Immersed double-refrigeration-unit data center heat dissipation system

Abstract

The utility model relates to the technical field of immersion type heat dissipation, in particular to an immersion type data center heat dissipation system with double refrigeration units, which comprises a box body and a data center server, a backflow type heat exchange unit and an evaporation type heat exchange unit are arranged in the box body, and a heat dissipation unit is arranged outside the box body. The backflow type heat exchange unit and the evaporation type heat exchange unit can exchange heat for the data center server, the backflow type heat exchange unit and the evaporation type heat exchange unit are connected with the heat dissipation unit, the heat dissipation system comprising the backflow type heat exchange unit and the evaporation type heat exchange unit is arranged, and the heat dissipation efficiency can be greatly improved through cooperation of the backflow type heat exchange unit and the evaporation type heat exchange unit. On one hand, the backflow type heat exchange unit takes away heat in cooling liquid to enable the cooling liquid to conduct heat exchange with the heat dissipation unit, the cooling liquid returns to the box body again after cooling is completed, on the other hand, the evaporation type heat exchange unit cools the data center server, the heat transfer path is shortened, heat dissipation is accelerated, and stable operation of the server is guaranteed.

Description

Technical Field

[0001] This utility model relates to the field of immersion heat dissipation technology, specifically an immersion dual-cooling-unit data center heat dissipation system. Background Technology

[0002] In today's digital age, especially with the development of AI technology, the scale of data centers is exploding, and the computing power of servers is constantly improving. However, the resulting heat dissipation problem has become increasingly prominent, becoming a key bottleneck restricting the development of data centers.

[0003] Traditional air cooling methods are no longer sufficient to meet the cooling requirements of high-density servers due to their low heat dissipation efficiency. Liquid cooling technology, on the other hand, has become the mainstream choice in the market due to its higher efficiency and lower energy consumption.

[0004] Liquid cooling mainly comes in two types: indirect contact liquid cooling, such as plate cooling, and direct contact liquid cooling, such as immersion cooling. Plate cooling appeared earlier and, compared to air cooling, has significant advantages in heat transfer efficiency and cost. However, it also has obvious disadvantages, mainly the following:

[0005] 1. The installation is highly complex, requiring hardware modifications and sometimes even the complete system disassembly for installation;

[0006] 2. There is a risk of coolant leakage, which can damage electronic components. The manufacturing process is demanding and the yield rate fluctuates greatly.

[0007] Immersion liquid cooling relies on a special fluid medium, coolant, which can directly contact the hardware of data center servers, such as CPUs and GPUs, areas prone to heat accumulation, and quickly remove this heat to achieve heat dissipation and cooling.

[0008] Common coolants include pure water, deionized water, fluorinated fluid, synthetic oil, or two-phase coolant. These coolants can quickly remove heat and cool the circuit, and their own properties also help prevent short circuits.

[0009] Chinese patent CN217957563U discloses a server immersion cooling oil tank, cooling system and heating system. It cools the server by means of a single oil immersion method. This cooling method mainly relies on the oil pump to control the rapid flow of oil to remove heat. The overall heat dissipation efficiency is limited and is not ideal for the heat dissipation of data center servers used for AI technology research and development. Utility Model Content

[0010] The purpose of this invention is to provide an immersion dual-cooling-unit data center heat dissipation system to address the aforementioned problems.

[0011] The technical solution adopted by this utility model is as follows: an immersion dual-cooling unit data center heat dissipation system, including a box and a data center server, wherein the box is filled with coolant, the data center server is placed in the box and immersed in the coolant, wherein the box is provided with a reflux heat exchange unit and an evaporative heat exchange unit, and the box is provided with a heat dissipation unit outside the box.

[0012] Both the reflux heat exchange unit and the evaporative heat exchange unit can exchange heat with the data center server, and the reflux heat exchange unit and the evaporative heat exchange unit are connected to the heat dissipation unit.

[0013] Optionally, the housing is equipped with a vertical partition, which divides the interior of the housing into a coolant chamber and a heat exchange chamber.

[0014] The data center server is placed in a coolant chamber.

[0015] Optionally, the reflux heat exchange unit includes a submersible pump and a plate heat exchanger;

[0016] The submersible pump is located inside the coolant chamber and at the top of the coolant chamber, and can pump the coolant in the coolant chamber to the plate heat exchanger.

