Practical mounting platform for chip flip-chip process and chip flip-chip welding device

Abstract

The utility model discloses a real installation platform for a chip inversion technology and a chip inversion welding device, the real installation platform comprises a pedestal which is provided with an installation groove, and the installation groove is provided with a first connection hole; the boss is inserted into the mounting groove, and a second connecting hole is formed in the boss; and the locking piece sequentially penetrates through the first connecting hole and the second connecting hole so as to fix the boss in the mounting groove. The chip reverse welding device is applied to the real installation platform. The boss and the base are designed to be of a detachable structure, when the boss is worn and needs to be scrapped, only the worn boss needs to be replaced, the whole mounting platform does not need to be replaced, and the production cost is effectively reduced. Moreover, the boss and the base are designed to be of a detachable structure, so that defective products are effectively reduced, the reject ratio of the chip is reduced, and the quality of the chip is ensured.

Description

Technical Field

[0001] This utility model relates to the field of flip chip manufacturing technology, and in particular to a practical platform chip flip bonding device for chip flip-chip process. Background Technology

[0002] With continuous innovation in mobile phone camera technology, cameras have evolved from single-lens to multi-lens, and from low-pixel to high-pixel and high-magnification optical zoom periscope lenses. This has led to increased manufacturing complexity for camera manufacturers, necessitating continuous research and development of advanced camera production technologies to adapt to market demands. Flip chip bonding technology involves flipping a chip with pre-mounted gold balls and ultrasonically bonding it to a ceramic substrate. This process enables thinner, more powerful, and more reliable cameras, making it a core technology in current camera assembly. Flip chip bonding is widely used in camera packaging, LED packaging, BGA packaging, and other fields, offering advantages such as smaller size, thinner dimensions, and higher reliability after bonding. The ceramic substrate is a unique raw material in the flip chip process, serving as a protector of the chip, forming interconnects with the chip, and providing a base for mounting infrared filters and lenses. In essence, the entire assembly process is based on the ceramic substrate. During the production process, the substrate is placed in the mounting platform of the welding equipment. During long-term welding operations, under the action of force and ultrasound, the substrate and the base boss will rub against each other, which will produce substrate debris or base metal objects. This can lead to problems such as substrate cracking, chip damage and dirt, and severe wear of the base.

[0003] Therefore, this application proposes a technical solution to solve the above problems. Utility Model Content

[0004] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a mounting platform for chip flip-chip processes and a chip flip-chip bonding device using this mounting platform. By designing the boss and base as a detachable structure, when the boss is worn to the point of being scrapped, only the worn boss needs to be replaced, without replacing the entire mounting platform, effectively reducing production costs. Furthermore, by designing the boss and base as a detachable structure, the generation of defective products is effectively reduced, the chip defect rate is lowered, and chip quality is ensured.

[0005] In a first aspect, a mounting platform for chip flip-chip technology according to an embodiment of the present invention includes:

[0006] The base is provided with a mounting slot, and the mounting slot is provided with a first connection hole;

[0007] A boss is inserted into a mounting slot, and the boss is provided with a second connecting hole;

[0008] The locking element passes through the first connecting hole and the second connecting hole in sequence to fix the boss in the mounting groove.

[0009] According to an embodiment of this utility model, a mounting platform for chip flip-chip technology has at least the following advantages: The mounting platform of this application designs the base and boss as a detachable structure. When the boss is worn to the point of needing to be scrapped, only the worn boss needs to be replaced, without replacing the entire mounting platform, effectively reducing production costs. Specifically, the base is provided with a first connecting hole, and correspondingly, the boss is provided with a second connecting hole. The base and boss are fixed by a locking member. Optionally, threads can be provided on the inner walls of the first and second connecting holes, and locking screws are used as the locking members. The base and boss are detachable by locking screws, and the threaded connection is stable and reliable.

[0010] According to an embodiment of the present invention, a mounting platform for chip flip-chip process includes a boss comprising a fixing block and a support block fixed on the fixing block. The fixing block is installed in a mounting groove, and the support block is used to place the workpiece.

[0011] According to an embodiment of this utility model, a mounting platform for flip-chip bonding includes four clearance slots arranged circumferentially around the axis of the mounting slot. The four corners of the fixing block extend into the clearance slots. During flip-chip bonding, debris and other defects generated during bonding can fall directly into the clearance slots, preventing damage to the chip substrate and thus avoiding chip scrapping. This helps reduce the chip defect rate.

[0012] According to an embodiment of the present invention, a mounting platform for chip flip-chip technology has chamfered corners on the four corners of the fixing block. On the one hand, the chamfered design increases the remaining space in the clearance slot after the fixing block is installed in the mounting slot, leaving enough space for defective parts generated during processing to fall off smoothly, and preventing defective parts from accumulating between the base and the boss.

[0013] According to an embodiment of the present invention, a mounting platform for chip flip-chip process is provided on the base, which is provided with multiple mounting slots, and the number of bosses corresponds to the number of mounting slots.

