Atomization assembly and atomizer

Abstract

The utility model discloses an atomization assembly and an atomizer. The atomization assembly comprises an upper shell, a lower shell, an atomization piece and a colloid structure. The lower shell is connected with the upper shell in the first direction, the lower shell and the upper shell jointly define a containing cavity, and the containing cavity comprises a positioning area. The atomization sheet is arranged in the containing cavity, and the colloid structure is arranged in the containing cavity and covers the positioning area. Wherein the colloid structure is respectively connected with the atomizing sheet and the lower shell, and / or the colloid structure is respectively connected with the atomizing sheet and the upper shell. According to the application, the stability and the sealing performance of atomization sheet connection can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to atomization technical field especially relates to a kind of atomization assembly and atomizer. BACKGROUND

[0002] Atomization piece module is a kind of device that converts liquid into small fog particles, widely used in medical, environmental protection, beauty, industry and many other fields.The core component is atomization piece, by high-frequency vibration or ultrasonic technology, liquid medicine, perfume, nutrient solution etc. are atomized into small particles, to facilitate human inhalation, skin absorption or improve air humidity etc.

[0003] Regarding traditional atomization piece module, atomization piece often adopts relatively simple connection mode, such as screw fixing or buckle splicing during assembly process.These connection modes are prone to looseness in long-term vibration or high-frequency use environment, seriously affecting the stability and service life of module.In addition, traditional process also has obvious deficiency in sealing performance.Due to the limitation of sealing material selection and process treatment, liquid leakage is likely to occur during use, which not only reduces atomization effect, but also may cause damage to equipment. SUMMARY

[0004] The main purpose of the utility model is to propose a kind of atomization assembly and atomizer, which can improve the stability and sealing property of atomization piece connection.

[0005] To achieve the above-mentioned purpose, some embodiments of the utility model propose an atomization assembly, comprising:

[0006] upper shell,

[0007] lower shell, connected to the upper shell along the first direction, the lower shell and the upper shell together define a containing chamber, the containing chamber includes a positioning area;

[0008] atomization piece, disposed in the containing chamber;

[0009] colloid structure, disposed in the containing chamber, and the colloid structure covers the positioning area;

[0010] Wherein, the colloid structure is connected to the atomization piece and the lower shell respectively, and / or the colloid structure is connected to the atomization piece and the upper shell respectively.

[0011] In some embodiments, the colloid structure is semi-solid, and the hardness of the colloid structure ranges from 0 to 30 degrees.

[0012] In some embodiments, the upper shell is provided with a first through hole, the lower shell is provided with a second through hole corresponding to the first through hole, the atomization piece includes an atomization part and a connecting part arranged circumferentially around the atomization part, the atomization part is configured as a mesh structure, the atomization part is exposed to the first through hole and the second through hole, and the colloid structure is connected to the connecting part.

[0013] In some embodiments, the connecting portion comprises a first flange, the second direction is perpendicular to the first direction, the first flange protrudes away from the atomizing portion along the second direction, and the gel structure covers at least part of the first flange.

[0014] In some embodiments, the upper shell comprises an upper shell body and a supporting protrusion, the supporting protrusion is connected to the upper shell body, and the supporting protrusion protrudes downward along the first direction toward the lower shell, and the gel structure covers at least part of the supporting protrusion.

[0015] In some embodiments, the gel structure is spaced apart from the upper shell body, and the atomizing sheet is spaced apart from the upper shell body.

[0016] In some embodiments, the lower shell comprises a second flange arranged circumferentially around the first direction, the second flange has a first wall surface perpendicular to the first direction and a second wall surface parallel to the first direction, and the positioning area comprises the first wall surface and the second wall surface.

[0017] In some embodiments, the atomizing sheet comprises a metal contact, and the metal contact is used for electrical connection.

[0018] In some embodiments, the lower shell comprises a hollow column, the hollow column is in communication with the accommodating cavity and the external environment, and the hollow column is adapted to pass a wire or an electrode to electrically connect the metal contact to the external environment.

