the wafer cassette is smaller than the diameter of the wafer. A positioning device is provided at the bottom of the wafer cassette. The positioning device includes a positioning ring. A positioning slider is provided on the inner side of the positioning ring. A positioning washer is provided on the outer side of the positioning ring. The positioning washer is flush with the upper surface of the positioning ring.

3. The wafer conveying device for atomic layer deposition equipment according to claim 2, characterized in that, The pretreatment device includes a drainage mechanism, a drying mechanism, a cleaning mechanism, and a first telescopic mechanism.

4. The wafer conveying device for atomic layer deposition equipment according to claim 3, characterized in that, The drainage mechanism includes a drainage trough, a drainage hole is provided on the side of the drainage trough, a sealing plug is detachably connected to the drainage hole, a drainage plate is provided above the drainage trough, the drainage plate is convex in shape, and leakage holes are provided on the low water plates on both sides of the drainage plate.

5. The wafer conveying device for atomic layer deposition equipment according to claim 3, characterized in that, The drying mechanism includes a dryer installed on the inner wall of the receiving cavity.

6. The wafer conveying device for atomic layer deposition equipment according to claim 4, characterized in that, The cleaning mechanism includes a water supply pipe, which is ring-shaped. Several nozzles are provided on the inner side of the water supply pipe, and the nozzles form a 45° angle with the water supply pipe. A support column is fixed to the lower surface of the water supply pipe, and the bottom of the support column is connected to the upper surface of the high water plate of the drainage plate. A water delivery pipe is provided on the upper surface of the water supply pipe, which passes through the receiving cavity to the outside of the box. A water pump is provided at the end of the water delivery pipe.

7. The wafer conveying device for atomic layer deposition equipment according to claim 4, characterized in that, The first telescopic mechanism includes a first telescopic rod, the bottom of which is rotatably connected to the upper surface of the high water plate of the drainage board. A positioning slide rail is provided at the top of the first telescopic rod, and the positioning slide rail corresponds to the shape of the positioning slider. A rotary motor is provided on the lower surface of the high water plate of the drainage board, and the output end of the rotary motor shaft is connected to the bottom of the first telescopic rod.

8. The wafer conveying device for atomic layer deposition equipment according to claim 1, characterized in that, The upper side of the box body is provided with a strip-shaped square hole. The top of the box body is provided with a door. The strip-shaped square hole is fitted onto the door. The upper and lower ends of the door are provided with drive plates. The drive plates are L-shaped. The bottom of the drive plates is provided with a rack. Two sets of drive motors are provided on the two sides of the box body respectively. The output end of the drive motor shaft is connected to a gear. The gear meshes with the rack. The door is a double door. The two doors are provided correspondingly.

9. The wafer conveying device for atomic layer deposition equipment according to claim 4, characterized in that, The conveying unit includes: The support assembly is provided with a base, the side of which is connected to the outer side of the drainage channel. Two support plates are provided on the upper surface of the base, and a base platform is provided on the upper surface of the two support plates. A second telescopic rod is fixed to the upper surface of the base platform, and a platform support frame is provided on the upper surface of the base. The conveying assembly includes a vertical connecting plate and a horizontal connecting plate, which are sleeved on a platform support frame. Horizontal support plates are fixed to both sides of the vertical connecting plate, and the horizontal support plates are fixed to the horizontal connecting plates. The lower surface of the horizontal connecting plate is connected to the top of the second telescopic rod, and a third telescopic rod is provided at the bottom of the vertical connecting plate. The end of the third telescopic rod away from the vertical connecting plate is connected to the base.

10. The wafer conveying device for atomic layer deposition equipment according to claim 9, characterized in that, The conveying assembly also includes a transverse platform, which is disposed above the transverse connecting plate and slidably connected to the transverse support plate. The transverse platform is sleeved on both sides of the transverse support plate. Push plates are provided on both sides of the transverse platform. The push plates are perpendicularly fixed to the transverse platform. A push rod is provided on the side of the push plate near the platform support frame. A hydraulic press is connected to the end of the push rod away from the push plate. The hydraulic press is connected to the transverse support plate through a fixed frame. A clamping groove is provided in the middle of the upper surface of the transverse platform. The diameter of the clamping groove is smaller than the diameter of the positioning washer.

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