[0017] The plate heat exchanger is located in the heat exchange chamber and is connected to the heat dissipation unit. It can also return the coolant input by the submersible pump to the coolant chamber.

[0018] Optionally, the plate heat exchanger is provided with a reflux inlet, a reflux outlet, a cooling inlet, and a cooling outlet;

[0019] The submersible pump is connected to the reflux inlet on the plate heat exchanger via a coolant inlet pipe;

[0020] The heat dissipation unit is connected to the cooling inlet on the plate heat exchanger via a refrigeration input pipe, and the heat dissipation unit is connected to the cooling outlet on the plate heat exchanger via a refrigeration output pipe.

[0021] The plate heat exchanger has a return outlet connected to a coolant return pipe, which returns the coolant to the coolant chamber.

[0022] The end of a section of the coolant return pipe located in the coolant chamber is located at the bottom of the coolant chamber.

[0023] Optionally, the plate heat exchanger is provided with heat exchange tubes, plate heat exchange fins, and heat exchange connecting pipes.

[0024] The heat exchange tube is connected to the coolant inlet pipe and the coolant return pipe at both ends, and the heat exchange tube can pass through the plate heat exchanger assembly.

[0025] The plate heat exchanger assembly is provided with plate heat exchangers arranged in layers.

[0026] The heat exchange connection pipe is located between adjacent plate heat exchange plates and connects the adjacent plate heat exchange plates.

[0027] Optionally, the refrigeration output pipe is connected to one end of the plate heat exchanger assembly, and a second one-way valve is provided on the refrigeration output pipe;

[0028] The refrigeration input pipe is connected to the other end of the plate heat exchanger assembly, and a first one-way valve is provided on the refrigeration input pipe;

[0029] The heat exchange tube has a U-shaped structure.

[0030] Optionally, the evaporative heat exchange unit includes an evaporator;

[0031] The evaporator is located inside the coolant chamber and is positioned parallel to the data center server. The evaporator is detachably connected to the vertical partition via a connecting block and is connected to the heat dissipation unit.

[0032] Optionally, the evaporator is provided with a curved coil, and the curved coil is filled with a heat exchanger.

[0033] The evaporator is connected to the refrigeration output pipe through the heat exchanger output pipe, and the refrigeration output pipe is connected to the heat dissipation unit.

[0034] The evaporator is connected to the refrigeration input pipe via a heat exchanger input pipe, and the refrigeration input pipe is connected to the heat dissipation unit.

[0035] A third one-way valve is installed on the heat exchanger inlet pipe.

[0036] Optionally, the heat dissipation unit is an outdoor unit of an air conditioner.

[0037] Optionally, a temperature sensor is installed in the coolant chamber, and the temperature sensor can collect the temperature of the coolant in the coolant chamber. The temperature sensor is connected to the controller signal.

[0038] The controller is signal-connected to the heat dissipation unit.

[0039] The beneficial effects of this utility model include at least one of the following;

[0040] 1. By setting up a heat dissipation system that includes a reflux heat exchange unit and an evaporative heat exchange unit, the heat dissipation efficiency can be greatly improved by combining the two.

[0041] 2. On the one hand, the reflux heat exchange unit removes heat from the coolant and exchanges it with the heat dissipation unit. After cooling, the coolant returns to the enclosure, achieving both cooling and dynamic balance of coolant capacity. On the other hand, the evaporative heat exchange unit cools the data center server, shortens the heat transfer path, accelerates heat dissipation, ensures stable server operation, and can reduce the temperature of key server components by 10℃-15℃.

[0042] 3. The evaporator is matched with the data center server and can be arranged closely, saving data center space and improving space utilization.

[0043] 4. By incorporating temperature sensors and controllers into an intelligent modular unit, the system temperature can be controlled, heat dissipation can be efficient, cooling system energy consumption can be reduced, and data center operating costs can be lowered. It is estimated that overall energy consumption can be reduced by 20%-30%. Attached Figure Description

[0044] Figure 1 A three-dimensional schematic diagram of an immersion dual-cooling-unit data center heat dissipation system;

[0045] Figure 2 A schematic diagram of the connection of an immersion dual-cooling-unit data center heat dissipation system;

[0046] Figure 3 This is a schematic diagram of the connection structure between a reflux heat exchange unit and an evaporative heat exchange unit.

