Half-wafer cutting mechanism of scribing machine

Abstract

The utility model discloses a scribing machine's half-piece cutting mechanism, including scribing support, manipulator and half-piece output module, be equipped with jacking motor and jacking frame on scribing support, jacking motor moves back and forth along scribing support, the drive end of jacking motor is connected with cam, the cam is located in the middle of jacking frame, and the cam is located in the middle of jacking frame. A scribing laser head and a scribing detection camera are arranged in the middle of the scribing support, the half-wafer output module comprises a half-wafer transverse moving module, a half-wafer vertical moving module and a half-wafer suction rod, the half-wafer vertical moving module is installed at the driving end of the half-wafer transverse moving module, the half-wafer suction rod is installed at the driving end of the half-wafer vertical moving module, and a half-wafer suction nozzle is fixed to the half-wafer suction rod. According to the half-wafer cutting mechanism of the scribing machine, the whole silicon wafer is placed in the scribing area through the mechanical arm, laser cutting is carried out on the whole silicon wafer from the middle through laser, and preparation is made for follow-up series welding of the half silicon wafer.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of silicon wafer taking and placing, especially to a half wafer cutting mechanism of wafer scribing machine. BACKGROUND

[0002] Photovoltaic solar silicon wafer is the core part of solar power generation system, and is also the highest value part in solar power generation system. The role of silicon wafer is to convert solar energy into electric energy, and the electric energy is stored by storage battery or directly loaded. The battery needs to string up the half silicon wafer, so the whole silicon wafer needs to be cut by equipment or mechanism. The conventional cutting of whole silicon wafer does not have jacking function, is easy to cut out of place, and the structure cannot meet the production requirements. UTILITY MODEL CONTENT

[0003] One purpose of the utility model is to provide a half wafer cutting mechanism of wafer scribing machine. The mechanical hand removes unqualified silicon wafer, the jacking frame is lifted by the cam structure to facilitate laser cutting, and preparation is made for subsequent wafer scribing.

[0004] In order to achieve this purpose, the utility model adopts the following technical scheme:

[0005] A half wafer cutting mechanism of wafer scribing machine, including wafer support, mechanical hand and half wafer output module, the jacking motor is arranged on the wafer support, the jacking motor moves along the wafer support back and forth, the driving end of the jacking motor is connected with a cam, the cam is in the middle part of the jacking frame, the middle part of the wafer support is provided with wafer laser head and wafer detection camera, the half wafer output module includes half wafer horizontal movement module, half wafer vertical movement module and half wafer suction rod, the half wafer vertical movement module is installed on the driving end of the half wafer horizontal movement module, the half wafer suction rod is installed on the driving end of the half wafer vertical movement module, and the half wafer suction rod is fixed with half wafer suction nozzle.

[0006] As a preferred technical scheme, the movable end of the mechanical hand is provided with an adsorption plate.

[0007] As a preferred technical scheme, the lower end of the wafer support is provided with a wafer front and rear module, the driving end of the wafer front and rear module is fixedly connected with the jacking motor, the middle part of the jacking frame is provided with a cam movable hole, and the cam is in the cam movable hole.

[0008] As a preferred technical scheme, the wafer support is provided with a movable groove along the front and rear direction, and the upper end of the jacking frame penetrates through the movable groove.

[0009] As a preferred technical scheme, the upper end of the jacking frame is provided with a plurality of adsorption hole positions.

[0010] As a preferred technical scheme, the one side of the wafer cutting support is provided with a transfer support, and the transfer support is provided with adsorption crossbars.

[0011] As a preferred technical scheme, the one side of the mechanical arm is provided with a separator supplement box and a defective placement box.

[0012] As a preferred technical scheme, the wafer cutting support is provided with a horizontal sliding table, the horizontal sliding table is connected with an L-shaped support, the L-shaped support is provided with a vertical sliding table, and the wafer cutting laser head and the wafer cutting detection camera are respectively arranged on one vertical sliding table.

