Heat dissipation unit

Abstract

The embodiment of the utility model provides a heat dissipation unit, the heat dissipation unit comprises a heat conduction body and N installation parts, N is greater than or equal to 1, the installation parts are arranged on the outer surface of the heat conduction body, and the installation parts are used for installing a circuit unit to be subjected to heat dissipation; the heat conduction body is internally provided with one or more heat dissipation channels, the heat dissipation channels penetrate from one end of the heat conduction body to the other end of the heat conduction body, and opening ends are formed at the two ends of the heat conduction body respectively. The technical problem that an existing heat dissipation unit is complex in structure is solved.

Description

Technical Field

[0001] This utility model relates to the field of machinery, and in particular to a heat dissipation unit. Background Technology

[0002] With the application of electronic technology, there are more and more types of electronic circuit units, and the existing heat sink structure is complex and costly. Utility Model Content

[0003] The present invention provides a heat dissipation unit that solves the technical problem of complex structure in existing heat dissipation units.

[0004] To solve the above-mentioned technical problems, this utility model provides a heat dissipation unit, including a heat-conducting body and N mounting parts, where N is greater than or equal to 1. The mounting parts are disposed on the outer surface of the heat-conducting body and are used to mount the circuit unit to be cooled. The heat-conducting body has one or more heat dissipation channels inside, which extend from one end of the heat-conducting body to the other end, and open ends are formed at both ends.

[0005] Beneficial effects

[0006] The heat dissipation unit provided in this embodiment of the utility model, through its ingenious structural design and by placing the circuit unit to be cooled on the heat dissipation unit, directly dissipates heat from the circuit unit, resulting in a simple overall structure, low cost, high heat dissipation efficiency, and without affecting the normal operation of the circuit unit to be cooled.

[0007] Other features and corresponding beneficial effects of this utility model will be described in the latter part of the specification, and it should be understood that at least some of the beneficial effects become obvious from the description in this utility model specification. Attached Figure Description

[0008] Figure 1 A schematic diagram of the heat dissipation unit provided in Embodiment 1 of this utility model;

[0009] Figure 2 for Figure 1 A schematic diagram of the heat dissipation channel of the heat dissipation unit shown;

[0010] Figure 3 A schematic diagram of another heat dissipation unit provided in Embodiment 1 of this utility model;

[0011] Figure 4 A schematic diagram of the power device provided in Embodiment 2 of this utility model;

[0012] Figure 5 This is a schematic diagram of another power device provided in Embodiment 2 of this utility model. Detailed Implementation

[0013] To make the objectives, technical solutions, and advantages of this utility model clearer, the embodiments of this utility model will be further described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of this utility model and are not intended to limit it.

[0014] Example 1:

[0015] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings and examples. An embodiment of this utility model provides a heat dissipation unit, which includes a heat-conducting body and N mounting portions, where N is greater than or equal to 1. The mounting portions are disposed on the outer surface of the heat-conducting body and are used to mount circuit units to be cooled. The heat-conducting body has one or more heat dissipation channels inside, extending from one end of the heat-conducting body to the other end, and forming open ends at both ends.

[0016] In some embodiments, the heat dissipation unit further includes a connector disposed at the open end, the connector being used to connect to an external heat dissipation system. The connector may be made of a thermally conductive material.

[0017] In some embodiments, the connector includes a hollow cylindrical connector with openings at both ends. One end of the cylindrical connector abuts against the open end, and the other end has a connecting portion for connecting to an external channel, through which it connects to an external heat dissipation system. The connecting portion includes one of the following: internal thread, external thread, snap-fit, slot, or clamp.

[0018] In some embodiments, the connector is one of internal thread, external thread, snap-fit, slot, or clamp, and is disposed at the open end for connecting to an external heat dissipation system. It has a simple structure, reduces the number of parts and assembly steps, and lowers costs.

[0019] In some embodiments, the interior of the heat-conducting body may have one or more heat dissipation channels. To increase the heat dissipation area and make heat dissipation more uniform, honeycomb or spiral heat dissipation channels can be provided. The heat dissipation channels can be located in the central region of the interior of the heat-conducting body, or they can be located inside the heat-conducting body, and the heat dissipation effect is better when they are located at the position corresponding to the mounting part.

