Semiconductor conductive adhesive dispensing device

Abstract

The embodiment of the utility model provides a semiconductor conductive adhesive dispensing device, and relates to the technical field of semiconductor processing. The semiconductor conductive adhesive dispensing device comprises a base, the top of the base is fixedly connected with an adhesive dispensing frame, the top of the adhesive dispensing frame is fixedly connected with an X-axis, Y-axis and Z-axis movement platform, and the side wall of the X-axis, Y-axis and Z-axis movement platform is fixedly connected with an adhesive dispenser. And the double-end threaded rod is provided with threads with opposite left and right rotating directions and can drive the conveying plates on the two sides to synchronously move towards each other or back to back, the conveying plates are accurately adjusted to proper positions according to the widths of the chips, the limiting effect on the chips is achieved, and the chips are prevented from deviating on the conveying belt.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor processing especially relates to a semiconductor conductive adhesive dispensing device. BACKGROUND

[0002] Conductive adhesive is a kind of adhesive with certain conductive performance after curing or drying, it is usually with matrix resin and conductive filler, i.e. conductive particle as main component, through the adhesive effect of matrix resin, conductive material is combined together, and a plurality of conductive material is connected to form conductive path, and semiconductor conductive adhesive dispensing is to point the conductive adhesive on the electronic element of chip by dispensing machine.

[0003] In prior art (Chinese invention patent application with application number CN222447084U and patent name as a dispensing device for semiconductor packaging), the device is provided with liquid storage block, appropriate amount of adhesive is sucked into liquid storage block through first conveying pipe by retraction of second electric telescopic rod, then appropriate amount of adhesive is conveyed to liquid outlet head through second conveying pipe by extension of second electric telescopic rod, then is coated on the required position, through continuous cycle operation, so that the device can more accurately control the injection amount of adhesive during each dispensing, can more accurately control the injection amount of adhesive during each dispensing, can ensure that dispensing position is accurate and glue is evenly applied, so as to improve packaging quality and reliability, and user can adjust the length of extension of second electric telescopic rod to adjust the output of adhesive, so as to improve the application range of the device. In the process of realizing the technical scheme, the inventor finds that at least the following problems exist in prior art:

[0004] In the dispensing process of existing device, conductive adhesive is extruded from dispensing head, which will generate certain thrust, especially in the application scene of high-precision and small-size chip, the thrust can cause slight displacement of chip, in addition, the viscosity of conductive adhesive itself can temporarily adhere chip and drive it to move, so as to damage the accurate positioning of chip. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a semiconductor conductive adhesive dispensing device, which can avoid the problem that the viscosity of conductive adhesive itself temporarily adheres chip and drives it to move.

[0006] The utility model provides a semiconductor conductive adhesive dispensing device, including base, the top of base is fixedly connected with dispensing frame, the top of dispensing frame is fixedly connected with XYZ three-axis motion platform, the side wall of XYZ three-axis motion platform is fixedly connected with dispenser, further include:

[0007] The top of the base is fixedly connected with a servo motor, the output end of the servo motor is fixedly connected with a drive rod, the outer wall of the drive rod is rotatably connected with a fixed seat, the bottom of the fixed seat is fixedly connected with the top of the base, and the outer wall of the fixed rod is sleeved with a conveying belt.

[0008] Preferably, the inside of the conveying belt is provided with a connecting groove, the inner wall of the connecting groove is fixedly connected with a fixed rod, the outer wall of the fixed rod is rotatably connected with a hinged seat, and the side wall of the hinged seat is fixedly connected with a positioning plate.

[0009] Preferably, the top of the base is provided with a positioning mechanism, the positioning mechanism comprises a I-shaped guide rail fixedly connected on the top of the base, the side wall of the I-shaped guide rail is slidably connected with a conveying plate, the through hole of the conveying plate is threadedly connected with a double-headed threaded rod, one end of the double-headed threaded rod is fixedly connected with a handle, the outer wall of the double-headed threaded rod is rotatably connected with a connecting frame, and the side wall of the connecting frame is fixedly connected with the side wall of the glue dispensing frame.

[0010] Preferably, the side wall of the positioning plate is provided with a clamping mechanism, the clamping mechanism comprises a slide rail fixedly connected on the side wall of the positioning plate, and the side wall of the slide rail is slidably connected with a lifting block.

