Tin brushing device for SMT (Surface Mount Technology)

Abstract

The utility model discloses a tin brushing device for SMT, which comprises an integration box and a placing box, the placing box is installed on the inner wall of the integration box, a stepping motor is installed on the outer wall of the placing box, a worm is installed at the output end of the stepping motor, a worm wheel is movably installed in the placing box on one side of the worm, and a motor is installed on the other side of the worm. A long connecting arm is movably installed at the top end of the worm gear, a short connecting arm is arranged at the end, away from the worm gear, of the long connecting arm, a movable shaft is installed at the end, close to the long connecting arm, of the short connecting arm, the short connecting arm is movably connected with the long connecting arm through the movable shaft, and a linkage shaft is installed at the end, away from the long connecting arm, of the short connecting arm; and the short connecting arm is movably connected with the placing box through a linkage shaft. According to the utility model, the tin liquid can be conveniently scraped, swept and brushed in a reciprocating swinging manner, the PCB can be conveniently and sequentially brushed, and the tin liquid brushing uniformity and the tin liquid brushing efficiency are improved.

Description

Technical Field

[0001] This utility model relates to the field of solder brushing device technology, specifically a solder brushing device for SMT. Background Technology

[0002] SMT, or Surface Mount Technology, is a circuit assembly technology that mounts leadless or short-lead surface mount components onto the surface of a printed circuit board or other substrate, and then solders them using methods such as reflow soldering or dip soldering. SMT is widely used in various electronic products, especially portable devices, consumer electronics, and communication equipment. Due to its miniaturization, high density, and high degree of automation, SMT performs exceptionally well in scenarios requiring efficient production and high-quality products. Before mounting, solder paste needs to be applied to the PCB board. To better apply solder paste to the PCB board, a soldering device for SMT has been proposed.

[0003] For example, the soldering device for SMT disclosed in the authorization announcement number CN221227875U includes a working frame, a transverse component fixedly mounted on the working frame, and a soldering station and a positioning station located on the moving path of the transverse component. A soldering plate is vertically mounted on the transverse end of the transverse component, and a protruding contact is fixedly provided on the soldering plate.

[0004] Although it achieves the replacement of the traditional mesh brushing structure with the method of using convex contacts to dip solder paste and form solder dots, it can not only avoid poor soldering caused by abnormal mesh, but also the position of the convex contacts corresponds to the product pads. Through the dot brushing process, it can avoid the solder brushed on the pads from shifting, thus improving the soldering accuracy of the device. Since the shape of the convex contacts and the pad mating surface correspond, the solder dots formed after the convex contacts dip in solder correspond to the shape of the solder dot surface of the pad, which can further ensure the accuracy of the solder dot area.

[0005] However, it did not solve the problem that the existing soldering device is not convenient for reciprocating oscillation to scrape and apply solder liquid, which is not conducive to sequential soldering operations on the PCB board and affects the uniformity and efficiency of solder liquid application. Utility Model Content

[0006] The purpose of this invention is to provide a solder brushing device for SMT, which solves the problems mentioned in the background art, such as the inconvenience of reciprocating oscillation to scrape and brush solder, the disadvantage of sequential brushing of PCB boards, and the impact on the uniformity and efficiency of solder brushing.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a solder brushing device for SMT, comprising an integration box and a placement box. The placement box is mounted on the inner wall of the integration box, and a stepper motor is mounted on the outer wall of the placement box. A worm gear is mounted on the output end of the stepper motor. A worm wheel is movably mounted inside the placement box on one side of the worm gear, and the worm gear and worm wheel mesh with each other. A long connecting arm is movably mounted on the top of the worm wheel. A short connecting arm is provided at the end of the long connecting arm away from the worm wheel, and a movable shaft is mounted at the end of the short connecting arm near the long connecting arm. The short connecting arm passes through the movable shaft. The short connecting arm is movably connected to the long connecting arm. A linkage shaft is installed at the end of the short connecting arm away from the long connecting arm, and the short connecting arm is movably connected to the placement box through the linkage shaft. A swing arm is installed at the bottom end of the linkage shaft, a brush plate is installed at the bottom end of the swing arm, and a liquid outlet rack is installed at the top end of the swing arm. Multiple sets of liquid outlet pipes with equal spacing are installed at the bottom ends of the liquid outlet racks on both sides of the brush plate. A support seat is provided on the outside of the integrated box. A solder liquid tank is installed at the top of the integrated box, and the output end of the solder liquid tank is connected to the liquid outlet rack through a flexible hose. Multiple sets of liquid outlet holes with equal spacing are installed at the bottom end of the integrated box.