[0020] In some embodiments, the heat dissipation channel includes heat dissipation holes, heat sinks, heat sinks, devices made of phase change materials, etc., and is disposed inside the heat-conducting body to achieve the effect of heat dissipation. The heat dissipation holes can be filled with phase change materials, thermal paste, coolant, etc., for heat dissipation. The coolant includes, but is not limited to, a 50% ethylene glycol aqueous solution with a freezing point of -40°C and a boiling point of 110°C, providing both antifreeze and thermal conductivity, with a thermal conductivity of approximately 0.4 W / m·K. An external heat dissipation system, such as a water-cooling system or an air-cooling system, can also be connected via connectors. A water-cooling system can fill the heat dissipation holes with water, and an air-cooling system can fill them with airflow to further accelerate heat dissipation. The heat dissipation channel can be fabricated using metal 3D printing (such as SLM technology). Spiral water-cooled heat dissipation channels or honeycomb air-cooled heat dissipation channels can be configured, utilizing natural convection or forced airflow for heat dissipation. Water-cooled heat dissipation channels are suitable for high-power applications, such as electric vehicle inverters, while air-cooled heat dissipation channels are suitable for medium- and low-power applications, such as industrial servo drives.

[0021] In some embodiments, the cross-sectional shape of the heat dissipation holes can be circular, semi-circular, square, polygonal, etc. In some embodiments, in order to accelerate heat dissipation and achieve more uniform heat dissipation, the interior of the heat-conducting body has multiple heat dissipation holes with a diameter of 0.5 mm to 1 mm, which are connected to an external water cooling system via connectors, with a water flow velocity of 0.8 m / s to 1.2 m / s.

[0022] In some embodiments, the mounting portion is an insulating portion, or the heat dissipation unit further includes an insulating portion disposed on the mounting portion, and the circuit unit to be cooled is mounted on the insulating portion. If the heat-conducting body is made of a conductive material, the insulating portion can provide insulation between the circuit unit to be cooled and the heat-conducting body; for example, the heat-conducting body is made of copper. The aforementioned insulating portion can be an insulating heat-conducting portion.

[0023] In some embodiments, the mounting section is used to mount a power unit, which is increasingly widely used, such as in the automotive industry.

[0024] In some embodiments, N mounting portions are symmetrically arranged on the outer surface of the heat-conducting body. Since the mounting portions are used to mount the circuit units to be cooled, the symmetrical arrangement of the circuit units to be cooled on the outer surface of the heat-conducting body is beneficial for uniform heat dissipation.

[0025] In some embodiments, the heat-conducting body has two ends and a sidewall portion located between the two ends. Each mounting portion is disposed on the outer surface of the sidewall portion of the heat-conducting body. The heat dissipation channel extends from one end of the heat-conducting body to the other end of the heat-conducting body, and an opening end is formed at each of the two ends.

[0026] In some embodiments, the heat-conducting body is a cylinder or a polyhedron. This eliminates the redundant structure of traditional heat sinks, directly utilizing the geometric symmetry and internal space of the cylinder or polyhedron to achieve efficient heat dissipation and reduce costs.

[0027] In some embodiments, the heat-conducting body is one of a cylinder, a triangular prism, a square prism, a pentagonal prism, or a hexagonal prism.

[0028] In some embodiments, the mounting portion is a plane. A plane facilitates the mounting of the circuit unit to be cooled.

[0029] In some embodiments, at least two of the mounting portion, connector, and heat-conducting body are integrally formed structures.

[0030] In some embodiments, the outer surface of the heat-conducting body has N planes, which serve as mounting portions; or the outer surface of the heat-conducting body is surrounded by M planes, where M is greater than or equal to N, and N of the M planes serve as mounting portions respectively.

[0031] In some embodiments, the heat-conducting body has an internal thread or an external thread, which is provided at the open end as a connector.

[0032] In some embodiments, the thermally conductive body, mounting portion, and / or connector are made of a highly thermally conductive material.

[0033] In some embodiments, a thermally conductive coating may be provided on the outer surface of the thermally conductive body and / or the outer surface of the mounting portion.

[0034] In some embodiments, the outer surface of the heat-conducting body may also be provided with a fin structure to increase the surface area and improve the heat dissipation effect.

[0035] The following is for reference. Figure 1 The figure shows a schematic diagram of a heat dissipation unit provided in Embodiment 1 of this utility model. The heat dissipation unit includes a heat-conducting body 41, three mounting parts 412 (only two are shown in the figure) and two connectors 43. The heat-conducting body 41 and the three mounting parts 412 are integrally formed structures.

[0036] The heat-conducting body 41 is made of metal and is a triangular prism. The mounting part 412 is a plane. The heat-conducting body 41 has two ends 411 (only one is shown in the figure) and a side wall part located between the two ends 411. The side wall part includes three side walls. The outer surface of the heat-conducting body 41 is surrounded by five planes, wherein the outer surface of the two ends 411 is a plane, the outer surface of the three side walls is a plane, and the outer surface of the three side walls is a mounting part 412.