[0011] Preferably, the side wall of the lifting block is provided with an inclined groove, the top of the lifting block is fixedly connected with a T-shaped pull rod, the side wall of the conveying plate is fixedly connected with a guide plate, and the top of the guide plate is in contact with the outer wall of the T-shaped pull rod.

[0012] Preferably, the inner wall of the inclined groove is slidably connected with a guide slide rod, the bottom of the guide slide rod is fixedly connected with a support frame, and the side wall of the support frame is fixedly connected with a clamping block.

[0013] Preferably, the side wall of the positioning plate is fixedly connected with a slide rod, the slide rod penetrates through the side wall of the support frame and extends to the outside, and one end of the slide rod away from the positioning plate is fixedly connected with a reset disc.

[0014] Preferably, the outer wall of the reset disc is fixedly connected with a reset spring, and one end of the reset spring away from the reset disc is fixedly connected with the side wall of the support frame.

[0015] Preferably, the side wall of the clamping block is provided with an anti-dropping mechanism, the anti-dropping mechanism comprises a groove plate fixedly connected on the side wall of the clamping block, the inner wall of the groove plate is slidably connected with an eccentric rod, and one end of the eccentric rod is fixedly connected with an eccentric disc.

[0016] Preferably, the side wall of the eccentric disc is fixedly connected with a shaft rod, the outer wall of the shaft rod is rotatably connected with the through hole of the side wall of the positioning plate, and the outer wall of the shaft rod is fixedly connected with an L-shaped pressing plate.

[0017] The beneficial effects of the present application are:

[0018] 1、The semiconductor conductive adhesive dispensing device, the staff rotates the handle, the handle is connected with the double-threaded rod, when rotating the handle, the double-threaded rod rotates, the double-threaded rod has opposite threads in left and right directions, can drive the two sides of the conveying plate to move synchronously towards or away from each other, the conveying plate is accurately adjusted to the appropriate position according to the width of the chip, forms the limiting action to the chip, prevents the chip from deviating on the conveying belt.

[0019] 2、The semiconductor conductive adhesive dispensing device, the staff puts the chip on the positioning plate, the servo motor drives the conveying belt to move through the driving rod, so that the chip advances along the predetermined path, the conveying belt drives the hinged seat and the positioning plate to move through the fixed rod, the T-shaped pull rod first contacts the guide plate in the movement, the T-shaped pull rod pulls the lifting block to rise, when the lifting block rises, the inclined groove on the lifting block guides the guide slide rod to move towards the bottom end, finally, the guide slide rod drives the support frame and the clamping block to stably clamp the chip.

[0020] 3、The semiconductor conductive adhesive dispensing device, after the clamping block completes the preliminary clamping of the chip, further drives the groove plate to move close to the chip, the movement of the groove plate drives the eccentric rod and the eccentric disc to rotate around the shaft rod, so that the shaft rod drives the L-shaped pressing plate to press the chip, the L-shaped pressing plate applies pressure to the chip, firmly fixes the chip at the dispensing position, prevents the chip from moving during the conductive adhesive dispensing process. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical scheme of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments, and it should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation to the scope, and for those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0022] Figure 1 It is a three-dimensional schematic view of the overall structure of the embodiment of the present application.

[0023] Figure 2 It is a three-dimensional schematic view of the XYZ three-axis motion platform structure of the embodiment of the present application.

[0024] Figure 3 It is a three-dimensional schematic view of the conveying belt structure of the embodiment of the present application.

[0025] Figure 4 It is a three-dimensional schematic view of the connecting groove structure of the embodiment of the present application.

[0026] Figure 5 It is a three-dimensional schematic view of the positioning mechanism structure of the embodiment of the present application.

[0027] Figure 6 It is the guide plate structure three-dimensional schematic view of the embodiment of the utility model;

[0028] Figure 7 It is the clamping mechanism structure three-dimensional schematic view of the embodiment of the utility model;

[0029] Figure 8 It is the L-shaped lower pressing plate structure three-dimensional schematic view of the embodiment of the utility model;

[0030] Figure 9 It is the anti-dropping mechanism structure three-dimensional schematic view of the embodiment of the utility model.

