Controller and electric control equipment
By employing a nested housing structure and a coolant circulation system in the controller, the temperature rise problem caused by motor self-heating is solved, achieving efficient heat dissipation and improving the stability and lifespan of the controller.
Patent Information
- Application Number
- CN202520500075.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-20
- Publication Date
- 2026-02-24
- Estimated Expiration
- 2035-03-20
AI Technical Summary
In existing electrical control equipment, motor stall causes self-heating, leading to increased controller current and temperature rise. There is a risk of excessive temperature at the three-phase output terminals and the three-phase adapter copper busbar, which affects the product's service life.
Design a controller that adopts a nested structure of a first housing and a second housing to form a receiving groove and a receiving cavity. The heat dissipation pipe is connected to the inlet flow channel, the outlet flow channel and the heat dissipation channel to realize the circulation of coolant. The heat dissipation channel coincides with the three-phase output terminal. The compact layout achieves efficient heat dissipation.
It effectively reduces the impact of motor stall and self-heating on the stability and lifespan of the controller, and improves the controller's heat dissipation efficiency and reliability.
Smart Images

Figure CN223942969U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of automobile production and manufacturing, specifically to a controller and electronic control equipment. Background Technology
[0002] In existing electrical control equipment, when the motor stalls and generates heat, the controller's current increases, leading to a greater temperature rise. This can cause the controller's three-phase output terminals and their connected three-phase busbars to exceed the product's temperature limits, affecting the product's lifespan. Therefore, precise and efficient heat dissipation of the three-phase output terminals or three-phase busbars is crucial for the reliability and lifespan of the controller. Utility Model Content
[0003] The purpose of this application is to provide a controller and an electrical control device.
[0004] This application provides a controller, including: a capacitor assembly; an IGBT module including three-phase output terminals; a controller housing including a first housing and a second housing, the first housing forming a receiving groove, the second housing disposed in the receiving groove, the second housing forming a receiving cavity; a heat dissipation pipe disposed in the receiving groove, the heat dissipation pipe being disposed on the side wall of the receiving cavity away from the receiving cavity; wherein, the capacitor assembly is disposed in the receiving cavity, the IGBT module is disposed on the side of the second housing away from the first housing, the first housing forming an inlet flow channel and an outlet flow channel, the heat dissipation pipe forming a heat dissipation flow channel, the heat dissipation flow channel connecting the inlet flow channel and the outlet flow channel, and the projection of the heat dissipation flow channel and the three-phase output terminals on the bottom of the groove at least partially overlap.
[0005] In one exemplary embodiment of this application, the second housing forms a second water channel, which extends from one side wall of the accommodating cavity through the top wall of the accommodating cavity to the other side wall of the accommodating cavity, and the second water channel communicates between the inlet flow channel and the outlet flow channel; the projections of the IGBT module and the second water channel on the top wall at least partially overlap, and the projections of the capacitor assembly and the second water channel on the top wall at least partially overlap.
[0006] In one exemplary embodiment of this application, the second water channel includes a heat dissipation water tank, which is disposed on the side of the top wall away from the accommodating cavity; the IGBT module includes an IGBT body and a water-cooling plate, which is disposed on the side of the IGBT body near the second housing, the IGBT body is disposed at the opening of the heat dissipation water tank, and the water-cooling plate extends into the heat dissipation water tank.
[0007] In one exemplary embodiment of this application, the second housing further includes a protrusion disposed on a side of the sidewall opposite to the receiving cavity, and the protrusion forms a third water channel, one side of the third water channel being connected to the liquid inlet channel, and the other side of the third water channel being connected to the second water channel.
[0008] In one exemplary embodiment of this application, the controller further includes a filtering component disposed in the receiving groove. The filtering component is located on the side of the sidewall opposite to the receiving cavity. The filtering component includes a high-voltage input copper busbar, and the projections of the high-voltage input copper busbar and the third water channel on the sidewall at least partially overlap.
[0009] In one exemplary embodiment of this application, the controller further includes an input copper busbar disposed on a side of the sidewall opposite to the accommodating cavity, and the input copper busbar is connected to the high-voltage input copper busbar.