[0037] refer to Figure 2The interior of the heat-conducting body 41 has multiple straight and parallel heat dissipation holes 413 arranged in a honeycomb pattern. Each heat dissipation hole 413 extends from one end 411 of the heat-conducting body 41 to the other end 411 (not shown in the figure), and an opening end 413a is formed at each end 411. The cross-sectional shape of the heat dissipation hole 413 is circular, and the hole diameter is 0.8 mm.

[0038] The two connectors 43 are identical in material, structure, and arrangement. Taking one connector 43 as an example, connector 43 is made of metal and includes a hollow cylindrical connector with openings at both ends. One end of the cylindrical connector is welded to one end 411 of the heat-conducting body 41, which is adapted to the position of the opening 413a formed by the heat dissipation through hole 413 at that end 411 and is aligned with the opening 413a. The other end has a connecting part 43a for connecting to an external channel, which connects to an external heat dissipation system. In this embodiment, the connecting part 43a has an external thread for connecting to an external water pipe with an internal thread, which connects to an external water cooling system. Of course, in other embodiments, the material, structure, and arrangement of the two connectors 43 may be different. In other embodiments, the two connectors 43 may also be integrally formed with the heat-conducting body 41.

[0039] Three mounting parts 412 are used to mount the circuit unit to be cooled. The circuit unit to be cooled may include three circuit sub-units to be cooled. Each of the three mounting parts 412 is provided with one circuit sub-unit to be cooled. Since the three mounting parts 412 are symmetrically arranged on the outer surface of the heat-conducting body 41, the three circuit sub-units to be cooled are also symmetrically arranged on the outer surface of the heat-conducting body 41. The symmetrical arrangement is conducive to uniform heat dissipation.

[0040] In this embodiment, a water pipe is connected via connector 43, and then an external water cooling system is connected. The water cooling system can inject water into the heat dissipation hole 413, and the heat dissipation is further accelerated through water circulation.

[0041] The following is for reference. Figure 3 This is a schematic diagram of another heat dissipation unit provided in Embodiment 1 of the present invention. The heat dissipation unit includes a heat-conducting body 51, three mounting portions 512a, and two connecting members 53. Figure 1The heat dissipation unit shown differs in that the three mounting portions 512a, two connectors 53, and the heat-conducting body 51 are integrally formed. The heat-conducting body 51 is cylindrical and has two ends 511 (only one is shown in the figure), and a sidewall portion 512 located between the two ends 511. The outer surface of the sidewall portion 512 has six planes symmetrically arranged, and three of these symmetrically arranged planes are selected as mounting portions 512a. The interior of the heat-conducting body 51 has a straight heat dissipation through hole 513, which extends from one end 511 to the other end 511, and forms an opening end 513a at each end 511. The cross-sectional shape of the heat dissipation through hole 513 is circular. The two connectors 53 and the heat-conducting body 51 are integrally formed. The connecting portion 43a of the two connectors 53 has an internal thread for connecting an external water pipe with an external thread, which connects to an external water cooling system.

[0042] The heat dissipation unit provided in this embodiment of the utility model, through its ingenious structural design and by placing the circuit unit to be cooled on the heat dissipation unit, directly dissipates heat from the circuit unit, resulting in a simple overall structure, low cost, high heat dissipation efficiency, and without affecting the normal operation of the circuit unit to be cooled.

[0043] Example 2:

[0044] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings and examples. An embodiment of this utility model provides a power device, which includes the heat dissipation unit provided in Embodiment 1, and further includes a power unit, wherein the power unit includes N power sub-units, and one power sub-unit is disposed on each mounting portion of the heat dissipation unit. The power sub-unit includes a power circuit disposed on the mounting portion; or the power sub-unit includes a substrate and a power circuit disposed on the substrate, the substrate being disposed on the mounting portion.

[0045] In some embodiments, the power unit may include a power sub-unit. For example, the power unit is a half-bridge power unit, which includes a power sub-unit, and the power circuit in the power sub-unit is a half-bridge circuit.

[0046] In some embodiments, the power unit may also include two power sub-units. For example, the power unit is an H-bridge power unit, which includes two power sub-units. The power circuits in the two power sub-units constitute an H-bridge circuit, wherein the power circuit in each power sub-unit can be a half-bridge circuit, and the two half-bridge circuits constitute an H-bridge circuit.

