Light emitting device

Abstract

The utility model relates to a light emitting device. The light-emitting device comprises a substrate, a light-emitting chip, a first light-transmitting layer and a lens, wherein the light-emitting chip is arranged on the substrate; the first light-transmitting layer is arranged on the light-emitting chip, a plurality of micro curved surfaces are arranged on the top surface of the first light-transmitting layer, and the plurality of micro curved surfaces are arranged corresponding to the light-emitting chip. The lens is arranged on the substrate and covers the light-emitting chip and the first light-transmitting layer. According to the light-emitting device, the plurality of micro curved surfaces are arranged on the top surface of the first light-transmitting layer, and the plurality of micro curved surfaces can scatter and disperse light emitted by the light-emitting chip, so that dispersion is compensated, the dispersion problem is improved, light spot yellow edges are reduced, Fresnel loss is reduced, the light extraction rate is improved, and the optical quality of the light-emitting device is improved; the scattering particles in the first light-transmitting layer can scatter the light, so that the color temperature uniformity of the light-emitting device is remarkably improved, the dispersion problem is solved, and the yellow edge of a light spot is eliminated.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor light emitting, in particular to a light emitting device. BACKGROUND

[0002] The light emitting device usually adopts LED chips of different light emitting colors to mix light and generate white light. Since white light is formed by mixing lights of multiple wavelengths, the refractive indexes of different wavelengths of light are different, the refractive index of yellow light is small, and the refractive index of blue light is large. After twice light distribution, dispersion phenomenon is easily formed, color distribution with high center color temperature and low edge color temperature, i.e. yellow edge of light spot, and optical quality needs to be improved. SUMMARY

[0003] Therefore, it is necessary to provide a light emitting device for solving the problems of dispersion and yellow edge of light spot of the light emitting device.

[0004] A light emitting device, comprising:

[0005] a substrate;

[0006] a light emitting chip, disposed on the substrate;

[0007] a first light transmitting layer, disposed on the light emitting chip, a top surface of the first light transmitting layer being provided with a plurality of microcurved surfaces corresponding to the light emitting chip; and

[0008] a lens, disposed on the substrate and covering the light emitting chip and the first light transmitting layer.

[0009] In one of the embodiments, the plurality of microcurved surfaces are arranged in an array to form a microlens array.

[0010] In one of the embodiments, the first light transmitting layer is a light transmitting glue filled with scattering particles.

[0011] In one of the embodiments, the first light transmitting layer only covers a front surface of the light emitting chip, and a bottom surface of the first light transmitting layer extends out of side surfaces of the light emitting chip.

[0012] In one of the embodiments, the light emitting device further comprises a second light transmitting layer connected between the light emitting chip and the first light transmitting layer.

[0013] In one of the embodiments, the second light transmitting layer only covers a front surface of the light emitting chip, and a bottom surface of the second light transmitting layer extends out of side surfaces of the light emitting chip; and the first light transmitting layer covers at least a top surface of the second light transmitting layer.

[0014] In one of the embodiments, the first light-transmissive layer covers the side surface of the second light-transmissive layer; or the first light-transmissive layer only covers the top surface of the second light-transmissive layer, and the bottom surface of the first light-transmissive layer extends beyond the side surface of the second light-transmissive layer.

[0015] In one of the embodiments, the second light-transmissive layer covers at least part of the front surface of the light-emitting chip; the first light-transmissive layer covers the side surface of the second light-transmissive layer and covers the exposed front surface of the light-emitting chip.

[0016] In one of the embodiments, the second light-transmissive layer covers the side surface of the light-emitting chip; the first light-transmissive layer covers at least the top surface of the second light-transmissive layer.

[0017] In one of the embodiments, the second light-transmissive layer comprises at least two layers of light-transmissive medium.

[0018] The light-emitting device described above, by arranging a plurality of micro-curvatures on the surface of the first light-transmissive layer facing away from the light-emitting chip, the plurality of micro-curvatures are arranged corresponding to the light-emitting chip, so as to scatter and disperse the light emitted by the light-emitting chip, compensate for chromatic dispersion, improve the chromatic dispersion problem, reduce the yellow edge of the light spot, reduce the Fresnel loss, improve the light extraction efficiency, and improve the optical quality of the light-emitting device.