[0008] Preferably, an integrated frame is installed at the center of the bearing seat, a rotating disk is provided above the bearing seat, the rotating disk is slidably connected to the bearing seat, and the rotating disk is movably connected to the integrated frame.

[0009] Preferably, a drive motor is installed inside the support seat on one side of the integrated frame, and a drive gear is installed at the output end of the drive motor.

[0010] Preferably, a gear ring is installed at the bottom end of the rotating disk on one side of the drive gear, and the drive gear and the gear ring mesh with each other.

[0011] Preferably, the top of the rotating disk is equipped with multiple sets of placement disks at equal intervals, and each placement disk has a PCB board inside.

[0012] Preferably, a lead screw is installed inside the integrated frame, and the lead screw is movably connected to the integrated frame.

[0013] Preferably, a servo motor is mounted on the top of the integrated frame, and the output end of the servo motor is connected to the lead screw.

[0014] Preferably, the surface of the lead screw is fitted with a threaded sleeve, and the threaded sleeve is threadedly connected to the lead screw, and the threaded sleeve is slidably connected to the integrated frame, and the threaded sleeve is fixedly connected to the integrated box.

[0015] Compared with the prior art, the beneficial effects of this utility model are: the solder brushing device not only realizes the convenient reciprocating swinging scraping and brushing of solder liquid, which facilitates the sequential brushing operation of PCB board, but also improves the uniformity and efficiency of solder liquid brushing.

[0016] (1) Place multiple PCB boards sequentially inside the placement tray. Then, open the integrated frame, which drives the lead screw to rotate. The lead screw drives the threaded sleeve to move downwards, and the threaded sleeve drives the integrated box to move downwards so that the liquid outlet at the bottom of the integrated box contacts the contact points on the surface of the PCB board. Then, turn on the water pump inside the solder tank to pump the solder through the flexible hose into the inside of the liquid outlet rack and discharge it from the liquid outlet pipe. Then, turn on the stepper motor, which drives the worm gear to rotate. Under the mutual meshing of the worm gear and the swing arm, the worm gear drives the worm wheel to rotate. The long connecting arm is driven by a worm gear to swing back and forth. The long connecting arm drives the short connecting arm to swing back and forth through a movable shaft. The short connecting arm drives the swing arm to swing back and forth through a linkage shaft. The swing arm drives the brush plate and the liquid outlet pipe to swing back and forth. With the sliding cooperation between the brush plate and the inner wall of the integrated box, the brush plate swings back and forth to scrape the molten solder discharged from the liquid outlet pipe, scraping the molten solder from the outlet hole and evenly applying it to the contact points on the PCB board surface, thus completing the molten solder coating operation on the PCB board. This achieves convenient reciprocating swinging scraping and brushing of molten solder, improving the uniformity of molten solder coating.

[0017] (2) After the PCB board is coated, the servo motor is turned on in reverse. The servo motor drives the integration box to move upward and away from the placement plate. Then the drive motor is turned on. The drive motor drives the drive gear to rotate. The drive gear drives the rotating disk to rotate through the gear ring. The rotating disk drives the placement plate and the PCB board to rotate to the bottom of the integration box in sequence. Then the above operation is repeated to complete the solder coating work of the PCB board in sequence. This facilitates the sequential coating operation of the PCB board and improves the efficiency of solder coating. Attached Figure Description

[0018] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0019] Figure 2 This is a three-dimensional perspective structural diagram of the support base of this utility model;

[0020] Figure 3 This is a three-dimensional structural diagram of the integrated frame of this utility model;

[0021] Figure 4 This is a top sectional view of the integrated box of this utility model.

