Integrated ultrahigh-voltage chip tantalum capacitor

Abstract

The utility model relates to the technical field of chip-type tantalum capacitors, in particular to an integrated ultrahigh-voltage chip-type tantalum capacitor which comprises a first shell, a second shell is movably arranged above the first shell, and a connecting assembly is fixedly installed on the lower surface of the second shell. The connecting assembly comprises a plurality of connecting rods which are symmetrically and fixedly installed on the lower surface of the second shell, a plurality of stepped grooves are symmetrically formed in the upper surface of the first shell, and the lead assembly is arranged between the first shell and the second shell. According to the utility model, the first shell and the second shell form a closed structure to package the tantalum core assembly, and the first shell and the second shell can be quickly separated after the glue is removed through the fixation of the connecting rod and the glue in the stepped groove, so that the damaged shell can be conveniently replaced; and meanwhile, the shell can be conveniently disassembled for maintenance when the lead plate and the tantalum core assembly are in poor contact, so that capacitor scrapping caused by the part of problems is reduced, and material waste and production cost are reduced.

Description

Technical Field

[0001] This utility model relates to the field of chip tantalum capacitor technology, specifically an integrated ultra-high voltage chip tantalum capacitor. Background Technology

[0002] Electronic products are now trending towards miniaturization and thinner designs. As one of the key components in power electronic equipment, transformers are also moving towards miniaturization. With the continuous development of electronic information equipment, the market demand for chip tantalum capacitors is increasing. Improving production capacity while ensuring quality has become one of the most pressing issues for the electronic components industry.

[0003] In existing chip tantalum capacitors, the tantalum core assembly with lead plates is usually placed inside a mold and encapsulated with epoxy resin during packaging. This results in the chip tantalum capacitor having a single, integral casing. If the casing is damaged during factory testing, the entire capacitor must be scrapped. Furthermore, if there is poor contact between the lead plates and the tantalum core assembly, it is not convenient to disassemble the casing for repair, leading to material waste and increased costs. Utility Model Content

[0004] The purpose of this invention is to provide an integrated ultra-high voltage chip tantalum capacitor to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] An integrated ultra-high voltage chip tantalum capacitor includes:

[0007] A first housing, with a second housing movably mounted above the first housing;

[0008] A connecting assembly is fixedly installed on the lower surface of the second housing. The connecting assembly includes multiple connecting rods that are symmetrically fixedly installed on the lower surface of the second housing. Multiple stepped grooves are symmetrically opened on the upper surface of the first housing.

[0009] The lead wire assembly is located between housing number one and housing number two.

[0010] Furthermore, a locking block is fixedly installed on the outer surface of the connecting rod, and multiple slots communicating with the stepped groove are opened on one side surface of the first housing. The locking block is movably inserted into the slot, and a connecting groove is opened at one end of the outer surface of the connecting rod. Glue is filled between the connecting groove and the stepped groove.

[0011] Furthermore, the upper surface of the first housing and the lower surface of the second housing are both provided with mounting grooves, conductive grooves are symmetrically provided on both sides of the first housing, and insert plates that are symmetrically fixedly installed on the lower surface of the second housing and movably connected to the conductive grooves are inserted into them.

[0012] Preferably, the lead assembly includes:

[0013] The tantalum core assembly is movably positioned inside the mounting slot;

[0014] Tantalum wire is placed inside the tantalum core assembly, with one end penetrating through the tantalum core assembly;

[0015] Washers are fixedly mounted on the outer surface of tantalum wires.

[0016] Preferably, a first lead plate is electrically connected to the outside of the tantalum core assembly, and a second lead plate is electrically connected to the outside of the tantalum wire.

[0017] Preferably, both the first lead plate and the second lead plate have through holes on one side surface, and the second housing has multiple positioning holes on its lower surface.

[0018] Preferably, a plurality of stepped positioning rods are fixedly installed on the upper surface of the first housing, and the stepped positioning rods are movably inserted through the through holes and positioning holes at corresponding positions.

[0019] Compared with the prior art, the beneficial effects of this utility model are:

[0020] 1. By passing a stepped positioning rod through the through hole, the No. 1 and No. 2 lead plates are reinforced, while preventing the No. 1 and No. 2 lead plates from bending and causing the connection to break, thus improving the stability of the tantalum core component during packaging.