[0019] Further, the first light-transmissive layer is a light-transmissive glue filled with scattering particles, the scattering particles can scatter light, making the light emitted by the micro-curvatures disordered, further improving the diffusion effect of the light emission, significantly improving the color temperature uniformity of the light-emitting device, overcoming the chromatic dispersion problem, eliminating the yellow edge of the light spot, and obviously improving the optical quality of the light-emitting device. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 FIG. 1 is a sectional view of a light-emitting device according to a first embodiment of the present application.

[0021] Figure 2 FIG. 2 is a sectional view of a light-emitting device according to a second embodiment of the present application.

[0022] Figure 3 FIG. 3 is a sectional view of a light-emitting device according to a third embodiment of the present application.

[0023] Figure 4 FIG. 4 is a sectional view of a light-emitting device according to a fourth embodiment of the present application.

[0024] Figure 5 FIG. 5 is a sectional view of a light-emitting device according to a fifth embodiment of the present application.

[0025] Figure 6 FIG. 6 is a sectional view of a light-emitting device according to a sixth embodiment of the present application.

[0026] Figure 7This is a cross-sectional view of the light-emitting device in the seventh embodiment of this application.

[0027] Explanation of reference numerals in the attached figures:

[0028] 100-Light-emitting device; 110-Substrate; 120-Light-emitting chip; 130-First light-transmitting layer; 132-Micro-curved surface; 140-Lens; 142-Optical interface; 144-Main body; 146-Supporting part; 150-Second light-transmitting layer; 160-Supporting component. Detailed Implementation

[0029] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0030] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0031] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0032] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0033] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0034] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0035] Please see Figure 1 , Figure 1A cross-sectional view of the light-emitting device in the first embodiment of this application is shown. The light-emitting device 100 provided in the first embodiment of this application includes a substrate 110, a light-emitting chip 120, a first light-transmitting layer 130, and a lens 140. The light-emitting chip 120 is disposed on the substrate 110. The first light-transmitting layer 130 is disposed on the light-emitting chip 120, and its top surface has multiple micro-curved surfaces 132, which are corresponding to the light-emitting chip 120. The lens 140 is disposed on the substrate 110 and covers the light-emitting chip 120 and the first light-transmitting layer 130. By providing multiple micro-curved surfaces 132 on the top surface of the first light-transmitting layer 130, which correspond to the light-emitting chip 120, the light emitted by the light-emitting chip 120 can be scattered and dispersed, thus compensating for dispersion, improving the dispersion problem of the light-emitting device 100, reducing the yellow edge of the light spot, reducing Fresnel loss, improving the light extraction rate, and thus enhancing the optical quality of the light-emitting device 100.

[0036] It should be noted that the top surface of the first light-transmitting layer 130 is the surface facing away from the light-emitting chip 120, and the bottom surface of the first light-transmitting layer 130 is the surface facing (or towards) the light-emitting chip 120. In this embodiment, the bottom surface of the first light-transmitting layer 130 is the surface that is in contact with the front surface of the light-emitting chip 120. The same definition applies to the top and bottom surfaces of other layer structures in this application.

[0037] In this embodiment, the substrate 110 is a circuit board, which may be, but is not limited to, a circuit board. At least one lens 140 may be disposed on the substrate, and each lens 140 contains at least one light-emitting chip 120. Multiple lenses 140 may be arranged in an array on the substrate, enabling the light-emitting device 100 to emit light and form a surface light source to meet the requirements of large-area illumination or display. In an alternative embodiment, the substrate 110 may be a support, with a die-bonding groove formed on its surface, in which the light-emitting chip 120 is fixed.

[0038] The light-emitting chip 120 can be, but is not limited to, an LED chip, and the number of light-emitting chips 120 in each lens 140 is not limited to one. At least three LED chips can be set in each lens 140, including red, green and blue LED chips, and the light emitted by the three types of LED chips is mixed to form white light; or at least one blue LED chip can be set in each lens 140, and the blue light emitted by the blue LED chip can be converted into white light by the phosphor in the encapsulating adhesive layer.