[0047] In some embodiments, the power unit may also include three power sub-units. For example, the power sub-unit is a three-phase full-bridge power unit, which includes three power sub-units. The power circuits in the three power sub-units constitute a three-phase full-bridge circuit. The power circuit in each power sub-unit can be a one-phase circuit, such as a half-bridge circuit. The three one-phase circuits constitute a three-phase full-bridge circuit.

[0048] Each power subunit is mounted on a separate mounting section, making full use of the installation space and facilitating heat dissipation.

[0049] The power circuit can be directly mounted on the mounting section, which can be an insulated mounting section. Alternatively, the power circuit can be mounted on the mounting section using a substrate with a thickness of 0.1 mm to 10 mm. The substrate can be mounted on the mounting section by soldering. The substrate can be an insulating substrate, such as a ceramic substrate, preferably an insulating and thermally conductive substrate, which can be selected according to actual needs.

[0050] The power circuit has a current output terminal, a current input terminal, and a control terminal, and may also have a detection terminal. The substrate can be equipped with current output pins, current input pins, control pins, and detection pins. The current output pins are internally connected to the current output terminal of the power circuit and externally connected to the current output circuit. The current input pins are internally connected to the current input terminal of the power circuit and externally connected to the current input circuit. The control pins are internally connected to the control terminal of the power circuit and externally connected to the drive circuit. The detection pins are internally connected to the detection terminal of the power circuit, such as in a temperature monitoring circuit, and externally connected to a detection circuit.

[0051] In some embodiments, the power circuit includes at least a power module, power electronic devices, and / or a power chip, with the power module containing the power electronic devices and / or the power chip. The power circuit is used to implement a preset function and may also include other auxiliary electronic devices and auxiliary circuits, such as resistors and control circuits. Power electronic devices include, but are not limited to, power semiconductor devices, such as MOSFETs, silicon controlled rectifier transistors (SCRs), insulated-gate bipolar transistors (IGBTs), etc. MOSFETs include, but are not limited to, silicon carbide MOSFETs. The power module, power electronic devices, and other auxiliary electronic devices in the power circuit can be mounted on a mounting portion or substrate by soldering, including but not limited to surface mount technology (SMT). The power chip can be mounted on the mounting portion or substrate by die bonding. The traces in the power circuit can be fabricated on the mounting portion or substrate using photolithography, etching, electroplating, printing, etc.

[0052] In some embodiments, the power circuit may further include a temperature monitoring circuit, which is connected to an external heat dissipation system. The temperature monitoring circuit sends a monitoring signal to the external heat dissipation system, which controls the heat dissipation efficiency; for example, a water-cooling system controls the flow rate of water flowing into the heat dissipation holes, and an air-cooling system controls the airflow speed.

[0053] In some embodiments, the power unit includes three power sub-units, and the power circuits in the three power sub-units constitute a three-phase full-bridge circuit.

[0054] In some embodiments, the power device further includes a housing that surrounds the heat dissipation unit and the power unit, serving to protect the power unit and the heat dissipation unit. The housing may be a thermally conductive housing. A circular housing may be used to improve vibration resistance.

[0055] In some embodiments, the power device further includes a filling unit that fills the space between the housing and the power unit and the heat dissipation unit. The filling module enhances shock resistance and water resistance in the gap between the housing and the power unit and the heat dissipation unit. The filling unit may be obtained by filling with a thermally conductive material.

[0056] refer to Figure 4 The power device shown has a heat dissipation unit that... Figure 1 Taking the heat dissipation unit shown as an example, the power unit includes three power sub-units 61 (only two power sub-units 61 are shown in the figure). The power circuits in the three power sub-units 61 constitute a three-phase full-bridge circuit. The power sub-unit 61 includes a substrate 611 and a power circuit (not shown in the figure) disposed on the substrate. The substrate 611 is disposed on the mounting part 412, and each power sub-unit 61 is disposed on one mounting part 412, symmetrically disposed on the outer surface of the heat-conducting body 41. The two ends of the substrate 611 facing the connector 43 have a current output pin 611a, which is internally connected to the current output terminal of the power circuit and externally connected to the current output circuit. The other end has a current input pin 611b, a control pin 611c, and a detection pin 611d. The current input pin 611b is internally connected to the current input terminal of the power circuit and externally connected to the current input circuit. The control pin 611c is internally connected to the control terminal of the power circuit and externally connected to the drive circuit. The detection pin 611d is internally connected to the detection terminal of the power circuit, such as a temperature monitoring circuit, and externally connected to a detection circuit. The manufacturing process of the power device can be as follows: first, the substrate 611 is mounted on the mounting section 412 using a soldering process, and then the power circuit is set on the substrate 611. (Reference) Figure 5 As shown, the power device also includes a housing 71, which is fitted outside the heat dissipation unit and the power unit.

