Gluing mechanism for manufacturing power electronic components
The adhesive application mechanism with three-sided positioning uses clamping and adjustment components to precisely position and correct electronic components, solving the problem of inaccurate circuit board position adjustment in existing equipment and achieving high efficiency and consistency in adhesive application.
Patent Information
- Application Number
- CN202520187833.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-06
- Publication Date
- 2026-02-27
- Estimated Expiration
- 2035-02-06
AI Technical Summary
Existing coating equipment lacks the function of adjusting and correcting the position of the circuit board, which makes it impossible to accurately determine the position during the coating process and affects the accuracy of the coating.
The adhesive application mechanism employs a three-sided positioning system. It uses clamping and adjusting components to correct the position of electronic components. The system includes components such as clamping plates, adjusting columns, adjusting springs, guide frames, telescopic rods, limiting ports, clamping springs, and turntables, which work together to achieve precise positioning and correction of electronic components.
It improves the accuracy and consistency of adhesive application, enhances the adaptability and controllability of the device, and ensures the stability and precision of electronic components during the adhesive application process.
Smart Images

Figure CN223946078U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to electronic component processing technical field, concretely relates to a gluing mechanism for power electronic component manufacturing. BACKGROUND
[0002] In the process of power electronic component manufacturing, gluing is a key step, which involves the fixation and insulation of electronic components.
[0003] However, the existing coating equipment often lacks adjustment and correction function for the position of the circuit board, which leads to the inability to achieve accurate positioning of the circuit board during the coating process. Since the circuit board may produce slight angular deviation or positional deviation during manufacturing and transportation, such deviation and deviation cannot be corrected during coating, which will directly affect the accuracy of coating.
[0004] For example, the Chinese patent with publication number CN221360816U discloses a gluing device for electronic component manufacturing, which includes a support gluing assembly and a clamping assembly. The support gluing assembly includes a bottom plate, U-shaped plates fixed vertically on both sides of the middle part of the upper end of the bottom plate, and a glue cylinder fixed on the upper end of the U-shaped plate. A placing groove is formed in the middle part of the side wall of the bottom plate, and a sliding groove is formed horizontally in the middle part of the upper end of the bottom plate. The lower end of the glue cylinder is provided with a gluing head on the lower side of the U-shaped plate. The clamping assembly includes a motor fixed in the placing groove, and a lead screw fixed on the output end of the motor and located in the sliding groove. This gluing device for electronic component manufacturing drives the lead screw to rotate through the motor, causing the two clamping seats to approach each other and place the electronic components. The threaded rod drives the pressing plate to move downward, clamping the electronic components on the two clamping seats, so that the device can clamp and glue electronic components of different sizes or shapes, thereby improving the practicality of the device.
[0005] The above device lacks a correction device for the position of the electronic components, and the electronic components are fixed after clamping, which cannot correct the position of the electronic components. Even if it can clamp electronic components of different sizes and shapes, it cannot correct the position of electronic components of different sizes, which cannot effectively ensure the gluing quality. UTILITY MODEL CONTENTS
[0006] Therefore, the utility model provides a gluing mechanism for power electronic component manufacturing, which can effectively correct the position of electronic components through three-side positioning.
[0007] To solve the above technical problems, the utility model provides a kind of gluing mechanism for power electronic component manufacturing, including support and adjustment assembly, the middle part of support is equipped with sliding slot, the middle part of sliding slot is provided with clamping assembly, clamping assembly includes the base slidingly connected in the middle part of sliding slot, the both sides of base are all fixedly connected with adjustment frame, the side of adjustment frame is all slidingly connected with clamping plate, adjustment assembly includes the fixed plate fixedly connected with the side of support, the middle part of fixed plate is slidingly connected with multiple array distribution adjustment column, the one end of adjustment column is fixedly connected with same push plate, adjustment spring is all set in the adjustment column cylinder between push plate and fixed plate, the side of base is fixedly connected with the support plate corresponding distribution with push plate, the top of support is provided with gluing cylinder for gluing, through the positioning of three sides, the position of electronic component can be effectively corrected.