[0031] Icon: 101, base; 102, glue dispensing frame; 103, XYZ three-axis motion platform; 104, glue dispenser; 201, servo motor; 202, drive rod; 203, fixed seat; 204, conveying belt; 21, connecting groove; 22, fixed rod; 23, hinged seat; 24, positioning plate; 3, positioning mechanism; 301, I-shaped guide rail; 302, conveying plate; 303, double-headed threaded rod; 304, handle; 305, connecting frame; 5, clamping mechanism; 501, slide rail; 502, lifting block; 503, inclined groove; 504, T-shaped pull rod; 54, guide plate; 505, guide slide rod; 506, support frame; 507, clamping block; 508, slide rod; 509, reset round plate; 510, reset spring; 6, anti-dropping mechanism; 601, groove plate; 602, eccentric rod; 603, eccentric disc; 604, shaft rod; 605, L-shaped lower pressing plate. DETAILED DESCRIPTION

[0032] Some embodiments of the utility model will be described in detail below with reference to the drawings. In the case of no conflict, the following examples and features in the examples can be combined with each other.

[0033] Please refer to Figures 1 to 9 The utility model embodiment provides a kind of semiconductor conductive glue glue dispensing device, including base 101, the top of base 101 is fixedly connected with glue dispensing frame 102, the top of glue dispensing frame 102 is fixedly connected with XYZ three-axis motion platform 103, the side wall of XYZ three-axis motion platform 103 is fixedly connected with glue dispenser 104, further include:

[0034] The top of the base 101 is fixedly connected with a servo motor 201, the output end of the servo motor 201 is fixedly connected with a drive rod 202, the outer wall of the drive rod 202 is rotatably connected with a fixed seat 203, the bottom of the fixed seat 203 is fixedly connected with the top of the base 101, the outer wall of the fixed rod 22 is sleeved with a conveying belt 204, the inner part of the conveying belt 204 is provided with a connecting groove 21, the inner wall of the connecting groove 21 is fixedly connected with a fixed rod 22, the outer wall of the fixed rod 22 is rotatably connected with a hinged seat 23, the side wall of the hinged seat 23 is fixedly connected with a positioning plate 24, and the positioning plate 24 is provided on the positioning plate 24. The chip is placed on the positioning plate 24, the servo motor 201 drives the conveying belt 204 to move through the drive rod 202, so that the chip advances along the predetermined path.

[0035] The top of the base 101 is provided with a positioning mechanism 3, the positioning mechanism 3 comprises a I-shaped guide rail 301 fixedly connected on the top of the base 101, the side wall of the I-shaped guide rail 301 is slidably connected with a conveying plate 302, the through hole of the conveying plate 302 is threadedly connected with a double-headed threaded rod 303, one end of the double-headed threaded rod 303 is fixedly connected with a handle 304, and the handle 304 is connected with the double-headed threaded rod 303. When the handle 304 is rotated, the double-headed threaded rod 303 rotates, the double-headed threaded rod 303 has opposite threads on the left and right sides, and can drive the two conveying plates 302 to move synchronously towards or away from each other, the conveying plate 302 is accurately adjusted to the appropriate position according to the width of the chip, forming a limiting action on the chip, preventing it from deviating on the conveying belt 204, the outer wall of the double-headed threaded rod 303 is rotatably connected with a connecting frame 305, and the side wall of the connecting frame 305 is fixedly connected with the side wall of the glue dispensing frame 102.

[0036] The side wall of the positioning plate 24 is provided with a clamping mechanism 5, the clamping mechanism 5 comprises a slide rail 501 fixedly connected to the side wall of the positioning plate 24, the side wall of the slide rail 501 is slidably connected with a lifting block 502, the side wall of the lifting block 502 is provided with an inclined groove 503, the top of the lifting block 502 is fixedly connected with a T-shaped pull rod 504, the side wall of the conveying plate 302 is fixedly connected with a guide plate 54, and the top of the guide plate 54 is in contact with the outer wall of the T-shaped pull rod 504. Thus, the T-shaped pull rod 504 moves along the top of the guide plate 54.