[0039] The light-emitting chip 120 can be a flip chip, which is directly die-bonded onto the substrate without wire bonding. The light-emitting chip 120 can also be a conventional chip, which is mounted on the substrate through die bonding and wire bonding, and achieves electrical connection.

[0040] In this embodiment, the light-emitting chip 120 is a vertical chip that emits light from its front side and does not emit light from its sides. In an alternative embodiment, the light-emitting chip 120 may emit light from its sides.

[0041] In this embodiment, the first light-transmitting layer 130 only covers the front side of the light-emitting chip 120, and the bottom surface of the first light-transmitting layer 130 extends beyond the side surface of the light-emitting chip 120. That is, the area of ​​the bottom surface of the first light-transmitting layer 130 is larger than the area of ​​the front surface of the light-emitting chip 120, so that all the light emitted by the light-emitting chip 120 can pass through the bottom surface of the first light-transmitting layer 130 and enter the first light-transmitting layer 130, thereby reducing the chip's light emission loss and improving the device's brightness. It should be noted that in other embodiments, the first light-transmitting layer 130 may exactly cover the front side of the light-emitting chip 120, that is, the bottom surface of the first light-transmitting layer 130 is the same size as the front surface of the light-emitting chip 120; or, the side surface of the light-emitting chip 120 may be light-emitting, and the first light-transmitting layer 130 covers the side surface of the light-emitting chip 120.

[0042] The distance d1 from the bottom surface of the first light-transmitting layer 130 to the side of the light-emitting chip 120 does not exceed 150um. Under the premise of conforming to the law of conservation of light spread, the area occupied by the first light-transmitting layer 130 is limited to avoid the overall device being too large, which is conducive to the miniaturization of the device and realizes chip-level optical packaging.

[0043] In this embodiment, multiple micro-curved surfaces 132 are arranged in an array, that is, multiple microlenses are arranged in an array to form a microlens array. The microlens array can cover the light-emitting surface of the light-emitting chip 120 and refract most of the light emitted by the light-emitting chip 120. Its light dispersion effect is better, which further improves the dispersion problem of the light-emitting device 100 and better reduces the yellow edge of the light spot. It should be noted that in other embodiments, the multiple micro-curved surfaces 132 can be irregularly distributed, that is, the multiple micro-curved surfaces 132 are randomly and irregularly formed on the surface of the first light-transmitting layer 130 facing away from the light-emitting chip 120.

[0044] The microlens array can be a rectangular array or a ring array. In this embodiment, the microlens array is a rectangular array, with two adjacent micro-surfaces 132 connected in each row and two adjacent micro-surfaces 132 connected in each column, and as many micro-surfaces 132 as possible are provided.

[0045] In this embodiment, the micro-surface 132 is convex and partially spherical; however, the shape of the micro-surface 132 is not limited to this. The partially spherical shape includes not only geometrically perfect hemispheres and hemispheres with irregular curvature, but also geometrically perfect spherical caps and spherical caps with irregular curvature. In alternative embodiments, the micro-surface 132 can have various shapes, such as square micro-surfaces, hexagonal micro-surfaces, elliptical micro-surfaces, conical micro-surfaces, cylindrical micro-surfaces, and polygonal prism micro-surfaces; the micro-surface 132 can also have combinations of at least two of the above-mentioned shapes. Moreover, the micro-surface 132 of the above-mentioned various shapes is not limited to convex surfaces, but can also be concave surfaces.

[0046] In this embodiment, the micro-curved surface 132 is formed on the surface of the first light-transmitting layer 130 facing away from the light-emitting chip 120 by molding. That is, before the first light-transmitting layer 130 is fully cured, the micro-curved surface 132 is molded onto this surface using a mold. After the first light-transmitting layer 130 is fully cured, the mold is separated from the first light-transmitting layer 130 to form the micro-curved surface 132. The use of a mold to form the micro-curved surface 132 results in good batch stability and consistency. It is understood that in other embodiments, the first light-transmitting layer 130 and its micro-curved surface 132 can be formed in a mold in one step and then bonded to the light-emitting chip 120.