[0019] An embodiment of the second aspect of the utility model provides a kind of atomizer, and the atomizer includes any one of the atomizing assembly described above.

[0020] According to the above-mentioned embodiments, the utility model has the beneficial effects that:

[0021] The atomizing assembly of the utility model comprises an upper shell, a lower shell, an atomizing sheet and a gel structure. The lower shell is connected to the upper shell along a first direction, and the upper shell and the lower shell jointly define an accommodating cavity. The atomizing sheet is arranged in the accommodating cavity, and the gel structure is arranged in the accommodating cavity and covers a positioning area. The gel structure is connected to the atomizing sheet and the lower shell, and / or the gel structure is connected to the atomizing sheet and the upper shell.

[0022] Specifically, when the colloidal structure is connected to the atomization sheet, the colloidal structure can be plasticized to correspond to the shape of the accommodating chamber through a specific mold, or the colloidal structure can diffuse to the connection area of the atomization sheet in a diffuse manner, and the colloidal structure can fill the unnecessary gap or groove between the upper shell and the lower shell. In summary, the colloidal structure has strong plasticity and can be sealed to more positions of the atomization sheet or the accommodating chamber, so that the atomization sheet is wrapped more tightly by the connection mode of the colloidal structure, that is, the sealing performance of the atomization assembly of the present application is stronger. In addition, the colloidal structure has a certain elasticity and can buffer vibration and impact. Compared with the traditional connection mode such as threaded connection, the connection form of the colloidal structure is less affected by vibration and impact, so that the stability of the connection of the atomization sheet is stronger. In summary, the atomization assembly of the present application connects the atomization sheet, the upper shell and / or the lower shell through the colloidal structure, so as to achieve the effect of strengthening the connection stability and sealing performance of the atomization sheet.

[0023] The additional aspects and advantages of the present application will be partially given in the following description, and some will become apparent from the following description, or be understood by those skilled in the art through the practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can also obtain other drawings according to the structures shown in these drawings without creative labor.

[0025] Figure 1 It is a schematic diagram of the three-dimensional structure of the atomization assembly in an embodiment of the present application;

[0026] Figure 2 It is Figure 1 It is an exploded structural schematic diagram of the atomization assembly in the embodiment, wherein the atomization sheet and the colloidal structure are separated;

[0027] Figure 3 It is Figure 1 It is an exploded structural schematic diagram of the atomization assembly in the embodiment, wherein the atomization sheet and the colloidal structure are integrally combined;

[0028] Figure 4 It is Figure 1 It is a sectional structural schematic diagram of the atomization assembly in the embodiment;

[0029] Figure 5 It is Figure 4 It is an enlarged view of A in the embodiment.

[0030] EXPLANATION OF DRAWINGS:

[0031] Upper shell 100; upper shell body 110; support protrusion 120;

[0032] lower shell 200; second flange 210; first wall surface 211; second wall surface 212; hollow column 220;

[0033] atomizing sheet 300; atomizing part 310; connecting part 320; first flange 321;

[0034] colloid structure 400.

[0035] The implementation, functional features and advantages of the utility model will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION

[0036] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all the other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0037] It should be noted that if the embodiments of the utility model involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement condition, etc. between the components in a certain posture, and if the certain posture changes, the directional indications also change accordingly.

[0038] In addition, if the embodiments of the utility model involve the description of "first", "second", etc., the description of "first", "second", etc. is only for the purpose of description, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features with "first" and "second" can explicitly or implicitly include at least one of the features. In addition, if "and / or", "and / or" or "and / or" appears in the whole text, it means that the three parallel schemes are included, for example, "A and / or B" includes A scheme, or B scheme, or A and B scheme. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of the ordinary skilled in the art, and when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, and is not within the protection scope required by the utility model.