[0010] In an exemplary embodiment of this application, the sidewall includes a first sidewall, a second sidewall, and a third sidewall. The first sidewall and the second sidewall are disposed opposite to each other, and the third sidewall is disposed between the first sidewall and the second sidewall. The liquid inlet channel is disposed on the side of the first sidewall away from the accommodating cavity, the liquid outlet channel is disposed on the side of the second sidewall away from the accommodating cavity, and the heat dissipation channel is disposed on the side of the third sidewall away from the accommodating cavity.
[0011] In an exemplary embodiment of this application, the heat dissipation pipe includes: a first pipe portion disposed on the side of the first sidewall away from the receiving cavity, the first pipe portion connecting the bottom and wall of the receiving groove; a second pipe portion disposed on the side of the second sidewall away from the receiving cavity, the second pipe portion connecting the bottom and wall of the receiving groove; and a third pipe portion disposed on the side of the third sidewall away from the receiving cavity, the third pipe portion connecting the first pipe portion and the second pipe portion, the third pipe portion and the projection portion of the three-phase output terminal on the bottom of the groove coinciding.
[0012] In one exemplary embodiment of this application, the controller further includes a three-phase adapter copper busbar connected to the three-phase output terminals, wherein the projections of the three-phase adapter copper busbar and the heat dissipation channel on the bottom of the tank at least partially overlap.
[0013] This application also provides an electrical control device, which includes a motor, a reducer, and a controller. The motor includes a motor housing, the reducer includes a reducer housing, and the controller includes a controller housing. The motor housing, the reducer housing, and the controller housing are configured as an integral structure.
[0014] The controller and electrical control device proposed in this application have the following advantages: The controller housing includes a first housing and a second housing. The first housing forms a receiving groove, and the second housing is disposed in the receiving groove, forming a receiving cavity. A capacitor assembly is disposed in the receiving cavity, and an IGBT module is disposed on the side of the second housing away from the first housing. By nesting the second housing within the first housing, physical isolation between the capacitor assembly and the IGBT module is achieved, avoiding electromagnetic interference. The first housing has an inlet channel and an outlet channel, and a heat dissipation pipe forms a heat dissipation channel. The heat dissipation channel connects the inlet channel and the outlet channel, and the projections of the heat dissipation channel and the three-phase output terminals on the bottom of the groove at least partially overlap. The inlet channel, the heat dissipation channel, and the outlet channel form a circulation path for the coolant. Since the projections of the heat dissipation channel and the three-phase output terminals on the bottom of the groove at least partially overlap, the heat dissipation channel and the three-phase output terminals are on the same plane. The heat dissipation channel can remove the heat from the three-phase output terminals, achieving efficient heat dissipation through a compact layout, thereby reducing the impact of motor stall and self-heating on the stability and lifespan of the controller.
[0015] Other features and advantages of this application will become apparent from the following detailed description, or may be learned in part from practice of this application.
[0016] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description
[0017] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.
[0018] Figure 1 This is a schematic diagram of the structure of an electrical control device according to an embodiment of this utility model;
[0019] Figure 2 This is a schematic diagram of the first structure of a controller according to an embodiment of the present utility model;
[0020] Figure 3 This is a schematic diagram of the second structure of a controller according to an embodiment of the present invention;
[0021] Figure 4 This is a front view schematic diagram of a controller according to an embodiment of this utility model;
[0022] Figure 5 yes Figure 4 Schematic diagram of the cross section at point AA;
[0023] Figure 6yes Figure 4 Schematic diagram of the cross section at point BB;
[0024] Figure 7 yes Figure 4 A cross-sectional view at point CC.
[0025] Explanation of reference numerals in the attached figures:
[0026] 10. Capacitor assembly; 20. IGBT module; 21. Three-phase output terminal; 22. IGBT body; 23. Water-cooled plate; 30. Controller housing; 31. First housing; 32. Second housing; 311. Receptacle; 3111. Bottom of the reservoir; 3112. Receptacle wall; 312. Liquid inlet channel; 313. Liquid outlet channel; 321. Receptacle cavity; 322. Side wall; 3221. First side wall; 3222. Second side wall; 3223. 323. Third side wall; 324. Top wall; 325. Second water channel; 326. Heat dissipation water tank; 327. Slot opening; 328. Protrusion; 329. Third water channel; 40. Heat dissipation pipe; 410. Heat dissipation flow channel; 411. First pipe section; 412. Second pipe section; 413. Third pipe section; 50. Filter assembly; 51. High voltage input copper busbar; 60. Input copper busbar; 70. Three-phase adapter copper busbar; 81. Motor housing; 91. Reducer housing. Detailed Implementation
[0027] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided to make this application more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art.