[0047] In this embodiment, the first light-transmitting layer 130 is a light-transmitting adhesive filled with scattering particles. After the light emitted by the light-emitting chip 120 enters the first light-transmitting layer 130, the scattering particles can scatter the light, making the light output of the micro-curved surface 132 disordered, further improving the light diffusion effect, significantly improving the color temperature uniformity of the light-emitting device 100, overcoming the dispersion problem, eliminating the yellow edge of the light spot, and significantly improving the optical quality of the light-emitting device 100.

[0048] The scattering particles may include, but are not limited to, at least one of the following: SiO2, TiO2, ZnO, BaSO4, CaSO4, MgCO3, Al(OH)3, synthetic silica, glass beads, and diamond. The size of the scattering particles is suitable for the formation of scattered light; for example, the diameter of the scattering particles is 5 μm to 7 μm.

[0049] In this embodiment, the side surface of the first light-transmitting layer 130 gradually expands in the direction of the light emission axis, and can reflect the large-angle light emitted from the self-emissive chip 120. Since the side surface of the first light-transmitting layer 130 is the interface between the first light-transmitting layer 130 and the cavity, when the large-angle light from the edge is incident on this side surface, it is easy for total internal reflection to occur as light enters from a denser medium to a less dense medium. After total internal reflection, the large-angle light from the edge will propagate in the direction of the optical axis and can directly enter the lens 140 and be utilized by the lens 140, further improving the light energy utilization rate of the light-emitting device 100, with little light energy loss, improving luminous efficiency, and significantly increasing the brightness of the light-emitting device 100.

[0050] In this embodiment, the side surface of the first light-transmitting layer 130 is a straight line in cross-section. It is understood that in other embodiments, the side surface of the first light-transmitting layer 130 may be a concave curve in cross-section.

[0051] In this embodiment, the first light-transmitting layer 130 and the lens 140 are spaced apart. Because the light-emitting surface of the first light-transmitting layer 130 and the light-incident surface of the lens 140 are spaced apart, light is refracted through the first light-transmitting layer 130, the cavity, and the lens 140 before exiting, ensuring that the emitted light accurately reaches the preset light-emitting angle, resulting in good light control. Therefore, the entire light-emitting device 100 can achieve zoned and precise light control, high light energy utilization, high overall brightness, and good light shaping effect.

[0052] In this embodiment, the lens 140 has an optical interface 142 facing away from the substrate 110. The optical interface 142 is a convex curved surface, which can improve light utilization and reduce Fresnel loss. The convex curved surface is a hemisphere, which includes not only geometrically perfect hemispheres but also hemispheres with irregular curvatures. In alternative embodiments, the optical interface 142 can also be a spherical cap, a semi-ellipsoidal curved surface, or other curved surfaces.

[0053] Furthermore, the lens 140 is a plano-convex lens and is integrally formed. The lens 140 includes a main body 144 and a support 146. The support 146 is connected to the plane of the main body 144 and is supported on the substrate 110. The lens 140 is mounted on the substrate 110 and covers the light-emitting chip 120, the first light-transmitting layer 130, and the second light-transmitting layer 150. The lens 140 can be molded onto the substrate 110 or formed first and then bonded to the substrate 110.

[0054] Please see Figure 2 , Figure 2 A cross-sectional view of the light-emitting device in the second embodiment of this application is shown. Compared with the light-emitting device 100 in the first embodiment described above, the light-emitting device 100 in the second embodiment of this application further includes a second light-transmitting layer 150, which is connected between the light-emitting chip 120 and the first light-transmitting layer 130. The second light-transmitting layer 150 can improve light utilization and reduce Fresnel loss of light emitted by the light-emitting chip 120.

[0055] In this embodiment, to allow more light emitted from the light-emitting chip 120 to enter the second light-transmitting layer 150, the second light-transmitting layer 150 only covers the front side of the light-emitting chip 120, and the bottom surface of the second light-transmitting layer 150 extends beyond the side surface of the light-emitting chip 120. The first light-transmitting layer 130 at least covers the top surface of the second light-transmitting layer 150. It is understood that, in alternative embodiments, the second light-transmitting layer 150 just covers the front side of the light-emitting chip 120, while the bottom surface of the second light-transmitting layer 150 is the same size as the front side of the light-emitting chip 120.

