PCB applied to Birch Stream server

Abstract

The utility model discloses a printed circuit board (PCB) applied to a Birch Stream server, which comprises a PCB body, and the PCB body comprises a copper foil layer I, a polytetrafluoroethylene layer I, a substrate layer, a polytetrafluoroethylene layer II and a copper foil layer II which are arranged in sequence. The PCB further comprises a heat dissipation piece, an installation hole is formed in the PCB body, and the heat dissipation piece is installed in the installation hole. According to the invention, the first polytetrafluoroethylene layer and the second polytetrafluoroethylene layer are arranged, and the excellent high-frequency dielectric property, excellent high and low temperature resistance and excellent radiation resistance of polytetrafluoroethylene are utilized, so that the PCB has the advantages of low dielectric constant, low dielectric loss, high signal fidelity, excellent high and low temperature resistance and excellent radiation resistance; meanwhile, by arranging the heat dissipation piece, the heat dissipation capacity of the PCB can be improved, and therefore the PCB can well meet the application requirement of a Birch Stream server.

Description

Technical Field

[0001] This utility model relates to the field of PCB board technology, specifically to a PCB board used in Birch Stream servers. Background Technology

[0002] For its next-generation Xeon chips, Intel will adopt the new Birch Stream platform, designed specifically for high-end Xeon chips such as Granite Rapids-AP and Sierra Forest AP. According to Intel's roadmap, next year will see the new Granite Rapids and Sierra Forest CPUs; Granite Rapids is designed for applications requiring high computing power, focusing on edge data processing and emphasizing FPGA applications, such as in the financial industry or scientific fields; while Sierra Forest will be based on the efficient "Atom" architecture, offering high energy efficiency, and will be used in telecommunications or IoT scenarios.

[0003] The 5th generation Xeon chips are all manufactured using Intel 3 technology, and use P high-performance cores and E energy-efficient small cores respectively. The highest core counts are rumored to be 132 cores and 512 cores respectively, which greatly exceeds AMD. The CPU socket uses LGA7529 with a length and width of approximately 105 x 70.5 mm and an area of ​​over 7400 square millimeters.

[0004] From the motherboard design perspective, it features a single CPU and 12 DDR5 memory slots. In terms of interfaces, the front panel of the PCB has two OCULink x8 interfaces, six MCIO bandwidth x16 interfaces (for CPU UPI interconnection), fourteen MCIO bandwidth x4 interfaces, one Riser bandwidth x32 interface, and one PCIe x8 5.0 interface on the back. The CPU uses a 5-phase power supply on each side.

[0005] In the PCB section, the CPU uses a 0.94mm pitch, the same pitch design as Sapphire Rapids. The PCB board is 2.6mm thick and has 18L through-hole boards. Ultra-low loss high-speed materials are used, combined with inner RTF2 and outer RTF copper foil to improve insert loss. The process includes back drilling, resin plugging, and impedance and insert loss control.

[0006] Existing PCBs have poor high and low temperature resistance and poor radiation resistance, making it difficult to meet the PCB requirements of the Birch Stream platform. Utility Model Content

[0007] The problem this invention aims to solve is to provide a PCB board for use in Birch Stream servers. By setting up a first PTFE layer and a second PTFE layer, and utilizing the excellent high-frequency dielectric properties, excellent high and low temperature resistance, and radiation resistance of PTFE, the PCB board exhibits low dielectric constant, low dielectric loss, high signal fidelity, and excellent resistance to high and low temperatures and radiation. Simultaneously, by incorporating heat dissipation components, the heat dissipation capacity of the PCB board can be improved, thus enabling the PCB board to well meet the application requirements of Birch Stream servers.

[0008] The technical solution provided by this utility model to solve the above problems is as follows: a PCB board for use in Birch Stream servers, comprising a PCB board body, wherein the PCB board body comprises a copper foil layer one, a polytetrafluoroethylene layer one, a substrate layer, a polytetrafluoroethylene layer two, and a copper foil layer two arranged sequentially.

[0009] It also includes a heat sink, and the PCB board body is provided with mounting holes, and the heat sink is installed in the mounting holes.

