Oblique insertion assembling mechanism for mobile phone mainboard

Abstract

The utility model discloses a mobile phone mainboard oblique insertion assembly mechanism in the technical field of mainboard installation, which comprises a pressing plate, an equal-height plate is fixedly connected to the upper end of the pressing plate, a suction cup is fixedly connected to the lower end of the pressing plate, arc groove plates are slidably arranged on two sides of the equal-height plate, and a rotating shaft is rotatably arranged at one end of each arc groove plate. A second limiting sliding groove is fixedly formed in one side of the arc groove plate, a second sliding pin is slidably connected into the second limiting sliding groove, a lifting plate is fixedly connected to one end of the second sliding pin, a spline is fixedly connected to the upper end of the lifting plate, the outer surface of the spline is sleeved with an enclasping sleeve, and a fixing plate is fixedly connected to one end of the enclasping sleeve. A locking clamping block is fixedly arranged at one end of the fixing plate, a locking groove is fixedly formed in one side of the equal-height plate, and the locking clamping block is connected into the locking groove in a buckled and sleeved mode. According to the arrangement, the 1 / n circular ring double sliding blocks are adopted to improve the circle center precision of the mechanism, the service life of the mechanism is prolonged, and meanwhile the split sliding groove mechanism is adopted to guarantee the X-direction precision.

Description

Technical Field

[0001] This utility model belongs to the field of motherboard installation technology, specifically relating to a mobile phone motherboard oblique insertion assembly mechanism. Background Technology

[0002] The motherboard is an important component of smartphone devices. During the motherboard manufacturing process, it is often necessary to attach some electrical components to the motherboard. However, the pressure applied to the motherboard by the existing surface mount technology (SMT) device is not convenient to adjust as needed. Excessive pressure will damage the motherboard, while insufficient pressure will affect the stability of the SMT.

[0003] Currently, mobile phone motherboards are typically mounted using an angled insertion method. However, existing angled insertion mechanisms have limited lifespan and relatively low mounting precision, which can easily lead to mounting errors and presents certain limitations. Utility Model Content

[0004] The purpose of this utility model is to provide a mobile phone motherboard oblique insertion assembly mechanism to solve the problems mentioned in the background art, such as the limited service life of existing oblique insertion mechanisms, the low precision of patch placement, the tendency for patch placement errors, and the certain limitations.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a mobile phone motherboard oblique insertion assembly mechanism, comprising a pressure plate, an equalization plate fixedly connected to the upper end of the pressure plate, a suction cup fixedly connected to the lower end of the pressure plate, arc groove plates slidably arranged on both sides of the equalization plate, a rotating shaft rotatably arranged at one end of the arc groove plate, a second limiting slide groove fixedly opened on one side of the arc groove plate, a second sliding pin slidably connected inside the second limiting slide groove, a lifting plate fixedly connected to one end of the second sliding pin, a spline fixedly connected to the upper end of the lifting plate, a clamping sleeve sleeved on the outer surface of the spline, a fixing plate fixedly connected to one end of the clamping sleeve, a locking block fixedly arranged at one end of the fixing plate, a locking groove fixedly opened on one side of the equalization plate, the locking block snapping into the inside of the locking groove, a first sliding pin fixedly connected to one side of the fixing plate, and a first limiting slide groove fixedly opened on the other side of the arc groove plate.

[0006] Preferably, there are two first limiting grooves, and the number of first sliding pins corresponds to the number of first limiting grooves.

[0007] Preferably, protective side plates are fixedly connected to both sides of the arc groove plate.

[0008] Compared with the prior art, the beneficial effects of this utility model are:

[0009] 1. This utility model adopts a 1 / n circular ring double slider to improve the accuracy of the mechanism's center, and the use of a 1 / n circular ring double slider increases the service life of the mechanism. At the same time, the use of a split slide groove mechanism ensures the accuracy in the X direction, making the whole system more accurate. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of the structure of this utility model;

[0011] Figure 2 This is a schematic diagram of the structure of the arc groove plate of this utility model;

[0012] Figure 3 This is a schematic diagram of the contour plate of this utility model.