[0008] Adjustment assembly further includes a plurality of array distribution guide frames fixedly connected to the other side of the fixed plate, and the middle part of the adjustment column is slidingly connected to the middle part of the adjacent guide frame.
[0009] The middle part of the adjustment column is fixedly connected with a plurality of array distribution telescopic rods, and the middle part of the guide frame is provided with a limiting opening.
[0010] The clamping assembly further includes a plurality of clamping springs sleeved in the middle part of the adjustment frame, and the clamping spring is located between the adjacent clamping plate and the adjustment frame.
[0011] The top of the base is rotatably connected with a turntable.
[0012] The top of the turntable is provided with a plurality of pads.
[0013] The middle part of the sliding slot is rotatably connected with a screw rod, and the middle part of the screw rod is threadedly connected to the middle part of the base.
[0014] Compared with the prior art, the present application has at least one of the following beneficial technical effects:
[0015] 1. The other side of the electronic component is finally in contact with the support plate, so that the two sides of the electronic component are clamped by the clamping plates and the other side is in contact with the fixed plate.
[0016] 2、 that is, by adjusting the action of the adjusting column and the adjusting spring, the position of the push plate can be self-adaptively adjusted according to electronic components of different sizes, so that the adaptability of the device can be effectively improved. BRIEF DESCRIPTION OF DRAWINGS
[0017] Figure 1 It is a structural schematic view of the glue applying mechanism for manufacturing power electronic components;
[0018] Figure 2 It is a structural schematic view of the enlarged A place of the utility model;
[0019] Figure 3 It is a structural schematic view of the utility model;
[0020] Figure 4 It is a structural schematic view of the enlarged B place of the utility model.
[0021] EXPLANATION OF REFERENCE NUMERALS:
[0022] 100, support; 101, sliding groove; 102, cushion block; 103, rotating disc; 104, screw rod; 105, glue applying cylinder;
[0023] 200, adjusting assembly; 201, fixed plate; 202, adjusting column; 203, push plate; 204, adjusting spring; 205, support plate; 206, guide frame; 207, telescopic rod; 208, limiting opening;
[0024] 300, clamping assembly; 301, base; 302, adjusting frame; 303, clamping plate; 304, clamping spring; DETAILED DESCRIPTION
[0025] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, below will combine the drawings of the embodiments of the utility model with the specific implementation of the embodiments of the utility model to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer. Figures 1-4 The technical scheme of the embodiments of the utility model is described clearly and completely. Obviously, the described embodiments are part of the embodiments of the utility model, rather than all the embodiments. Based on the described embodiments of the utility model, all other embodiments obtained by the person skilled in the art belong to the scope of protection of the utility model.
[0026] As Figures 1-4The embodiment provides a gluing mechanism for power electronic component manufacturing, which comprises a support 100 and an adjusting assembly 200. The middle part of the support 100 is provided with a sliding groove 101, and the middle part of the sliding groove 101 is provided with a clamping assembly 300. The clamping assembly 300 comprises a base 301 which is slidingly connected to the middle part of the sliding groove 101. Both sides of the base 301 are fixedly connected with adjusting frames 302. Both sides of the adjusting frames 302 are slidingly connected with clamping plates 303. The adjusting assembly 200 comprises a fixed plate 201 which is fixedly connected to one side of the support 100. The middle part of the fixed plate 201 is slidingly connected with a plurality of arrayed adjusting columns 202. One end of the adjusting column 202 is fixedly connected with a same push plate 203. The middle part of the adjusting column 202 is sleeved with an adjusting spring 204. The adjusting spring 204 is located between the push plate 203 and the adjusting column 202 column body of the fixed plate 201. One side of the base 301 is fixedly connected with a support plate 205 which is correspondingly distributed with the push plate 203. The top of the support 100 is provided with a glue applying cylinder 105 for gluing.