[0039] Referring to Figures 1 to 5 In some embodiments, the embodiments of the first aspect of the present application propose an atomizing assembly. Referring to Figure 1 , Figure 2 and Figure 4The atomization assembly includes an upper shell 100, a lower shell 200, an atomization sheet 300, and a colloid structure 400. The lower shell 200 is connected to the upper shell 100 along a first direction, and the upper shell 100 and the lower shell 200 jointly define a containing chamber, which includes a positioning area. The atomization sheet 300 is arranged in the containing chamber, and the colloid structure 400 is arranged in the containing chamber and covers the positioning area. The colloid structure 400 is connected to the atomization sheet 300 and the lower shell 200 respectively, and / or the colloid structure 400 is connected to the atomization sheet 300 and the upper shell 100 respectively.

[0040] The upper shell 100 has a certain thickness and strength to protect the internal atomization assembly from external environment. The material of the upper shell 100 can be selected from metal or plastic, etc. to ensure sufficient mechanical strength and corrosion resistance. The lower shell 200 and the upper shell 100 are firmly connected together by threads, buckles or other means, and together form a sealed containing chamber. This structure design enables the atomization assembly to maintain good sealing performance in different use environments, preventing liquid leakage or external contaminants from entering, thereby ensuring the stability and reliability of the product.

[0041] The atomization sheet 300 is the key component for realizing liquid atomization and is located in the containing chamber. When an electric current passes through the atomization sheet 300, the atomization sheet 300 will heat up or vibrate, causing the liquid in contact with the atomization sheet 300 to evaporate into tiny particles, i.e. forming mist. It can be understood that, in order to ensure the atomization efficiency and effect, the atomization sheet 300 needs to have sufficient contact area with the liquid, and at the same time, it also needs to be able to dissipate heat quickly, so as not to be damaged or affect the atomization quality due to excessive temperature.

[0042] Regarding the colloid structure 400, on the one hand, the colloid structure 400 covers the positioning area, ensuring that the atomization sheet 300 is fixed in the correct position, and on the other hand, the colloid structure 400 connects the atomization sheet 300 with the upper shell 100 and the lower shell 200, so that the atomization sheet 300 is in a sealed environment and is protected by the upper shell 100 and the lower shell 200. The colloid structure 400 can have certain elasticity and adhesion, which not only can associate the atomization sheet 300 with the connected position and the positioning area, so that the atomization sheet 300 is firmly connected to the upper shell 100 and / or the lower shell 200, but also can absorb vibration and impact, thereby reducing the influence of external factors on the work of the atomization sheet 300. In addition, the colloid structure 400 can also act as a sealing material to further improve the sealing performance of the containing chamber, i.e. to further ensure the sealed environment of the atomization sheet 300.

[0043] Specifically, when the colloidal structure 400 is connected to the atomization sheet 300, it can diffuse to the connection area of the atomization sheet 300 in a diffused manner, or the colloidal structure 400 is first molded into a shape corresponding to the accommodation chamber by a mold, and the whole of the colloidal structure 400 and the atomization sheet 300 is assembled into the atomization assembly as an assembly unit, and the colloidal structure 400 can fill the unnecessary gap or groove between the upper shell 100 and the lower shell 200, so that the connection mode of the colloidal structure 400 is stronger in wrapping the atomization sheet 300, and the sealing performance of the atomization assembly of the present application is stronger. In addition, the colloidal structure 400 has a certain elasticity and can buffer vibration and impact. Compared with the traditional connection mode such as threaded connection, the connection form of the colloidal structure 400 is less affected by vibration and impact, so the stability of the connection of the atomization sheet 300 of the present application is stronger. In summary, the atomization assembly of the present application connects the atomization sheet 300 and the upper shell 100 and / or the lower shell 200 through the colloidal structure 400, thereby achieving the effect of strengthening the connection stability and sealing performance of the atomization sheet 300.