[0013] In the diagram: 1. Clamping sleeve; 2. Fixing plate; 3. First sliding pin; 4. Elevation plate; 5. Arc groove plate; 6. Pressure plate; 7. Suction cup; 8. Spline; 9. Lifting plate; 10. Second sliding pin; 11. Rotating shaft; 12. Protective side plate; 13. Locking groove; 14. Locking block; 15. First limiting slide groove; 16. Second limiting slide groove. Detailed Implementation

[0014] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0015] Please see Figure 1-3 This utility model provides a technical solution: a mobile phone motherboard oblique insertion assembly mechanism, including a pressure plate 6, an equalization plate 4 fixedly connected to the upper end of the pressure plate 6, a suction cup 7 fixedly connected to the lower end of the pressure plate 6, arc groove plates 5 slidably arranged on both sides of the equalization plate 4, a rotating shaft 11 rotatably arranged at one end of the arc groove plate 5, a second limiting slide groove 16 fixedly opened on one side of the arc groove plate 5, a second sliding pin 10 slidably connected inside the second limiting slide groove 16, a lifting plate 9 fixedly connected to one end of the second sliding pin 10, a spline 8 fixedly connected to the upper end of the lifting plate 9, a clamping sleeve 1 sleeved on the outer surface of the spline 8, a fixing plate 2 fixedly connected to one end of the clamping sleeve 1, a locking block 14 fixedly arranged at one end of the fixing plate 2, a locking groove 13 fixedly opened on one side of the equalization plate 4, the locking block 14 snapping into the inside of the locking groove 13, a first sliding pin 3 fixedly connected to one side of the fixing plate 2, and a first limiting slide groove 15 fixedly opened on the other side of the arc groove plate 5.

[0016] In this implementation scheme, by locking the clamping sleeve 1, the fixing plate 2, and the first sliding pin 3 together, the clamping sleeve 1 acts as a guide. When the spline 8 moves up and down with the small Z-axis, it can drive the second sliding pin 10 to move up and down together. When the second sliding pin 10 moves up and down, it drives the arc groove plate 5 to swing along the rotating shaft 11. When the arc groove plate 5 swings, by opening two first limiting slide grooves 15, it can drive the first sliding pin 3 to swing, so that the equal height plate 4, the pressure plate 6, and the suction cup 7 can move in an arc synchronously along a fixed center. The entire module can perform any movement with the clamping sleeve 1 to achieve complex oblique insertion. This design method uses a 1 / n circular ring double slider to improve the accuracy of the mechanism's center. The use of a 1 / n circular ring double slider improves the service life of the mechanism. At the same time, the use of a split slide groove mechanism ensures the accuracy in the X direction, making the whole more accurate.

[0017] Specifically, there are two first limiting grooves 15, and the number of first sliding pins 3 corresponds to the number of first limiting grooves 15.

[0018] In this embodiment, the use of a double groove and double slider design results in higher accuracy.

[0019] Specifically, protective side plates 12 are fixedly connected to both sides of the arc groove plate 5.

[0020] In this embodiment, the protective side panel 12 can play a certain role in concealment and also has a certain aesthetic effect.

[0021] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A mobile phone motherboard oblique insertion assembly mechanism, comprising a pressure plate (6), characterized in that: The upper end of the pressure plate (6) is fixedly connected to a leveling plate (4), and the lower end of the pressure plate (6) is fixedly connected to a suction cup (7). Arc groove plates (5) are slidably arranged on both sides of the leveling plate (4). A rotating shaft (11) is rotatably arranged at one end of the arc groove plate (5). A second limiting slide groove (16) is fixedly opened on one side of the arc groove plate (5). A second sliding pin (10) is slidably connected inside the second limiting slide groove (16). A lifting plate (9) is fixedly connected to one end of the second sliding pin (10). The upper end of the lifting plate (9)... A spline (8) is fixedly connected to the end of the plate (4). A clamping sleeve (1) is fitted onto the outer surface of the spline (8). A fixing plate (2) is fixedly connected to one end of the clamping sleeve (1). A locking block (14) is fixedly provided at one end of the fixing plate (2). A locking groove (13) is fixedly opened on one side of the plate (4). The locking block (14) is snapped into the inside of the locking groove (13). A first sliding pin (3) is fixedly connected to one side of the fixing plate (2). A first limiting groove (15) is fixedly opened on the other side of the arc groove plate (5).

2. The mobile phone motherboard oblique insertion assembly mechanism according to claim 1, characterized in that: There are two first limiting grooves (15), and the number of first sliding pins (3) corresponds to the number of first limiting grooves (15).

3. The mobile phone motherboard oblique insertion assembly mechanism according to claim 1, characterized in that: Protective side plates (12) are fixedly connected to both sides of the arc groove plate (5).

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