[0014] According to an embodiment of the present invention, a mounting platform for chip flip-chip process is provided, wherein multiple mounting slots are arranged in a group along the width direction of the base, and multiple groups of mounting slots are arranged along the length direction of the base.

[0015] According to an embodiment of this utility model, a mounting platform for chip flip-chip technology has two adjacent sets of mounting slots staggered along the length of the base. This optimizes the layout of the mounting platform to improve space utilization and flip-chip efficiency, while the staggered arrangement prevents adjacent bosses from interfering with each other and affecting the flip-chip quality.

[0016] According to an embodiment of the present invention, a mounting platform for a chip flip-chip process includes a base with at least two positioning posts, which are located on opposite sides near the mounting slot. Specifically, the positioning posts are mainly used for auxiliary positioning when the carrier board carrying the chip is connected to the positioning platform.

[0017] According to an embodiment of the present invention, a mounting platform for a chip flip-chip process has recessed portions on both sides of the base, and each recessed portion has a third connecting hole. The third connecting hole is used to connect the mounting platform to other equipment or worktables.

[0018] Secondly, a chip flip-chip bonding apparatus according to an embodiment of the present invention utilizes the aforementioned mounting platform.

[0019] According to an embodiment of the present invention, a chip flip-chip bonding apparatus has at least the following advantages: The mounting platform of this application, by designing the base and boss as a detachable structure, allows only the worn boss to be replaced when it is worn to the point of needing to be scrapped, without replacing the entire mounting platform, effectively reducing production costs. Specifically, the base is provided with a first connecting hole, and correspondingly, the boss is provided with a second connecting hole, and the base and boss are fixed by a locking member. Optionally, threads can be provided on the inner walls of the first and second connecting holes, and locking screws are used as the locking members. The base and boss are detachable by the locking screws, and the threaded connection is stable and reliable.

[0020] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0021] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0022] Figure 1 This is a structural breakdown of a practical platform for chip flip-chip technology according to an embodiment of the present invention.

[0023] Figure 2 This is a structure of a practical mounting platform for chip flip-chip process according to an embodiment of the present utility model;

[0024] Figure 3 This is a top view of a mounting platform for chip flip-chip process according to an embodiment of the present invention;

[0025] Figure 4 for Figure 3 Enlarged view of the image marked A;

[0026] Figure 5This is a cross-sectional view of a mounting platform for chip flip-chip process according to an embodiment of the present invention.

[0027] Explanation of reference numerals in the attached figures:

[0028] Base 100; mounting groove 110; clearance groove 111; first connecting hole 120; recessed part 130; third connecting hole 140;

[0029] Boss 200; Second connecting hole 210; Fixing block 220; Support block 230;

[0030] Positioning post 300;

[0031] Locking component 400. Detailed Implementation

[0032] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0033] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0034] In the description of a utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If the terms "first" and "second" are used, they are merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly specifying the number of indicated technical features or the order of the indicated technical features.

[0035] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0036] Reference Figures 1 to 5 This utility model embodiment provides a practical platform for chip flip-chip processes. Specifically, as shown in the following example... Figure 1 and Figure 5As shown, the mounting platform includes a base 100 with a mounting groove 110 and a first connecting hole 120; a boss 200 inserted into the mounting groove 110 and a second connecting hole 210; and a locking member 400 that passes through the first connecting hole 120 and the second connecting hole 210 to fix the boss 200 in the mounting groove 110.

[0037] The mounting platform of this application is designed with a detachable structure for the base 100 and the boss 200. When the boss 200 is worn to the point of needing to be scrapped, only the worn boss 200 needs to be replaced, without replacing the entire mounting platform, effectively reducing production costs. Specifically, the base 100 is provided with a first connecting hole 120, and correspondingly, the boss 200 is provided with a second connecting hole 210. The base 100 and the boss 200 are fixed by a locking member 400.

[0038] Optionally, threads can be provided on the inner walls of the first connecting hole 120 and the second connecting hole 210, and the locking member 400 can be a locking screw. The base 100 and the boss 200 can be disassembled by the locking screw, and the threaded connection is stable and reliable.

[0039] Furthermore, as shown in Figure 5, the first connecting hole 120 is a countersunk hole, which prevents the locking member 400 from protruding from the bottom of the base 100 and reduces the wear caused by the locking member 400 on the worktable after the base 100 is installed on the worktable.

[0040] According to some embodiments of this application, as shown in the figure, the boss 200 includes a fixing block 220 and a support block 230 fixed on the fixing block 220. The fixing block 220 is installed in the mounting groove 110, and the support block 230 is used to place the workpiece. The fixing block 220 and the support block 230 are integral structures.

[0041] Preferably, the boss 200 is made entirely of tungsten carbide. Because tungsten carbide has high hardness and good thermal stability, the boss 200 has excellent wear resistance, and it will not deform due to high temperatures during flip-chip soldering, effectively extending the service life of the boss 200 and reducing costs caused by production losses.