[0028] Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a thorough understanding of embodiments of this application. However, those skilled in the art will recognize that the technical solutions of this application can be practiced without one or more of the specific details, or other methods, components, apparatuses, steps, etc., can be employed. In other instances, well-known methods, apparatuses, implementations, or operations are not shown or described in detail to avoid obscuring various aspects of this application.
[0029] The present application will now be described in further detail with reference to the accompanying drawings and specific embodiments. It should be noted that the technical features involved in the various embodiments described below can be combined with each other as long as they do not conflict with each other. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present application, and should not be construed as limiting the present application.
[0030] It should be noted that "multiple" in this article refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. The character " / " generally indicates that the preceding and following related objects have an "or" relationship.
[0031] In existing electrical control equipment, when the motor stalls and generates heat, the controller's current increases, leading to a greater temperature rise. This can cause the controller's three-phase output terminals and their connected three-phase busbars to exceed the product's temperature limits, affecting the product's lifespan. Therefore, precise and efficient heat dissipation of the three-phase output terminals or three-phase busbars is crucial for the reliability and lifespan of the controller.
[0032] To address the aforementioned technical problems, this application provides a controller, with reference to... Figures 1 to 4 As shown, the controller includes a capacitor assembly 10, a controller housing 30, and a heat sink 40. The capacitor assembly 10 includes three-phase output terminals 21; the controller housing 30 includes a first housing 31 and a second housing 32, the first housing 31 forming a receiving groove 311, and the second housing 32 disposed within the receiving groove 311, forming a receiving cavity 321; the heat sink 40 is disposed in the receiving groove 311, and the heat sink 40 is located on the side wall 322 of the receiving cavity 321 away from the receiving cavity 321; wherein, referring to… Figures 4 to 7As shown, the capacitor assembly 10 is disposed in the accommodating cavity 321, and the IGBT module 20 is disposed on the side of the second housing 32 away from the first housing 31. The first housing 31 forms an inlet channel 312 and an outlet channel 313, and the heat sink 40 forms a heat dissipation channel 41. The heat dissipation channel 41 connects the inlet channel 312 and the outlet channel 313. The projections of the heat dissipation channel 41 and the three-phase output terminal 21 on the bottom 3111 of the slot at least partially overlap. Thus, the controller housing 30 includes a first housing 31 and a second housing 32. The first housing 31 forms an accommodating slot 311, and the second housing 32 is disposed in the accommodating slot 311, forming an accommodating cavity 321. The capacitor assembly 10 is disposed in the accommodating cavity 321, and the IGBT module 20 is disposed on the side of the second housing 32 away from the first housing 31. By nesting the second housing 32 within the first housing 31, physical isolation between the capacitor assembly 10 and the IGBT module 20 is achieved, avoiding electromagnetic interference. The first housing 31 has an inlet channel 312 and an outlet channel 313. The heat dissipation pipe 40 has a heat dissipation channel 41, which connects the inlet channel 312 and the outlet channel 313. The projections of the heat dissipation channel 41 and the three-phase output terminal 21 on the bottom 3111 of the tank at least partially overlap. The inlet channel 312, the heat dissipation channel 41, and the outlet channel 313 form a circulation path for the coolant. Since the projections of the heat dissipation channel 41 and the three-phase output terminal 21 on the bottom 3111 of the tank at least partially overlap, the heat dissipation channel 41 and the three-phase output terminal 21 are on the same plane. The heat dissipation channel 41 can carry away the heat from the three-phase output terminal 21. The compact layout achieves efficient heat dissipation, thereby reducing the impact of motor stall and self-heating on the stability and lifespan of the controller.
[0033] In some embodiments, the capacitor assembly 10 is used to store energy and suppress voltage fluctuations, and the IGBT module 20 is used to convert the battery DC power into three-phase AC power to drive the motor. The speed and torque are adjusted by PWM. The capacitor provides instantaneous current to support the fast switching of the IGBT, while protecting the IGBT from voltage spikes.