[0022] Figure 5 This is a three-dimensional perspective structural diagram of the integrated box of this utility model.

[0023] In the diagram: 1. Support base; 2. Rotary disk; 3. Placement disk; 4. PCB board; 5. Integrated frame; 6. Integrated box; 7. Solder bath; 8. Threaded sleeve; 9. Drive motor; 10. Drive gear; 11. Lead screw; 12. Servo motor; 13. Stepper motor; 14. Placement box; 15. Discharge pipe; 16. Long connecting arm; 17. Movable shaft; 18. Short connecting arm; 19. Linkage shaft; 20. Worm gear; 21. Worm; 22. Swing arm; 23. Discharge rack; 24. Discharge hole; 25. Brush plate; 26. Gear ring. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0025] Please see Figure 1-5 This utility model provides an embodiment of a solder brushing device for SMT, comprising an integrated box 6 and a placement box 14. The placement box 14 is installed on the inner wall of the integrated box 6, and a stepper motor 13 is installed on the outer wall of the placement box 14. The stepper motor 13 serves as a power drive. A worm gear 21 is installed at the output end of the stepper motor 13. A worm wheel 20 is movably installed inside the placement box 14 on one side of the worm gear 21, and the worm gear 21 and the worm wheel 20 mesh with each other. A long connecting arm 16 is movably installed at the top of the worm wheel 20. A short connecting arm 18 is provided at the end of the long connecting arm 16 away from the worm wheel 20, and a movable shaft 17 is installed at the end of the short connecting arm 18 near the long connecting arm 16. The short connecting arm 18 is movably connected to the long connecting arm 16 via the movable shaft 17. The end of the short connecting arm 18 away from the long connecting arm 16 is equipped with a linkage shaft 19, and the short connecting arm 18 is movably connected to the placement box 14 via the linkage shaft 19. A swing arm 22 is installed at the bottom of the linkage shaft 19, a brush plate 25 is installed at the bottom of the swing arm 22, and a liquid outlet rack 23 is installed at the top of the swing arm 22. Multiple sets of liquid outlet pipes 15 with equal spacing are installed at the bottom of the liquid outlet racks 23 on both sides of the brush plate 25. A bearing seat 1 is provided on the outside of the integrated box 6. A solder liquid tank 7 is installed at the top of the integrated box 6, and the output end of the solder liquid tank 7 is connected to the liquid outlet rack 23 via a flexible hose. Multiple sets of liquid outlet holes 24 with equal spacing are installed at the bottom of the integrated box 6.

[0026] Multiple PCB boards 4 are placed sequentially inside the placement tray 3. Then, the integrated frame 5 is opened, and the integrated frame 5 drives the lead screw 11 to rotate. With the lead screw 11 and the threaded sleeve 8 connected by threads, the lead screw 11 drives the threaded sleeve 8 to move downwards. The threaded sleeve 8 drives the integrated box 6 to move downwards so that the liquid outlet hole 24 at the bottom of the integrated box 6 contacts the contact point on the surface of the PCB board 4. Then, the water pump inside the solder bath 7 is turned on, and the solder liquid is pumped through the flexible hose into the liquid outlet rack 23 and discharged from the liquid outlet pipe 15. Then, the stepper motor 13 is turned on, and the stepper motor 13 drives the worm gear 21 to rotate. With the mutual meshing of the worm gear 21 and the swing arm 22, the worm gear 21 drives the worm gear 22 to rotate. The rotating worm gear 20 drives the long connecting arm 16 to swing back and forth. The long connecting arm 16 drives the short connecting arm 18 to swing back and forth through the movable shaft 17. The short connecting arm 18 drives the swing arm 22 to swing back and forth through the linkage shaft 19. The swing arm 22 drives the brush plate 25 and the liquid outlet pipe 15 to swing back and forth. With the sliding cooperation between the brush plate 25 and the inner wall of the integrated box 6, the brush plate 25 swings back and forth to scrape the solder liquid discharged from the liquid outlet pipe 15, scraping the solder liquid from the liquid outlet hole 24 and evenly applying it to the contact points on the surface of the PCB board 4, thus completing the solder liquid brushing operation of the PCB board. This achieves convenient reciprocating swinging scraping to brush the solder liquid, improving the uniformity of the solder liquid brushing.

