Wafer bearing disc
By designing a rubber ring and elastic block structure for the wafer carrier disk, the problem of edge damage caused by the shaking of the epitaxial wafer substrate at high temperatures is solved, achieving stable positioning and convenient replacement, which is suitable for wafer carrier.
Patent Information
- Application Number
- CN202520397625.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-09
- Publication Date
- 2026-02-27
- Estimated Expiration
- 2035-03-09
AI Technical Summary
There is a risk of movement when placing the epitaxial wafer substrate, which can lead to edge damage.
A wafer carrier disk is designed, comprising a carrier disk body, a first groove, a first rubber ring, a second rubber ring, and a plastic ring. The epitaxial wafer substrate is fixed by the friction of the rubber ring, and the design of holes and elastic blocks ensures stable positioning.
It effectively avoids damage to the edge of the epitaxial wafer substrate, ensures that the heating effect is not affected in high-temperature environments, and facilitates the replacement and installation of the rubber ring.
Smart Images
Figure CN223951269U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to wafer bearing disc technical field, concretely is a wafer bearing disc. BACKGROUND
[0002] Wafer is a kind of miniaturization component widely used in electronic equipment, wafer bearing disc is the device for fixing wafer and providing smooth support surface, wafer bearing disc usually adopts high-purity ultrafine silicon carbide powder, is formed after high-temperature sintering of 2450 DEG C.
[0003] When bearing disc is used, epitaxial wafer substrate is usually placed into the recess of wafer bearing disc, then wafer bearing disc with wafer is placed into MOCVD reaction chamber, other epitaxial layer is grown on epitaxial wafer substrate by setting temperature, gas inlet process etc., since epitaxial wafer substrate is positioned only by the recess when placing, in the process of processing, bearing disc is in the state of high-speed rotation, it leads to the risk of shaking after placing, so there is the possibility of causing damage to the edge of epitaxial wafer substrate, therefore, a kind of wafer bearing disc is proposed for the above problems. UTILITY MODEL CONTENT
[0004] The utility model aims at providing a kind of wafer bearing disc to solve the problem of the risk of shaking after epitaxial wafer substrate is placed possibly leading to edge damage.
[0005] To achieve the above object, the utility model provides the following technical scheme:
[0006] A kind of wafer bearing disc, including the bearing disc main body for bearing epitaxial wafer substrate and first recess, the bearing disc main body surface is equipped with a plurality of first recess, first rubber ring is tightly attached to the inner wall bottom of the first recess, the first rubber ring top is fixedly connected with plastic ring, the plastic ring outer side is fixedly connected with second rubber ring.
[0007] Preferably, the first rubber ring surface is equipped with a plurality of holes, and the first rubber ring and the second rubber ring are fixedly connected.
[0008] Preferably, the second rubber ring outer side is fixedly connected with a plurality of first elastic blocks arranged in a hemispherical shape, a through hole is formed in the first elastic block, and a second elastic block is fixedly connected in the through hole.
[0009] Preferably, a plurality of limiting grooves arranged in a hemispherical shape are formed in the bearing disc main body, the limiting grooves are tightly attached to the first elastic blocks, and the limiting grooves and the first recesses are arranged in communication.
[0010] Preferably, a second recess is formed on the surface of the bearing disc main body to facilitate the taking and placing of the first rubber ring and the second rubber ring, and the second recess and the first recess are arranged in communication.