[0034] In some embodiments, refer to Figure 1 As shown, the second housing 32 forms a receiving cavity 321. The walls of the receiving cavity 321 in the front-back, left-right directions are used as side walls 322, the wall above the receiving cavity 321 is used as top wall 323, and the wall below the receiving cavity 321 is used as bottom wall. In this embodiment, only part of the side walls 322 and top wall 323 are shown.
[0035] In some embodiments, refer to Figure 1As shown, the heat dissipation pipe 40 is disposed on the side of the side wall 322 of the accommodating cavity 321 away from the accommodating cavity 321. The accommodating cavity 321 is used as the interior of the second housing 32, that is, the heat dissipation pipe 40 is disposed outside the second housing 32. The heat dissipation pipe 40 is disposed in the accommodating groove 311 at intervals from the second housing 32, so that the heat dissipation pipe 40 and the second housing 32 do not interfere with each other. The heat dissipation pipe 40 can be disposed outside at least one side wall 322 of the second housing 32. Specifically, depending on the structure of the heat dissipation pipe 40, it can be disposed outside one side wall 322 or outside two side walls 322.
[0036] In some embodiments, refer to Figure 2 As shown, the sidewall 322 includes a first sidewall 3221, a second sidewall 3222, and a third sidewall 3223. The first sidewall 3221 and the second sidewall 3222 are disposed opposite to each other, and the third sidewall 3223 is disposed between the first sidewall 3221 and the second sidewall 3222. Figure 5 As shown, the liquid inlet channel 312 is located on the side of the first side wall 3221 away from the accommodating cavity 321, the liquid outlet channel 313 is located on the side of the second side wall 3222 away from the accommodating cavity 321, and the heat dissipation channel 41 is located on the side of the third side wall 3223 away from the accommodating cavity 321.
[0037] In some embodiments, refer to Figure 1 and Figure 2 As shown, the heat dissipation pipe 40 includes a first pipe section 411, a second pipe section 412, and a third pipe section 413. The first pipe section 411 is located on the side of the first sidewall 3221 away from the receiving cavity 321, and the first pipe section 411 connects the bottom 3111 and the wall 3112 of the receiving groove 311. The second pipe section 412 is located on the side of the second sidewall 3222 away from the receiving cavity 321, and the second pipe section 412 connects the bottom 3111 and the wall 3112 of the receiving groove 311. The third pipe section 413 is located on the side of the third sidewall 3223 away from the receiving cavity 321, and the third pipe section 413 connects between the first pipe section 411 and the second pipe section 412. The projection of the third pipe section 413 and the three-phase output terminal 21 on the bottom 3111 coincides. The first tube section 411, the second tube section 412, and the third tube section 413 cooperate to form a heat dissipation tube 40, which is roughly H-shaped. The first tube section 411, the second tube section 412, and the third tube section 413 can also dissipate heat from the side wall 322 of the second housing 32, and the third tube section 413 can also dissipate heat from the three-phase output terminal 21, mainly dissipating the high heat of the three-phase output terminal 21.
[0038] In some embodiments, refer to Figure 2 and Figure 3As shown, the capacitor assembly 10 includes components such as capacitor cores; the controller also includes a control drive board, which is located on the side of the IGBT module 20 opposite to the second housing 32. The control drive board is used to control and drive the IGBT module 20 and the capacitor assembly 10.
[0039] In some embodiments, refer to Figures 4 to 7 As shown, the coolant enters the heat dissipation channel 41 from the inlet channel 312 and then flows out from the outlet channel 313. After being cooled, the outflowing coolant can be reintroduced into the inlet channel 312, thus realizing the recycling of the coolant.
[0040] In some embodiments, refer to Figure 2 Figure 3 As shown, the IGBT module 20 and capacitor assembly 10 are integrated on the second housing 32, forming a single unit. This results in greater consistency in the amplitude of displacement changes under long-term operation, vibration, and different temperatures and humidity levels, which can improve the structural strength of the inverter brick and prevent the IGBT module 20 and capacitor assembly 10 from desoldering or disconnecting. This improves safety and stability. It should be noted that the capacitor assembly 10 (which may include film capacitors, filter capacitors, magnetic rings, and other effective devices) is integrated under the housing. At the same time, the housing directly dissipates heat from the battery cell, which can reduce the capacitance cost.