[0021] 2. After the lead assembly is installed, insert multiple connecting rods into the stepped grooves at the corresponding positions. Then, inject glue between the connecting grooves and the stepped grooves. After the glue is applied, the No. 1 and No. 2 housings are fixed. By removing the glue, damaged No. 1 and No. 2 housings can be quickly replaced. This also facilitates the disassembly and repair of No. 1 and No. 2 housings when there is poor contact between the No. 1 and No. 2 lead plates and the tantalum core assembly, reducing capacitor scrap caused by this problem and lowering material waste and production costs.

[0022] 3. The conductive groove is L-shaped, with its lower end face located below the first housing. When installing the capacitor, the welding medium drips into the conductive groove and makes an electrical connection with the connected component (such as a circuit board), reducing the overflow of the welding medium and improving the stability during welding. At the same time, the medium is collected into the conductive groove through the first lead plate and the second lead plate, making the distance between the lower surface of the first housing and the connected component smaller, reducing the thickness of the thermally conductive adhesive and improving the heat conduction effect. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0024] Figure 2This is a schematic diagram of the overall disassembled structure of this utility model;

[0025] Figure 3 This is a schematic diagram of the overall vertical cross-sectional structure of this utility model;

[0026] Figure 4 This is a schematic diagram of the vertical cross-sectional structure of the connection between the connecting rod and the stepped groove in this utility model;

[0027] Figure 5 This is a schematic diagram of the overall side cross-sectional structure of this utility model.

[0028] In the diagram: 1. Housing No. 1; 101. Housing No. 2; 102. Mounting slot; 103. Conductive slot; 104. Insert plate; 105. Positioning hole; 2. Connecting assembly; 201. Connecting rod; 202. Connecting slot; 203. Locking block; 204. Locking groove; 205. Stepped groove; 206. Glue; 3. Lead wire assembly; 301. Tantalum core assembly; 302. Tantalum wire; 303. Washer; 304. Lead wire No. 1 plate; 305. Lead wire No. 2 plate; 306. Through hole; 4. Stepped positioning rod. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] Please see Figure 1-5 In this embodiment of the present invention, an integrated ultra-high voltage chip tantalum capacitor includes a first housing 1, a second housing 101 movably disposed above the first housing 1, a connecting assembly 2 fixedly installed on the lower surface of the second housing 101, the connecting assembly 2 including a plurality of connecting rods 201 symmetrically fixedly installed on the lower surface of the second housing 101, a plurality of stepped grooves 205 symmetrically opened on the upper surface of the first housing 1, and a lead assembly 3 disposed between the first housing 1 and the second housing 101; the lead assembly 3 includes: a tantalum core assembly 301 movably disposed inside the mounting groove 102, a tantalum wire 302 disposed inside the tantalum core assembly 301 with one end penetrating through the tantalum core assembly 301, and a washer 303 fixedly disposed on the outer surface of the tantalum wire 302; a first lead plate 304 is electrically connected to the outer side of the tantalum core assembly 301, and a second lead plate 305 is electrically connected to the outer side of the tantalum wire 302.

[0031] Specifically, the first housing 1 and the second housing 101 are connected and closed by inserting the connecting rod 201 and the stepped groove 205, thereby encapsulating the tantalum core assembly 301.

[0032] Example 1

[0033] like Figure 4 and Figure 5 As shown, in this embodiment, a locking block 203 is fixedly installed on the outer surface of the connecting rod 201, and a plurality of locking slots 204 communicating with the stepped groove 205 are opened on one side surface of the first housing 1. The locking block 203 is movably inserted into the locking slot 204, and a connecting groove 202 is opened at one end of the outer surface of the connecting rod 201. Glue 206 is filled between the connecting groove 202 and the stepped groove 205.

[0034] In this embodiment, after the lead assembly 3 is installed, multiple connecting rods 201 are inserted into the stepped grooves 205 at corresponding positions. Then, glue 206 is injected between the connecting groove 202 and the stepped groove 205. After the glue 206 is fixed, the first housing 1 and the second housing 101 are fixed. At the same time, the first housing 1 and the second housing 101 are disassembled by removing the glue 206. This allows for quick replacement of the damaged first housing 1 and the second housing 101 after the glue 206 is removed. It also facilitates the disassembly and repair of the first housing 1 and the second housing 101 when the first lead plate 304 and the second lead plate 305 have poor contact with the tantalum core assembly 301. This reduces the scrapping of capacitors caused by this problem and lowers material waste and production costs.