[0047] Figure 4 A schematic diagram of the connection structure between a reflux heat exchange unit and an evaporative heat exchange unit from another perspective;

[0048] Figure 5 This is a schematic diagram of a plate heat exchanger.

[0049] In the picture:

[0050] 1 is coolant, 2 is enclosure, 3 is temperature sensor, 4 is data center server, 5 is submersible pump, 6 is evaporator, 7 is plate heat exchanger, 8 is first check valve, 9 is heat dissipation unit, 10 is controller, 11 is second check valve, 12 is third check valve, 13 is vertical partition, 14 is coolant chamber, 15 is heat exchange chamber, 16 is coolant inlet pipe, 17 is coolant return pipe, 18 is heat exchanger outlet pipe, 19 is heat exchanger inlet pipe, 20 is refrigeration outlet pipe, 21 is refrigeration inlet pipe, 22 is top plate, 23 is limit plate, 24 is top door of enclosure, 25 is observation window, 26 is rear door of enclosure, 27 is side door of enclosure, 28 is heat exchange tube, 29 is plate heat exchange plate, and 30 is heat exchange connection pipe. Detailed Implementation

[0051] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can typically be arranged and designed in various different configurations.

[0052] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0053] It should be noted that, where there is no conflict, the embodiments and features in the embodiments of this utility model can be combined with each other.

[0054] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0055] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use, or the orientation or positional relationship commonly understood by those skilled in the art. They are only used for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0056] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0057] like Figure 1 and Figure 2 As shown, an immersion dual-cooling unit data center heat dissipation system includes a housing 2 and a data center server 4. Coolant 1 is injected into the housing 2, and the data center server 4 is placed inside the housing 2 and immersed in the coolant 1. A reflux heat exchange unit and an evaporative heat exchange unit are provided inside the housing 2, and a heat dissipation unit 9 is provided outside the housing 2.

[0058] Both the reflux heat exchange unit and the evaporative heat exchange unit can exchange heat with the data center server 4, and the reflux heat exchange unit and the evaporative heat exchange unit are connected to the heat dissipation unit 9.

[0059] The purpose of this design is to significantly improve heat dissipation efficiency by incorporating both reflux and evaporative heat exchange units into the cooling system. On one hand, the reflux heat exchange unit removes heat from the coolant, allowing it to exchange heat with the cooling unit. After cooling, the coolant returns to the enclosure, achieving both coolant cooling and dynamic coolant volume balance. On the other hand, the evaporative heat exchange unit cools the data center servers, shortening the heat transfer path, accelerating heat dissipation, and ensuring stable server operation. This can reduce the temperature of critical server components by 10°C-15°C.

[0060] In this embodiment, as Figure 3 and Figure 4 As shown, a vertical partition 13 is provided inside the housing 2, and the vertical partition 13 divides the interior of the housing 2 into a coolant chamber 14 and a heat exchange chamber 15.

[0061] The data center server 4 is placed in the coolant chamber 14.

[0062] The purpose of this design is to divide the enclosure so that the heat exchange section and the coolant section can be matched and arranged closely, saving data center space and improving space utilization.

[0063] In this embodiment, a specific structure of a reflux heat exchange unit is provided, wherein the reflux heat exchange unit includes a submersible pump 5 and a plate heat exchanger 7.

[0064] The submersible pump 5 is located in the coolant chamber 14 and at the top of the coolant chamber 14, and can pump the coolant 1 in the coolant chamber 14 to the plate heat exchanger 7.

[0065] The plate heat exchanger 7 is located in the heat exchange chamber 15. The plate heat exchanger 7 is connected to the heat dissipation unit 9 and can return the coolant 1 input by the submersible pump 5 to the coolant chamber 14.

[0066] The purpose of this design is to achieve heat dissipation and cooling from two dimensions: one is to quickly remove the heat from the data center server through the evaporative heat exchange unit, and the other is to reduce the temperature of the coolant through the reflux heat exchange unit, so that it will not continue to heat up and ensure the efficiency and quality of the overall heat dissipation.