[0010] Preferably, the heat sink is a heat sink pipe, and the outer circumferential wall of the heat sink pipe is in close contact with the wall of the mounting hole.

[0011] Preferably, the space between the heat dissipation pipe and the mounting hole is filled with a thermally conductive filler.

[0012] Preferably, the thermally conductive filler is thermally conductive silicone grease.

[0013] Preferably, the inner wall of the heat sink is provided with a plurality of axial heat sink fins, and the plurality of heat sink fins are distributed in a ring array along the inner wall of the heat sink.

[0014] Preferably, the heat dissipation pipe and the heat dissipation fins are integrally formed.

[0015] Preferably, the heat pipe and heat sink fins are made of copper.

[0016] Preferably, the substrate layer is made of FR-5 glass fiber epoxy resin copper clad laminate.

[0017] Compared with the prior art, the advantages of this utility model are: by setting polytetrafluoroethylene layer one and polytetrafluoroethylene layer two, the excellent high-frequency dielectric properties, excellent high and low temperature resistance and radiation resistance of polytetrafluoroethylene are utilized to enable the PCB board to have low dielectric constant, low dielectric loss, high signal fidelity, and excellent high and low temperature resistance and radiation resistance; at the same time, by setting heat dissipation components, the heat dissipation capacity of the PCB board can be improved, so that the PCB board can well meet the application requirements of Birch Stream server. Attached Figure Description

[0018] The accompanying drawings, which are provided to further illustrate the present invention and constitute a part of the present invention, illustrate exemplary embodiments of the present invention and are used to explain the present invention, but do not constitute an undue limitation of the present invention.

[0019] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0020] Figure 2 This is a utility model Figure 1 Enlarged diagram of point A in the middle.

[0021] The attached diagram is labeled as follows: 1. Copper foil layer one, 2. Polytetrafluoroethylene layer one, 3. Substrate layer, 4. Polytetrafluoroethylene layer two, 5. Copper foil layer two, 6. Heat sink, 7. Heat sink fins. Detailed Implementation

[0022] The following will describe in detail the implementation of this utility model with reference to the accompanying drawings and embodiments, so that the implementation of this utility model can be fully understood and carried out based on how technical means are used to solve technical problems and achieve technical effects.

[0023] In the description of this utility model, it should be noted that the directional terms such as "center", "horizontal", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", and "counterclockwise" are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limiting the specific protection scope of this utility model.

[0024] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. Thus, the use of "first" and "second" to define a feature may explicitly or implicitly include one or more of that feature. In this description of the utility model, "a number" means two or more, unless otherwise explicitly specified.

[0025] In this utility model, unless otherwise explicitly specified and limited, the terms "assembly," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can also refer to a mechanical connection; they can refer to a direct connection or a connection through an intermediate medium; or they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0026] It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0027] It should also be understood that the terminology used in this specification of embodiments of the present invention is for the purpose of describing particular embodiments only and is not intended to limit the embodiments of the present invention. As used in this specification of embodiments of the present invention and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0028] As shown in the attached drawings, a PCB board for use in Birch Stream servers is characterized by comprising a PCB board body, wherein the PCB board body comprises a copper foil layer 1, a polytetrafluoroethylene layer 2, a substrate layer 3, a polytetrafluoroethylene layer 4, and a copper foil layer 5 arranged sequentially.

[0029] It also includes a heat sink, and the PCB board body is provided with mounting holes, and the heat sink is installed in the mounting holes.

[0030] In the above solution, by setting up polytetrafluoroethylene (PTFE) layer one and PTFE layer two, the excellent high-frequency dielectric properties, excellent high and low temperature resistance, and radiation resistance of PTFE are utilized to give the PCB board low dielectric constant, low dielectric loss, high signal fidelity, and excellent high and low temperature resistance and radiation resistance. At the same time, by setting up heat sinks, the heat dissipation capacity of the PCB board can be improved, thus enabling the PCB board to well meet the application requirements of the Birch Stream server.

[0031] In this embodiment, the heat sink is specifically a heat sink 6, and the outer circumferential wall of the heat sink 6 is in close contact with the wall of the mounting hole.