[0041] In some embodiments, refer to Figure 2 Figure 3 As shown, an IGBT module 20 is disposed outside the accommodating cavity 321, and a capacitor assembly 10 is encapsulated inside the accommodating cavity 321, for example, by using epoxy resin encapsulation, and the capacitor assembly 10 is located inside the accommodating cavity 321 so that the capacitor assembly 10 can contact the shell with water channels for heat exchange, thereby improving the heat exchange effect of the capacitor assembly 10.
[0042] In some embodiments, the first housing 31 and the second housing 32 can be made by aluminum alloy die casting process, which makes the first housing 31 and the second housing 32 have high rigidity and high structural strength. Moreover, the structure is simple and convenient to change through mold forming, and has certain cost-effectiveness advantages. At the same time, the die-cast second housing 32 is arranged in layers with IGBT module 20 and capacitor assembly 10, which can solve the technical problems of excessive cumulative error of laser welding, low product strength and poor electromagnetic compatibility. Moreover, it can achieve the inverter solution with the highest power density and lowest cost in a limited space.
[0043] In some embodiments, the first housing 31, the second housing 32, and the heat dissipation pipe 40 can be integrated into a single structure by means of casting, thread fastening, etc., and the first housing 31, the second housing 32, and the heat dissipation pipe 40 are made of metal, specifically aluminum or aluminum alloy.
[0044] In some embodiments, refer to Figure 5As shown, the second housing 32 forms a second water channel 324, which extends from one side wall 322 of the accommodating cavity 321 through the top wall 323 to the other side wall 322 of the accommodating cavity 321. The second water channel 324 connects the inlet channel 312 and the outlet channel 313. Figure 4 As shown, the projections of the IGBT module 20 and the second water channel 324 onto the top wall 323 at least partially overlap, and the projections of the capacitor assembly 10 and the second water channel 324 onto the top wall 323 also at least partially overlap. Thus, the top wall 323 of the second housing 32 forms an embedded second water channel 324, which extends from one side wall 322 through the top wall 323 to the other side. For example, the second water channel 324 can extend from the left side wall 322 through the top wall 323 to the right side wall 322, and of course, it can also extend from the right side wall 322 through the top wall 323 to the left side wall 322. The second water channel 324 connects the inlet flow channel 312 and the outlet flow channel 313, a coolant circulation channel. The partial overlap of the projections of the IGBT module 20 and the second water channel 324 onto the top wall 323 allows the heat generated by the IGBT module 20 to be discharged through the coolant in the second water channel 324. The projections of the battery cell assembly and the second water channel 324 on the top wall 323 also partially overlap, allowing the heat generated by the battery cell during operation to be absorbed by the water channel, thus achieving coordinated heat dissipation of the two components.
[0045] In some embodiments, refer to Figure 5 As shown, the second water channel 324 includes a heat dissipation tank 325, which is located on the side of the top wall 323 away from the receiving cavity 321. The IGBT module 20 includes an IGBT body 22 and a water-cooling plate 23. The water-cooling plate 23 is located on the side of the IGBT body 22 near the second housing 32. The IGBT body 22 is located at the opening 3251 of the heat dissipation tank 325, and the water-cooling plate 23 extends into the heat dissipation tank 325. The heat from the IGBT body 22 is transferred to the water-cooling plate 23. The heat dissipation tank 325 has a larger heat dissipation area, and the water-cooling plate 23 of the IGBT module 20 can be completely inserted into the heat dissipation tank 325. The coolant in the heat dissipation tank 325 carries away the heat from the water-cooling plate 23, and the opening 3251 of the heat dissipation tank 325 is sealed by the IGBT body 22, so that the coolant in the heat dissipation tank 325 will not flow out and affect the operation of the IGBT body 22. Specifically, a sealing ring, rubber ring, or other structure can be provided between the IGBT body 22 and the slot 3251 of the heat sink 325 to increase the sealing performance.
[0046] In some embodiments, refer to Figure 5As shown, a portion of the second water channel 324 extends from the left sidewall 322 along the height direction to the top wall 323, where the top wall 323 is a heat dissipation water tank 325. Another portion of the second water channel 324 extends from the right sidewall 322 along the height direction to the top wall 323, thereby connecting the portion of the second water channel 324 located on the left sidewall 322, the portion of the second water channel 324 located on the right sidewall 322, and the heat dissipation water tank 325 to form a complete second water channel 324.