[0067] Based on this premise, during the entire heat dissipation process, the heat generated by the data center server is distributed from bottom to top in the coolant and accumulates in the upper area. Therefore, the submersible pump is usually set in the upper part of the enclosure. This allows the coolant, which accumulates heat in the upper part of the enclosure, to be pumped to the plate heat exchanger. After being cooled by heat exchange, it flows back from the lower part of the enclosure, and the entire coolant forms a large circulation, with heat being continuously removed from the enclosure.

[0068] Based on this, such as Figure 5 As shown, this embodiment provides a specific structure of a plate heat exchanger, wherein the plate heat exchanger 7 is provided with a reflux inlet, a reflux outlet, a cooling inlet, and a cooling outlet;

[0069] The submersible pump 5 is connected to the return inlet on the plate heat exchanger 7 via the coolant inlet pipe 16.

[0070] The heat dissipation unit 9 is connected to the cooling inlet on the plate heat exchanger 7 via the refrigeration input pipe 21, and the heat dissipation unit 9 is connected to the cooling outlet on the plate heat exchanger 7 via the refrigeration output pipe 20.

[0071] The plate heat exchanger 7 is connected to a coolant return pipe 17 at its return outlet, and the coolant 1 is returned to the coolant chamber 14.

[0072] The end of a section of the coolant return pipe 17 located in the coolant chamber 14 is located at the lower part of the coolant chamber 14.

[0073] Meanwhile, the plate heat exchanger 7 is equipped with heat exchange tubes 28, plate heat exchange fins and heat exchange connecting pipes 30.

[0074] The two ends of the heat exchange tube 28 are connected to the coolant inlet pipe 16 and the coolant return pipe 17, respectively, and the heat exchange tube 28 can pass through the plate heat exchanger assembly.

[0075] The plate heat exchanger assembly is provided with plate heat exchangers 29 arranged in layers;

[0076] The heat exchange connecting pipe 30 is located between adjacent plate heat exchange plates 29 and connects the adjacent plate heat exchange plates 29.

[0077] Furthermore, the cooling output pipe 20 is connected to one end of the plate heat exchanger assembly, and a second one-way valve 11 is provided on the cooling output pipe 20.

[0078] The refrigeration input pipe 21 is connected to the other end of the plate heat exchanger assembly, and a first one-way valve 8 is provided on the refrigeration input pipe 21.

[0079] The heat exchange tube 28 has a U-shaped structure.

[0080] The purpose of this design is that the entire heat exchange process is a heat conduction process, where heat is transferred from the high-temperature coolant to the low-temperature heat exchanger, and the heat exchanger is introduced into the plate heat exchanger through the heat dissipation unit.

[0081] In the specific heat exchange process, the heat exchanger enters the plate heat exchanger through the refrigeration input pipe, fills the plate heat exchanger assembly through the heat exchange connection pipe, and then returns to the heat exchange unit through the refrigeration output pipe. The discharged coolant then enters the heat exchange tube. Since the heat exchange tube passes through the plate heat exchanger and is also U-shaped, the contact area between the heat exchange tube and the plate heat exchanger is greatly increased, providing ample heat exchange space.

[0082] In this embodiment, to prevent backflow during pipeline transportation, one-way valves are added to several important pipelines, such as a second one-way valve 11 on the refrigeration output pipe 20 and a first one-way valve 8 on the refrigeration input pipe 21.

[0083] In this embodiment, a specific structure of an evaporative heat exchange unit is provided, wherein the evaporative heat exchange unit includes an evaporator 6;

[0084] The evaporator 6 is located in the coolant chamber 14 and is arranged parallel to the data center server 4. The evaporator 6 is detachably connected to the vertical partition 13 via a connecting block. The evaporator 6 is connected to the heat dissipation unit 9. A curved coil is provided inside the evaporator 6, and the curved coil is filled with heat exchanger.

[0085] The evaporator 6 is connected to the refrigeration output pipe 20 through the heat exchanger output pipe 18, and the refrigeration output pipe 20 is connected to the heat dissipation unit 9;

[0086] The evaporator 6 is connected to the refrigeration input pipe 21 through the heat exchanger input pipe 19, and the refrigeration input pipe 21 is connected to the heat dissipation unit 9;

[0087] A third one-way valve 12 is provided on the heat exchanger inlet pipe 19.