[0027] An integrated frame 5 is installed at the center of the inside of the support 1. A rotating disk 2 is provided above the support 1, and the rotating disk 2 is slidably connected to the support 1 and movably connected to the integrated frame 5.

[0028] A drive motor 9 is installed inside the bearing seat 1 on one side of the integrated frame 5. The drive motor 9 plays the role of power drive. A drive gear 10 is installed at the output end of the drive motor 9. A gear ring 26 is installed at the bottom end of the rotating disk 2 on one side of the drive gear 10, and the drive gear 10 and the gear ring 26 mesh with each other.

[0029] The top of the rotating disk 2 is equipped with multiple sets of placement disks 3 at equal intervals, and each placement disk 3 has a PCB board 4 inside. The integrated frame 5 is equipped with a lead screw 11 inside, and the lead screw 11 is movably connected to the integrated frame 5.

[0030] A servo motor 12 is installed at the top of the integrated frame 5. The servo motor 12 serves as a power drive, and the output end of the servo motor 12 is connected to the lead screw 11. A threaded sleeve 8 is fitted on the surface of the lead screw 11, and the threaded sleeve 8 is threadedly connected to the lead screw 11. The threaded sleeve 8 is slidably connected to the integrated frame 5, and the threaded sleeve 8 is fixedly connected to the integrated box 6.

[0031] After the PCB board is coated, the servo motor 12 is turned on in reverse. The servo motor 12 drives the integration box 6 to move upward and away from the placement tray 3. Then, the drive motor 9 is turned on, which drives the drive gear 10 to rotate. With the meshing of the drive gear 10 and the gear ring 26, and the sliding cooperation between the rotating disk 2 and the support seat 1, the drive gear 10 drives the rotating disk 2 to rotate through the gear ring 26. The rotating disk 2 drives the placement tray 3 and the PCB board 4 to rotate sequentially to the bottom of the integration box 6. The above operation is repeated to complete the solder coating of the PCB board in sequence, which facilitates the sequential coating of the PCB board and improves the efficiency of solder coating.

[0032] Working principle: Multiple PCB boards 4 are placed sequentially inside the placement tray 3. Then, the integrated frame 5 is opened, which drives the lead screw 11 to rotate. The lead screw 11 drives the threaded sleeve 8 to move downward, and the threaded sleeve 8 drives the integrated box 6 to move downward so that the liquid outlet 24 at the bottom of the integrated box 6 contacts the contact points on the surface of the PCB board 4. Then, the water pump inside the solder tank 7 is turned on, and the solder liquid is pumped through the flexible hose into the liquid outlet rack 23 and discharged from the liquid outlet pipe 15. The stepper motor 13 drives the worm gear 21 to rotate, which drives the worm wheel 20 to rotate. The worm wheel 20 drives the long connecting arm 16 to swing back and forth. The long connecting arm 16 drives the short connecting arm 18 to swing back and forth through the movable shaft 17. The short connecting arm 18 drives the swing arm 22 to swing back and forth through the linkage shaft 19. The swing arm 22 drives the brush plate 25 and the outlet... The liquid pipe 15 oscillates back and forth. With the sliding cooperation between the brush plate 25 and the inner wall of the integrated box 6, the brush plate 25 oscillates and scrapes the molten solder discharged from the liquid pipe 15. This scrapes the molten solder from the liquid outlet 24 and evenly coats it onto the contact points on the surface of the PCB board 4, thus completing the molten solder coating operation on the PCB board. After the PCB board is coated, the servo motor 12 is turned on in reverse. The servo motor 12 drives the integrated box 6 to move upward and away from the placement tray 3. The drive motor 9 drives the drive gear 10 to rotate. The drive gear 10 drives the rotating disk 2 to rotate through the gear ring 26. The rotating disk 2 drives the placement tray 3 and the PCB board 4 to rotate sequentially to the bottom of the integrated box 6. The above operation is repeated to complete the molten solder coating operation on the PCB board. The above is the complete usage of the solder coating device for SMT.