[0044] The colloidal structure 400 can be silica gel, which is in a semi-solid state, and the hardness of the silica gel is between 0 and 30 degrees, for example, the hardness can be 1 degree, 10 degrees, 15 degrees, 20 degrees, 25 degrees, or 30 degrees. In some embodiments, the atomization sheet 300 is first placed in a specific mold, the inner cavity of the mold matches the structure of the accommodation chamber, and then the colloidal structure 400 is injected into the mold. After being fixed, the whole combination of the colloidal structure 400 and the atomization sheet 300 is taken out of the mold and placed in the accommodation chamber composed of the lower shell 200 and the upper shell 100, thereby realizing the assembly of the atomization sheet 300.

[0045] It can be understood that, regarding the connection of the colloidal structure 400, first, the colloidal structure 400 has the properties of liquid and solid states, which can have good sealing performance. Second, the colloidal structure 400 can fix the atomization sheet 300 by adhesion, and the colloidal structure 400 can also fill the accommodation chamber along the first direction to provide a pressing force to the atomization sheet 300 along the first direction, so as to stably press the atomization sheet 300 at a specific position and realize the stable assembly of the atomization sheet 300.

[0046] It can be understood that, in order to further improve the buffering effect of vibration, in some embodiments, the colloidal structure 400 is not limited to directly connecting the atomization sheet 300 and the lower shell 200, but can also selectively adopt an indirect connection mode. For example, a gasket or buffer layer can be added between the colloidal structure 400 and the lower shell 200, which not only enhances the sealing effect, but also provides additional protection for the atomization sheet 300.

[0047] In some embodiments, the colloid structure 400 can only connect the atomizing sheet 300 and the upper shell 100 without directly connecting with the lower shell 200, or the colloid structure 400 only connects the atomizing sheet 300 and the lower shell 200 without directly connecting with the upper shell 100. In this case, the atomizing sheet 300 can still be firmly installed in the positioning area and maintain good atomization performance by optimizing the design of the colloid structure 400, such as adjusting its shape, thickness or material properties. For example, the colloid structure 400 completely wraps the atomizing sheet 300 along the circumferential direction of the atomizing sheet 300, and the colloid structure 400 only connects the lower shell 200, and the colloid structure 400 and the upper shell 100 are spaced apart. Such a design can make the atomizing sheet 300 receive less pressure. Since the smaller the pressure received by the atomizing sheet 300, the higher the atomization rate of the atomizing sheet 300, such a design can allow the atomizing sheet 300 to be not pressed from the front, thereby making the performance of the atomizing sheet 300 better.

[0048] In some embodiments, the colloid structure 400 can be made of a variety of materials with different properties, such as silicone rubber, polyurethane foam, etc., and the selection of these materials depends on the specific application requirements, such as temperature range, chemical stability, etc. For example, the colloid structure 400 selects a food-grade liquid silicone with a viscosity of 3000 cps and a Shore hardness of 30A for applications in the medical field, etc.

[0049] In some embodiments, the colloid structure 400 has weak adhesion and mainly fixes the atomizing sheet 300 by pressure compression. Specifically, according to the requirements of different application scenarios, the colloid structure 400 is designed in a detachable form to facilitate the maintenance and replacement of the atomizing sheet 300. Such a design increases the flexibility and service life of the product.

[0050] In some embodiments, the atomizing sheet 300 can be placed in a specific mold first, the colloid structure 400 is injected into the mold, and then the whole is placed in the accommodation cavity after the colloid structure 400 and the atomizing sheet 300 are integrally formed.

[0051] Specifically, the transition of the colloidal structure 400 from liquid to solid is usually accomplished through a curing process, such as thermal curing, photo-curing, or chemical reaction curing, etc. Before curing, the liquid colloidal structure 400 can flow and completely fill the positioning area, ensuring that all parts that need to be fixed are uniformly covered by the colloidal structure 400. After curing, the colloidal structure 400 hardens, forming a solid connection that firmly fixes the atomizing sheet 300 in place. This feature allows the atomizing sheet 300 to work stably without additional support, reducing the need for additional fixing parts during assembly and simplifying the manufacturing process. The cured colloidal structure 400 also provides additional sealing function, enhancing the durability and sealing of the overall structure, prolonging the service life of the atomizing assembly. This feature of the colloidal structure 400 also allows manufacturers to adjust the curing time according to specific needs, optimizing production efficiency.