[0042] According to some embodiments of this application, such as Figure 4 As shown, the mounting slot 110 is provided with clearance slots 111. Four clearance slots 111 are arranged circumferentially around the axis of the mounting slot 110, and the four corners of the fixing block 220 extend into the clearance slots 111. When the chip is flip-chip soldered, the debris and other defects generated during soldering can fall directly into the clearance slots 111, avoiding damage to the chip substrate caused by defects, thus preventing chip scrapping and helping to reduce the chip defect rate.

[0043] Understandably, during the flip-chip soldering process, debris and other defects generated during processing can fall directly into the clearance groove 111 for temporary storage, preventing the debris from scratching the chip substrate and causing the chip to be scrapped. When the clearance groove 111 is full of debris, the user can remove the boss 200 from the base 100 and use cleaning tools such as a cleaning brush or air gun to remove the debris from the clearance groove 111, keeping the base 100 clean and facilitating its continued use next time.

[0044] Furthermore, such as Figure 4 As shown, the four corners of the fixing block are chamfered. On the one hand, the chamfer design can increase the remaining space of the clearance groove 111 after the fixing block 220 is installed in the mounting groove 110, leaving enough space for defective products generated during processing to fall off smoothly, and preventing defective products from accumulating between the base 100 and the boss 200.

[0045] According to some embodiments of this application, in order to improve the space utilization of the base 100, this application improves production efficiency by optimizing the design layout of the mounting slot 110. Specifically, as... Figure 3 As shown, the base 100 is provided with multiple mounting slots 110, and the number of bosses 200 corresponds to the number of mounting slots 110. Furthermore, the multiple mounting slots 110 are grouped along the width direction of the base 100, and multiple groups of mounting slots 110 are provided along the length direction of the base 100. And, as... Figure 3 As shown, along the length of the base 100, two adjacent sets of mounting slots 110 are staggered. This optimizes the layout of the mounting platform to improve space utilization and flip-chip efficiency, and the staggered arrangement prevents adjacent bosses 200 from interfering with each other and affecting the flip-chip quality.

[0046] According to some embodiments of this application, the base 100 is provided with at least two positioning posts 300, which are respectively located on both sides near the mounting groove 110. Specifically, the positioning posts 300 are mainly used for auxiliary positioning when the carrier board carrying the chip is connected to the positioning platform.

[0047] According to some embodiments of this application, a recessed portion 130 is provided on both sides of the base 100, and a third connecting hole 140 is provided in the recessed portion 130. The third connecting hole 140 is used to connect the mounting platform to other equipment or workbench.

[0048] This application also provides a chip inversion bonding apparatus (not shown) that utilizes the aforementioned mounting platform. Specifically, the mounting platform is fixed to the bonding platform of the chip inversion bonding apparatus via a third connection hole 140.

[0049] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0050] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A mounting platform for chip flip-chip technology, characterized in that, include: The base (100) is provided with a mounting groove (110), and the mounting groove (110) is provided with a first connecting hole (120); A boss (200) is inserted into the mounting groove (110), and the boss (200) is provided with a second connecting hole (210). A locking member (400) passes through the first connecting hole (120) and the second connecting hole (210) in sequence to fix the boss (200) in the mounting groove (110).

2. The mounting platform for chip flip-chip process according to claim 1, characterized in that, The boss (200) includes a fixing block (220) and a support block (230) fixed on the fixing block (220). The fixing block (220) is installed in the mounting groove (110), and the support block (230) is used to place the workpiece.

3. The mounting platform for chip flip-chip technology according to claim 2, characterized in that, The mounting slot (110) is provided with a clearance slot (111), and the four clearance slots (111) are arranged circumferentially around the axis of the mounting slot (110), and the four corners of the fixing block (220) extend into the clearance slot (111).

4. The mounting platform for chip flip-chip process according to claim 3, characterized in that, The four corners of the fixing block (220) are chamfered.

5. The mounting platform for chip flip-chip process according to any one of claims 1 to 4, characterized in that, The base (100) is provided with a plurality of mounting slots (110), and the number of bosses (200) corresponds to the number of mounting slots (110).

6. The mounting platform for chip flip-chip process according to claim 5, characterized in that, Multiple mounting slots (110) are arranged in a group along the width direction of the base (100), and multiple groups of mounting slots (110) are arranged along the length direction of the base (100).

7. The mounting platform for chip flip-chip process according to claim 6, characterized in that, Along the length of the base (100), two adjacent sets of mounting slots (110) are staggered.

8. The mounting platform for chip flip-chip process according to claim 1, characterized in that, The base (100) is provided with at least two positioning posts (300), which are respectively located on both sides near the mounting groove (110).

9. The mounting platform for chip flip-chip process according to claim 1, characterized in that, The base (100) has a recessed portion (130) on both sides, and the recessed portion (130) has a third connecting hole (140).

10. A chip flip-chip bonding apparatus, characterized in that, The implementation platform for chip flip-chip processes as described in any one of claims 1 to 9 is included.

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