[0027] When gluing, the clamping plates 303 are separated to two sides, the electronic component is placed on the top of the base 301, then the clamping plates 303 are driven to move to the middle part of the base 301 along the adjusting frames 302 to clamp the electronic component. After clamping, the base 301 is driven to move along the sliding groove 101, so that the base 301 with the electronic component is in contact with the adjusting assembly 200. With the movement of the electronic component, the electronic component is finally in contact with the push plate 203. With the electronic component extruding the push plate 203, the push plate 203 drives the adjusting column 202 to move. In this process, the adjusting spring 204 is compressed. With the size of the electronic component being different, the moving distance of the adjusting column 202 also changes correspondingly, so that the position of the push plate 203 is changed. That is, through the action of the adjusting column 202 and the adjusting spring 204, the position of the push plate 203 can be adaptively adjusted according to the electronic components of different sizes, so that the adaptability of the device can be effectively improved. The adjusting spring 204 is continuously compressed to provide a continuous thrust for the push plate 203. When the thrust reaches the movement of the electronic component, the electronic component is pushed by the push plate 203 to move backward, so that the other side of the electronic component is in contact with the support plate 205. In this way, the two sides of the electronic component are clamped by the clamping plates 303, and the other side is in contact with the fixed plate 201. Through the positioning of three sides, the position of the electronic component can be effectively corrected.
[0028] After the position correction is completed, the glue applying cylinder 105 starts to work to uniformly apply glue on the top of the electronic component. The posture of the corrected electronic component is consistent and controllable, so as to ensure the accuracy and consistency of gluing. After gluing is completed, the clamping plates 303 are separated again, and the electronic component can be taken off from the base 301 to complete the whole gluing process.
[0029] The guide frame 206 is like Figure 3 ,4 As shown,
[0030] The adjusting assembly 200 further comprises a plurality of arrayed guide frames 206 fixedly connected to the other side of the fixed plate 201, the guide frames 206 correspond to the positions of the adjusting columns 202 one by one, and the middle parts of the adjusting columns 202 are slidingly connected to the middle parts of the adjacent guide frames 206;
[0031] The guide frames 206 can guide the middle parts of the adjusting columns 202, and cooperating with the fixed plate 201, the adjusting columns 202 can be guided in two positions, ensuring the stability of the adjusting columns 202 in the moving process and improving the accuracy and reliability of the gluing mechanism.
[0032] The telescopic rods 207 are arranged in an array, Figure 4 As shown,
[0033] The middle parts of the adjusting columns 202 are fixedly connected with a plurality of arrayed telescopic rods 207, the telescopic ends of the telescopic rods 207 are all upwardly arranged, the middle parts of the guide frames 206 are all provided with limiting openings 208, and the limiting openings 208 are located on the same straight line with the adjacent telescopic rods 207;
[0034] When the adjusting columns 202 drive the telescopic rods 207 to move to the limiting openings 208, the telescopic ends of the telescopic rods 207 will extend into the limiting openings 208 to simply fix the positions of the adjusting columns 202, until the pressure on the adjusting columns 202 is increased to make the telescopic rods 207 separate from the limiting openings 208, and then move again. Through such arrangement, the adjusting columns 202 can have segmented and graded positioning, improving the controllability of the gluing mechanism when adjusting the positions of electronic components and preventing unlimited movement.
[0035] The clamping springs 304 are arranged in an array, Figure 2 , 3 As shown,
[0036] The clamping assembly 300 further comprises a plurality of clamping springs 304 sleeved on the middle part of the adjusting frame 302, and the clamping springs 304 are all located between the adjacent clamping plates 303 and the adjusting frame 302;
[0037] When clamping, the clamping plates 303 are first pulled to separate to both sides, then the electronic components are placed between the two clamping plates 303, and then the clamping plates 303 are loosened and will close to the middle part under the pushing of the clamping springs 304, finally clamping the electronic components.
[0038] And by driving the clamping plates 303 through the clamping springs 304, the clamping plates 303 on both sides can be self-adaptively adjusted in tightness when the electronic components are in the correcting position, preventing the position of the clamping plates 303 from being too rigid to adjust the position of the electronic components, or even damaging the electronic components.