[0013] The wafer cutting machine half wafer cutting mechanism has the advantages that the wafer cutting machine half wafer cutting mechanism places the whole wafer into the wafer cutting area by the mechanical arm, and the whole wafer is cut from the middle by laser, so that the subsequent half wafer string welding is prepared. BRIEF DESCRIPTION OF DRAWINGS

[0014] The utility model will be further explained in detail in connection with the drawings and embodiments.

[0015] Figure 1 The whole structure schematic view of the wafer cutting machine half wafer cutting mechanism is described in the embodiments.

[0016] Figure 2 The first structure schematic view of the wafer cutting support is described in the embodiments.

[0017] Figure 3 The second structure schematic view of the wafer cutting support is described in the embodiments.

[0018] Figure 4 The structure schematic view of the half wafer output module is described in the embodiments.

[0019] Figure 5 The structure schematic view of the transfer support is described in the embodiments.

[0020] Figures 1 to 5 MID:

[0021] 1, wafer cutting support;2, mechanical arm;3, half wafer output module;4, jacking motor;5, jacking frame;6, cam;7, wafer cutting laser head;8, wafer cutting detection camera;9, half wafer horizontal movement module;10, half wafer vertical movement module;11, half wafer suction rod;12, half wafer suction nozzle;13, adsorption plate;14, wafer cutting front and rear module;15, movable groove;16, transfer support;17, adsorption crossbar;18, separator supplement box;19, defective placement box;20, horizontal sliding table;21, L-shaped support;22, vertical sliding table;23, wafer. DETAILED DESCRIPTION

[0022] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0023] like Figures 1 to 5 As shown in this embodiment, a half-piece cutting mechanism for a dicing machine includes a dicing bracket 1, a robotic arm 2, and a half-piece output module 3. The dicing bracket 1 is equipped with a lifting motor 4 and a lifting frame 5. The lifting motor 4 moves back and forth along the dicing bracket 1. The driving end of the lifting motor 4 is connected to a cam 6, which is located in the middle of the lifting frame 5. The middle of the dicing bracket 1 is equipped with a dicing laser head 7 and a dicing detection camera 8. The half-piece output module 3 includes a half-piece horizontal movement module 9, a half-piece vertical movement module 10, and a half-piece suction rod 11. The half-piece vertical movement module 10 is installed on the driving end of the half-piece horizontal movement module 9, and the half-piece suction rod 11 is installed on the driving end of the half-piece vertical movement module 10. A half-piece suction nozzle 12 is fixed on the half-piece suction rod 11.

[0024] Based on the identification of defective silicon wafers 23 and good silicon wafers 23, the robotic arm 2 picks up the qualified whole silicon wafer 23 and places it onto the dicing support 1, which is supported by the lifting frame 5. As the lifting frame 5 moves back and forth along the dicing support 1, when the whole silicon wafer 23 approaches the dicing laser head 7, the lifting motor 4 controls the cam 6 to rotate, so that the lifting frame 5 is briefly lifted up. The whole silicon wafer 23 on the lifting frame 5 is closer to the dicing laser head 7, thus completely and accurately dividing the whole silicon wafer 23 from the middle. After the dicing inspection camera 8 detects that the cutting is completed, the half wafer horizontal movement module 9 and the half wafer vertical movement module 10 on the half wafer output module 3 control the half wafer suction rod 11 to adsorb the two halves and move them to the rear.

[0025] The robotic arm 2 is equipped with an adsorption plate 13, which is used to grip the entire silicon wafer 23.

[0026] The lower end of the dicing bracket 1 is equipped with a dicing front and rear module 14. The drive end of the dicing front and rear module 14 is fixedly connected to the lifting motor 4. The middle part of the lifting frame 5 is provided with a cam movable hole, and the cam 6 is located in the cam movable hole. The dicing bracket 1 is provided with a movable groove 15 along the front and rear direction. The upper end of the lifting frame 5 passes through the movable groove 15. The dicing front and rear module 14 controls the lifting frame 5 to move back and forth. When the lifting motor 4 controls the lifting frame 5 to rise through the cam 6, the upper end of the lifting frame 5 is higher than the movable groove 15 on the dicing bracket 1. The lifting frame 5 can move along the movable groove 15, driving the silicon wafer 23 to perform laser cutting.