[0088] The purpose of this design is that the evaporator, with its large contact surface and efficient thermal conductivity, can quickly transfer the heat from the coolant near the data center server to the external heat dissipation unit, thereby cooling the area. The cooled coolant then circulates around the server to continue absorbing heat, thus forming a continuous and stable heat dissipation cycle.

[0089] It should also be noted that in the technical solution provided in this embodiment, the refrigeration output pipe and the refrigeration input pipe are used to exchange heat with the evaporator and the plate heat exchanger respectively. Therefore, Freon is selected as the heat exchange agent. Considering environmental protection and other factors, those skilled in the art can choose more environmentally friendly materials to make corresponding replacements. This embodiment is only used to illustrate the principle and does not limit the materials.

[0090] Furthermore, in practical applications, the heat dissipation unit functions similarly to the outdoor unit of an air conditioner. Therefore, this embodiment uses it as the heat dissipation unit, but those skilled in the art can also choose other suitable structures.

[0091] Meanwhile, in this embodiment, a temperature sensor 3 is provided in the coolant chamber 14, and the temperature sensor 3 can collect the temperature of the coolant 1 in the coolant chamber 14. The temperature sensor 3 is connected to the controller 10 via signal.

[0092] The controller 10 is connected to the heat dissipation unit 9 via a signal connection.

[0093] The purpose of this design is that the controller monitors the coolant temperature in real time using a temperature sensor according to the preset temperature control mode, and controls the opening of the one-way valve through an algorithm to control the coolant temperature. The temperature difference control is ±t = 2 degrees Celsius; for example, the system shuts down when the temperature reaches 30°C, and automatically restarts when the temperature exceeds 32°C. This control of the entire system temperature ensures the normal operation of the server.

[0094] Meanwhile, by using temperature sensors and controllers to form an intelligent modular unit, the system temperature can be controlled, heat dissipation can be efficient to reduce the energy consumption of the cooling system, and data center operating costs can be reduced. It is estimated that the overall energy consumption can be reduced by 20%-30%.

[0095] However, it should be noted that the technical solution provided in this embodiment is mainly a hardware structure. To achieve more precise temperature control, it needs to be combined with existing mature algorithms. This part is for those skilled in the art to choose according to actual needs.

[0096] In this embodiment, the temperature sensor used can be one of thermistors, resistance temperature detectors, thermocouples, or fiber optic temperature sensors. Those skilled in the art can select one according to the actual needs of the scenario and choose the corresponding model. The change of model does not affect the use of the temperature sensor function in this embodiment.

[0097] For the controller, either a conventional PCL or a microcontroller can be used, and the Mitsubishi FX series is a good choice.

[0098] In this embodiment, in order to observe and test the entire heat dissipation system, a rear door 26 is provided at the rear end of the enclosure, and a side door 27 is provided at the side end of the enclosure, so that the corresponding pipes can pass through them. An observation window 25 is provided at the top of the enclosure near the heat exchange chamber.

[0099] In this embodiment, to ensure the heat dissipation effect of the data center server, it is better to suspend it in the coolant cavity than to place it at the bottom, as this provides a larger contact area with the coolant. Therefore, a top door 24 is provided at the top of the enclosure near the coolant cavity, along with a top plate 22 and a limiting plate 23. The data center server is connected to the top plate 22 using a hollow, detachable structure, and then the whole unit is placed into the enclosure. The limiting plate 23 is then engaged with the opening of the top door 24, thus suspending the data center server in the coolant cavity.

[0100] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An immersion-type dual-cooling-unit data center heat dissipation system, comprising a housing (2) and a data center server (4), wherein the housing (2) is filled with coolant (1), and the data center server (4) is placed inside the housing (2) and immersed in the coolant (1), characterized in that, The box (2) is equipped with a reflux heat exchange unit and an evaporative heat exchange unit, and the box (2) is equipped with a heat dissipation unit (9) outside the box (2); Both the reflux heat exchange unit and the evaporative heat exchange unit can exchange heat with the data center server (4), and the reflux heat exchange unit and the evaporative heat exchange unit are connected to the heat dissipation unit (9).