[0039] The rotating disc 103 is rotatably connected to the top of the base 301. Figure 1 、 3 The rotating disc 103 is rotatably connected to the top of the base 301.
[0040] The rotating disc 103 is rotatably connected to the top of the base 301.
[0041] The bottom of the electronic component is attached to the top of the rotating disc 103, and the rotation of the rotating disc 103 allows the bottom of the electronic component to rotate more flexibly when adjusting the position, thereby improving the flexibility of the electronic component on the plane and allowing the position to be corrected more smoothly.
[0042] The cushion block 102 is arranged in an array on the top of the rotating disc 103. Figure 1 、 3 The cushion block 102 is arranged in an array on the top of the rotating disc 103.
[0043] The cushion block 102 is arranged in an array on the top of the rotating disc 103.
[0044] The cushion block 102 can support the electronic component and ensure the stability of the electronic component on the rotating disc 103. At the same time, the friction provided by the cushion block 102 can prevent the electronic component from deviating or tilting during rotation, thereby improving the precision and consistency of the gluing.
[0045] The screw rod 104 is rotatably connected to the middle of the sliding groove 101. Figure 1 、 3 The screw rod 104 is rotatably connected to the middle of the sliding groove 101.
[0046] The screw rod 104 is rotatably connected to the middle of the sliding groove 101.
[0047] The screw rod 104 is rotatably connected to the middle of the sliding groove 101.
[0048] In addition, it should be noted that in the description of the present application, unless otherwise specified and limited, the terms "installation", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, or it can be connected inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0049] The above is the preferred embodiment of the present application, it should be pointed out that, for those skilled in the ordinary in the art, without departing from the principles described in the present application, can be made several improvements and refinements, these improvements and refinements should also be considered as the scope of protection of the present application.
Claims
1. A gluing mechanism for power electronics manufacturing, characterized by: The utility model provides a kind of adjustable bracket, including support (100) and adjustment assembly (200), the middle part of the support (100) is equipped with sliding slot (101), the middle part of the sliding slot (101) is equipped with clamping assembly (300), the clamping assembly (300) includes the base (301) being arranged in the middle part of sliding slot (101), the both sides of the base (301) are equipped with adjusting frame (302), the side of the adjusting frame (302) is equipped with clamping plate (303), the adjustment assembly (200) includes the fixed plate (201) being arranged in the side of support (100), the middle part of the fixed plate (201) is equipped with multiple adjusting column (202), the one end of the adjusting column (202) is equipped with same push plate (203), the middle part of the adjusting column (202) is equipped with adjusting spring (204), the side of the base (301) is equipped with the support plate (205) corresponding distribution with push plate (203), the top of the support (100) is equipped with glue coating cylinder (105) for gluing.
2. The gluing mechanism for manufacturing power electronic components according to claim 1, wherein: The adjustment assembly (200) further includes a plurality of guide frames (206) disposed on the other side of the fixed plate (201), and the middle part of the adjusting column (202) is disposed in the middle part of the adjacent guide frame (206).
3. The gluing mechanism for manufacturing power electronic components according to claim 2, wherein: The middle part of the adjusting column (202) is provided with a plurality of telescopic rods (207), and the middle part of the guide frame (206) is provided with a limiting opening (208).
4. The gluing mechanism for manufacturing power electronic components according to claim 1, wherein: The clamping assembly (300) further includes a plurality of clamping springs (304) sleeved with the middle part of the adjusting frame (302), and the clamping spring (304) is located between the adjacent clamping plate (303) and the adjusting frame (302).
5. The gluing mechanism for manufacturing power electronic components according to claim 1, wherein: The top of the base (301) is rotatably provided with a turntable (103).
6. The gluing mechanism for manufacturing power electronic components according to claim 5, wherein: The top of the turntable (103) is provided with a plurality of pads (102).
7. The gluing mechanism for manufacturing power electronic components according to claim 1, wherein: The middle part of the sliding slot (101) is provided with a screw rod (104), and the middle part of the screw rod (104) is disposed in the middle part of the base (301).
Citation Information
Patent Citations
Gluing device for electronic component manufacturing
CN221360816U