[0052] It can be understood that in some embodiments, for the state change of the colloidal structure 400, the curing speed can be controlled by selecting different curing agents or adjusting the curing conditions (such as temperature, humidity, light intensity, etc.). For example, in some application scenarios, it may be necessary to speed up the curing speed to improve production efficiency, at which time a fast-drying curing agent can be selected or the temperature during curing can be increased. In some embodiments, involving delayed curing in order to more accurately adjust the position of the atomizing sheet 300, a slow-drying curing agent can be selected or the curing temperature can be reduced. In addition, a staged curing method can also be used, which first performs preliminary curing to fix the basic position, and then performs final curing to achieve the best fixing effect. This method not only improves the assembly accuracy, but also effectively prevents the generation of bubbles or voids during the curing process, ensuring that the colloidal structure 400 provides reliable fixing and sealing.

[0053] In some embodiments, the upper shell 100 is provided with a first through hole, and the lower shell 200 is provided with a second through hole corresponding to the first through hole. The atomizing sheet 300 comprises an atomizing part 310 and a connecting part 320 arranged circumferentially around the atomizing part 310, wherein the atomizing part 310 is designed as a mesh structure and is exposed between the first through hole and the second through hole, and the colloidal structure 400 connects the connecting part 320.

[0054] In some embodiments, the first through hole of the upper shell 100 is an opening designed for liquid or gas flow in and out, which corresponds to the second through hole of the lower shell 200, ensuring the smooth flow of the fluid path. Such a structure not only simplifies the assembly process of the product, but also ensures the maximization of the atomization effect. Referring to Figure 2 and Figure 3In some embodiments, the atomizing part 310 and the connecting part 320 are combined. The atomizing part 310 adopts a mesh structure design, which increases the surface area in contact with the liquid and improves the evaporation efficiency. At the same time, the mesh structure also has good mechanical strength and can withstand a certain pressure without deformation. The connecting part 320 is arranged around the atomizing part 310 to fix the atomizing sheet 300 in the correct position. By exposing the atomizing part 310 to the first and second through holes, the atomizing part 310 can directly contact the liquid to be atomized, thereby achieving efficient atomization.

[0055] The colloidal structure 400 covers and connects the connecting part 320, playing a role in fixing and supporting the atomizing sheet 300. Since the connecting part 320 and the atomizing part 310 are independent structures, the liquid to be atomized and the gas after atomization flow along the first direction on the atomizing part 310, and the connecting part 320 is arranged in the circumferential direction of the atomizing part 310 around the first direction, so the colloidal structure 400 connected to the connecting part 320 will not hinder the flow of the liquid to be atomized or the gas after atomization, thereby ensuring the atomization efficiency.

[0056] Referring to Figure 4 In some embodiments, the connecting part 320 includes a first flange 321, and the second direction is perpendicular to the first direction. The first flange 321 protrudes away from the atomizing part 310 along the second direction, and the colloidal structure 400 wraps at least part of the first flange 321.

[0057] The first flange 321 of the connecting part 320 extends along the first direction perpendicular to the connection of the upper and lower shells 200, forming an additional support point and increasing the contact area between the atomizing sheet 300 and the accommodation chamber. This structure enhances the stability of the installation of the atomizing sheet 300, and can remain fixed even under vibration or impact conditions. The design of the first flange 321 not only helps to improve the positioning accuracy of the atomizing sheet 300, but also can disperse the pressure from the outside and reduce the stress concentration on the atomizing sheet 300 itself, prolonging its service life.

[0058] The colloidal structure 400 wraps at least part of the first flange 321, forming a closed annular area, further enhancing the fixing effect of the atomizing sheet 300. By reasonably designing the thickness and distribution of the colloidal structure 400, sufficient adhesion can be ensured without excessively affecting the heat conduction performance of the atomizing sheet 300. When the colloidal solidifies, it not only plays a bonding role, but also completely wraps the first flange 321, providing an additional protective layer and avoiding corrosion or aging problems caused by long-term use.