[0056] The distance d2 from the bottom surface of the second light-transmitting layer 150 to the side of the light-emitting chip 120 does not exceed 150um. Under the premise of conforming to the law of conservation of light spread, the area occupied by the second light-transmitting layer 150 is limited to avoid the overall device being too large, which is conducive to the miniaturization of the device and realizes chip-level optical packaging.

[0057] In this embodiment, the first light-transmitting layer 130 covers the side surface of the second light-transmitting layer 150, allowing light emitted from the side surface of the second light-transmitting layer 150 to be directly guided into the first light-transmitting layer 130, further reducing chip light-emitting loss and improving device brightness. In an alternative embodiment, the first light-transmitting layer 130 can just cover the top surface of the second light-transmitting layer 150, making the bottom surface of the first light-transmitting layer 130 the same size as the top surface of the second light-transmitting layer 150.

[0058] In this embodiment, the thickness of the first light-transmitting layer 130 is greater than the thickness of the second light-transmitting layer 150, thus providing thickness for forming the microlens structure. At the same time, the greater the thickness of the first light-transmitting layer 130, the longer the light path propagates within it, which is beneficial for the scattering particles within it to fully scatter the light, thereby improving the light diffusion effect.

[0059] In this embodiment, the second light-transmitting layer 150 is a single-layer structure. However, in an alternative embodiment, the second light-transmitting layer 150 may include at least two light-transmitting media. Specifically, at least one of the at least two light-transmitting media is a fluorescent adhesive layer, and adjacent light-transmitting media can be completely overlapped or form a cavity. The light emitted from the light-emitting chip 120 is processed by at least two light-transmitting media, enabling the light-emitting device 100 to better control the light, with high light control precision and good light control effect.

[0060] The single-layer second light-transmitting layer 150 can be a light-transmitting adhesive filled with color-converting particles to form different colors of light, satisfying the requirement of the light-emitting device 100 to emit different colors of light. The color-converting particles are fluorescent materials, specifically including at least one of yellow, red, and green fluorescent materials that emit yellow light, excite red light, and green light.

[0061] In this embodiment, the second light-transmitting layer 150 may be, but is not limited to, a yellow fluorescent adhesive layer, and the light-emitting chip 120 is a blue LED chip, whose emitted blue light is converted into white light by the yellow fluorescent adhesive layer.

[0062] As for the other aspects of the light-emitting device 100 in this embodiment, they are basically the same as the other aspects of the light-emitting device 100 in the first embodiment above. The specific details can be referred to the description of the first embodiment above, and will not be repeated here.

[0063] Please see Figure 3 , Figure 3 A cross-sectional view of the light-emitting device in the third embodiment of this application is shown. Compared with the light-emitting device 100 in the second embodiment, the first light-transmitting layer 130 of the light-emitting device 100 in the third embodiment of this application only covers the top surface of the second light-transmitting layer 150, and the bottom surface of the first light-transmitting layer 130 extends out of the side surface of the second light-transmitting layer 150. This allows the light emitted from the top surface of the second light-transmitting layer 150 to enter the first light-transmitting layer 130, which also helps to reduce light propagation loss and improve the brightness of the device.

[0064] The distance d3 from the bottom surface of the first light-transmitting layer 130 to the side surface of the second light-transmitting layer 150 does not exceed 150um. Under the premise of conforming to the law of conservation of light spread, the area occupied by the first light-transmitting layer 130 is further limited to avoid the overall device being too large, which is conducive to the miniaturization of the device and realizes chip-level optical packaging.