2. The immersion dual-cooling-unit data center heat dissipation system according to claim 1, characterized in that, The box (2) is provided with a vertical partition (13), which divides the interior of the box (2) into a coolant chamber (14) and a heat exchange chamber (15); The data center server (4) is placed in the coolant chamber (14).

3. The immersion dual-cooling-unit data center heat dissipation system according to claim 2, characterized in that, The reflux heat exchange unit includes a submersible pump (5) and a plate heat exchanger (7); The submersible pump (5) is located in the coolant chamber (14) and at the top of the coolant chamber (14), and can pump the coolant (1) in the coolant chamber (14) to the plate heat exchanger (7); The plate heat exchanger (7) is located in the heat exchange chamber (15). The plate heat exchanger (7) is connected to the heat dissipation unit (9) and can return the coolant (1) input by the submersible pump (5) to the coolant chamber (14).

4. The immersion dual-cooling-unit data center heat dissipation system according to claim 3, characterized in that, The plate heat exchanger (7) is provided with a reflux inlet, a reflux outlet, a cooling inlet, and a cooling outlet; The submersible pump (5) is connected to the return inlet on the plate heat exchanger (7) via a coolant inlet pipe (16); The heat dissipation unit (9) is connected to the cooling inlet on the plate heat exchanger (7) through the refrigeration input pipe (21), and the heat dissipation unit (9) is connected to the cooling outlet on the plate heat exchanger (7) through the refrigeration output pipe (20). The plate heat exchanger (7) is connected to a coolant return pipe (17) at its return outlet, and the coolant (1) is returned to the coolant chamber (14). The end of a section of the coolant return pipe (17) located in the coolant chamber (14) is located at the lower part of the coolant chamber (14).

5. The immersion dual-cooling-unit data center heat dissipation system according to claim 4, characterized in that, The plate heat exchanger (7) is provided with heat exchange tubes (28), plate heat exchange fins and heat exchange connecting pipes (30); The two ends of the heat exchange tube (28) are connected to the coolant inlet pipe (16) and the coolant return pipe (17) respectively, and the heat exchange tube (28) can pass through the plate heat exchanger assembly; The plate heat exchanger assembly is provided with plate heat exchangers (29) arranged in layers; The heat exchange connecting pipe (30) is located between adjacent plate heat exchange plates (29) and connects the adjacent plate heat exchange plates (29).

6. The immersion dual-cooling-unit data center heat dissipation system according to claim 5, characterized in that, The refrigeration output pipe (20) is connected to one end of the plate heat exchanger assembly, and a second one-way valve (11) is provided on the refrigeration output pipe (20); The refrigeration input pipe (21) is connected to the other end of the plate heat exchanger assembly, and a first one-way valve (8) is provided on the refrigeration input pipe (21); The heat exchange tube (28) has a U-shaped structure.

7. The immersion dual-cooling-unit data center heat dissipation system according to claim 2, characterized in that, The evaporative heat exchange unit includes an evaporator (6); The evaporator (6) is located in the coolant chamber (14) and is arranged parallel to the data center server (4). The evaporator (6) is detachably connected to the vertical partition (13) via a connecting block. The evaporator (6) is connected to the heat dissipation unit (9).

8. The immersion dual-cooling-unit data center heat dissipation system according to claim 7, characterized in that, The evaporator (6) is provided with a curved coil, and the curved coil is filled with heat exchanger. The evaporator (6) is connected to the refrigeration output pipe (20) through the heat exchanger output pipe (18), and the refrigeration output pipe (20) is connected to the heat dissipation unit (9); The evaporator (6) is connected to the refrigeration input pipe (21) through the heat exchanger input pipe (19), and the refrigeration input pipe (21) is connected to the heat dissipation unit (9); A third check valve (12) is provided on the heat exchanger inlet pipe (19).

9. A submersible dual-cooling-unit data center heat dissipation system according to any one of claims 1 to 8, characterized in that, The heat dissipation unit (9) is an outdoor unit of an air conditioner.

10. A submersible dual-cooling-unit data center heat dissipation system according to any one of claims 2 to 8, characterized in that, A temperature sensor (3) is installed in the coolant chamber (14), and the temperature sensor (3) can collect the temperature of the coolant (1) in the coolant chamber (14). The temperature sensor (3) is connected to the controller (10) via signal. The controller (10) is connected to the heat dissipation unit (9) via a signal.

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