[0059] It can be understood that in some embodiments, the shape of the first flange 321 can be circular, square or other geometric shapes, depending on the overall design of the atomization assembly and application requirements. For example, in some cases, in order to optimize the installation stability of the atomization sheet 300, the width of the first flange 321 can be increased or its edge profile can be adjusted. In addition, for the colloid structure 400, in addition to the basic bonding function, conductive or thermal conductive fillers can be added to the colloid to provide additional functions such as improved heat dissipation or electromagnetic shielding. These improvements can significantly improve the overall performance of the atomization assembly without changing the original structure, meeting the special requirements of different application scenarios.

[0060] With reference to Figure 4 and Figure 5 In some embodiments, the upper shell 100 includes an upper shell body 110 and a support protrusion 120 connected to the upper shell body 110 and protruding in a first direction towards the lower shell 200. The presence of the support protrusion 120 provides additional physical support for the components inside the accommodation chamber, enhancing the structural stability of the entire atomization assembly.

[0061] The support protrusion 120 extends from the upper shell body 110 and its shape and size can be designed according to specific application requirements. For example, the support protrusion 120 can be cylindrical, conical or any other geometric shape that helps to enhance stability. The main function of the support protrusion 120 is to provide a positioning reference point during assembly. The colloid structure 400 wraps around the support protrusion 120 or the support protrusion 120 extends into the colloid structure 400 in a plug-in mode, improving the bonding strength and further enhancing the connection effect of the upper shell 100 and the colloid structure 400. By combining the support protrusion 120 with the colloid structure 400, the atomization assembly not only achieves precise fixation of internal components, but also improves the reliability and safety of the overall structure.

[0062] With reference to Figure 5In some embodiments, the colloid structure 400 is spaced apart from the upper shell body 110, and the atomization sheet 300 is spaced apart from the upper shell body 110. Both the atomization sheet 300 and the colloid structure 400 are spaced apart from the upper shell body 110, so that the atomization sheet 300 is less likely to be pressed from above, which is conducive to improving the atomization rate. Specifically, on the one hand, the presence of the spacing can also prevent the stress generated during the solidification of the colloid from directly acting on the upper shell body 110, which can improve the atomization rate and avoid possible structural damage. On the other hand, such a design can reduce heat conduction between different components. Since the atomization sheet 300 generates heat when it is working, if it directly contacts the upper shell body 110, it can cause excessive heat to be transferred to the upper shell body 110, thereby affecting the temperature distribution of the entire assembly. By maintaining the spacing, the heat conduction effect can be effectively reduced, and the upper shell body 110 can be protected from high temperatures, and at the same time, it is also conducive to the more uniform dissipation of heat around the atomization sheet 300. It can be understood that in some embodiments, the spacing can be achieved by setting a specific gasket or frame. These additional structures not only can accurately control the distance of the spacing, but also can provide additional functions, such as enhancing sound insulation or improving vibration resistance. For example, choosing a material with good thermal conductivity as a spacer can accelerate heat dissipation without affecting the spacing function, further optimizing the thermal management performance of the atomization assembly.

[0063] With reference to Figure 4 In some embodiments, the lower shell 200 includes a second flange 210 arranged circumferentially around the first direction, the second flange 210 having a first wall surface 211 perpendicular to the first direction and a second wall surface 212 parallel to the first direction, and the positioning area includes the first wall surface 211 and the second wall surface 212.