[0057] The heat-conducting body is perfectly matched to the three-phase topology of the three-phase full-bridge circuit. Water flows through the heat dissipation channels within the heat-conducting body, directly carrying away the heat from the three-phase full-bridge circuit. This direct water-cooling design reduces the need for external heat sinks and lowers system complexity. It also reduces parasitic inductance and wiring complexity. The three-phase magnetic fields cancel each other out, reducing common-mode noise and electromagnetic radiation. The symmetrical design of the mounting section ensures that the temperatures of the three power sub-units are essentially uniform, avoiding localized overheating and reliability issues caused by single-phase overheating. The symmetrical layout also reduces unbalanced current. The cylindrical or polyhedral structure of the heat-conducting body also facilitates multi-module combination and modular expansion to form larger power systems.

[0058] Power modules include, but are not limited to, the following: power sub-circuits arranged on a circuit board, the circuit board and the power sub-circuit are encapsulated together into a module, and have current input terminals, current output terminals and control terminals externally, and the power sub-circuit includes at least power electronic devices and / or power chips.

[0059] The heat dissipation unit and power device provided in this embodiment of the utility model have the power unit set on the heat dissipation unit. Through the ingenious structural design of the heat dissipation unit, the overall structure is simple, the cost is low, the heat dissipation efficiency is high, and the normal operation of the power unit is not affected.

[0060] The above description, in conjunction with specific implementation methods, provides a further detailed explanation of the embodiments of this utility model. It should not be construed that the specific implementation of this utility model is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of this utility model, and all such modifications and substitutions should be considered within the protection scope of this utility model.

Claims

1. A heat dissipation unit, characterized in that, It includes a heat-conducting body and N mounting parts, where N is greater than or equal to 1. The mounting part is disposed on the outer surface of the heat-conducting body, and the mounting part is used to mount the circuit unit to be cooled. The heat-conducting body has one or more heat dissipation channels inside, which extend from one end of the heat-conducting body to the other end, and open ends are formed at both ends.

2. The heat dissipation unit as described in claim 1, characterized in that, It also includes a connector disposed at the open end, the connector being used to connect to an external heat dissipation system.

3. The heat dissipation unit as described in claim 2, characterized in that, The connector includes a hollow cylindrical connector with openings at both ends. One end of the cylindrical connector is connected to the open end, and the other end has a connecting part for connecting to an external channel, through which it is connected to the external heat dissipation system.

4. The heat dissipation unit as described in claim 2, characterized in that, The connector is one of the following: internal thread, external thread, snap fastener, slot, or clamp.

5. The heat dissipation unit as described in claim 1, characterized in that, The mounting portion is an insulating portion, or the heat dissipation unit further includes an insulating portion, the insulating portion is disposed on the mounting portion, and the circuit unit to be cooled is mounted on the insulating portion.

6. The heat dissipation unit as described in claim 1, characterized in that, The mounting section is used to install the power unit.

7. The heat dissipation unit as described in claim 1, characterized in that, N mounting portions are symmetrically arranged on the outer surface of the heat-conducting body.

8. The heat dissipation unit as described in claim 1, characterized in that, The heat-conducting body has two ends and a sidewall portion located between the two ends. Each of the mounting portions is disposed on the outer surface of the sidewall portion of the heat-conducting body. The heat dissipation channel extends from one end of the heat-conducting body to the other end of the heat-conducting body, and an opening end is formed at each of the two ends.

9. The heat dissipation unit as described in claim 8, characterized in that, The heat-conducting body is a cylinder or a polyhedron.

10. The heat dissipation unit as described in claim 9, characterized in that, The heat-conducting body is one of the following: cylinder, triangular prism, square prism, pentagonal prism, or hexagonal prism.

11. The heat dissipation unit as claimed in claim 1, characterized in that, The mounting part is a plane.

12. The heat dissipation unit as described in any one of claims 2 to 4, characterized in that, At least two of the mounting part, the connector, and the heat-conducting body are integrally formed structures.

13. The heat dissipation unit as described in claim 12, characterized in that, The outer surface of the heat-conducting body has M planes; or the outer surface of the heat-conducting body is surrounded by M planes; M is greater than or equal to N, and N of the M planes serve as the mounting parts.

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