[0037] The inner wall of the chute 503 is slidably connected with a guide sliding rod 505, the bottom of the guide sliding rod 505 is fixedly connected with a supporting frame 506, and the side wall of the supporting frame 506 is fixedly connected with a clamping block 507, so that when the lifting block 502 rises, the chute 503 guides the guide sliding rod 505 to move to the bottom end, finally, the guide sliding rod 505 drives the supporting frame 506 and the clamping block 507 to stably clamp the chip, the side wall of the positioning plate 24 is fixedly connected with a sliding rod 508, the sliding rod 508 penetrates through the side wall of the supporting frame 506 and extends to the outside, one end of the sliding rod 508 away from the positioning plate 24 is fixedly connected with a reset disc 509, the outer wall of the reset disc 509 is fixedly connected with a reset spring 510, and one end of the reset spring 510 away from the reset disc 509 is fixedly connected with the side wall of the supporting frame 506, so that when the T-shaped pull rod 504 is separated from the contact with the guide plate 54, the reset spring 510 drives the supporting frame 506 to reset, and then the supporting frame 506 drives the clamping block 507 to release the restriction on the chip, so that the chip is automatically released.

[0038] The side wall of the clamping block 507 is provided with an anti-disengagement mechanism 6, the anti-disengagement mechanism 6 comprises a groove plate 601 fixedly connected to the side wall of the clamping block 507, the inner wall of the groove plate 601 is slidably connected with an eccentric rod 602, one end of the eccentric rod 602 is fixedly connected with an eccentric disc 603, the side wall of the eccentric disc 603 is fixedly connected with a shaft core rod 604, the outer wall of the shaft core rod 604 is rotatably connected with a through hole in the side wall of the positioning plate 24, and the outer wall of the shaft core rod 604 is fixedly connected with an L-shaped pressing plate 605, so that the L-shaped pressing plate 605 exerts pressure on the chip and firmly fixes the chip at the dispensing position, and displacement of the chip during conductive glue dispensing is prevented.

[0039] In summary, the working principle of the semiconductor conductive glue dispensing device is as follows: when in use, an operator rotates the handle 304, the handle 304 is connected with the double-headed threaded rod 303, when the handle 304 is rotated, the double-headed threaded rod 303 is rotated, the double-headed threaded rod 303 has opposite threads in left and right directions, can drive the two conveying plates 302 to move synchronously towards or away from each other, the conveying plates 302 are accurately adjusted to appropriate positions according to the width of the chip, and the chip is limited to prevent deviation on the conveying belt 204.

[0040] The staff puts the chip on the positioning plate 24, the servo motor 201 drives the conveying belt 204 to move through the driving rod 202, so that the chip moves along the predetermined path, the conveying belt 204 drives the hinged seat 23 and the positioning plate 24 to move through the fixed rod 22, the T-shaped pull rod 504 first contacts the guide plate 54 in the movement, the T-shaped pull rod 504 pulls the lifting block 502 to rise, when the lifting block 502 rises, the inclined groove 503 on the lifting block 502 guides the guide slide rod 505 to move to the bottom end, finally, the guide slide rod 505 drives the supporting frame 506 and the clamping block 507 to stably clamp the chip, when the T-shaped pull rod 504 is separated from the contact with the guide plate 54, the reset spring 510 drives the supporting frame 506 to reset, and then the supporting frame 506 drives the clamping block 507 to release the restriction on the chip, so that the automatic release is realized;

[0041] After the clamping block 507 completes the preliminary clamping on the chip, further drives the groove plate 601 to move close to the chip, the movement of the groove plate 601 drives the eccentric rod 602 and the eccentric disc 603 to rotate around the shaft rod 604, so that the shaft rod 604 drives the L-shaped pressing plate 605 to press the chip, the L-shaped pressing plate 605 applies pressure to the chip, and the chip is firmly fixed at the glue dispensing position, so that the chip is prevented from being displaced in the conductive glue dispensing process, when the chip moves to the glue dispensing position, the XYZ three-axis movement platform 103 drives the glue dispenser 104 to dispense glue on the chip.

[0042] The above only for preferred embodiments of the present application, and is not intended to limit the present application, for those skilled in the art, the present application can have various changes and variations. Any modification, equivalent replacement, improvement, etc. within the spirit and principles of the present application, should be included in the protection scope of the present application.