[0064] The second flange 210 not only can provide precise positioning for other components (such as the atomization sheet 300) in the accommodation chamber, but also can improve the sealing and mechanical strength of the entire atomization assembly by increasing the structural complexity. Such a design ensures that all internal components can be accurately assembled at the predetermined position and remain stable during use without displacement due to external factors such as vibration or impact. For example, the colloid structure 400 fits the first wall surface 211 and the second wall surface 212, and by increasing the fitting area of the colloid structure 400 and the lower shell 200, the connection between the colloid structure 400 and the lower shell 200 is more stable, and the probability of displacement between the colloid structure 400 and the lower shell 200 is smaller in the case of falling or other impacts of the atomization assembly, that is, the combination of the colloid structure 400 and the lower shell 200 is more stable, and the installation of the atomization sheet 300 is more stable,

[0065] It can be understood that in some embodiments, the shape and size of the second flange 210 can be adjusted according to the actual application requirements. For example, for cases requiring greater space utilization, the width of the second flange 210 can be appropriately reduced to make more space for other components. Conversely, if higher mechanical strength is pursued, the second flange 210 can be widened or even designed as a double-layer or multi-layer structure, which not only provides more area for the colloid structure 400 to adhere to, but also enhances the compression resistance.

[0066] In some embodiments, the surface treatment of the second flange 210 also uses a rough surface structure such as a sawtooth design to further improve the fastening and stability when it and the colloid structure 400 are combined.

[0067] Referring to Figure 2 and Figure 3 In some embodiments, the atomizing sheet 300 includes metal contacts for electrical connection. The metal contacts are usually made of metal materials with good electrical conductivity, such as copper, silver, or gold, etc., to ensure efficient and stable current transmission. The main function of the metal contacts is to serve as an interface for current import and export. When the atomizing assembly is working, power needs to be transmitted to the atomizing sheet 300 through the metal contacts to make it vibrate and thus achieve liquid atomization.

[0068] Referring to Figures 1 to 3 In some embodiments, the lower shell 200 includes a hollow column 220 that communicates the accommodation cavity with the external environment, and the hollow column 220 is adapted to pass a wire or electrode to electrically connect the metal contacts to the external environment. The hollow column 220 is hollow inside, allowing the wire or electrode to pass through, thereby achieving electrical connection between the metal contacts on the atomizing sheet 300 and the external power supply or control system.

[0069] The presence of the hollow column 220 solves the problem of how to lead the internal metal contacts out to the outside. It not only provides a physical channel, but also plays a protective role for the wire or electrode, avoiding damage during installation and use.

[0070] In particular, the design of the hollow column 220 helps to maintain the sealing of the entire atomizing assembly, preventing external contaminants from entering the accommodation chamber and affecting the atomization effect. To achieve the best sealing effect, a rubber ring or other type of sealing member can be provided at the entrance of the hollow column 220 to ensure good airtightness even under pressure difference. At the same time, the material selection of the hollow column 220 also needs to consider the properties of anti-aging and chemical corrosion resistance to adapt to the needs of different application scenarios.

[0071] It can be understood that in some embodiments, the hollow column 220 can also be equipped with additional functional modules. For example, built-in limiting devices can prevent damage caused by excessive insertion of wires or electrodes; integrated temperature sensors can be used to monitor the working temperature of the atomization assembly in real time, providing an overheating protection mechanism. In addition, the appearance of the hollow column 220 can also be personalized designed according to specific application scenarios, such as using anti-slip textures or color coding, etc., to enhance user experience. For occasions that require higher waterproof and dustproof levels, the hollow column 220 can also be specially treated, such as adding a waterproof and breathable film, etc., to meet higher protection standards.

[0072] With reference to Figures 1 to 5 The embodiments of the second aspect of the present application propose an atomization device, which comprises the atomization assembly of any of the above embodiments. The atomization assembly of the present application realizes the effect of improving the connection stability and sealing performance through the connection form of the silica gel structure, the principle of which has been described above and will not be repeated here. Therefore, the atomization device of the present application has excellent stability and sealing performance.