[0027] The upper end of the lifting frame 5 is provided with several adsorption holes, which firmly adsorb and fix the silicon wafer 23 to prevent displacement and accurately perform laser cutting.

[0028] One side of the wafer support 1 is provided with a transfer support 16, and the transfer support 16 is provided with adsorption cross bars 17, and there is a gap between two adjacent adsorption cross bars 17, and the half-piece output module 3 places the cut double half-pieces on the adsorption cross bars 17 for fixation, and then the subsequent stringer inserts the rails into the gap between the adsorption cross bars 17, and then lifts the double half-pieces to take them away.

[0029] One side of the manipulator 2 is provided with a separator paper supplement box 18 and a defective placement box 19, and when the front end detects whether the whole silicon wafer 23 meets the requirements, the defective silicon wafer 23 will be placed in the defective placement box 19, and the defective silicon wafer 23 is placed in an interval mode of one layer of separator paper and one layer of silicon wafer 23, and the separator paper is taken out from the separator paper supplement box 18 and placed in the defective placement box 19, so as to separate and protect each layer of silicon wafer 23.

[0030] The wafer support 1 is provided with a horizontal sliding table 20, the horizontal sliding table 20 is connected with an L-shaped support 21, the L-shaped support 21 is provided with a vertical sliding table 22, the wafer laser head 7 and the wafer detection camera 8 are respectively installed on one vertical sliding table 22, and the positions of the wafer laser head 7 and the wafer detection camera 8 are finely adjusted by using the horizontal sliding table 20 and the vertical sliding table 22, so as to adapt to the positions of the silicon wafer 23 to be scribed.

[0031] The modules involved in the application are all linear modules.

[0032] It should be stated that the above specific embodiments are only the preferred embodiments of the utility model and the applied technical principles, and any changes or replacements easily thought by any person skilled in the art in the technical range disclosed by the utility model should be covered in the protection range of the utility model.

Claims

1. A wafer dicing mechanism of a wafer sawing machine, characterized by, The utility model provides a kind of wafer slicing device, including wafer slicing support, manipulator and half wafer output module, top lifting motor and top lifting frame are arranged on the wafer slicing support, the top lifting motor moves along the wafer slicing support back and forth, the driving end of the top lifting motor is connected with cam, the cam is in the middle part of the top lifting frame, the middle part of the wafer slicing support is provided with wafer slicing laser head and wafer slicing detection camera, the half wafer output module includes half wafer horizontal movement module, half wafer vertical movement module and half wafer suction rod, the half wafer vertical movement module is installed on the driving end of the half wafer horizontal movement module, the half wafer suction rod is installed on the driving end of the half wafer vertical movement module, and the half wafer suction rod is fixed with half wafer suction nozzle.

2. A wafer dicing mechanism of a wafer saw according to claim 1, wherein The movable end of the manipulator is installed with an adsorption plate.

3. A wafer dicing mechanism of a wafer saw according to claim 1, wherein The lower end of the wafer slicing support is installed with wafer slicing front and back module, the driving end of the wafer slicing front and back module is fixedly connected with the top lifting motor, the middle part of the top lifting frame is provided with cam movable hole, and the cam is in the cam movable hole.

4. The wafer dicing apparatus of claim 1, wherein, The wafer slicing support is provided with movable slot along the front and back direction, and the upper end of the top lifting frame passes through the movable slot.

5. The wafer dicing apparatus of claim 1, wherein, The upper end of the top lifting frame is provided with a plurality of adsorption hole positions.

6. A wafer dicing mechanism of a wafer saw according to claim 1, wherein One side of the wafer slicing support is provided with a transfer support, the transfer support is installed with an adsorption cross bar, and there is a gap between adjacent two adsorption cross bars.

7. The wafer dicing apparatus of claim 1, wherein, One side of the manipulator is provided with a separator supplement box and a defective placement box.

8. The wafer dicing mechanism of claim 1, wherein, The wafer slicing support is installed with a horizontal sliding table, the horizontal sliding table is connected with an L-shaped support, the L-shaped support is installed with a vertical sliding table, and the wafer slicing laser head and the wafer slicing detection camera are respectively installed on one vertical sliding table.

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