[0047] In some embodiments, refer to Figure 5 As shown, the second housing 32 also includes a protrusion 326, which is located on one side of the side wall 322 away from the receiving cavity 321. The protrusion 326 forms a third water channel 327, one side of which connects to the inlet channel 312, and the other side connects to the second water channel 324. Thus, at the inlet channel 312, some coolant is diverted to the second water channel 324, and some to the third water channel 327. During the flow, some coolant flows away from the inlet channel 312 merge before entering the cooling water tank 325. One end of the third water channel 327 connects to the inlet channel 312, and the other end connects to the second water channel 324, forming a coolant diversion path. This design optimizes the flow channel distribution and reduces fluid resistance.
[0048] In some embodiments, refer to Figure 1 As shown, the controller also includes a filter assembly 50, which is disposed in the receiving groove 311. The filter assembly 50 is located on the side of the side wall 322 opposite to the receiving cavity 321, and is combined with... Figure 2 As shown, the filter component 50 includes a high-voltage input copper busbar 51. Combined with... Figure 4 As shown, the projections of the high-voltage input copper busbar 51 and the third water channel 327 on the side wall 322 at least partially overlap. The high-voltage input copper busbar 51 of the filter assembly 50 is connected to the battery busbar through the side wall 322. A large amount of heat is generated when the battery busbar and the high-voltage input copper busbar 51 transfer current. Figure 5 As shown, since the high-voltage input copper busbar 51 and the third channel 327 are located on the same plane, the third channel 327 can absorb the heat from the high-voltage input copper busbar 51 and effectively dissipate heat, thus further increasing the heat dissipation effect of the controller. At the same time, the third channel 327 can also optimize the resistance. Through the reuse of the third channel 327, the structure of the controller becomes more compact.
[0049] In some embodiments, refer to Figure 1 As shown, the controller also includes an input copper busbar 60, which is located on the side of one side wall 322 away from the accommodating cavity 321. The input copper busbar 60 is connected to the high-voltage input copper busbar 51. The input copper busbar 60 and the high-voltage input copper busbar 51 are located outside the same side wall 322. The input copper busbar 60 is used to connect the battery busbar and the high-voltage input copper busbar 51, which facilitates the structural layout of the battery busbar.
[0050] In some embodiments, refer to Figure 1 As shown, the controller also includes a three-phase adapter copper busbar 70, which is connected to the three-phase output terminal 21. The projections of the three-phase adapter copper busbar 70 and the heat dissipation channel 41 on the bottom of the slot 3111 at least partially overlap. Since the three-phase adapter copper busbar 70 and the three-phase output terminal 21 are connected, heat is generated on both the three-phase adapter copper busbar 70 and the three-phase output terminal 21. The heat dissipation channel 41 can also dissipate the heat from the three-phase adapter copper busbar 70, resulting in better heat dissipation.
[0051] In some embodiments, the controller further includes a three-phase Hall element, with the IGBT module 20 disposed on the second housing; the three-phase Hall element is fixedly connected to the side wall 322 of the second housing 32; and the three-phase adapter copper busbar 70 is fixed on the three-phase Hall element.
[0052] In this application, reference is made to Figures 1 to 7 As shown, by forming an inlet channel 312, an outlet channel 313, a heat dissipation channel 41, and a second water channel 324 on the first housing 31 and the second housing 32, liquid is introduced into the heat dissipation channel 41 and the second water channel 324 through the inlet channel 312, and liquid is discharged into the heat dissipation channel 41 and the second water channel 324 through the outlet channel 313, thereby forming a dual-channel heat dissipation system and achieving a better heat dissipation effect.
[0053] This application also provides an electrical control device, as shown in the reference. Figure 1 As shown, the electrical control equipment includes a motor, a reducer, and a controller. The motor includes a motor housing 81, the reducer includes a reducer housing 91, and the controller includes a controller housing 30. The motor housing 81, the reducer housing 91, and the controller housing 30 are integrated into a single structure. This reduces connecting parts, increases overall rigidity, and allows for shared cooling channels, achieving system-level heat dissipation optimization.