[0011] Compared with the prior art, the utility model has the advantages of:
[0012] In the utility model, through setting up the bearing disc main part, first recess, first rubber ring, second rubber ring and plastic ring, the first rubber ring and the second rubber ring cooperate and use, the epitaxial wafer substrate is placed in the first rubber ring top and the second rubber ring inboard, the rubber material increases the friction after the epitaxial wafer substrate is placed, so that it is not easy to shake after being placed, thereby the risk of causing damage to the epitaxial wafer substrate edge is avoided, through setting up the hole, since the epitaxial wafer substrate needs to be heated after being placed, and the rubber has good heat insulation effect, opening several holes will not affect the heating of the epitaxial wafer substrate, through setting up the plastic ring, the overall shape of the second rubber ring is more stable, and the plastic ring of plastic material has slight elasticity, the second rubber ring is convenient to take out, through setting up the first elastic block, through hole, second elastic block and limiting groove, the simple fixing after the second rubber ring is placed is convenient, through setting up the second recess, the first rubber ring and the second rubber ring are convenient to take out and replace. BRIEF DESCRIPTION OF DRAWINGS
[0013] Figure 1 It is the whole structure schematic diagram of the utility model;
[0014] Figure 2 It is the structure schematic diagram of A place of the utility model Figure 1 ;
[0015] Figure 3 It is the second rubber ring installation structure schematic diagram of the utility model;
[0016] Figure 4 It is the structure schematic diagram of B place of the utility model Figure 3 ;
[0017] Figure 5 It is the first elastic block section view structure schematic diagram of the utility model.
[0018] In the drawing: 1, bearing disc main part;2, first recess;3, first rubber ring;4, second rubber ring;5, plastic ring;6, hole;7, first elastic block;8, through hole;9, second elastic block;10, second recess;11, limiting groove. DETAILED DESCRIPTION
[0019] The technical scheme in the embodiments of the utility model will be apparently and completely described below in conjunction with the drawings of the embodiments of the utility model, and obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without creative labor fall within the protection scope of the utility model.
[0020] It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments in accordance with the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising," when used in this specification, specify the presence of stated features, steps, operations, elements, components, and / or groups thereof, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups thereof.
[0021] Referring to Figures 1-5 The utility model provides a technical scheme:
[0022] A wafer bearing disc, comprising a bearing disc body 1 for bearing epitaxial wafer substrates and a first groove 2, the bearing disc body 1 surface is provided with a plurality of first grooves 2, the first groove 2 inner wall bottom is closely combined with first rubber ring 3, the first rubber ring 3 top is fixedly connected with plastic ring 5, the plastic ring 5 outside is fixedly connected with second rubber ring 4, through the first rubber ring 3 and second rubber ring 4 set, increase the friction between epitaxial wafer substrate and the inner wall of first groove 2, so that it is not easy to shake after placing, thereby avoid the risk of damage to the edge of epitaxial wafer substrate.
[0023] The first rubber ring 3 surface is provided with a plurality of holes 6, and the first rubber ring 3 and the second rubber ring 4 are fixedly connected, so that the heating of the epitaxial wafer substrate is not affected; the second rubber ring 4 is fixedly connected with a plurality of first elastic blocks 7 in the form of a hemisphere on the outside, a through hole 8 is formed in the first elastic block 7, and a second elastic block 9 is fixedly connected in the through hole 8, so that the second rubber ring 4 is convenient to install; a plurality of limiting grooves 11 in the form of a hemisphere are formed in the bearing disc body 1, the limiting groove 11 is closely combined with the first elastic block 7, the limiting groove 11 and the first groove 2 are connected, and the first elastic block 7 is convenient to engage; the bearing disc body 1 surface is provided with a second groove 10 for taking and placing the first rubber ring 3 and the second rubber ring 4, and the second groove 10 and the first groove 2 are connected, so that the second rubber ring 4 and the first rubber ring 3 are convenient to take out.