[0035] like Figure 2 and Figure 3 As shown, in this embodiment, mounting grooves 102 are provided on the upper surface of the first housing 1 and the lower surface of the second housing 101. Conductive grooves 103 are symmetrically provided on both sides of the first housing 1. Insert plates 104 that are movably inserted into the conductive grooves 103 are symmetrically fixedly installed on the lower surface of the second housing 101.

[0036] In specific implementation, when the second housing 101 is connected and closed with the first housing 1, the insert plate 104 moves downward, pushing the first lead plate 304 and the second lead plate 305 downward to bend them into the conductive groove 103. The conductive groove 103 is L-shaped, with its lower end face opened below the first housing 1. When installing it, the welding medium drips into the conductive groove 103 and makes an electrical connection with the connected parts (such as circuit boards), reducing the overflow of the welding medium and improving the stability during welding. At the same time, the first lead plate 304 and the second lead plate 305 are drawn into the conductive groove 103, making the distance between the lower surface of the first housing 1 and the connected parts smaller, reducing the thickness of the thermally conductive adhesive injected, and improving the heat conduction effect.

[0037] Example 2

[0038] Based on Embodiment 1, in order to compensate for the problem that the connection between the No. 1 lead plate 304 and the No. 2 lead plate 305 is prone to breakage when bent.

[0039] like Figure 2 and Figure 5 As shown, in this embodiment, both the first lead plate 304 and the second lead plate 305 have through holes 306 on one side surface, and the second housing 101 has multiple positioning holes 105 on its lower surface; multiple stepped positioning rods 4 are fixedly installed on the upper surface of the first housing 1, and the stepped positioning rods 4 are movably inserted into the corresponding through holes 306 and positioning holes 105.

[0040] In practice, after the tantalum core assembly 301 is installed inside the mounting slot 102, the stepped positioning rod 4 passes through the through hole 306 to reinforce the first lead plate 304 and the second lead plate 305, while preventing the first lead plate 304 and the second lead plate 305 from being bent, which would cause the connection to break and improve the stability of the tantalum core assembly 301 during packaging.

[0041] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0042] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. An integrated ultra-high voltage surface-mount tantalum capacitor, characterized in that, include: A first shell (1) is provided above the first shell (1); The connecting component (2) is fixedly installed on the lower surface of the second housing (101). The connecting component (2) includes a plurality of connecting rods (201) symmetrically fixedly installed on the lower surface of the second housing (101). A plurality of stepped grooves (205) are symmetrically opened on the upper surface of the first housing (1). The lead wire assembly (3) is located between housing 1 (1) and housing 2 (101).

2. The integrated ultra-high voltage chip tantalum capacitor according to claim 1, characterized in that, A locking block (203) is fixedly installed on the outer surface of the connecting rod (201). A plurality of locking slots (204) communicating with the stepped groove (205) are opened on one side surface of the first housing (1). The locking block (203) is movably inserted into the locking slot (204). A connecting groove (202) is opened at one end of the outer surface of the connecting rod (201). Glue (206) is filled between the connecting groove (202) and the stepped groove (205).

3. The integrated ultra-high voltage chip tantalum capacitor according to claim 1, characterized in that, The upper surface of the first housing (1) and the lower surface of the second housing (101) are provided with mounting grooves (102). The two sides of the first housing (1) are symmetrically provided with conductive grooves (103). The lower surface of the second housing (101) is symmetrically fixed with insert plates (104) that are movably inserted into the conductive grooves (103).

4. The integrated ultra-high voltage chip tantalum capacitor according to claim 3, characterized in that, The lead assembly (3) includes: The tantalum core assembly (301) is movably disposed inside the mounting slot (102); A tantalum wire (302) is disposed inside the tantalum core assembly (301), and one end of the wire passes through the tantalum core assembly (301). Washer (303) is fixed on the outer surface of tantalum wire (302).

5. The integrated ultra-high voltage chip tantalum capacitor according to claim 4, characterized in that, The tantalum core assembly (301) is electrically connected to a first lead plate (304) on the outside, and the tantalum wire (302) is electrically connected to a second lead plate (305) on the outside.

6. The integrated ultra-high voltage chip tantalum capacitor according to claim 5, characterized in that, Both the first lead plate (304) and the second lead plate (305) have through holes (306) on one side surface, and the second housing (101) has multiple positioning holes (105) on its lower surface.

7. The integrated ultra-high voltage chip tantalum capacitor according to claim 6, characterized in that, Multiple stepped positioning rods (4) are fixedly installed on the upper surface of the first housing (1). The stepped positioning rods (4) are movably inserted through the through holes (306) at the corresponding positions and the positioning holes (105).

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