[0073] Regarding the production of the atomization assembly and the atomization device, specifically, in some embodiments, the atomization sheet 300 adopts a high polymer film mesh structure that is not easy to break, and the electrode material is copper. The upper shell 100 and the lower shell 200 are both made of plastic material. The gel structure 400 selects a food-grade liquid silicone with a viscosity of 3000 cps and a Shore hardness of 30A. The silicone is injected into a mold at 70°C using an injection equipment with an injection pressure of 1 MPa and an injection speed of 10 ml / s. Then it is cured in a curing oven in a stepwise heating manner, with an initial heating rate of 3°C / min from room temperature to 120°C, and a final heating rate of 2°C / min from 120°C to 150°C, with a curing time of 20 minutes. The manufactured atomization assembly is tested and no liquid leakage is found under a pressure of 0.3 MPa. The component connection is firm after continuous operation for 1200 hours in an environment with a vibration frequency of 500 Hz. The relative position accuracy of the micro-mesh atomization sheet 300 and other components such as electrodes is ±0.03 mm, and the atomization effect is good.

[0074] Regarding the process of the colloidal structure 400, specifically, the colloidal structure 400 selects a food-grade liquid silicone, which has good fluidity (viscosity of 1000-5000 cps), high elasticity (Shore hardness of 10-40A), temperature resistance (can maintain stable performance in the range of-40℃ to 200℃) and biocompatibility. The liquid silicone is injected into the mold through high-precision injection. The mold is designed to closely match each component of the micro-mesh atomization sheet 300 module, ensuring that the silicone can accurately fill the parts that need to be sealed and fixed. The injection pressure is controlled at 0.5-2MPa, and the injection speed is 5-20ml / s. During the injection process, the mold is heated, and the temperature is maintained at 60-80℃ to reduce the viscosity of the silicone and promote its uniform filling, while avoiding the generation of bubbles. After the injection is completed, the mold is placed in a curing oven for curing. The curing temperature is 100-150℃, and the curing time is 10-30 minutes. During the curing process, a stepwise heating method is used, with a pre-heating rate of 2-5℃ / min and a post-heating rate of 1-3℃ / min to reduce the generation of internal stress and ensure good bonding of the silicone with each component.

[0075] Through the liquid silicone process, the sealing performance of the atomization assembly is greatly improved. Under a pressure of 0.1-0.5MPa, there is no liquid leakage, effectively preventing damage to the module and external equipment caused by liquid leakage. After the liquid silicone is cured, it forms a stable wrapping and connection to the internal components, and the module can work continuously for more than 1000 hours in an environment with a vibration frequency of 100-1000Hz, and the connection between the components in the module is firm and there is no loosening phenomenon. Under the premise of balancing the liquid leakage, the smaller the pressure on the atomization sheet 300, the better the atomization rate will be. Because the atomization sheet 300 is wrapped by liquid silicone with a hardness of 10-30A, the atomization sheet 300 can be waterproofed by the silicone on the periphery of the atomization sheet 300, and the front surface of the atomization sheet 300 can not be pressed, thereby making the performance of the atomization sheet 300 better. The silicone structure of the present application can be manufactured into a complex shape to meet the installation requirements of different equipment. The relative position accuracy of the atomization sheet 300 and other components can be controlled within ±0.05mm, ensuring the consistency of the atomization effect.

[0076] The above is only a preferred embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structural transformation or direct / indirect application in other related technical fields based on the inventive concept of the present application and the contents of the present application specification and drawings are included in the patent protection scope of the present application.

Claims

1. An atomizing assembly, characterized in that, The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly.

2. The atomization assembly of claim 1, wherein, The application relates to an atomizing assembly.

3. The atomization assembly of claim 1, wherein, The application relates to an atomizing assembly.

4. The atomization assembly of claim 3, wherein, The application relates to an atomizing assembly.

5. The atomization assembly of claim 1, wherein, The application relates to an atomizing assembly.

6. The atomization assembly of claim 5, wherein, The application relates to an atomizing assembly.

7. The atomization assembly of claim 1, wherein, The application relates to an atomizing assembly.

8. The atomization assembly of claim 1, wherein, The application relates to an atomizing assembly.

9. The atomization assembly of claim 8, wherein, The application relates to an atomizing assembly.

10. An atomizer characterized by, The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an atomizing assembly. The application relates to an

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