[0065] In this embodiment, the side surface of the second light-transmitting layer 150 is gradually widened in the direction of the light emission axis, which can reflect the large-angle light emitted from the self-emissive chip 120. Since the side surface of the second light-transmitting layer 150 is not covered by the first light-transmitting layer 130 and is the interface between the second light-transmitting layer 150 and the cavity, when the large-angle light is incident on this side surface, it is easy for total internal reflection to occur as light enters from a denser medium to a less dense medium. After total internal reflection, the large-angle light will propagate in the direction of the optical axis and can directly enter the first light-transmitting layer 130 and be utilized by the first light-transmitting layer 130, further improving the light energy utilization rate of the light-emitting device 100, reducing light energy loss, improving light efficiency, and significantly enhancing the brightness of the light-emitting device 100.

[0066] In this embodiment, the side surface of the second light-transmitting layer 150 is a straight line in cross-section. It is understood that in other embodiments, the side surface of the second light-transmitting layer 150 may be a concave curve in cross-section.

[0067] As for the other aspects of the light-emitting device 100 in this embodiment, they are basically the same as the other aspects of the light-emitting device 100 in the second embodiment above. The specific details can be referred to the description of the second embodiment above, and will not be repeated here.

[0068] Please seeFigure 4 , Figure 4 A cross-sectional view of the light-emitting device in the fourth embodiment of this application is shown. Compared with the light-emitting device 100 in the second embodiment described above, in this embodiment, the second light-transmitting layer 150 of the light-emitting device 100 exactly covers the front side of the light-emitting chip 120, while the bottom surface of the second light-transmitting layer 150 is the same size as the front surface of the light-emitting chip 120. Moreover, the first light-transmitting layer 130 covers the side surface of the second light-transmitting layer 150, so that the light emitted from the side surface of the second light-transmitting layer 150 is directly guided into the first light-transmitting layer 130, further reducing chip light-emitting loss and improving the brightness of the device.

[0069] In this embodiment, the second light-transmitting layer 150 is coated and formed on the light-emitting chip 120, and its process is mature, simple, and low-cost. When there is only one light-emitting chip 120 inside the lens 140, the area of ​​the top surface of the second light-transmitting layer 150 is equal to the area of ​​the light-emitting surface of the light-emitting chip 120. In an alternative embodiment, the second light-transmitting layer 150 can simultaneously cover the light-emitting surface and the side surface of the light-emitting chip 120. When there is only one light-emitting chip 120 inside the lens 140, the area of ​​the top surface of the second light-transmitting layer 150 is greater than the area of ​​the front surface of the light-emitting chip 120; or the second light-transmitting layer 150 does not completely cover the light-emitting surface of the light-emitting chip 120. When there is only one light-emitting chip 120 inside the lens 140, the area of ​​the top surface of the second light-transmitting layer 150 is smaller than the area of ​​the front surface of the light-emitting chip 120.

[0070] In this embodiment, the bottom surface of the first light-transmitting layer 130 also does not extend beyond the side surface of the light-emitting chip 120. It is understood that in other embodiments, the bottom surface of the first light-transmitting layer 130 may extend beyond the side surface of the light-emitting chip 120, or, when the side surface of the light-emitting chip 120 is configured to emit light, the first light-transmitting layer 130 covers the side surface of the light-emitting chip 120.

[0071] Please see Figure 5 , Figure 5 A cross-sectional view of the light-emitting device in the fifth embodiment of this application is shown. Compared with the light-emitting device 100 in the fourth embodiment, the light-emitting device 100 in the fifth embodiment further includes a support member 160, which is connected between the substrate 110 and the lens 140. Due to the provision of the support member 160, the structure of the lens 140 is relatively simple, its volume is greatly reduced, and it is easier to form and process, reducing the processing difficulty and improving the structural stability of the light-emitting device 100. Obviously, the support member 160 of the light-emitting device 100 in this embodiment is equivalent to the support portion 146 of the lens 140 of the light-emitting device 100 in the above embodiments.

[0072] In this embodiment, the support member 160 has a hollow structure, in which the hollow space is used to accommodate the light-emitting chip 120, the first light-transmitting layer 130, and the second light-transmitting layer 150. The support member 160 can be bonded and fixed to the substrate 110 or molded onto the substrate 110, and the lens 140 can also be molded onto the support member 160.