[0024] Work flow: when the wafer carrier tray is in use, first place the carrier tray body 1 in the appropriate position, then install the first rubber ring 3 and the second rubber ring 4 in sequence, that is, hold the second rubber ring 4 with the hand, align the first rubber ring 3 with the first groove 2 on the surface of the carrier tray body 1 and insert, in the process of insertion, the first elastic block 7 is in a state of being extruded and deformed, until the first rubber ring 3 is tightly attached to the inner wall bottom of the first groove 2, at this time, the first elastic block 7 rapidly recovers to the original state under the action of its own elastic force and the second elastic block 9, the first elastic block 7 arranged in a hemispherical shape is tightly attached to the limiting groove 11, the first rubber ring 3 and the second rubber ring 4 after installation are simply fixed, at the same time, the plastic ring 5 in the second rubber ring 4 makes the overall shape of the second rubber ring 4 more stable, install the first rubber ring 3 and the second rubber ring 4 in all the first grooves 2 on the carrier tray body 1 in the same way, when the epitaxial wafer substrate is installed, align it between the first rubber ring 3 and the second rubber ring 4 and insert, so that the bottom of the epitaxial wafer substrate is tightly attached to the top of the first rubber ring 3 and the edge of the epitaxial wafer substrate is tightly attached to the second rubber ring 4, the first rubber ring 3 and the second rubber ring 4 are used in cooperation, the rubber material increases the friction force, so that the epitaxial wafer substrate is not easy to shake after being placed, since the epitaxial wafer substrate needs to be heated after being placed, the plurality of holes 6 opened on one side of the first rubber ring 3 will not affect the heating of the epitaxial wafer substrate, and the rubber is easy to be damaged in a high-temperature environment for a long time, when the first rubber ring 3 and the second rubber ring 4 need to be replaced after being used for a long time, the user moves one end of the second rubber ring 4 upward and then takes out the second rubber ring 4 as a whole through the second groove 10 communicating with the first groove 2, and then replaces it, through the first rubber ring 3 and the second rubber ring 4, the friction force between the epitaxial wafer substrate and the inner wall of the first groove 2 is increased, so that the epitaxial wafer substrate is not easy to shake after being placed, thereby avoiding the risk of causing damage to the edge of the epitaxial wafer substrate.
[0025] The contents not described in detail in the specification belong to the prior art known to the person skilled in the art. The standard parts used in the utility model can be purchased from the market, the special-shaped parts can be ordered according to the description and the drawings, and the specific connection mode of each part adopts the conventional means such as bolts, rivets and welding in the prior art, the machinery, parts and equipment adopt the conventional models in the prior art, and the circuit connection adopts the conventional connection mode in the prior art, which will not be described in detail here.
[0026] Although the embodiments of the utility model have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirits of the utility model, the scope of the utility model is defined by the appended claims and their equivalents.
Claims
1. A wafer carrier disc comprising a carrier disc body (1) for carrying an epitaxial wafer substrate and a first recess (2), characterized in that: The surface of the bearing disc body (1) is provided with a plurality of first grooves (2), the inner wall bottom of the first groove (2) is closely attached with a first rubber ring (3), the top of the first rubber ring (3) is fixedly connected with a plastic ring (5), and the outer side of the plastic ring (5) is fixedly connected with a second rubber ring (4).
2. A wafer carrier as set forth in claim 1, further comprising: The surface of the first rubber ring (3) is provided with a plurality of holes (6), and the first rubber ring (3) and the second rubber ring (4) are fixedly connected.
3. A wafer carrier as set forth in claim 1, further comprising: The outer side of the second rubber ring (4) is fixedly connected with a plurality of first elastic blocks (7) arranged in a hemispherical shape, the first elastic block (7) is internally provided with a through hole (8), and the through hole (8) is fixedly connected with a second elastic block (9).
4. The wafer carrier of claim 1, wherein: The bearing disc body (1) is internally provided with a plurality of limiting grooves (11) arranged in a hemispherical shape, the limiting groove (11) is closely attached with the first elastic block (7), and the limiting groove (11) and the first groove (2) are arranged in communication.
5. The wafer carrier of claim 1, wherein: The surface of the bearing disc body (1) is provided with a second groove (10) facilitating the taking and placing of the first rubber ring (3) and the second rubber ring (4), and the second groove (10) and the first groove (2) are arranged in communication.