[0032] Specifically, to improve the connection between the heat pipe and the mounting hole, a thermally conductive filler is used to fill the space between the heat pipe 6 and the mounting hole. Further, the thermally conductive filler is thermally conductive silicone grease.

[0033] Furthermore, a plurality of axial heat dissipation fins 7 are provided on the inner wall of the heat dissipation pipe 6, and the plurality of heat dissipation fins 7 are distributed in a ring array along the inner wall of the heat dissipation pipe 6. Even further, to improve the thermal conductivity and stability between the heat dissipation pipe and the heat dissipation fins, the heat dissipation pipe 6 and the heat dissipation fins 7 are integrally formed. The heat generated by the PCB board body is collected and conducted to the heat dissipation pipe and the heat dissipation fins, and carried away by the gas flowing through the heat dissipation pipe. In this design, the heat dissipation fins increase the heat dissipation area of ​​the heat dissipation pipe, improving the heat dissipation capacity of the heat dissipation component, and also improve the bending resistance and strength of the heat dissipation pipe.

[0034] The heat pipe 6 and the heat sink fins 7 are made of a material with high thermal conductivity, specifically copper.

[0035] In another embodiment of this utility model, the substrate layer 3 is made of FR-5 glass fiber epoxy resin copper-clad laminate. Specifically, the FR-5 glass fiber epoxy resin copper-clad laminate is a plate-shaped laminated product made by impregnating special electronic cloth with epoxy phenolic resin and other materials and hot-pressing it under high temperature and high pressure. Utilizing the high glass transition temperature (Tg), resistance to deformation, and good stability of the FR-5 glass fiber epoxy resin copper-clad laminate, the PCB board is less prone to deformation and exhibits good stability when used at high frequencies, further improving its suitability for high-frequency applications. Furthermore, the high glass transition temperature (Tg) and high decomposition temperature (Td) of the FR-5 glass fiber epoxy resin copper-clad laminate enhance the high-temperature resistance of the high-frequency PCB board. Moreover, the rapid heat dissipation of the copper surface of the FR-5 glass fiber epoxy resin copper-clad laminate improves the heat dissipation performance of the PCB board.

[0036] The above description only illustrates the preferred embodiment of this utility model and should not be construed as limiting the scope of the claims. This utility model is not limited to the above embodiments, and variations in its specific structure are permitted. All changes made within the scope of the independent claims of this utility model are also within the scope of protection of this utility model.

Claims

1. A PCB board for use in Birch Stream servers, characterized in that: The PCB board body includes a copper foil layer (1), a polytetrafluoroethylene layer (2), a substrate layer (3), a polytetrafluoroethylene layer (4), and a copper foil layer (5) arranged sequentially. It also includes a heat sink, and the PCB board body is provided with mounting holes, and the heat sink is installed in the mounting holes.

2. The PCB board for use in a Birch Stream server according to claim 1, characterized in that: The heat sink is a heat sink (6), and the outer circumferential wall of the heat sink (6) is in close contact with the wall of the mounting hole.

3. A PCB board for use in a Birch Stream server according to claim 2, characterized in that: The space between the heat dissipation pipe (6) and the mounting hole is filled with a thermally conductive filler.

4. A PCB board for use in a Birch Stream server according to claim 3, characterized in that: The thermally conductive filler is thermally conductive silicone grease.

5. A PCB board for use in a Birch Stream server according to claim 2, characterized in that: The inner wall of the heat dissipation pipe (6) is provided with a plurality of axial heat dissipation fins (7), and the plurality of heat dissipation fins (7) are arranged in a ring array along the inner wall of the heat dissipation pipe (6).

6. A PCB board for use in a Birch Stream server according to claim 2, characterized in that: The heat dissipation pipe (6) and the heat dissipation fins (7) are integrally formed.

7. A PCB board for use in a Birch Stream server according to claim 5 or 6, characterized in that: The heat dissipation pipe (6) and heat dissipation fins (7) are made of copper.

8. A PCB board for use in a Birch Stream server according to claim 1, characterized in that: The substrate layer (3) is made of FR-5 glass fiber epoxy resin copper clad board.

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