Claims

1. A semiconductor conductive adhesive dispensing device, comprising a base (101), the top of the base (101) is fixedly connected with a dispensing frame (102), the top of the dispensing frame (102) is fixedly connected with an XYZ three-axis motion platform (103), the side wall of the XYZ three-axis motion platform (103) is fixedly connected with a dispenser (104), characterized in that, Also includes: The top of the base (101) is fixedly connected with a servo motor (201), the output end of the servo motor (201) is fixedly connected with a drive rod (202), the outer wall of the drive rod (202) is rotatably connected with a fixed seat (203), the bottom of the fixed seat (203) is fixedly connected with the top of the base (101), the outer wall of the drive rod (202) is sleeved with a conveying belt (204).

2. The apparatus according to claim 1, wherein: The inside of the conveying belt (204) is provided with a connecting groove (21), the inner wall of the connecting groove (21) is fixedly connected with a fixed rod (22), the outer wall of the fixed rod (22) is rotatably connected with a hinged seat (23), the side wall of the hinged seat (23) is fixedly connected with a positioning plate (24).

3. The apparatus according to claim 2, wherein: The top of the base (101) is provided with a positioning mechanism (3), the positioning mechanism (3) comprises a I-shaped guide rail (301) fixedly connected on the top of the base (101), the side wall of the I-shaped guide rail (301) is slidably connected with a conveying plate (302), the through hole of the conveying plate (302) is threadedly connected with a double-headed threaded rod (303), one end of the double-headed threaded rod (303) is fixedly connected with a handle (304), the outer wall of the double-headed threaded rod (303) is rotatably connected with a connecting frame (305), the side wall of the connecting frame (305) is fixedly connected with the side wall of the glue dispensing frame (102).

4. The apparatus according to claim 3, wherein the apparatus further comprises a semiconductor conductive adhesive dispensing device. The side wall of the positioning plate (24) is provided with a clamping mechanism (5), the clamping mechanism (5) comprises a slide rail (501) fixedly connected on the side wall of the positioning plate (24), the side wall of the slide rail (501) is slidably connected with a lifting block (502).

5. The apparatus according to claim 4, wherein the apparatus further comprises a semiconductor conductive adhesive dispensing device. The side wall of the lifting block (502) is provided with an inclined groove (503), the top of the lifting block (502) is fixedly connected with a T-shaped pull rod (504), the side wall of the conveying plate (302) is fixedly connected with a guide plate (54), the top of the guide plate (54) is in contact with the outer wall of the T-shaped pull rod (504).

6. The apparatus according to claim 5, wherein the apparatus further comprises a semiconductor conductive adhesive dispensing device. The inner wall of the inclined groove (503) is slidably connected with a guide slide rod (505), the bottom of the guide slide rod (505) is fixedly connected with a support frame (506), the side wall of the support frame (506) is fixedly connected with a clamping block (507).

7. The apparatus according to claim 6, wherein the apparatus further comprises a semiconductor conductive adhesive dispensing device. The side wall of the positioning plate (24) is fixedly connected with a slide rod (508), the slide rod (508) penetrates through the side wall of the support frame (506) and extends to the outside, one end of the slide rod (508) away from the positioning plate (24) is fixedly connected with a reset circular plate (509).

8. The apparatus according to claim 7, wherein the apparatus further comprises a semiconductor conductive adhesive dispensing device. The outer wall of the reset circular plate (509) is fixedly connected with a reset spring (510), one end of the reset spring (510) away from the reset circular plate (509) is fixedly connected with the side wall of the support frame (506).

9. The apparatus according to claim 8, wherein the apparatus further comprises a semiconductor conductive adhesive dispensing device. The side wall of the clamping block (507) is provided with an anti-dropping mechanism (6), the anti-dropping mechanism (6) comprises a groove plate (601) fixedly connected on the side wall of the clamping block (507), the inner wall of the groove plate (601) is slidably connected with an eccentric rod (602), one end of the eccentric rod (602) is fixedly connected with an eccentric disc (603).

10. The apparatus according to claim 9, wherein the apparatus further comprises a semiconductor conductive adhesive dispensing device. The side wall of the eccentric disc (603) is fixedly connected with a shaft core rod (604), the outer wall of the shaft core rod (604) is rotationally connected with the side wall through hole of the positioning plate (24), and the outer wall of the shaft core rod (604) is fixedly connected with an L-shaped pressing plate (605).

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