[0073] In this embodiment, the support member 160 and the lens 140 are separate structures. The support member 160 supports the lens 140 and provides a receiving space for the light-emitting chip 120, the first light-transmitting layer 130, and the second light-transmitting layer 150. It should be noted that in other embodiments, the lens 140 and the support member 160 can be integrally formed, and the integrally formed two are equivalent to the lens 140 of the light-emitting device 100 in the above embodiment.

[0074] As for the other aspects of the light-emitting device 100 in this embodiment, they are basically the same as the other aspects of the light-emitting device 100 in the second embodiment above. The specific details can be referred to the description of the second embodiment above, and will not be repeated here.

[0075] Please see Figure 6 , Figure 6 A cross-sectional view of the light-emitting device in the sixth embodiment of this application is shown. Compared with the light-emitting device 100 in the fourth embodiment above, in the sixth embodiment of this application, the second light-transmitting layer 150 of the light-emitting device 100 covers at least a portion of the front side of the light-emitting chip 120, and the first light-transmitting layer 130 covers the side side of the second light-transmitting layer 150 and covers the exposed front side of the light-emitting chip 120.

[0076] In this embodiment, the second light-transmitting layer 150 covers the central area of ​​the front surface of the light-emitting chip 120, and the first light-transmitting layer 130 covers the edge area of ​​the front surface of the light-emitting chip 120. Although the second light-transmitting layer 150 does not completely cover the front surface of the light-emitting chip 120, the first light-transmitting layer 130 covers the remaining part of the front surface of the light-emitting chip 120. Some of the light emitted from the front surface of the light-emitting chip 120 directly enters the first light-transmitting layer 130 for light mixing, thereby achieving color temperature uniformity. The micro-curved surface 132 of the first light-transmitting layer 130 is more conducive to light emission. It should be noted that when the second light-transmitting layer 150 covers the entire front surface of the light-emitting chip 120, the first light-transmitting layer 130 naturally cannot cover the front surface of the light-emitting chip 120, as described in the fourth and fifth embodiments of this application.

[0077] In this embodiment, the second light-transmitting layer 150 is a yellow fluorescent adhesive layer, and the light-emitting chip 120 is a blue light chip. Since the second light-transmitting layer 150 does not cover the periphery of the light-emitting chip 120, blue light will leak out from the periphery when the light-emitting chip 120 emits light. The leaked blue light is mixed by the first light-transmitting layer 130 to achieve uniform color temperature distribution.

[0078] As for the other aspects of the light-emitting device 100 in this embodiment, they are basically the same as the other aspects of the light-emitting device 100 in the fourth embodiment above. The specific content can be referred to the description of the fourth embodiment above, and will not be repeated here.

[0079] Please see Figure 7 , Figure 7 A cross-sectional view of the light-emitting device in the seventh embodiment of this application is shown. Compared with the light-emitting device 100 in the fourth embodiment described above, the light-emitting chip 120 of the light-emitting device 100 in the seventh embodiment of this application is configured to emit light from the side. The second light-transmitting layer 150 covers the side of the light-emitting chip 120, that is, the second light-transmitting layer 150 simultaneously covers the front and side of the light-emitting chip 120, thereby reducing Fresnel loss of side-emitting light and improving light extraction efficiency. The first light-transmitting layer 130 at least covers the top surface of the second light-transmitting layer 150.

[0080] In this embodiment, the first light-transmitting layer 130 covers the side surface of the second light-transmitting layer 150. Light emitted from the side surface of the second light-transmitting layer 150 can completely enter the first light-transmitting layer 130, improving light utilization and thus enhancing the brightness of the light-emitting device 100. It should be noted that in an alternative embodiment, the side surface of the second light-transmitting layer 150 is gradually widened in the direction of the light emission axis, and can refract light emitted from the side surface of the self-emissive chip 120. The first light-transmitting layer 130 may only cover the top surface of the second light-transmitting layer 150. To allow more light to enter, the bottom surface of the first light-transmitting layer 130 may extend beyond the side surface of the second light-transmitting layer 150.