Claims

1. A solder brushing device for SMT, comprising an integration box (6) and a placement box (14), characterized in that: An inner wall of the integrated box (6) is fitted with a placement box (14). A stepper motor (13) is fitted with an outer wall of the placement box (14). A worm gear (21) is fitted with an output end of the stepper motor (13). A worm wheel (20) is movably fitted inside the placement box (14) on one side of the worm gear (21), and the worm gear (21) and the worm wheel (20) mesh with each other. A long connecting arm (16) is movably fitted with the top of the worm wheel (20). A short connecting arm (18) is provided at the end of the long connecting arm (16) away from the worm wheel (20), and a movable shaft (17) is fitted at the end of the short connecting arm (18) close to the long connecting arm (16). The short connecting arm (18) is movably connected to the long connecting arm (16) through the movable shaft (17). One end of the arm (16) is equipped with a linkage shaft (19), and the short connecting arm (18) is movably connected to the placement box (14) through the linkage shaft (19). A swing arm (22) is installed at the bottom end of the linkage shaft (19). A brush plate (25) is installed at the bottom end of the swing arm (22). A liquid outlet rack (23) is installed at the top end of the swing arm (22). Multiple sets of liquid outlet pipes (15) with equal spacing are installed at the bottom ends of the liquid outlet racks (23) on both sides of the brush plate (25). A bearing seat (1) is provided on the outside of the integrated box (6). A tin liquid tank (7) is installed at the top end of the integrated box (6). The output end of the tin liquid tank (7) is connected to the liquid outlet rack (23) through a flexible hose. Multiple sets of liquid outlet holes (24) with equal spacing are installed at the bottom end of the integrated box (6).

2. The solder brushing device for SMT according to claim 1, characterized in that: An integrated frame (5) is installed at the center of the bearing seat (1). A rotating disk (2) is provided above the bearing seat (1), and the rotating disk (2) is slidably connected to the bearing seat (1) and movably connected to the integrated frame (5).

3. The solder brushing device for SMT according to claim 2, characterized in that: A drive motor (9) is installed inside the support seat (1) on one side of the integrated frame (5), and a drive gear (10) is installed at the output end of the drive motor (9).

4. A solder brushing device for SMT according to claim 3, characterized in that: A toothed ring (26) is installed at the bottom of the rotating disk (2) on one side of the drive gear (10), and the drive gear (10) and the toothed ring (26) mesh with each other.

5. A solder brushing device for SMT according to claim 2, characterized in that: The top of the rotating disk (2) is equipped with multiple sets of placement disks (3) at equal intervals, and each placement disk (3) has a PCB board (4) inside.

6. A solder brushing device for SMT according to claim 2, characterized in that: The integrated frame (5) is equipped with a lead screw (11), and the lead screw (11) is movably connected to the integrated frame (5).

7. A solder brushing device for SMT according to claim 2, characterized in that: A servo motor (12) is mounted on the top of the integrated frame (5), and the output end of the servo motor (12) is connected to the lead screw (11).

8. A solder brushing device for SMT according to claim 6, characterized in that: The surface of the lead screw (11) is fitted with a threaded sleeve (8), and the threaded sleeve (8) is threadedly connected to the lead screw (11), and the threaded sleeve (8) is slidably connected to the integrated frame (5), and the threaded sleeve (8) is fixedly connected to the integrated box (6).

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