[0054] In this application, unless otherwise expressly specified and limited, the terms "set up (provided)" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0055] In the description of this specification, references to terms such as "some embodiments" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment is included in at least one embodiment of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of those different embodiments or examples.
[0056] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application. Therefore, any changes or modifications made in accordance with the claims and description of this application should fall within the scope of this patent application.
Claims
1. A controller, characterized in that, include: Capacitor assembly; IGBT module, including three-phase output terminals; The controller housing includes a first housing and a second housing, wherein the first housing forms a receiving groove, and the second housing is disposed in the receiving groove, forming a receiving cavity; A heat dissipation pipe is provided in the receiving groove, and the heat dissipation pipe is provided on the side wall of the receiving cavity away from the receiving cavity; The capacitor assembly is disposed in the accommodating cavity, the IGBT module is disposed on the side of the second housing away from the first housing, the first housing has an inlet channel and an outlet channel, the heat sink has a heat dissipation channel, the heat dissipation channel connects the inlet channel and the outlet channel, and the projection of the heat dissipation channel and the three-phase output terminal on the bottom of the tank at least partially overlaps.
2. The controller according to claim 1, characterized in that, The second housing forms a second water channel, which extends from one side wall of the accommodating cavity through the top wall of the accommodating cavity to the other side wall of the accommodating cavity, and the second water channel connects the inlet channel and the outlet channel. The projections of the IGBT module and the second water channel on the top wall at least partially overlap, and the projections of the capacitor assembly and the second water channel on the top wall at least partially overlap.
3. The controller according to claim 2, characterized in that, The second water channel includes a heat dissipation water tank, which is located on the side of the top wall away from the accommodating cavity; The IGBT module includes an IGBT body and a water-cooling plate. The water-cooling plate is located on the side of the IGBT body near the second housing. The IGBT body is located at the opening of the heat dissipation water tank, and the water-cooling plate extends into the heat dissipation water tank.
4. The controller according to claim 2, characterized in that, The second housing further includes a protrusion disposed on a side wall away from the receiving cavity, and the protrusion forms a third water channel, one side of the third water channel being connected to the liquid inlet channel, and the other side of the third water channel being connected to the second water channel.
5. The controller according to claim 4, characterized in that, The controller further includes a filtering component disposed in the receiving groove. The filtering component is located on the side of the side wall away from the receiving cavity. The filtering component includes a high-voltage input copper busbar. The projection of the high-voltage input copper busbar and the third water channel on the side wall at least partially overlaps.
6. The controller according to claim 5, characterized in that, The controller also includes an input copper busbar, which is disposed on a side of the sidewall opposite to the accommodating cavity, and the input copper busbar is connected to the high-voltage input copper busbar.
7. The controller according to claim 1, characterized in that, The sidewall includes a first sidewall, a second sidewall, and a third sidewall, wherein the first sidewall and the second sidewall are disposed opposite to each other, and the third sidewall is disposed between the first sidewall and the second sidewall; The liquid inlet channel is located on the side of the first sidewall away from the accommodating cavity, the liquid outlet channel is located on the side of the second sidewall away from the accommodating cavity, and the heat dissipation channel is located on the side of the third sidewall away from the accommodating cavity.
8. The controller according to claim 7, characterized in that, The heat pipe includes: The first tube is located on the side of the first sidewall away from the receiving cavity, and the first tube connects the bottom and the wall of the receiving groove. The second tube is located on the side of the second sidewall away from the receiving cavity, and the second tube connects the bottom of the receiving groove and the groove wall; The third tube section is located on the side of the third sidewall away from the accommodating cavity. The third tube section is connected between the first tube section and the second tube section. The projection of the third tube section and the three-phase output terminal on the bottom of the slot coincides.
9. The controller according to claim 1, characterized in that, The controller also includes a three-phase adapter copper busbar, which is connected to the three-phase output terminals. The projections of the three-phase adapter copper busbar and the heat dissipation channel on the bottom of the tank at least partially overlap.
10. An electrical control device, characterized in that, The electrical control device includes a motor, a reducer, and a controller as described in any one of claims 1 to 9. The motor includes a motor housing, the reducer includes a reducer housing, and the controller includes a controller housing. The motor housing, the reducer housing, and the controller housing are configured as an integral structure.