[0081] In this embodiment, the second light-transmitting layer 150 is a yellow fluorescent adhesive layer, and the light-emitting chip 120 is a blue light chip. Since the second light-transmitting layer 150 covers both the front and side of the light-emitting chip 120, the light emitted from the second light-transmitting layer 150 when the light-emitting chip 120 emits light is yellowish. The light is mixed through the first light-transmitting layer 130 to achieve a uniform color temperature distribution.

[0082] As for the other aspects of the light-emitting device 100 in this embodiment, they are basically the same as the other aspects of the light-emitting device 100 in the fourth embodiment above. The specific content can be referred to the description of the fourth embodiment above, and will not be repeated here.

[0083] In summary, the light-emitting device 100 provided in this application embodiment, by setting multiple micro-curved surfaces 132 on the top surface of the first light-transmitting layer 130, with each micro-curved surface 132 corresponding to the light-emitting chip 120, can scatter and disperse the light emitted by the light-emitting chip 120, thereby compensating for dispersion, improving dispersion problems, reducing yellow edges on the light spot, reducing Fresnel loss, and improving light extraction efficiency, thus enhancing the optical quality of the light-emitting device 100. Furthermore, the first light-transmitting layer 130 is a light-transmitting adhesive filled with scattering particles. These scattering particles can scatter light, causing the light emitted from the micro-curved surfaces to become disordered, further improving the light diffusion effect, significantly enhancing the color temperature uniformity of the light-emitting device 100, overcoming dispersion problems, eliminating yellow edges on the light spot, and significantly improving the optical quality of the light-emitting device 100. Moreover, the processing technology used for the light-emitting device 100 is mature and simple, with optical processing performed on the LED chip, resulting in low cost and small size.

[0084] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0085] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A light-emitting device, characterized in that, include: Base (110); A light-emitting chip (120) is disposed on the substrate (110); A first light-transmitting layer (130) is disposed on the light-emitting chip (120). The top surface of the first light-transmitting layer (130) is provided with a plurality of micro-curved surfaces (132), which are disposed corresponding to the light-emitting chip (120). Lens (140) is disposed on the substrate (110) and covers the light-emitting chip (120) and the first light-transmitting layer (130).

2. The light-emitting device according to claim 1, characterized in that, The multiple micro-surfaces (132) are arranged in an array to form a microlens array.

3. The light-emitting device according to claim 1, characterized in that, The first light-transmitting layer (130) is a light-transmitting adhesive filled with scattering particles.

4. The light-emitting device according to claim 1, characterized in that, The first light-transmitting layer (130) covers only the front side of the light-emitting chip (120), and the bottom surface of the first light-transmitting layer (130) extends out of the side of the light-emitting chip (120).

5. The light-emitting device according to any one of claims 1 to 4, characterized in that, Also includes: The second light-transmitting layer (150) is connected between the light-emitting chip (120) and the first light-transmitting layer (130).

6. The light-emitting device according to claim 5, characterized in that, The second light-transmitting layer (150) covers only the front side of the light-emitting chip (120), and the bottom surface of the second light-transmitting layer (150) extends out of the side of the light-emitting chip (120); The first light-transmitting layer (130) at least covers the top surface of the second light-transmitting layer (150).

7. The light-emitting device according to claim 6, characterized in that, The first light-transmitting layer (130) covers the side of the second light-transmitting layer (150); or The first light-transmitting layer (130) only covers the top surface of the second light-transmitting layer (150), and the bottom surface of the first light-transmitting layer (130) extends out of the side surface of the second light-transmitting layer (150).

8. The light-emitting device according to claim 5, characterized in that, The second light-transmitting layer (150) covers at least a portion of the front side of the light-emitting chip (120); The first light-transmitting layer (130) covers the side of the second light-transmitting layer (150) and also covers the exposed front of the light-emitting chip (120).

9. The light-emitting device according to claim 5, characterized in that, The second light-transmitting layer (150) covers the side of the light-emitting chip (120); The first light-transmitting layer (130) at least covers the top surface of the second light-transmitting layer (150).

10. The light-emitting device according to claim 5, characterized in that, The second light-transmitting layer (150) comprises at least two light-transmitting media.

Images